TW322593B - - Google Patents

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Info

Publication number: TW322593B
Authority: TW; Taiwan
Prior art keywords: landmark; corrosion; surrounding; magnet mechanism; magnetic
Prior art date: 1997-05-19

Application number

TW86106676A

Other languages

English (en)

Chinese (zh)

Original Assignee

Aneruba Kk

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1997-05-19

Filing date

1997-05-19

Publication date

1997-12-11

1997-05-19 Application filed by Aneruba Kk filed Critical Aneruba Kk

1997-05-19 Priority to TW86106676A priority Critical patent/TW322593B/zh

1997-12-11 Application granted granted Critical

1997-12-11 Publication of TW322593B publication Critical patent/TW322593B/zh

Links

239000000758 substrate Substances 0.000 claims description 69
238000004544 sputter deposition Methods 0.000 claims description 61
230000007797 corrosion Effects 0.000 claims description 57
238000005260 corrosion Methods 0.000 claims description 57
230000007246 mechanism Effects 0.000 claims description 53
239000010409 thin film Substances 0.000 claims description 17
230000000875 corresponding effect Effects 0.000 claims description 11
150000002500 ions Chemical class 0.000 claims description 4
230000002079 cooperative effect Effects 0.000 claims description 3
QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 2
239000002245 particle Substances 0.000 description 32
239000010408 film Substances 0.000 description 27
238000000151 deposition Methods 0.000 description 18
230000008021 deposition Effects 0.000 description 18
239000000306 component Substances 0.000 description 17
BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 15
238000000034 method Methods 0.000 description 14
230000002093 peripheral effect Effects 0.000 description 13
238000000427 thin-film deposition Methods 0.000 description 13
239000007789 gas Substances 0.000 description 12
239000008358 core component Substances 0.000 description 9
238000000429 assembly Methods 0.000 description 8
230000000712 assembly Effects 0.000 description 8
230000000694 effects Effects 0.000 description 7
230000004907 flux Effects 0.000 description 7
230000008569 process Effects 0.000 description 7
238000010586 diagram Methods 0.000 description 6
238000009826 distribution Methods 0.000 description 6
238000004519 manufacturing process Methods 0.000 description 6
238000005516 engineering process Methods 0.000 description 5
XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
230000005684 electric field Effects 0.000 description 4
238000007747 plating Methods 0.000 description 3
239000004065 semiconductor Substances 0.000 description 3
244000227633 Ocotea pretiosa Species 0.000 description 2
235000004263 Ocotea pretiosa Nutrition 0.000 description 2
229910052786 argon Inorganic materials 0.000 description 2
230000001276 controlling effect Effects 0.000 description 2
230000007423 decrease Effects 0.000 description 2
238000001755 magnetron sputter deposition Methods 0.000 description 2
238000012546 transfer Methods 0.000 description 2
241000282326 Felis catus Species 0.000 description 1
RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
230000004888 barrier function Effects 0.000 description 1
230000008859 change Effects 0.000 description 1
238000013461 design Methods 0.000 description 1
230000006866 deterioration Effects 0.000 description 1
238000011161 development Methods 0.000 description 1
230000003628 erosive effect Effects 0.000 description 1
238000002474 experimental method Methods 0.000 description 1
239000012530 fluid Substances 0.000 description 1
239000011521 glass Substances 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
230000010354 integration Effects 0.000 description 1
239000004973 liquid crystal related substance Substances 0.000 description 1
229910052751 metal Inorganic materials 0.000 description 1
239000002184 metal Substances 0.000 description 1
238000001465 metallisation Methods 0.000 description 1
239000000203 mixture Substances 0.000 description 1
238000012856 packing Methods 0.000 description 1
238000012545 processing Methods 0.000 description 1
238000005546 reactive sputtering Methods 0.000 description 1
230000003068 static effect Effects 0.000 description 1
239000013077 target material Substances 0.000 description 1
239000010936 titanium Substances 0.000 description 1
229910052719 titanium Inorganic materials 0.000 description 1
238000003466 welding Methods 0.000 description 1
238000004804 winding Methods 0.000 description 1

Landscapes

Physical Vapour Deposition (AREA)

TW86106676A 1997-05-19 1997-05-19 TW322593B (fr)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
TW86106676A TW322593B (fr)	1997-05-19	1997-05-19

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
TW86106676A TW322593B (fr)	1997-05-19	1997-05-19

Publications (1)

Publication Number	Publication Date
TW322593B true TW322593B (fr)	1997-12-11

Family

ID=51567156

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW86106676A TW322593B (fr)	1997-05-19	1997-05-19

Country Status (1)

Country	Link
TW (1)	TW322593B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI414618B (zh) *	2005-08-26	2013-11-11	尼康股份有限公司	A holding device, an assembling system, a sputtering device, and a processing method and a processing device

1997
- 1997-05-19 TW TW86106676A patent/TW322593B/zh not_active IP Right Cessation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI414618B (zh) *	2005-08-26	2013-11-11	尼康股份有限公司	A holding device, an assembling system, a sputtering device, and a processing method and a processing device

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Legal Events

Date	Code	Title	Description
2017-09-11	MM4A	Annulment or lapse of patent due to non-payment of fees