TW304269B - - Google Patents
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- Publication number
- TW304269B TW304269B TW085111510A TW85111510A TW304269B TW 304269 B TW304269 B TW 304269B TW 085111510 A TW085111510 A TW 085111510A TW 85111510 A TW85111510 A TW 85111510A TW 304269 B TW304269 B TW 304269B
- Authority
- TW
- Taiwan
- Prior art keywords
- magnetic
- powder
- soft
- item
- gas
- Prior art date
Links
- 239000000843 powder Substances 0.000 claims description 46
- 239000006247 magnetic powder Substances 0.000 claims description 37
- 239000002245 particle Substances 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 28
- 239000000203 mixture Substances 0.000 claims description 28
- 239000007789 gas Substances 0.000 claims description 24
- 239000010410 layer Substances 0.000 claims description 14
- 238000002309 gasification Methods 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 12
- 239000011230 binding agent Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- 239000002344 surface layer Substances 0.000 claims description 5
- 230000008859 change Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 230000036961 partial effect Effects 0.000 claims description 4
- 230000000704 physical effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 230000005415 magnetization Effects 0.000 claims 1
- 230000014759 maintenance of location Effects 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 230000000979 retarding effect Effects 0.000 claims 1
- 230000035699 permeability Effects 0.000 description 28
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 238000000137 annealing Methods 0.000 description 16
- 239000010408 film Substances 0.000 description 11
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 10
- -1 iron-aluminum-silicon Chemical compound 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 8
- 239000010409 thin film Substances 0.000 description 8
- 229910000676 Si alloy Inorganic materials 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 239000006249 magnetic particle Substances 0.000 description 7
- 239000012071 phase Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 239000000696 magnetic material Substances 0.000 description 6
- 239000004848 polyfunctional curative Substances 0.000 description 6
- 239000007858 starting material Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 230000001629 suppression Effects 0.000 description 5
- 230000005347 demagnetization Effects 0.000 description 4
- 239000007791 liquid phase Substances 0.000 description 4
- 238000011068 loading method Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229960005419 nitrogen Drugs 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000013467 fragmentation Methods 0.000 description 3
- 238000006062 fragmentation reaction Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000000877 morphologic effect Effects 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 240000007817 Olea europaea Species 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 230000001568 sexual effect Effects 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- XINQFOMFQFGGCQ-UHFFFAOYSA-L (2-dodecoxy-2-oxoethyl)-[6-[(2-dodecoxy-2-oxoethyl)-dimethylazaniumyl]hexyl]-dimethylazanium;dichloride Chemical compound [Cl-].[Cl-].CCCCCCCCCCCCOC(=O)C[N+](C)(C)CCCCCC[N+](C)(C)CC(=O)OCCCCCCCCCCCC XINQFOMFQFGGCQ-UHFFFAOYSA-L 0.000 description 1
- 241000208340 Araliaceae Species 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000004705 aldimines Chemical class 0.000 description 1
- KCZFLPPCFOHPNI-UHFFFAOYSA-N alumane;iron Chemical compound [AlH3].[Fe] KCZFLPPCFOHPNI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000002079 cooperative effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920003244 diene elastomer Polymers 0.000 description 1
- 208000036526 difference of sexual differentiation Diseases 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 235000012907 honey Nutrition 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- PANJMBIFGCKWBY-UHFFFAOYSA-N iron tricyanide Chemical compound N#C[Fe](C#N)C#N PANJMBIFGCKWBY-UHFFFAOYSA-N 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 108010007425 oligomycin sensitivity conferring protein Proteins 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005211 surface analysis Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/28—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder dispersed or suspended in a bonding agent
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Soft Magnetic Materials (AREA)
- Hard Magnetic Materials (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Aerials With Secondary Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7244096A JPH0993034A (ja) | 1995-09-22 | 1995-09-22 | 複合磁性体及びその製造方法ならびに電磁干渉抑制体 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW304269B true TW304269B (2) | 1997-05-01 |
Family
ID=17113698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW085111510A TW304269B (2) | 1995-09-22 | 1996-09-20 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US5827445A (2) |
| EP (2) | EP0764954B1 (2) |
| JP (1) | JPH0993034A (2) |
| KR (1) | KR100247444B1 (2) |
| CN (1) | CN1097270C (2) |
| DE (2) | DE69608933T2 (2) |
| MY (1) | MY115205A (2) |
| SG (1) | SG48471A1 (2) |
| TW (1) | TW304269B (2) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0935927A (ja) * | 1995-07-20 | 1997-02-07 | Tokin Corp | 複合磁性体及びそれを用いた電磁干渉抑制体 |
| US6972097B2 (en) * | 1995-07-20 | 2005-12-06 | Nec Tokin Corporation | Composite magnetic material and electromagnetic interference suppressor member using the same |
| JP3608063B2 (ja) * | 1996-08-23 | 2005-01-05 | Necトーキン株式会社 | Emi対策部品及びそれを備えた能動素子 |
| JP3404618B2 (ja) * | 1996-09-02 | 2003-05-12 | エヌイーシートーキン株式会社 | 電磁干渉抑制体 |
| WO1998009788A1 (en) * | 1996-09-03 | 1998-03-12 | Tokin Corporation | Method of manufacturing composite magnetic sheet |
| US6521140B2 (en) * | 1996-09-06 | 2003-02-18 | Nec Tokin Corp. | Composite magnetic body and electromagnetic interference suppressing body using the same |
| JP3475386B2 (ja) * | 1997-09-01 | 2003-12-08 | Necトーキン株式会社 | 電磁干渉抑制体 |
| JPH11112229A (ja) * | 1997-10-07 | 1999-04-23 | Tokin Corp | 複合磁性体,その製造方法,及びそれを用いた電磁干渉抑制体 |
| JPH11214912A (ja) * | 1998-01-27 | 1999-08-06 | Tokin Corp | 指向性アンテナ |
| EP1133780B1 (en) * | 1999-09-28 | 2003-05-02 | NEC TOKIN Corporation | Composite magnetic sheet and method of producing the same |
| JP2001126910A (ja) * | 1999-10-25 | 2001-05-11 | Tokin Corp | 複合磁性体、複合磁性体シートおよびそれらの製造方法 |
| US6586046B1 (en) | 2000-01-26 | 2003-07-01 | General Electric Company | Fluidized bed apparatus and method for treatment of nonspherical, nonequiaxed particles |
| JP2001210510A (ja) * | 2000-01-28 | 2001-08-03 | Tokin Corp | 軟磁性粉末及びそれを用いた複合磁性体 |
| JP2001297905A (ja) * | 2000-04-17 | 2001-10-26 | Tokin Corp | 高周波電流抑制体 |
| WO2001080616A2 (en) * | 2000-04-17 | 2001-10-25 | Tokin Corporation | High-frequency current supressor capable of being readily attached to cable or the like and earphone system using the same |
| GB0211443D0 (en) * | 2002-05-18 | 2002-06-26 | Qinetiq Ltd | Microwave absorbent material |
| US20040041121A1 (en) * | 2002-08-30 | 2004-03-04 | Shigeyoshi Yoshida | Magnetic loss material and method of producing the same |
| US6914183B2 (en) * | 2002-09-25 | 2005-07-05 | Sumitomo Electric Industries, Ltd. | Board for printed wiring |
| US7868723B2 (en) * | 2003-02-26 | 2011-01-11 | Analogic Corporation | Power coupling device |
| US9368272B2 (en) | 2003-02-26 | 2016-06-14 | Analogic Corporation | Shielded power coupling device |
| US8350655B2 (en) * | 2003-02-26 | 2013-01-08 | Analogic Corporation | Shielded power coupling device |
| US9490063B2 (en) | 2003-02-26 | 2016-11-08 | Analogic Corporation | Shielded power coupling device |
| US7625633B2 (en) | 2003-03-25 | 2009-12-01 | Shin-Etsu Polymer., Ltd. | Electromagnetic noise suppressor, article with electromagnetic noise suppressing function, and their manufacturing methods |
| JP4010296B2 (ja) * | 2003-11-20 | 2007-11-21 | 株式会社デンソー | 軟磁性粉末材料の製造方法 |
| JP4417377B2 (ja) | 2004-02-24 | 2010-02-17 | 信越ポリマー株式会社 | 電磁波ノイズ抑制体、電磁波ノイズ抑制機能付構造体、およびそれらの製造方法 |
| US8134084B2 (en) | 2006-06-30 | 2012-03-13 | Shin-Etsu Polymer Co., Ltd. | Noise-suppressing wiring-member and printed wiring board |
| JP4692768B2 (ja) * | 2006-12-08 | 2011-06-01 | 住友電気工業株式会社 | 軟磁性複合材料 |
| CN101231707A (zh) * | 2007-01-25 | 2008-07-30 | 3M创新有限公司 | 电磁屏蔽装置 |
| US9972913B2 (en) | 2009-12-15 | 2018-05-15 | Asahi Kasei Fibers Corporation | Noise absorbing fabric |
| JP2011129798A (ja) * | 2009-12-21 | 2011-06-30 | Mitsumi Electric Co Ltd | 高周波用磁性材料、高周波デバイス及び磁性粒子 |
| JP4692859B2 (ja) * | 2010-08-19 | 2011-06-01 | 住友電気工業株式会社 | リアクトル |
| DE102014215318A1 (de) * | 2014-08-04 | 2016-02-04 | Siemens Aktiengesellschaft | Anisotrop weichmagnetisches Komposit-Material mit hoher Anisotropie der Permeabilität zur Unterdrückung von Querfluss und dessen Herstellung |
| US11229147B2 (en) | 2015-02-06 | 2022-01-18 | Laird Technologies, Inc. | Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide |
| US10287413B2 (en) | 2016-12-19 | 2019-05-14 | 3M Innovative Properties Company | Thermoplastic polymer composite containing soft, ferromagnetic particulate material and methods of making thereof |
| KR102722514B1 (ko) | 2017-11-16 | 2024-10-29 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 중합체 매트릭스 복합재의 제조 방법 |
| US10836873B2 (en) | 2017-11-16 | 2020-11-17 | 3M Innovative Properties Company | Polymer matrix composites comprising thermally insulating particles and methods of making the same |
| JP2021503718A (ja) * | 2017-11-16 | 2021-02-12 | ジョージア テック リサーチ コーポレイション | 磁性層を有する基板対応インダクタ |
| US11732104B2 (en) | 2017-11-16 | 2023-08-22 | 3M Innovative Properties Company | Polymer matrix composites comprising dielectric particles and methods of making the same |
| US10913834B2 (en) | 2017-11-16 | 2021-02-09 | 3M Innovative Properties Company | Polymer matrix composites comprising indicator particles and methods of making the same |
| US10927228B2 (en) | 2017-11-16 | 2021-02-23 | 3M Innovative Properties Company | Polymer matrix composites comprising intumescent particles and methods of making the same |
| WO2019097446A1 (en) | 2017-11-16 | 2019-05-23 | 3M Innovative Properties Company | Polymer matrix composites comprising functional particles and methods of making the same |
| EP3969508A1 (en) | 2019-05-15 | 2022-03-23 | 3M Innovative Properties Company | (co)polymer matrix composites comprising thermally-conductive particles and magnetic particles and methods of making the same |
| KR102771530B1 (ko) * | 2019-07-19 | 2025-02-20 | 현대자동차주식회사 | 자기유변 탄성체 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1024647B (de) * | 1954-11-24 | 1958-02-20 | Deutsche Edelstahlwerke Ag | Ferromagnetische Bestandteile enthaltender, magnetisch haftender, biegsamer Formkoerper |
| FR1152152A (fr) * | 1956-03-20 | 1958-02-12 | Thomson Houston Comp Francaise | Matière anti-réflectrice absorbant les ondes hertziennes |
| US2873225A (en) * | 1957-05-20 | 1959-02-10 | Adams Edmond | Magnetic flake core |
| JPS62221199A (ja) * | 1986-03-24 | 1987-09-29 | 株式会社 リケン | 磁気シ−ルド材 |
| GB2232165A (en) * | 1989-03-22 | 1990-12-05 | Cookson Group Plc | Magnetic compositions |
| US5352268A (en) * | 1989-12-12 | 1994-10-04 | Hitachi Metals, Ltd. | Fe-Ni alloy fine powder of flat shape |
| US5207841A (en) * | 1990-04-12 | 1993-05-04 | Tdk Corporation | Soft magnetic powder and magnetic shield composition |
| JPH04276002A (ja) * | 1991-02-28 | 1992-10-01 | Hitachi Metals Ltd | 扁平状軟磁性Fe−Co合金微粉末 |
| DE4124458A1 (de) * | 1991-07-24 | 1993-01-28 | Degussa | Emi-abschirmpigmente, verfahren zu deren herstellung und deren verwendung |
| FI117224B (fi) * | 1994-01-20 | 2006-07-31 | Nec Tokin Corp | Sähkömagneettinen häiriönpoistokappale, ja sitä soveltavat elektroninen laite ja hybridimikropiirielementti |
| JP3401650B2 (ja) * | 1994-01-20 | 2003-04-28 | エヌイーシートーキン株式会社 | 電磁波干渉抑制体 |
-
1995
- 1995-09-22 JP JP7244096A patent/JPH0993034A/ja active Pending
-
1996
- 1996-09-17 US US08/714,805 patent/US5827445A/en not_active Expired - Lifetime
- 1996-09-17 DE DE69608933T patent/DE69608933T2/de not_active Expired - Lifetime
- 1996-09-17 EP EP96114895A patent/EP0764954B1/en not_active Expired - Lifetime
- 1996-09-17 EP EP99114943A patent/EP0951023B1/en not_active Expired - Lifetime
- 1996-09-17 DE DE69618252T patent/DE69618252T2/de not_active Expired - Lifetime
- 1996-09-18 MY MYPI96003855A patent/MY115205A/en unknown
- 1996-09-20 SG SG1996010660A patent/SG48471A1/en unknown
- 1996-09-20 CN CN96112346A patent/CN1097270C/zh not_active Expired - Lifetime
- 1996-09-20 TW TW085111510A patent/TW304269B/zh not_active IP Right Cessation
- 1996-09-20 KR KR1019960041006A patent/KR100247444B1/ko not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CN1097270C (zh) | 2002-12-25 |
| EP0764954A1 (en) | 1997-03-26 |
| DE69608933T2 (de) | 2000-11-16 |
| EP0951023B1 (en) | 2001-12-19 |
| JPH0993034A (ja) | 1997-04-04 |
| SG48471A1 (en) | 1998-04-17 |
| DE69618252D1 (de) | 2002-01-31 |
| DE69618252T2 (de) | 2002-08-22 |
| EP0951023A3 (en) | 1999-11-03 |
| KR100247444B1 (ko) | 2000-03-15 |
| EP0951023A2 (en) | 1999-10-20 |
| MY115205A (en) | 2003-04-30 |
| EP0764954B1 (en) | 2000-06-21 |
| CN1149747A (zh) | 1997-05-14 |
| DE69608933D1 (de) | 2000-07-27 |
| KR970017717A (ko) | 1997-04-30 |
| US5827445A (en) | 1998-10-27 |
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