TW304269B - - Google Patents

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Publication number
TW304269B
TW304269B TW085111510A TW85111510A TW304269B TW 304269 B TW304269 B TW 304269B TW 085111510 A TW085111510 A TW 085111510A TW 85111510 A TW85111510 A TW 85111510A TW 304269 B TW304269 B TW 304269B
Authority
TW
Taiwan
Prior art keywords
magnetic
powder
soft
item
gas
Prior art date
Application number
TW085111510A
Other languages
English (en)
Chinese (zh)
Original Assignee
Tokiin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=17113698&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW304269(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Tokiin Corp filed Critical Tokiin Corp
Application granted granted Critical
Publication of TW304269B publication Critical patent/TW304269B/zh

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/28Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder dispersed or suspended in a bonding agent

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Soft Magnetic Materials (AREA)
  • Hard Magnetic Materials (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Aerials With Secondary Devices (AREA)
TW085111510A 1995-09-22 1996-09-20 TW304269B (2)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7244096A JPH0993034A (ja) 1995-09-22 1995-09-22 複合磁性体及びその製造方法ならびに電磁干渉抑制体

Publications (1)

Publication Number Publication Date
TW304269B true TW304269B (2) 1997-05-01

Family

ID=17113698

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085111510A TW304269B (2) 1995-09-22 1996-09-20

Country Status (9)

Country Link
US (1) US5827445A (2)
EP (2) EP0764954B1 (2)
JP (1) JPH0993034A (2)
KR (1) KR100247444B1 (2)
CN (1) CN1097270C (2)
DE (2) DE69608933T2 (2)
MY (1) MY115205A (2)
SG (1) SG48471A1 (2)
TW (1) TW304269B (2)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0935927A (ja) * 1995-07-20 1997-02-07 Tokin Corp 複合磁性体及びそれを用いた電磁干渉抑制体
US6972097B2 (en) * 1995-07-20 2005-12-06 Nec Tokin Corporation Composite magnetic material and electromagnetic interference suppressor member using the same
JP3608063B2 (ja) * 1996-08-23 2005-01-05 Necトーキン株式会社 Emi対策部品及びそれを備えた能動素子
JP3404618B2 (ja) * 1996-09-02 2003-05-12 エヌイーシートーキン株式会社 電磁干渉抑制体
WO1998009788A1 (en) * 1996-09-03 1998-03-12 Tokin Corporation Method of manufacturing composite magnetic sheet
US6521140B2 (en) * 1996-09-06 2003-02-18 Nec Tokin Corp. Composite magnetic body and electromagnetic interference suppressing body using the same
JP3475386B2 (ja) * 1997-09-01 2003-12-08 Necトーキン株式会社 電磁干渉抑制体
JPH11112229A (ja) * 1997-10-07 1999-04-23 Tokin Corp 複合磁性体,その製造方法,及びそれを用いた電磁干渉抑制体
JPH11214912A (ja) * 1998-01-27 1999-08-06 Tokin Corp 指向性アンテナ
EP1133780B1 (en) * 1999-09-28 2003-05-02 NEC TOKIN Corporation Composite magnetic sheet and method of producing the same
JP2001126910A (ja) * 1999-10-25 2001-05-11 Tokin Corp 複合磁性体、複合磁性体シートおよびそれらの製造方法
US6586046B1 (en) 2000-01-26 2003-07-01 General Electric Company Fluidized bed apparatus and method for treatment of nonspherical, nonequiaxed particles
JP2001210510A (ja) * 2000-01-28 2001-08-03 Tokin Corp 軟磁性粉末及びそれを用いた複合磁性体
JP2001297905A (ja) * 2000-04-17 2001-10-26 Tokin Corp 高周波電流抑制体
WO2001080616A2 (en) * 2000-04-17 2001-10-25 Tokin Corporation High-frequency current supressor capable of being readily attached to cable or the like and earphone system using the same
GB0211443D0 (en) * 2002-05-18 2002-06-26 Qinetiq Ltd Microwave absorbent material
US20040041121A1 (en) * 2002-08-30 2004-03-04 Shigeyoshi Yoshida Magnetic loss material and method of producing the same
US6914183B2 (en) * 2002-09-25 2005-07-05 Sumitomo Electric Industries, Ltd. Board for printed wiring
US7868723B2 (en) * 2003-02-26 2011-01-11 Analogic Corporation Power coupling device
US9368272B2 (en) 2003-02-26 2016-06-14 Analogic Corporation Shielded power coupling device
US8350655B2 (en) * 2003-02-26 2013-01-08 Analogic Corporation Shielded power coupling device
US9490063B2 (en) 2003-02-26 2016-11-08 Analogic Corporation Shielded power coupling device
US7625633B2 (en) 2003-03-25 2009-12-01 Shin-Etsu Polymer., Ltd. Electromagnetic noise suppressor, article with electromagnetic noise suppressing function, and their manufacturing methods
JP4010296B2 (ja) * 2003-11-20 2007-11-21 株式会社デンソー 軟磁性粉末材料の製造方法
JP4417377B2 (ja) 2004-02-24 2010-02-17 信越ポリマー株式会社 電磁波ノイズ抑制体、電磁波ノイズ抑制機能付構造体、およびそれらの製造方法
US8134084B2 (en) 2006-06-30 2012-03-13 Shin-Etsu Polymer Co., Ltd. Noise-suppressing wiring-member and printed wiring board
JP4692768B2 (ja) * 2006-12-08 2011-06-01 住友電気工業株式会社 軟磁性複合材料
CN101231707A (zh) * 2007-01-25 2008-07-30 3M创新有限公司 电磁屏蔽装置
US9972913B2 (en) 2009-12-15 2018-05-15 Asahi Kasei Fibers Corporation Noise absorbing fabric
JP2011129798A (ja) * 2009-12-21 2011-06-30 Mitsumi Electric Co Ltd 高周波用磁性材料、高周波デバイス及び磁性粒子
JP4692859B2 (ja) * 2010-08-19 2011-06-01 住友電気工業株式会社 リアクトル
DE102014215318A1 (de) * 2014-08-04 2016-02-04 Siemens Aktiengesellschaft Anisotrop weichmagnetisches Komposit-Material mit hoher Anisotropie der Permeabilität zur Unterdrückung von Querfluss und dessen Herstellung
US11229147B2 (en) 2015-02-06 2022-01-18 Laird Technologies, Inc. Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide
US10287413B2 (en) 2016-12-19 2019-05-14 3M Innovative Properties Company Thermoplastic polymer composite containing soft, ferromagnetic particulate material and methods of making thereof
KR102722514B1 (ko) 2017-11-16 2024-10-29 쓰리엠 이노베이티브 프로퍼티즈 캄파니 중합체 매트릭스 복합재의 제조 방법
US10836873B2 (en) 2017-11-16 2020-11-17 3M Innovative Properties Company Polymer matrix composites comprising thermally insulating particles and methods of making the same
JP2021503718A (ja) * 2017-11-16 2021-02-12 ジョージア テック リサーチ コーポレイション 磁性層を有する基板対応インダクタ
US11732104B2 (en) 2017-11-16 2023-08-22 3M Innovative Properties Company Polymer matrix composites comprising dielectric particles and methods of making the same
US10913834B2 (en) 2017-11-16 2021-02-09 3M Innovative Properties Company Polymer matrix composites comprising indicator particles and methods of making the same
US10927228B2 (en) 2017-11-16 2021-02-23 3M Innovative Properties Company Polymer matrix composites comprising intumescent particles and methods of making the same
WO2019097446A1 (en) 2017-11-16 2019-05-23 3M Innovative Properties Company Polymer matrix composites comprising functional particles and methods of making the same
EP3969508A1 (en) 2019-05-15 2022-03-23 3M Innovative Properties Company (co)polymer matrix composites comprising thermally-conductive particles and magnetic particles and methods of making the same
KR102771530B1 (ko) * 2019-07-19 2025-02-20 현대자동차주식회사 자기유변 탄성체

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1024647B (de) * 1954-11-24 1958-02-20 Deutsche Edelstahlwerke Ag Ferromagnetische Bestandteile enthaltender, magnetisch haftender, biegsamer Formkoerper
FR1152152A (fr) * 1956-03-20 1958-02-12 Thomson Houston Comp Francaise Matière anti-réflectrice absorbant les ondes hertziennes
US2873225A (en) * 1957-05-20 1959-02-10 Adams Edmond Magnetic flake core
JPS62221199A (ja) * 1986-03-24 1987-09-29 株式会社 リケン 磁気シ−ルド材
GB2232165A (en) * 1989-03-22 1990-12-05 Cookson Group Plc Magnetic compositions
US5352268A (en) * 1989-12-12 1994-10-04 Hitachi Metals, Ltd. Fe-Ni alloy fine powder of flat shape
US5207841A (en) * 1990-04-12 1993-05-04 Tdk Corporation Soft magnetic powder and magnetic shield composition
JPH04276002A (ja) * 1991-02-28 1992-10-01 Hitachi Metals Ltd 扁平状軟磁性Fe−Co合金微粉末
DE4124458A1 (de) * 1991-07-24 1993-01-28 Degussa Emi-abschirmpigmente, verfahren zu deren herstellung und deren verwendung
FI117224B (fi) * 1994-01-20 2006-07-31 Nec Tokin Corp Sähkömagneettinen häiriönpoistokappale, ja sitä soveltavat elektroninen laite ja hybridimikropiirielementti
JP3401650B2 (ja) * 1994-01-20 2003-04-28 エヌイーシートーキン株式会社 電磁波干渉抑制体

Also Published As

Publication number Publication date
CN1097270C (zh) 2002-12-25
EP0764954A1 (en) 1997-03-26
DE69608933T2 (de) 2000-11-16
EP0951023B1 (en) 2001-12-19
JPH0993034A (ja) 1997-04-04
SG48471A1 (en) 1998-04-17
DE69618252D1 (de) 2002-01-31
DE69618252T2 (de) 2002-08-22
EP0951023A3 (en) 1999-11-03
KR100247444B1 (ko) 2000-03-15
EP0951023A2 (en) 1999-10-20
MY115205A (en) 2003-04-30
EP0764954B1 (en) 2000-06-21
CN1149747A (zh) 1997-05-14
DE69608933D1 (de) 2000-07-27
KR970017717A (ko) 1997-04-30
US5827445A (en) 1998-10-27

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