TW297808B - - Google Patents

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Publication number
TW297808B
TW297808B TW83108847A TW83108847A TW297808B TW 297808 B TW297808 B TW 297808B TW 83108847 A TW83108847 A TW 83108847A TW 83108847 A TW83108847 A TW 83108847A TW 297808 B TW297808 B TW 297808B
Authority
TW
Taiwan
Prior art keywords
flow channel
resin
thermosetting resin
movable
packaging
Prior art date
Application number
TW83108847A
Other languages
English (en)
Chinese (zh)
Original Assignee
Tomas Kagi Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomas Kagi Kk filed Critical Tomas Kagi Kk
Application granted granted Critical
Publication of TW297808B publication Critical patent/TW297808B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B29C2045/024—Transfer plungers and pots with an oblong cross section

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
TW83108847A 1993-09-30 1994-09-23 TW297808B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5245483A JP2683204B2 (ja) 1993-09-30 1993-09-30 樹脂パッケージング方法及びその装置

Publications (1)

Publication Number Publication Date
TW297808B true TW297808B (it) 1997-02-11

Family

ID=17134336

Family Applications (1)

Application Number Title Priority Date Filing Date
TW83108847A TW297808B (it) 1993-09-30 1994-09-23

Country Status (2)

Country Link
JP (1) JP2683204B2 (it)
TW (1) TW297808B (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3596689B2 (ja) * 1995-05-31 2004-12-02 ローム株式会社 電子部品の樹脂封止装置およびこれを用いた樹脂封止方法
WO2016093265A1 (ja) * 2014-12-12 2016-06-16 エア・ウォーター・マッハ株式会社 成形方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57128931A (en) * 1981-02-04 1982-08-10 Yamagata Nippon Denki Kk Resin sealing for semiconductor device
JPH01232733A (ja) * 1988-03-14 1989-09-18 Hitachi Ltd 半導体樹脂封止装置

Also Published As

Publication number Publication date
JP2683204B2 (ja) 1997-11-26
JPH07106361A (ja) 1995-04-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees