TW311270B - - Google Patents

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Info

Publication number: TW311270B
Authority: TW; Taiwan
Prior art keywords: mold; lead frame; epoxy resin; molding compound; injection
Prior art date: 1995-01-26

Application number

TW85108705A

Other languages

English (en)

Chinese (zh)

Original Assignee

Sumitomo Bakelite Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1995-01-26

Filing date

1996-07-17

Publication date

1997-07-21

1996-01-24 Priority claimed from JP1005096A external-priority patent/JPH08264573A/ja

1996-01-24 Priority claimed from JP01005196A external-priority patent/JP3192957B2/ja

1996-07-17 Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co

1997-07-21 Application granted granted Critical

1997-07-21 Publication of TW311270B publication Critical patent/TW311270B/zh

Links

238000000465 moulding Methods 0.000 claims description 140
150000001875 compounds Chemical class 0.000 claims description 83
238000001746 injection moulding Methods 0.000 claims description 60
238000002347 injection Methods 0.000 claims description 56
239000007924 injection Substances 0.000 claims description 56
239000003822 epoxy resin Substances 0.000 claims description 48
229920000647 polyepoxide Polymers 0.000 claims description 48
239000004065 semiconductor Substances 0.000 claims description 39
238000000034 method Methods 0.000 claims description 27
230000007246 mechanism Effects 0.000 claims description 17
238000004519 manufacturing process Methods 0.000 claims description 12
239000004593 Epoxy Substances 0.000 claims description 9
239000005011 phenolic resin Substances 0.000 claims description 7
229920006336 epoxy molding compound Polymers 0.000 claims description 4
239000004848 polyfunctional curative Substances 0.000 claims description 4
238000010438 heat treatment Methods 0.000 claims description 3
230000002079 cooperative effect Effects 0.000 claims 3
PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
238000003780 insertion Methods 0.000 claims 1
230000037431 insertion Effects 0.000 claims 1
238000006243 chemical reaction Methods 0.000 description 13
229920005989 resin Polymers 0.000 description 11
239000011347 resin Substances 0.000 description 11
238000005520 cutting process Methods 0.000 description 7
238000012545 processing Methods 0.000 description 7
WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 description 6
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
238000005259 measurement Methods 0.000 description 6
239000000155 melt Substances 0.000 description 6
229920003986 novolac Polymers 0.000 description 5
230000008569 process Effects 0.000 description 5
ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
230000000694 effects Effects 0.000 description 4
239000005350 fused silica glass Substances 0.000 description 4
238000007542 hardness measurement Methods 0.000 description 4
125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
238000007689 inspection Methods 0.000 description 4
239000002932 luster Substances 0.000 description 4
239000000203 mixture Substances 0.000 description 4
239000006082 mold release agent Substances 0.000 description 4
239000004843 novolac epoxy resin Substances 0.000 description 4
238000011179 visual inspection Methods 0.000 description 4
239000002699 waste material Substances 0.000 description 4
QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
238000005452 bending Methods 0.000 description 3
229930003836 cresol Natural products 0.000 description 3
239000000843 powder Substances 0.000 description 3
XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
230000009471 action Effects 0.000 description 2
238000010586 diagram Methods 0.000 description 2
239000008187 granular material Substances 0.000 description 2
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
239000012535 impurity Substances 0.000 description 2
239000000463 material Substances 0.000 description 2
229920001568 phenolic resin Polymers 0.000 description 2
238000007639 printing Methods 0.000 description 2
230000009467 reduction Effects 0.000 description 2
238000000926 separation method Methods 0.000 description 2
229920001187 thermosetting polymer Polymers 0.000 description 2
RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
WZZBNLYBHUDSHF-DHLKQENFSA-N 1-[(3s,4s)-4-[8-(2-chloro-4-pyrimidin-2-yloxyphenyl)-7-fluoro-2-methylimidazo[4,5-c]quinolin-1-yl]-3-fluoropiperidin-1-yl]-2-hydroxyethanone Chemical compound CC1=NC2=CN=C3C=C(F)C(C=4C(=CC(OC=5N=CC=CN=5)=CC=4)Cl)=CC3=C2N1[C@H]1CCN(C(=O)CO)C[C@@H]1F WZZBNLYBHUDSHF-DHLKQENFSA-N 0.000 description 1
UNILWMWFPHPYOR-KXEYIPSPSA-M 1-[6-[2-[3-[3-[3-[2-[2-[3-[[2-[2-[[(2r)-1-[[2-[[(2r)-1-[3-[2-[2-[3-[[2-(2-amino-2-oxoethoxy)acetyl]amino]propoxy]ethoxy]ethoxy]propylamino]-3-hydroxy-1-oxopropan-2-yl]amino]-2-oxoethyl]amino]-3-[(2r)-2,3-di(hexadecanoyloxy)propyl]sulfanyl-1-oxopropan-2-yl Chemical compound O=C1C(SCCC(=O)NCCCOCCOCCOCCCNC(=O)COCC(=O)N[C@@H](CSC[C@@H](COC(=O)CCCCCCCCCCCCCCC)OC(=O)CCCCCCCCCCCCCCC)C(=O)NCC(=O)N[C@H](CO)C(=O)NCCCOCCOCCOCCCNC(=O)COCC(N)=O)CC(=O)N1CCNC(=O)CCCCCN\1C2=CC=C(S([O-])(=O)=O)C=C2CC/1=C/C=C/C=C/C1=[N+](CC)C2=CC=C(S([O-])(=O)=O)C=C2C1 UNILWMWFPHPYOR-KXEYIPSPSA-M 0.000 description 1
KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
229930185605 Bisphenol Natural products 0.000 description 1
HEFNNWSXXWATRW-UHFFFAOYSA-N Ibuprofen Chemical compound CC(C)CC1=CC=C(C(C)C(O)=O)C=C1 HEFNNWSXXWATRW-UHFFFAOYSA-N 0.000 description 1
206010041349 Somnolence Diseases 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
238000004891 communication Methods 0.000 description 1
230000002844 continuous effect Effects 0.000 description 1
238000010924 continuous production Methods 0.000 description 1
230000007423 decrease Effects 0.000 description 1
230000003247 decreasing effect Effects 0.000 description 1
-1 dicyclopentadiene modified phenol Chemical class 0.000 description 1
238000005538 encapsulation Methods 0.000 description 1
230000001747 exhibiting effect Effects 0.000 description 1
239000004413 injection moulding compound Substances 0.000 description 1
238000002955 isolation Methods 0.000 description 1
WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
230000007774 longterm Effects 0.000 description 1
235000012054 meals Nutrition 0.000 description 1
238000002844 melting Methods 0.000 description 1
230000008018 melting Effects 0.000 description 1
239000012528 membrane Substances 0.000 description 1
239000012778 molding material Substances 0.000 description 1
238000004806 packaging method and process Methods 0.000 description 1
229910000073 phosphorus hydride Inorganic materials 0.000 description 1
238000007781 pre-processing Methods 0.000 description 1
230000002441 reversible effect Effects 0.000 description 1
238000001175 rotational moulding Methods 0.000 description 1
239000000126 substance Substances 0.000 description 1
238000012546 transfer Methods 0.000 description 1

Landscapes

Injection Moulding Of Plastics Or The Like (AREA)

TW85108705A 1995-01-26 1996-07-17 TW311270B (2)

Applications Claiming Priority (5)

Application Number	Priority Date	Filing Date	Title
JP1106095		1995-01-26
JP1211695		1995-01-27
JP1211595		1995-01-27
JP1005096A JPH08264573A (ja)	1995-01-26	1996-01-24	半導体封止方法
JP01005196A JP3192957B2 (ja)	1995-01-27	1996-01-24	半導体封止方法

Publications (1)

Publication Number	Publication Date
TW311270B true TW311270B (2)	1997-07-21

Family

ID=51566430

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW85108705A TW311270B (2)	1995-01-26	1996-07-17

Country Status (1)

Country	Link
TW (1)	TW311270B (2)

1996
- 1996-07-17 TW TW85108705A patent/TW311270B/zh not_active IP Right Cessation

Legal Events

Date	Code	Title	Description
2016-04-21	MM4A	Annulment or lapse of patent due to non-payment of fees

Publication	Publication Date	Title
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US5158780A (en)	1992-10-27	Device for encapsulating electronic components
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JP3524982B2 (ja)	2004-05-10	半導体モールド装置
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JP3192957B2 (ja)	2001-07-30	半導体封止方法
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JPH02192742A (ja)	1990-07-30	半導体装置の樹脂封止方法
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JPH1140592A (ja)	1999-02-12	封止成形方法およびその装置
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JPH10138280A (ja)	1998-05-26	半導体封止方法
JPH08264575A (ja)	1996-10-11	半導体封止方法
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