TW247967B - - Google Patents

Info

Publication number
TW247967B
TW247967B TW082103144A TW82103144A TW247967B TW 247967 B TW247967 B TW 247967B TW 082103144 A TW082103144 A TW 082103144A TW 82103144 A TW82103144 A TW 82103144A TW 247967 B TW247967 B TW 247967B
Authority
TW
Taiwan
Application number
TW082103144A
Other languages
Chinese (zh)
Original Assignee
Tokyo Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Co Ltd filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW247967B publication Critical patent/TW247967B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
TW082103144A 1992-03-23 1993-04-23 TW247967B (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9590892 1992-03-23
JP29078792A JP3173676B2 (ja) 1992-03-23 1992-10-05 プローブ装置

Publications (1)

Publication Number Publication Date
TW247967B true TW247967B (fr) 1995-05-21

Family

ID=14150396

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082103144A TW247967B (fr) 1992-03-23 1993-04-23

Country Status (3)

Country Link
JP (1) JP3173676B2 (fr)
KR (1) KR930020629A (fr)
TW (1) TW247967B (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI456213B (zh) * 2013-01-18 2014-10-11 Hon Tech Inc 電子元件作業單元、作業方法及其應用之作業設備
US11262401B2 (en) 2020-04-22 2022-03-01 Mpi Corporation Wafer probe station
TWI789857B (zh) * 2020-08-03 2023-01-11 日商日本麥克隆尼股份有限公司 檢查用連接裝置及檢查用連接裝置的組裝方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4713763B2 (ja) * 2000-05-18 2011-06-29 株式会社アドバンテスト プローブの位置ずれ検出方法・プローブの位置決定方法・プローブの位置ずれ検出装置・プローブの位置決定装置
JP4885139B2 (ja) * 2005-09-15 2012-02-29 株式会社アドバンテスト Ｔｃｐハンドリング装置
JP4606319B2 (ja) * 2005-12-19 2011-01-05 日東電工株式会社 復旧支援装置
JP2011075450A (ja) * 2009-09-30 2011-04-14 Hitachi High-Tech Instruments Co Ltd 特性検査装置及びテーピング装置
JP6999321B2 (ja) * 2017-07-31 2022-01-18 東京エレクトロン株式会社 検査装置、検査方法及び記憶媒体
TWI674413B (zh) * 2018-10-31 2019-10-11 致茂電子股份有限公司 探針對準設備
JP7218909B2 (ja) * 2019-05-09 2023-02-07 株式会社昭和真空 プローブピン位置合せ装置及びプローブピン位置合せ装置を使用した電子デバイスの製造方法
US11821912B2 (en) * 2020-05-29 2023-11-21 Formfactor, Inc. Methods of producing augmented probe system images and associated probe systems
JP7784890B2 (ja) * 2021-12-27 2025-12-12 東京エレクトロン株式会社 検査装置及び検査方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI456213B (zh) * 2013-01-18 2014-10-11 Hon Tech Inc 電子元件作業單元、作業方法及其應用之作業設備
US11262401B2 (en) 2020-04-22 2022-03-01 Mpi Corporation Wafer probe station
TWI765649B (zh) * 2020-04-22 2022-05-21 旺矽科技股份有限公司 晶圓探針台
TWI789857B (zh) * 2020-08-03 2023-01-11 日商日本麥克隆尼股份有限公司 檢查用連接裝置及檢查用連接裝置的組裝方法

Also Published As

Publication number Publication date
JP3173676B2 (ja) 2001-06-04
JPH05326675A (ja) 1993-12-10
KR930020629A (ko) 1993-10-20

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