TW204425B - - Google Patents
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- Publication number
- TW204425B TW204425B TW080107624A TW80107624A TW204425B TW 204425 B TW204425 B TW 204425B TW 080107624 A TW080107624 A TW 080107624A TW 80107624 A TW80107624 A TW 80107624A TW 204425 B TW204425 B TW 204425B
- Authority
- TW
- Taiwan
- Prior art keywords
- hole
- holes
- laminated substrate
- small
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26329990A JP3226533B2 (ja) | 1990-10-01 | 1990-10-01 | 多層配線基板及びその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW204425B true TW204425B (de) | 1993-04-21 |
Family
ID=17387548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW080107624A TW204425B (de) | 1990-10-01 | 1991-09-26 |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR920009274A (de) |
| DE (1) | DE69116299T2 (de) |
| TW (1) | TW204425B (de) |
-
1991
- 1991-09-19 KR KR1019910016389A patent/KR920009274A/ko not_active Withdrawn
- 1991-09-26 TW TW080107624A patent/TW204425B/zh active
- 1991-09-27 DE DE69116299T patent/DE69116299T2/de not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE69116299T2 (de) | 1996-08-22 |
| KR920009274A (ko) | 1992-05-28 |
| DE69116299D1 (de) | 1996-02-22 |
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