TW348090B - One side grinding device having dresser - Google Patents

One side grinding device having dresser

Info

Publication number
TW348090B
TW348090B TW086106918A TW86106918A TW348090B TW 348090 B TW348090 B TW 348090B TW 086106918 A TW086106918 A TW 086106918A TW 86106918 A TW86106918 A TW 86106918A TW 348090 B TW348090 B TW 348090B
Authority
TW
Taiwan
Prior art keywords
dresser
grinding device
side grinding
block
pressing plates
Prior art date
Application number
TW086106918A
Other languages
English (en)
Chinese (zh)
Inventor
Shunji Hakomori
Original Assignee
Speedfam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Co Ltd filed Critical Speedfam Co Ltd
Application granted granted Critical
Publication of TW348090B publication Critical patent/TW348090B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW086106918A 1996-05-29 1997-05-22 One side grinding device having dresser TW348090B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15761096A JPH09314457A (ja) 1996-05-29 1996-05-29 ドレッサ付き片面研磨装置

Publications (1)

Publication Number Publication Date
TW348090B true TW348090B (en) 1998-12-21

Family

ID=15653497

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086106918A TW348090B (en) 1996-05-29 1997-05-22 One side grinding device having dresser

Country Status (4)

Country Link
US (1) US5885140A (ja)
JP (1) JPH09314457A (ja)
KR (1) KR100237995B1 (ja)
TW (1) TW348090B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI399260B (zh) * 2005-07-28 2013-06-21 3M Innovative Properties Co 自含式修整研磨物件，製造自含式修整研磨物件之方法及包含自含式修整研磨物件之拋光系統

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11300599A (ja) * 1998-04-23 1999-11-02 Speedfam-Ipec Co Ltd ワークの片面研磨方法及び装置
TW467795B (en) * 1999-03-15 2001-12-11 Mitsubishi Materials Corp Wafer transporting device, wafer polishing device and method for making wafers
US6517422B2 (en) * 2000-03-07 2003-02-11 Toshiba Ceramics Co., Ltd. Polishing apparatus and method thereof
KR20020067789A (ko) * 2001-02-19 2002-08-24 삼성전자 주식회사 다이아몬드 디스크 드레싱 설비
JP4573503B2 (ja) * 2003-06-10 2010-11-04 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェーハ研磨装置における研磨クロス研削装置
TWI286963B (en) * 2004-03-10 2007-09-21 Read Co Ltd Dresser for polishing cloth and method for manufacturing thereof
JP4583207B2 (ja) * 2004-03-31 2010-11-17 不二越機械工業株式会社 研磨装置
KR100579865B1 (ko) * 2004-12-23 2006-05-12 동부일렉트로닉스 주식회사 화학기계적 연마장치
US20100112905A1 (en) * 2008-10-30 2010-05-06 Leonard Borucki Wafer head template for chemical mechanical polishing and a method for its use
JP6239354B2 (ja) * 2012-12-04 2017-11-29 不二越機械工業株式会社 ウェーハ研磨装置
CN107671725B (zh) * 2017-10-20 2019-08-06 德淮半导体有限公司 修整盘系统、化学机械研磨装置及研磨方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54112091A (en) * 1978-02-22 1979-09-01 Fujikoshi Kikai Kogyo Kk Lap surface compensator of lapping machine
JPS57149158A (en) * 1981-03-09 1982-09-14 Fujimi Kenmazai Kogyo Kk Method of removing choke in grinding pad and dresser
JPS5981054A (ja) * 1982-10-29 1984-05-10 Toshiba Corp 研磨布クリーニング方法
US5205082A (en) * 1991-12-20 1993-04-27 Cybeq Systems, Inc. Wafer polisher head having floating retainer ring
US5329732A (en) * 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
DE69333322T2 (de) * 1992-09-24 2004-09-30 Ebara Corp. Poliergerät
JP3370112B2 (ja) * 1992-10-12 2003-01-27 不二越機械工業株式会社 ウエハーの研磨装置
EP0599299B1 (en) * 1992-11-27 1998-02-04 Kabushiki Kaisha Toshiba Method and apparatus for polishing a workpiece
US5443416A (en) * 1993-09-09 1995-08-22 Cybeq Systems Incorporated Rotary union for coupling fluids in a wafer polishing apparatus
US5486131A (en) * 1994-01-04 1996-01-23 Speedfam Corporation Device for conditioning polishing pads
US5423558A (en) * 1994-03-24 1995-06-13 Ipec/Westech Systems, Inc. Semiconductor wafer carrier and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI399260B (zh) * 2005-07-28 2013-06-21 3M Innovative Properties Co 自含式修整研磨物件，製造自含式修整研磨物件之方法及包含自含式修整研磨物件之拋光系統

Also Published As

Publication number Publication date
KR970073870A (ko) 1997-12-10
KR100237995B1 (ko) 2000-04-01
US5885140A (en) 1999-03-23
JPH09314457A (ja) 1997-12-09

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