TW217465B - - Google Patents

Info

Publication number
TW217465B
TW217465B TW082102266A TW82102266A TW217465B TW 217465 B TW217465 B TW 217465B TW 082102266 A TW082102266 A TW 082102266A TW 82102266 A TW82102266 A TW 82102266A TW 217465 B TW217465 B TW 217465B
Authority
TW
Taiwan
Application number
TW082102266A
Other languages
Chinese (zh)
Original Assignee
Lasa Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lasa Ind Inc filed Critical Lasa Ind Inc
Application granted granted Critical
Publication of TW217465B publication Critical patent/TW217465B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/71—Etching of wafers, substrates or parts of devices using masks for conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/73—Etching of wafers, substrates or parts of devices using masks for insulating materials
TW082102266A 1992-03-10 1993-03-25 TW217465B (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US84923792A 1992-03-10 1992-03-10

Publications (1)

Publication Number Publication Date
TW217465B true TW217465B (fr) 1993-12-11

Family

ID=25305375

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082102266A TW217465B (fr) 1992-03-10 1993-03-25

Country Status (2)

Country Link
TW (1) TW217465B (fr)
WO (1) WO1993018545A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100071765A1 (en) * 2008-09-19 2010-03-25 Peter Cousins Method for fabricating a solar cell using a direct-pattern pin-hole-free masking layer

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60173502A (ja) * 1984-02-17 1985-09-06 Nippon Telegr & Teleph Corp <Ntt> 導波形光分岐回路
JPS6153731A (ja) * 1984-08-24 1986-03-17 Anritsu Corp 紫外線によるエツチング方法及び装置
EP0272799B1 (fr) * 1986-11-26 1993-02-10 Quick Technologies Ltd. Couche destructurable et résistant à la gravure pour la personnalisation par laser de circuits intégrés

Also Published As

Publication number Publication date
WO1993018545A1 (fr) 1993-09-16

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