TW253984B - - Google Patents

Info

Publication number: TW253984B
Authority: TW; Taiwan

Application number

TW081108248A

Other languages

Chinese (zh)

Original Assignee

Gold Star Electronics

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1991-11-14

Filing date

1992-10-16

Publication date

1995-08-11

1992-10-16 Application filed by Gold Star Electronics filed Critical Gold Star Electronics

1995-08-11 Application granted granted Critical

1995-08-11 Publication of TW253984B publication Critical patent/TW253984B/zh

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/688—Flexible insulating substrates
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/016—Manufacture or treatment using moulds
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

TW081108248A 1991-11-14 1992-10-16 TW253984B (2)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
KR1019910020242A KR940005712B1 (ko)	1991-11-14	1991-11-14	잭 타입 아이씨 패키지(jack-type ic package)

Publications (1)

Publication Number	Publication Date
TW253984B true TW253984B (2)	1995-08-11

Family

ID=19322814

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW081108248A TW253984B (2)	1991-11-14	1992-10-16

Country Status (5)

Country	Link
US (1)	US5365404A (2)
JP (1)	JPH05218232A (2)
KR (1)	KR940005712B1 (2)
DE (1)	DE4237267C2 (2)
TW (1)	TW253984B (2)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4340266A (en) *	1978-05-22	1982-07-20	Minnesota Mining And Manufacturing Company	Connector system
US4331371A (en) *	1979-03-09	1982-05-25	Japan Aviation Electronics Industry, Ltd.	Electrical connector
FR2554980B1 (fr) *	1983-11-10	1986-01-17	Socapex	Connecteur a force d'insertion nulle pour support rectangulaire de circuit et pince de fermeture pour un tel connecteur
US4783695A (en) *	1986-09-26	1988-11-08	General Electric Company	Multichip integrated circuit packaging configuration and method
JPS63253653A (ja) *	1987-04-10	1988-10-20	Citizen Watch Co Ltd	樹脂封止型ピングリツドアレイ及びその製造方法
US5180976A (en) *	1987-04-17	1993-01-19	Everett/Charles Contact Products, Inc.	Integrated circuit carrier having built-in circuit verification
JPH0777255B2 (ja) *	1988-07-26	1995-08-16	松下電工株式会社	ピングリッドアレイおよび半導体素子塔載方法
US4936783A (en) *	1988-12-21	1990-06-26	Minnesota Mining And Manufacturing Company	Electronic socket for IC quad pack
US4912547A (en) *	1989-01-30	1990-03-27	International Business Machines Corporation	Tape bonded semiconductor device

1991
- 1991-11-14 KR KR1019910020242A patent/KR940005712B1/ko not_active Expired - Fee Related
1992
- 1992-10-16 TW TW081108248A patent/TW253984B/zh active
- 1992-10-19 US US07/962,878 patent/US5365404A/en not_active Expired - Lifetime
- 1992-11-04 DE DE4237267A patent/DE4237267C2/de not_active Expired - Fee Related
- 1992-11-12 JP JP4302041A patent/JPH05218232A/ja active Pending

Also Published As

Publication number	Publication date
KR940005712B1 (ko)	1994-06-23
KR930011138A (ko)	1993-06-23
DE4237267A1 (en)	1993-05-19
US5365404A (en)	1994-11-15
JPH05218232A (ja)	1993-08-27
DE4237267C2 (de)	2000-03-09

Publication	Publication Date	Title
DE4290261T1 (2)	1993-01-28
DK0498143T3 (2)	1997-03-03
DE4291719T1 (2)	1993-07-15
TW245847B (2)	1995-04-21
DE4292255T1 (2)	1993-07-15
DE4291827T1 (2)	1993-06-03
DE4291721T1 (2)	1993-05-13
ATA181891A (2)	1995-01-15
JPH0496789U (2)	1992-08-21
JPH0490139U (2)	1992-08-06
JPH04100528U (2)	1992-08-31
DE4193594T1 (2)	1993-05-13
JPH0498560U (2)	1992-08-26
TW225596B (2)	1994-06-21
TW253984B (2)	1995-08-11
IN179635B (2)	1997-11-01
ECSM91556U (2)	1992-03-27
ECSM91561U (2)	1992-05-25
ECSDI910041S (2)	1992-12-21
ITTO910848A0 (2)	1991-11-07
ECSM91543U (2)	1992-02-14
DK132791D0 (2)	1991-07-09
JPH0496917U (2)	1992-08-21
ECSM91533U (2)	1991-11-04
ECSDI910049S (2)	1992-06-03