TW282573B - - Google Patents
Info
- Publication number
- TW282573B TW282573B TW83111008A TW83111008A TW282573B TW 282573 B TW282573 B TW 282573B TW 83111008 A TW83111008 A TW 83111008A TW 83111008 A TW83111008 A TW 83111008A TW 282573 B TW282573 B TW 282573B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12662693A JP2789563B2 (ja) | 1993-05-28 | 1993-05-28 | 集積回路装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW282573B true TW282573B (cs) | 1996-08-01 |
Family
ID=14939852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW83111008A TW282573B (cs) | 1993-05-28 | 1994-11-26 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2789563B2 (cs) |
| TW (1) | TW282573B (cs) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6181006B1 (en) * | 1998-05-28 | 2001-01-30 | Ericsson Inc. | Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sink |
| JP5382049B2 (ja) | 2010-06-30 | 2014-01-08 | 株式会社デンソー | 半導体装置 |
| JP6316731B2 (ja) * | 2014-01-14 | 2018-04-25 | 新光電気工業株式会社 | 配線基板及びその製造方法、並びに半導体パッケージ |
-
1993
- 1993-05-28 JP JP12662693A patent/JP2789563B2/ja not_active Expired - Fee Related
-
1994
- 1994-11-26 TW TW83111008A patent/TW282573B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2789563B2 (ja) | 1998-08-20 |
| JPH06338577A (ja) | 1994-12-06 |