TW202602664A - 底漆皮膜形成用組成物、積層體、積層體之製造方法、及加工後之半導體基板或電子裝置基板之製造方法 - Google Patents

底漆皮膜形成用組成物、積層體、積層體之製造方法、及加工後之半導體基板或電子裝置基板之製造方法

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Publication number
TW202602664A
TW202602664A TW114109821A TW114109821A TW202602664A TW 202602664 A TW202602664 A TW 202602664A TW 114109821 A TW114109821 A TW 114109821A TW 114109821 A TW114109821 A TW 114109821A TW 202602664 A TW202602664 A TW 202602664A
Authority
TW
Taiwan
Prior art keywords
substrate
electronic device
primer film
adhesive
semiconductor substrate
Prior art date
Application number
TW114109821A
Other languages
English (en)
Chinese (zh)
Inventor
臼井友輝
奥野貴久
岸岡高廣
Original Assignee
日商日產化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日產化學股份有限公司 filed Critical 日商日產化學股份有限公司
Publication of TW202602664A publication Critical patent/TW202602664A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
TW114109821A 2024-03-19 2025-03-17 底漆皮膜形成用組成物、積層體、積層體之製造方法、及加工後之半導體基板或電子裝置基板之製造方法 TW202602664A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2024043603 2024-03-19
JP2024-043603 2024-03-19

Publications (1)

Publication Number Publication Date
TW202602664A true TW202602664A (zh) 2026-01-16

Family

ID=97139796

Family Applications (1)

Application Number Title Priority Date Filing Date
TW114109821A TW202602664A (zh) 2024-03-19 2025-03-17 底漆皮膜形成用組成物、積層體、積層體之製造方法、及加工後之半導體基板或電子裝置基板之製造方法

Country Status (2)

Country Link
TW (1) TW202602664A (fr)
WO (1) WO2025197877A1 (fr)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010260893A (ja) * 2009-04-30 2010-11-18 Nitto Denko Corp 積層フィルム及び半導体装置の製造方法
JP5010668B2 (ja) * 2009-12-03 2012-08-29 信越化学工業株式会社 積層型半導体集積装置の製造方法
JP2012149240A (ja) * 2010-12-31 2012-08-09 Dow Corning Toray Co Ltd シリコーン粘着剤用プライマー組成物、積層体およびシリコーン粘着テープ
WO2016136244A1 (fr) * 2015-02-26 2016-09-01 東レ・ダウコーニング株式会社 Composition d'amorce, procédé de liaison, et composant électrique/électronique
JP7742422B2 (ja) * 2021-04-27 2025-09-19 ダウ シリコーンズ コーポレーション シリコーン感圧接着剤及び組成物、並びにその調製方法及びフレキシブル表示装置における使用方法

Also Published As

Publication number Publication date
WO2025197877A1 (fr) 2025-09-25

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