TW278207B - Method and apparatus for deposition of material on a semiconductor wafer - Google Patents

Method and apparatus for deposition of material on a semiconductor wafer

Info

Publication number
TW278207B
TW278207B TW84107533A TW84107533A TW278207B TW 278207 B TW278207 B TW 278207B TW 84107533 A TW84107533 A TW 84107533A TW 84107533 A TW84107533 A TW 84107533A TW 278207 B TW278207 B TW 278207B
Authority
TW
Taiwan
Prior art keywords
deposition
nozzles
mass flow
during
semiconductor wafer
Prior art date
Application number
TW84107533A
Other languages
Chinese (zh)
Inventor
H Glaenzer Richard
Original Assignee
Memc Electronic Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memc Electronic Materials filed Critical Memc Electronic Materials
Priority to TW84107533A priority Critical patent/TW278207B/en
Application granted granted Critical
Publication of TW278207B publication Critical patent/TW278207B/en

Links

Abstract

A method and apparatus for deposition of material on a semiconductor wafer (W) which produces a high level of thickness uniformity on each wafer and among the several wafers processed at the same time in a barrel reactor (10). The mass flow rates ofreactant vapor and its carrier gas from two nozzles (20,21) into the reaction chamber of the barrel reactor are purposely unbalanced. A first of the nozzles (20) emits gas at a greater mass flow rate than a second of the nozzles (21) during a first half of the deposition cycle. The second nozzle emits gas at a greater mass flow rate than the first nozzle during a second half of the deposition cycle. The composite of the layers deposited on the wafers during each half cycle produces a layer having a uniform thickness.
TW84107533A 1995-07-20 1995-07-20 Method and apparatus for deposition of material on a semiconductor wafer TW278207B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW84107533A TW278207B (en) 1995-07-20 1995-07-20 Method and apparatus for deposition of material on a semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW84107533A TW278207B (en) 1995-07-20 1995-07-20 Method and apparatus for deposition of material on a semiconductor wafer

Publications (1)

Publication Number Publication Date
TW278207B true TW278207B (en) 1996-06-11

Family

ID=51397441

Family Applications (1)

Application Number Title Priority Date Filing Date
TW84107533A TW278207B (en) 1995-07-20 1995-07-20 Method and apparatus for deposition of material on a semiconductor wafer

Country Status (1)

Country Link
TW (1) TW278207B (en)

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