TW335523B - Apparatus and method of manufacturing semicondctor, semiconductor carrier - Google Patents

Apparatus and method of manufacturing semicondctor, semiconductor carrier

Info

Publication number
TW335523B
TW335523B TW086100369A TW86100369A TW335523B TW 335523 B TW335523 B TW 335523B TW 086100369 A TW086100369 A TW 086100369A TW 86100369 A TW86100369 A TW 86100369A TW 335523 B TW335523 B TW 335523B
Authority
TW
Taiwan
Prior art keywords
lead
semicondctor
leads
manufacturing
semiconductor carrier
Prior art date
Application number
TW086100369A
Other languages
English (en)
Inventor
Kenshi Itou
Toshio Sutou
Original Assignee
Toshiba Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Co Ltd filed Critical Toshiba Co Ltd
Application granted granted Critical
Publication of TW335523B publication Critical patent/TW335523B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)
TW086100369A 1996-01-15 1997-01-15 Apparatus and method of manufacturing semicondctor, semiconductor carrier TW335523B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8021899A JPH09199534A (ja) 1996-01-15 1996-01-15 半導体装置及びその製造方法、半導体装置用テープキャリア

Publications (1)

Publication Number Publication Date
TW335523B true TW335523B (en) 1998-07-01

Family

ID=12067962

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086100369A TW335523B (en) 1996-01-15 1997-01-15 Apparatus and method of manufacturing semicondctor, semiconductor carrier

Country Status (3)

Country Link
JP (1) JPH09199534A (zh)
KR (1) KR100241199B1 (zh)
TW (1) TW335523B (zh)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63302543A (ja) * 1987-06-02 1988-12-09 Seiko Epson Corp 半導体装置
JP3028875B2 (ja) * 1992-01-18 2000-04-04 ソニー株式会社 リードフレームの製造方法

Also Published As

Publication number Publication date
KR970060462A (ko) 1997-08-12
KR100241199B1 (ko) 2000-02-01
JPH09199534A (ja) 1997-07-31

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees