TW388732B

TW388732B - 087111547

Info

Publication number: TW388732B
Application number: TW87111547A
Authority: TW
Original assignee: Tw; Kinik Co; Univ Nat Taiwan Science Tech; Shie Yu Jan; Lin Shen Tain
Priority date: 1998-07-15
Filing date: 1998-07-15
Publication date: 2000-05-01

Abstract

A method of fabricating composite blocks that are composed of diamond grits and metal matrix, and are intended to be used as cutting and grinding tools. In this invention, mixed metallic powders are initally blended with diamond grits and an organic binder, which was then formed into granules of controlled sizes. The granules are subsequently uni-axially pressed into green components which in turn are pressureless-sintered in a controlled atmosphere. Such a process routs is more cost-effective than conventional hot-pressing method, while the bonding strength between diamond grits and metal matrix is also significantly improved. In addition, diamond grits as small as 1 mu m can be sintered without causing excessive graphitization of diamond grits, and the hardness of the metal matrix can be adjusted by varying the composition of the metal matrix.

Description

發明説明（ <發明之背景> <發明範疇> 本發明是有關-種易於大量生產、應用範圍廣，且鑽 f顆粒與結合基材之間結合力強的—種_齡塊狀複合材料切削與研磨工具的製造方法。本方法以金屬為主要基材，用低融點的鋼元素’配合錫元素而控制金屬基材的融點低於1〇5〇。(：，並添加鈦元素來增加鑽石顆粒與金屬基材的結合度，添加碳元素控制鑽石劣化率，以及添加鉬及鶴兀素來調整基材硬度。元素之相對比例依用途需求而可適當的調配添加鑽石之濃度與鑽石顆粒尺寸。依此調配的粉末與鑽石齡經由iu彡及液相燒結而製叙塊狀複合材料，適用多種切削與研磨環境的鑽石工具。 <先前技藝之描述> 以金屬結合之鑽石工具有兩種形態之產品，一種為表面植佈鑽石工具(Surface -Set Diamond Tool)，另-種為使用鑽石-基材之塊狀複合材料。表面植佈鑽石工具通常以電錄錄的製法來製作鑽石顆粒切割工具，但若欲鑛成甚厚的基材，需費時甚久，故通常僅有一層薄薄的錢層。且鑽石不導電，故電鑛時會阻礙錄基材堆積於鑽石表面，而在錯石及電鍍層介面呈現凹陷的現象，減少鑽石的抓持強度，再因鎖石與錄基材以物理的方式接合，其破壞行為均以鑽石顆粒的脫落及整片電鍍層的撕裂為主。且製程上需使用大量的酸液，及鎳離子含量過多對人體有害，尤其處理不當的時候’易生環保的問題。現今的專利亦有使用銘、鎳 (請先閲讀背面之注意事項再填寫本頁) *1T. 4 4 •t 票五、發明説明（i) 或鐵基合金為基材的硬銲製金之融點甚高（高於_。 ^_域、鎮、鐵合溶析出的方式而導致鑽石的石黑^、錦或鐵元素容易以固 (>l〇um)的天然鑽石，或t : 故僅能使用顆粒較大銅基材料硬焊_齡&、、好。^有專利以植的工具，主要缺點為鑽果’但此種表面佈在連續式加工中較不能符合動化j達到多層之產品，狀的鑽石複合材料的需求。化的要求，所以才有以塊結合濃度鑽石塊狀複合材料工具之鑽石顆粒例士 =單，包含金屬、陶究(玻續成份)或樹脂等。 :業期使用以玻璃為結合介質的方法製作鑽石切割了脆的特性’成為其使用上的限制。於是亦有 ί =顆粒的製法。在此法中，常於鑽石表面彼二銼’：右為乾磨者’披覆層通常為銅，若為濕磨者， ‘莖爆、此'練有製作料，基材具有勤性，可避免震動门..i但树月曰基材無法耐高溫、硬度低，且無法有效的 ^結合鑽；5，造成絲料合範財。以祕金屬為結 σ "負的鑽石工具通常使用為石材、玻璃及陶充之鑛片。其製法通常以熱壓法製造，此種工具在現代鐵石切削工具的麩湏域裡扮演著異常重要的角色。然而，鑽石顆粒與銘基金屬的結合操作甚為困難，原因主要在於鑽石材料與金屬材料的鍵結本性差異，鑽石材料係共價鍵的鍵結，鈷基金屬材料則為金屬鍵的鍵結，這樣的結果導致它們之間的熱膨脹係數差異甚大，且界面反應以固溶形態進行接合 (請先閲讀背面之注意事項再填寫本頁) ---'I-.¾ 5 B7 五、發明説明（j ) (請先閲讀背面之注意事項再填寫本頁} 的條件居於非常惡劣的地位。而好的接合可提高鑽石工具切削及研磨之加工效率及壽命，並可避免接合處因冷熱變化而產生的疲勞應力的破壞而造成其壽命減低。以鈷基金屬結合低濃度的鑽石顆粒塊狀複合材料現在主要以熱壓法製造’在此法中鑽石顆粒與以鈷為主成份之粉末混合，採用加壓（約6〇〇 MPa)及加熱的方式，將鑽石顆粒結合於基材内。為避免鈷催化鑽石之石墨化，熱壓的溫度通常控制低於8〇〇它以避免介面反應，所以其界面結合方式主要為物理性的接合方式，使得鑽石顆粒的固持強度不夠。再者，鑽石顆粒會因鑽石顆粒分散不均而產生接觸，更強烈的減少鑽石的固持強度。故此類的塊狀複合材料所月&使用之鑽石濃度無法太高，而降低了工具使用上的加工速度。為了解決鑽石顆粒互相接觸之問題，於是又有了鑽石顆粒表面黏結結合金屬粉末的造粒方法的出現，此方法改善了鑽石顆粒彼此間的接觸及鑽石顆粒分佈不均的問題。但終因物理性結合而使界面結合強度過低，造成鑽^ 顆粒容易在應用中脫出，減少鑽石顆粒的使用率。這可由工業鋸片於加工後的直線刮痕看出鑽石顆粒是以拉出的形式脫出於基材之外。另一方面，鈷基基材散熱不易，甚至會將鑽石顆粒表面石墨化，所以使用的鑽石顆粒不能太小。再者，鈷粉昂貴，粉末具有毒性等缺失。此外，鈷的硬度不易調整’所以有以添加鎢或碳化鎢等高融點材料來改變基材硬度的方式，但此法亦提高鑽石顆粒與這些高融點材料之接觸而導致鑽石顆粒固持於基材的強度降低。另 6 6 經濟部中央標準局員工消費合作社印製 A7 --**^-—— B7 五、發明説明（Li ) '~~- 。外，夕晶鑽石（PCD)燒結體的製作，需要經過高溫(>〗3〇〇 C)及超高壓(>5GPa)的過程’將鑽石微粉加入微量鈷粉（$ 6—Vol%)燒結後，因製造時鑽石顆粒可在高溫及超高壓下固溶於鉛’且析出為鑽石，而造成鑽石之晶粒成長，而成無方向性的鑽石塊。因其結晶上的無方向性，故使用上的限制較天然鑽石少，諸如韌性、破壞方向 '破裂應力等，且有相當大的應用潛力。然而其製造成本太高而僅適用於某些特殊之應用。再者，於實際的使用上，卻受限於切削時所可能產生的高溫而使得姑催化鑽石石墨化的影響。除了以熱壓法製作塊狀複合材料的鑽石工具外，常壓燒結是為一種研究之新趨勢，文獻上有以鑄鐵粉及碳醯鐵粉與細鑽石微粉經由混合、成形與燒結將鑽石燒結在基材内，燒結的溫度於1100〜1150°C之間，經由成份與製程之控制而使此類工具可應用於拋光（Lapping)及大量研磨 (Grinding)的場合，其具有之優點為具韌性及能承受高負載。然而在高於900°C之氫氣氛中，基材會導致鑽石顆粒参面之石墨化，而造成鑽石顆粒與基材接合強度差，且基材太硬，鑽石顆粒於磨削時無法有效的曝出切刃，須不斷的以放電加工的方式，將鑽石切刃突出於基材的表面上，然此加工方式繁瑣且限制條件多。另外一種新的鑽石工具製造方法是以常壓熔滲方式，將熔融矽溶滲入鑽石顆粒胚體中而形成複合材。但因矽融點太高而使鑽石可能產生嚴重的石墨化。為了避免前面所列舉的各種鑽石工具製作方法的缺點，本發明以控制金屬基材之成份，而以氣氛或真 -6-------- 查赛張尺度適用中國國家標準（CNS_) A4%格（210X 297公釐） —— (讀先Μ讀背面之注項再填寫本頁)Description of the invention (< Background of the invention > < Invention category >) The present invention is related to a species that is easy to mass-produce, has a wide range of applications, and has a strong bonding force between the diamond particles and the bonding substrate. A method for manufacturing a composite material cutting and grinding tool. This method uses metal as the main substrate, and uses a low melting point steel element 'in combination with the tin element to control the melting point of the metal substrate to be lower than 1050. (:, and add Titanium is used to increase the combination of diamond particles and metal substrates, carbon is added to control the rate of diamond deterioration, and molybdenum and crane element are added to adjust the hardness of the substrate. The relative proportion of the elements can be appropriately adjusted according to the needs of the concentration of the added diamond And diamond particle size. The powder and diamond blended in this way can be used to prepare block composite materials through iu 彡 and liquid phase sintering, which are suitable for diamond tools in a variety of cutting and grinding environments. &Lt; Description of previous techniques > There are two types of diamond tools. One is the Surface-Set Diamond Tool, and the other is the block-shaped composite material using diamond-substrate. Stone tools usually use diamond recording to make diamond particle cutting tools, but if you want to mine into a very thick substrate, it takes a long time, so usually there is only a thin layer of money. And diamond is not conductive, so electricity During mining, the recording substrate will be prevented from accumulating on the diamond surface, and the interface of the wrong stone and the electroplating layer will be depressed, which will reduce the holding strength of the diamond. Because the lock stone and the recording substrate are physically joined, the destruction behavior is all It is mainly based on the shedding of diamond particles and the tearing of the entire electroplated layer. Moreover, a large amount of acid solution is needed in the manufacturing process, and excessive nickel ion content is harmful to the human body, especially when improperly handled, it is easy to produce environmental problems. Today's patents There are also inscriptions and nickels (please read the precautions on the back before filling out this page) * 1T. 4 4 • t Ticket 5. Invention Description (i) The melting point of brazed gold with iron-based alloy as the substrate High (higher than _. ^ _ Domain, town, iron, and the way of iron precipitation, which results in the stone black ^, brocade, or iron element is easy to solid (> 10um) natural diamond, or t: so only Brazing with copper-based materials with larger particles_age &, good. ^ 有专The main disadvantage of the planting tool is the drill fruit. However, this type of surface cloth can't meet the needs of dynamic composite products and diamond-like composite materials in continuous processing. Therefore, the combination of blocks is necessary. Examples of diamond particles for concentration diamond block composite tools: single, containing metal, ceramics (glassy components) or resin, etc. Restrictions on use. Therefore, there is also a manufacturing method of ί = granules. In this method, the two are often filed on the surface of the diamond ': the right is a dry grinder. The coating is usually copper. If it is a wet grinder, the stem is burst. 、 This' training material, the substrate has diligence, which can avoid shaking the door .. But Shuyue said that the substrate cannot withstand high temperature, low hardness, and cannot be effectively combined with drills; 5, resulting in silk material Fanfancai . Σ " Negative diamond tools with a secret metal knot are usually used as stone pieces, glass and ceramic filling pieces. The manufacturing method is usually made by hot pressing. Such tools play an extremely important role in the bran field of modern iron cutting tools. However, the operation of combining diamond particles with Mingji metal is very difficult, mainly due to the difference in the nature of the bond between diamond material and metal material. Diamond material is a covalent bond, while cobalt-based metal materials are metal bonds. This result results in a large difference in the coefficient of thermal expansion between them, and the interface reaction is joined in a solid solution form (please read the precautions on the back before filling out this page) --- 'I-.¾ 5 B7 V. Description of the invention (J) (Please read the precautions on the back before filling out this page} The conditions are in a very bad position. Good bonding can improve the machining efficiency and life of diamond tools during cutting and grinding, and it can prevent the joints from changing due to hot and cold changes. Damage caused by the fatigue stress caused by the reduction of its life. Cobalt-based metal combined with low concentration of diamond particles bulk composites are now mainly produced by hot pressing method. In this method diamond particles are mixed with powder containing cobalt as the main component, Diamond particles are incorporated into the substrate by means of pressure (about 600 MPa) and heating. To avoid cobalt catalyzing the graphitization of diamonds, the temperature of the hot pressing is usually controlled. If it is lower than 800, it avoids the interface reaction, so the interface bonding method is mainly physical bonding, which makes the holding strength of the diamond particles insufficient. Furthermore, the diamond particles may come into contact due to the uneven dispersion of the diamond particles. Strongly reduce the holding strength of diamonds. Therefore, the concentration of diamonds used in such block composite materials cannot be too high, which reduces the processing speed in the use of tools. In order to solve the problem of diamond particles contacting each other, there is another The advent of the granulation method of bonding and combining metal powder on the surface of diamond particles has improved the contact between diamond particles and the problem of uneven distribution of diamond particles. However, the physical bonding caused the interface bonding strength to be too low, resulting in diamond ^ The particles are easy to come off in the application, reducing the use of diamond particles. This can be seen from the linear scratches of the industrial saw blade after processing. The diamond particles are pulled out of the substrate in a pulled out form. On the other hand, cobalt The base material is not easy to dissipate heat, and even the surface of the diamond particles is graphitized, so the diamond particles used cannot be too small. Moreover, cobalt powder Expensive, powder is lack of toxicity, etc. In addition, the hardness of cobalt is not easy to adjust 'so there are ways to change the hardness of the substrate by adding high melting point materials such as tungsten or tungsten carbide, but this method also improves diamond particles and these high melting point materials The contact results in a decrease in the strength of the diamond particles held on the substrate. Another 6 6 Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs A7-** ^ ----- B7 V. Description of the Invention (Li) '~~-. Outside , The production of sintered diamond (PCD) sintered body needs to go through the process of high temperature (> 300 ° C) and ultra high pressure (> 5GPa) 'sintering diamond fine powder with trace cobalt powder ($ 6-Vol%) Later, because the diamond particles can be dissolved in lead at high temperature and ultra-high pressure during the manufacture and precipitate into diamonds, the diamond grains grow and become non-directional diamond blocks. Because of the non-directionality in the crystal, Therefore, there are fewer restrictions on use than natural diamonds, such as toughness, fracture direction 'breaking stress, etc., and it has considerable application potential. However, its manufacturing cost is too high and it is only suitable for some special applications. In addition, in actual use, it is limited by the high temperature that may be generated during cutting, which makes the graphitization of diamond catalyzed. In addition to making diamond tools of block composite materials by hot pressing, atmospheric pressure sintering is a new trend of research. In the literature, cast iron powder, carbon iron powder and fine diamond powder are used to mix, shape and sinter diamonds. In the substrate, the sintering temperature is between 1100 ~ 1150 ° C. Through the control of the composition and process, such tools can be applied to the occasion of polishing and grinding. The advantages of this tool are Tough and able to withstand high loads. However, in a hydrogen atmosphere higher than 900 ° C, the substrate will cause graphitization of the diamond particles on the surface, resulting in poor bonding strength between the diamond particles and the substrate, and the substrate is too hard, and the diamond particles cannot be effectively used during grinding. When the cutting edge is exposed, the diamond cutting edge must be continuously protruded on the surface of the substrate by means of electrical discharge processing. However, this processing method is cumbersome and has many restrictions. Another new method for manufacturing diamond tools is to infiltrate molten silicon into diamond particle embryos to form composites by infiltration under normal pressure. However, due to the high melting point of silicon, diamonds may be severely graphitized. In order to avoid the disadvantages of the various diamond tool manufacturing methods listed above, the present invention controls the composition of the metal substrate, and uses atmosphere or true -6 -------- Chase Zhang scales to apply Chinese national standards (CNS_) A4% grid (210X 297mm) —— (Read the first note on the back and then fill out this page)

經濟部中央橾準局員工消費合作社印製五、發明説明（g* ) 空中的液相燒結達到提·高鑽石軸與基材結合強度，提高鑽石顆粒於塊狀複合材料之濃度，並調整基材硬度的經濟性鑽石工具製造方法。 <發明總論> 本發明即旨在提供-種金屬基材結合鑽石顆粒而成塊 ^複合材料_與研磨工具的製作方法，其成品具有用途範圍廣、鑽石顆粒不易脫落、鑽石賴粒濃度高而不易斷裂、鑽石顆粒尺寸可降至lum、基材硬度可大幅調整及製造成本低廉等優點。其金屬基材組成元素包含銅、錫、鉬、鈦、鎢、妷，依工具之加工對象與加工方法的不同而調整各元素比例、鑽石顆粒濃度與鑽石顆粒尺寸。基材粉末與鑽石顆粒混合中加入5〜15%體積量的石臘，經由混合球磨、造粒及乾壓過程，最後於氫氣氛或真空中使用液相燒結的方式，燒結完成於750〜1050。(：之間，而得到鑽石顆粒與金屬基材結合的塊狀複合材料。因為基材特性及鑽石顆粒尺寸與濃度可大幅度地調整，而可製成廣泛的適用於多種材料的切削與研磨的鑽石工具。依本發明之此種金屬基材結合鑽石之塊狀複合材料的切削與研磨工具之製造方法，其不會如以電鑛鍊的製法一般，要鍍成甚厚的基材，需費時甚久，而僅需較短的時間，即可得到甚厚的基材；本發明也不會如該種方法，於鑽石及電鍍層介面呈現凹陷的現象，減少鑽石的抓持強度；本發明更不需使用大量的酸液’而產生環保的問題，又無需使用顆粒較大，或高等級的人工鑽石；而且，鑽石層可本終張尺裏適用中國國家梯卒( CNS ) A4規格（210X297公釐）Printed by the Consumers' Cooperative of the Central Economic and Technical Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (g *) Liquid-phase sintering in the air can increase the bonding strength between the diamond shaft and the substrate, increase the concentration of diamond particles in the bulk composite material, and adjust the substrate. Manufacturing method of economical diamond tool for wood hardness. < General invention > The present invention aims to provide a metal substrate combined with diamond particles to form a block ^ composite material_ and a method for manufacturing a grinding tool. The finished product has a wide range of uses, diamond particles are not easy to fall off, and diamond particles High concentration does not easily break, diamond particle size can be reduced to lum, substrate hardness can be adjusted significantly, and manufacturing costs are low. The metal substrate consists of copper, tin, molybdenum, titanium, tungsten, and thallium. The proportion of each element, the concentration of diamond particles, and the size of diamond particles are adjusted according to the processing object and processing method of the tool. 5-15% by volume of paraffin wax is added to the mixture of the substrate powder and the diamond particles. After mixing ball milling, granulation and dry pressing, the liquid phase sintering is used in a hydrogen atmosphere or vacuum. The sintering is completed at 750 ~ 1050. . (:, To obtain a block composite material combining diamond particles with a metal substrate. Because the characteristics of the substrate and the size and concentration of diamond particles can be greatly adjusted, it can be made into a wide range of cutting and grinding for a variety of materials Diamond tool. According to the method for manufacturing a cutting and grinding tool of a metal composite material combined with a diamond-shaped block material according to the present invention, it will not be plated into a very thick substrate, as is the case with an electric ore chain manufacturing method. It takes a long time, and it takes only a short time to obtain a very thick substrate; the present invention will not show the phenomenon of depression on the interface of the diamond and the electroplated layer as in this method, reducing the grip strength of the diamond; The invention does not need to use a large amount of acid solution, which causes environmental protection problems, and does not require the use of large particles or high-grade artificial diamonds; moreover, the diamond layer can be used in the final ruler of the Chinese National Echelon (CNS) A4 Specifications (210X297 mm)

In n - - I- n - I I (請先閲讀背面之注意事項再填窝本頁) .In n--I- n-I I (Please read the precautions on the back before filling this page).

經央嘌隼爲員二消費社印五、發明説明（b) 制達到多層之產品，此為本發明之另一目的。切削=====_ 法有效的18持給合鑽石’造成其亦不會有習見以錯基金属為結合鑽石介 ^產生兩者“反應關溶形態進行接合的條件 ==的破壞而造成其壽命減低的情形，此:本發崎合材料的士磁其鑽石顆粒與基材的強度粒不易在應用中脫出；且基材散熱容易，不i 見熱壓法將鑽石顆粒表面石墨化的情形；更因，用銘為基材’其價格不昂貴，且不具毒性，更不會^ ϋ調整而必需添加鶴或碳化鶴等高融點材料來ί ，基材硬度’也不會因高融點材料的加人，提高鑽石顆粒 /、故些向融點材料之接觸導致鑽石顆粒固持於基材降低’此為本發明之再一目的。又依本發明之此種金屬基材結合鑽石之塊狀複合材 =與研磨工具之製造方法，其不會如已知的常壓燒結與常堅炫渗法一般地導致鑽石顆粒表面之石墨化，而造成鑽，顆粒與絲接合強度差；以及基材太硬’鑽石顆粒於磨 1時無法有效地曝出切刃，須不斷的以放電加工的方式，將鑽石切刀突出於基材的表面上，導致加工方式制條件多的情形，此為本發明之更—目的。…限識齡^.】:中國:!家榡準(，阳)八娜(21〇'心987公釐 A7 _______B7 9 五、發明説明（) 至於本發明之其他作用、目的與功效，則參照下列依附圖所作之說明即可得到完全的了解： (請先閲讀背面之注意事項再填寫本頁) <圖示之簡單說明> 第1圖為本發明使用之燒結昇溫曲線圖第2圖顯示工具結合基材成份為Cu-43.32Xk$.74C-5.64Sn之破斷面的顯微結搆第3圖顯示工具結合基材成份為Cu-43.32Ti-8.74C-5 ·64Sn之切削面的顯微結構第4圖顯示工具結合基材成份為W-25.93Mo-21·31Cu-4.26Ti-2.84Sn-2.8C 之破斷面的顯微結構第5圖顯示工具結合基材成份為W-25.93MO-21.31 Cu-4.26Ti-2.84Sn-2.8C之切削面的顯微結構第6圖顯示工具結合基材成份為Mo-34Cu-6 · 8Ti-4.53 Sn 之破斷面的顯微結構第7圖顯示工具結合基材成份為Mo-34Cu-6.8Ti-4.53Sn 之切削面的顯微結構經濟部中央樣準局員工消費合昨社印策第8圖顯示工具結合基材成份為Mo-28.88Cu-5.78Ti-3.85Sn之破斷面的顯微結構第9圖顯示工具元素成份為Mo-28.88Cu_5.78Ti-3.85Sn 之切削面的顯微結構第10圖顯示工具結合基材成份為Cu-29.02Mo-23.99W-6.81Ti-4.54C-1.57Sn之破斷面的顯微結構第11圖顯示工具結合基材成份為Cu-29.02Mo-23.99W-6.81Ti-4.54C-1.57Sn之切削面的顯微結構本紙張尺度璁用中國國家標準（CNS ) A4規格（210X29^•釐）輕濟部中夬螓隼局員K消費合咋社 ___ A7 ' ___________B7 ΙΟ 五、發明説明（β ) 第12圖顯示工具結.合基材成份為Cu-15.5Ti-9.5Sn之破斷面的顯微結構第13圖顯示工具結合基材成份為Cu-15.5Ti-9.5Sn之切削面的顯微結構表一、本發明之金屬基鑽石塊狀複合材料切削與研磨工具與現行熱壓製法工具之比較表二、實例中之工具性質比幸交 <較佳具體實施例之詳細描述> 根據先前的敘述，本發明乃係採用了粉末冶金的相關製程’首先依使用目的及需求，決定適當比例的結合基材元素比例及鑽石顆粒尺寸與濃度，並加入石臘經由球磨與造粒’經乾壓成形，壓成胚體，置於氫氣氛或真空中，以適當的昇溫速率及液相燒結的方式，於750。(：至1050。(：之間燒結完成，而得到高密度及高強度的燒結體。適用於本發明的結合金屬元素，主要以金屬基為基礎，含有銅、錫、錮、鈦、鶴、碳等元素，上述元素比例，銅的重量百分比梦.18.25〜75之間，錫的重量百分比於2.4〜15之間，鉬的重量百分比於0〜61.5之間，鈦的重量百分比於3.5〜44之間，轉的重量百分比於0〜74之間，碳的重量百分比於〇〜8.8之間。依上述元素之相對比例值之配合而達到控制燒結溫度及基材燒結體之硬度。鑽石顆粒尺寸大小的使用，20〜50 mesh間的鑽石顆粒使用於切割’ 150〜400 mesh間的鑽石顆粒使用於初級的研磨，^400 mesh間的鑽石顆粒使用於精密的研磨。而鑽石濃度的使用’切割所需的鑽石濃度約本紙張尺度適用中國國家標準（CMS ) A4規格（210X297公楚 :———1!亡------^ ——；_1— -----I (請先閲讀背面之注意事項再填寫本頁) A7 —--- B7__Π 五、發明説明（y ) 2〇%〜1(K)% ’研磨所需的鑽石濃度約40%〜200%，鑽石濃度 (100%=4·4克拉/立方公分，-克拉=0·2公克）。比較例以熱壓法與本發明燒結法所製作之鑽石工具比較如表一所不’本發明所製成之物件具有用途範圍廣、鑽石顆粒不易脫落、基材硬度可大幅調整及製造成本低廉等優點，且鑽石顆粒與基材結合面較強，故其破壞面大都以鑽石顆粒之拉斷為主’鑽石顆粒研磨損失的方式為漸近式磨耗，較熱壓法之鑽石顆粒約1/2的磨耗，其餘為拉出之形式為佳。表一、本發明之金屬基材與鑽石顆粒經由液向燒結的塊狀複合材料切削與研磨工具與現行熱壓製法製成的鑽石工具之比較製成方式勒才成份 (wt%) 错石濃度錢石顆粒大小緻密方式破斷介面抗彎強度勒才秋熱壓法 CO-2.1C 20% (5Vol%) 3(M0 mesh 壓力拉出 157 MPa Hv300 液相燒結 (本發明） Cu-43.32Ti- 8.74C-5.64Sn 40% (lOVol%) 3(M0 mesh 毛細作用拉斷 321 MPa Hv577 經濟部中央標準局員工消費合作社印製實例一切削硬質材(花崗石）根據較佳具體實施例之描述，使用本發明製法之鐵石顆粒大小為+ 40mesh/- 30mesh，鑽石濃度為40%，使用於此塊狀複合材料之元素的相對重量比例為Cu-43.32Ti-8.74C-5.64Sn，經由加入此工具約2wt%的石躐球磨造粒，本巧張尺度適用中國國家標準（CNS ) A4規格（210X29)公釐）經濟部中央標準局貝工消費合作社印製 A7 —___________B7 12 五、發明説明（/(?) 經乾壓（1 OOMPa)成形後·’於真空爐(< 1 〇-5 torr)中液相燒結，昇溫曲線如第1圖所示，其中燒結完成溫度為1000乞，破斷面顯微結構如第2圖，切削面之顯微結構如第3圖，之中可觀察出基材與鑽石顆粒表面間為強的化學鍵結接合，於鑽石顆粒表面形成一層薄的碳化層，其性質詳見於表二0 實例二粗磨硬質材(花崗石）根據具體實施例之描述，使用本發明製法之鑽石顆粒大小為+ 180mesh/- 170mesh，鑽石濃度為40〇/〇，使用於此塊狀複合材料之元素的相對重量比例為W-25.93MO- 21.31Cu-4.26Ti-2.84Sn-2.8C ’ 經由加入此工具約2wt%的石蠟球磨造粒，經乾壓(lOOMPa)成形後，於真空爐(<10-5torr) 中液相燒結’幵溫曲線如第1圖所不，其中燒結完成溫度為980°C ’破斷面顯微結構如第4圖，切削面之顯微結構如第5圖’其中可觀察出基材與鑽石顆粒表面間為強的化，鍵結接合，其性質詳見於表二。實例三細磨硬質材(花崗石）根據具體實施例之描述’使用本發明製法之鑽石顆粒大小為+ 180mesh/- 170mesh，鑽石濃度為1〇〇%，使用於此塊狀複合材料之元素的相對重量比例為M〇-34Cu-6 8Ti-4.53Sn’經由加入此工具約2wt%的石壤球磨造粒.，經乾壓 (lOOMPa)成形後’於真空爐(<i〇_5 torr)中液相燒結，昇溫 (請先閱讀背面之注意事項再填寫本頁) 訂Printed by the central government of the Consumers' Club 5. V. INTRODUCTION TO THE INVENTION (b) Production of multilayer products is another object of the present invention. Cutting ====== _ The effective method of 18 holding diamonds' causes it will not have the habit of using the wrong base metal as the diamond to produce the diamond, which results in the "reaction-resolving condition for joining conditions == damage caused by In the case of reduced life, this: The magnetic particles of the Benzaki materials taxi magnets and the strength particles of the substrate are not easy to come off in the application; and the substrate is easy to dissipate heat. In addition, the use of inscriptions as the substrate 'is not expensive, non-toxic, and it will not be adjusted. It is necessary to add high melting point materials such as cranes or carbonized cranes, and the hardness of the substrate will not be affected. The addition of high melting point materials increases the diamond particles, and thus the contact with the melting point materials causes the diamond particles to be held on the substrate to be reduced. This is another object of the present invention. According to the combination of such metal substrates of the present invention Diamond block composite material and manufacturing method of grinding tools, which will not lead to the graphitization of diamond particle surface, which results in poor bonding strength between diamond, particle and wire, as is known in normal pressure sintering and constant hardening method. ; And the substrate is too hard 'diamond particles When grinding 1, the cutting edge cannot be effectively exposed, and the diamond cutter must be continuously protruded on the surface of the substrate in the manner of electrical discharge machining, which results in a lot of processing conditions. This is a further object of the present invention. … Limit the age of knowledge ^.]: China :! Jia Jun Zhuan (, Yang) Ba Na (21〇 'heart 987 mm A7 _______B7 9 V. Description of the invention () For other functions, purposes and effects of the present invention, please refer to The following description based on the drawings can be fully understood: (Please read the precautions on the back before filling out this page) < Simplified description of the diagram > Figure 1 is the sintering temperature rise curve used in the present invention Figure 2 Show the microstructure of the broken surface of the tool-bound substrate with Cu-43.32Xk $ .74C-5.64Sn. Figure 3 shows the cut surface of the tool-bound substrate with Cu-43.32Ti-8.74C-5 · 64Sn. Microstructure Figure 4 shows the microstructure of the fractured surface of the tool-bound substrate with a composition of W-25.93Mo-21 · 31Cu-4.26Ti-2.84Sn-2.8C. Figure 5 shows the composition of the tool-bound substrate with W- 25.93MO-21.31 Cu-4.26Ti-2.84Sn-2.8C microstructure of the cutting surface Figure 6 shows that the tool binding substrate is Mo- The microstructure of the broken surface of 34Cu-6 · 8Ti-4.53 Sn Figure 7 shows the microstructure of the cutting surface of the tool combined with the substrate composition of Mo-34Cu-6.8Ti-4.53Sn. Figure 8 shows the microstructure of the fracture surface of the tool with a substrate composition of Mo-28.88Cu-5.78Ti-3.85Sn. Figure 9 shows the tool element composition of Mo-28.88Cu_5.78Ti-3.85Sn. Figure 10 shows the microstructure of the cutting surface. Figure 10 shows the microstructure of the broken surface of the tool bonded substrate with Cu-29.02Mo-23.99W-6.81Ti-4.54C-1.57Sn. Figure 11 shows the component of the tool bonded substrate. The microstructure of the cutting surface of Cu-29.02Mo-23.99W-6.81Ti-4.54C-1.57Sn. The paper size (using China National Standard (CNS) A4 specification (210X29 ^ • centimeter)) Bureau member K Consumer Co., Ltd. ___ A7 '___________ B7 ΙΟ 5. Description of the invention (β) Figure 12 shows the tool knot. The microstructure of the broken surface whose composition is Cu-15.5Ti-9.5Sn is shown in Figure 13. The microstructure of the cutting surface of the tool combined with the base material composition of Cu-15.5Ti-9.5Sn Table 1. Cutting and grinding of the metal-based diamond block composite material of the present invention Comparison with existing hot-pressed tools Table II. Properties of the tools in the example Xingjiao < Detailed description of preferred embodiments > According to the previous description, the present invention uses a related process of powder metallurgy ' According to the purpose and requirements of use, determine the appropriate proportion of the combined substrate element ratio and diamond particle size and concentration, and add paraffin through ball milling and granulation 'dry pressing to form the embryo body, put it in a hydrogen atmosphere or vacuum, At an appropriate temperature increase rate and liquid sintering method, at 750. (: To 1050. (: complete sintering between, and obtain a high density and high strength sintered body. The combination of metal elements suitable for the present invention is mainly based on metal base, containing copper, tin, hafnium, titanium, crane, Elements such as carbon, the proportions of the above elements, the weight percentage of copper. 18.25 ~ 75, the weight percentage of tin between 2.4 ~ 15, the weight percentage of molybdenum between 0 ~ 61.5, and the weight percentage of titanium between 3.5 ~ 44. The weight percentage of rotation is between 0 ~ 74, and the weight percentage of carbon is between 0 ~ 8.8. According to the relative proportion of the above elements, the sintering temperature and the hardness of the sintered body of the substrate can be controlled. Diamond particle size Use of size, diamond particles between 20 ~ 50 mesh are used for cutting '150 ~ 400 mesh diamond particles are used for primary grinding, diamond particles between ^ 400 mesh are used for precision grinding. And diamond concentration is used for cutting The required diamond concentration is about the size of this paper. Applicable to the Chinese National Standard (CMS) A4 specification (210X297): ——— 1! Dies ------ ^ ——; _1— ----- I (please first Read the notes on the back and fill in (This page) A7 ----- B7__Π V. Description of the invention (y) 20% ~ 1 (K)% 'The diamond concentration required for grinding is about 40% ~ 200%, and the diamond concentration (100% = 4 · 4 carats / Cubic centimeter, -Carat = 0.2 g) Comparative Example The diamond tool made by the hot pressing method and the sintering method of the present invention is as shown in Table 1. The object made by the present invention has a wide range of uses and diamond particles are not easy. The advantages of falling off, the hardness of the substrate can be greatly adjusted, and the manufacturing cost is low, and the diamond particle and the substrate have a strong bonding surface. Therefore, the damage surface is mostly based on the breaking of the diamond particles. The diamond particle grinding loss method is asymptotic wear. It is better to wear about 1/2 of the diamond particles by hot pressing method, and the rest is better in the form of pulling out. Table 1. The metal substrate and diamond particles of the present invention cut and grind the block composite material through liquid sintering and grinding tools and Comparison of diamond tools made by the current hot pressing method Lecai composition (wt%) Wrong stone concentration Qianshi particle size compact method Fracture interface flexural strength Lecai hot pressing CO-2.1C 20% (5Vol %) 3 (M0 mesh pressure pull out 157 MPa Hv300 liquid phase (Invention) Cu-43.32Ti- 8.74C-5.64Sn 40% (lOVol%) 3 (M0 mesh Capillary break 321 MPa Hv577 Printed example of employee consumer cooperative of Central Standard Bureau of Ministry of Economic Affairs Stone) According to the description of the preferred embodiment, the particle size of the iron stone using the method of the present invention is + 40mesh / -30mesh, the diamond concentration is 40%, and the relative weight ratio of the elements used in this block composite material is Cu-43.32Ti -8.74C-5.64Sn, granulated by stone ball milling with about 2wt% of this tool. The dimensions of this sheet are applicable to China National Standard (CNS) A4 (210X29) mm). Manufacturing A7 —___________ B7 12 V. Description of the invention (/ (?) After forming by dry pressing (100 MPa) · 'Liquid phase sintering in a vacuum furnace (< 〇-5 torr), the temperature rise curve is shown in Figure 1 , Where the sintering completion temperature is 1000, the microstructure of the fracture surface is as shown in Fig. 2, and the microstructure of the cutting surface is as shown in Fig. 3. Among them, a strong chemical bond between the substrate and the surface of the diamond particles can be observed. A thin carbonized layer is formed on the surface of diamond particles. See Table 20 for details. Example 2 Rough ground hard material (granite) According to the description of the specific embodiment, the diamond particle size of the method produced by the present invention is + 180mesh / -170mesh, and the diamond concentration is 40 //, which is used here. The relative weight ratio of the elements of the block composite material is W-25.93MO- 21.31Cu-4.26Ti-2.84Sn-2.8C ′ After being granulated by paraffin ball milling with about 2wt% of this tool, and after forming by dry pressing (100MPa), The sintering temperature curve of liquid phase sintering in a vacuum furnace (< 10-5torr) is as shown in Fig. 1, where the sintering completion temperature is 980 ° C. The structure is shown in Figure 5 ', where the substrate and the surface of the diamond particles are observed to be strong and bonded, and their properties are shown in Table 2. Example 3 Finely ground hard material (granite) According to the description of the specific embodiment, the diamond particle size using the method of the present invention is + 180mesh / -170mesh, and the diamond concentration is 100%. The elements used in this block composite material The relative weight ratio of Mo-34Cu-6 8Ti-4.53Sn 'is granulated by ball soil milling of about 2wt% by adding this tool. After dry pressing (100MPa), it is formed in a vacuum furnace (< i〇_5 torr) Medium and liquid phase sintering, heating (please read the precautions on the back before filling this page)

13 A7 B7 經濟部中央標準局員工消費合汴杜印裂五、發明説明（d ) 曲線如第1圖所示，其·中燒結完成溫度為950°C ’破斷面顯微結構如第6圖，切削面之顯微結構如第7圖’其性質詳見於表二。實例四切削軟質材(大理石）根據具體實施例之描述，使用本發明製法之鑽石顆粒大小為+ 40mesh/- 30mesh，鑽石漢度為40%，使用於此塊狀複合材料之元素的相對重量比例為Mo-28.88Cu-5.78Ti-3.85Sn，經由加入此工具約2wt%的石蠟球磨造粒，經乾壓 (lOOMPa)成形後，於真空爐(<10·5 torr)中液相燒結，昇溫曲線如第1圖所示，其中燒結完成溫度為1000°C，破斷面顯微結構如第8圊，切削面之顯微結構如第9圖，其中可觀察出基材與鑽石顆粒表面間為強的化學鍵結接合，於鑽石顆粒表面形成一層薄的碳化層，其性質詳見於表二。實例五粗磨軟質材（大理石） .. .根據具體實施例之描述，使用本發明製法之鑽石顆粒大小為+ 180mesh/- 170mesh，鑽石濃度為40%，使用於此塊狀複合材料之元素的相對重量比例為Cu-29.02M〇- 23.99W-6.81Ti-4.54C-l.57Sn，經由加入此工具約 2wt% 的石蠟球磨造粒，經乾壓（1 OOMPa)成形後，於真空爐(< 1 〇-5 torr) 中液相燒結，昇溫曲線如第1一所示，其中燒結完成溫度為980°C ’破斷面顯微結構如第1〇圖，切削面之顯微結構如第11圖，其中可觀察出基材與鑽石顆粒表面間為強化學請先閲讀背之注意13 A7 B7 Consumption of employees of the Central Bureau of Standards of the Ministry of Economic Affairs Du Yinli V. Description of the invention (d) The curve is shown in Figure 1, and the intermediate sintering temperature is 950 ° C. The microstructure of the fracture surface is shown in Figure 6. The microstructure of the cutting surface is shown in Figure 7 '. The properties are shown in Table 2. Example 4 Cutting a soft material (marble) According to the description of the specific embodiment, the diamond particle size of the method of the present invention is + 40mesh / -30mesh, the diamond hardness is 40%, and the relative weight ratio of the elements used in this block composite material Mo-28.88Cu-5.78Ti-3.85Sn, granulated by paraffin ball milling with about 2wt% of this tool, formed by dry pressing (100MPa), and sintered in liquid phase in a vacuum furnace (< 10 · 5 torr), The heating curve is shown in Figure 1, where the sintering temperature is 1000 ° C, the microstructure of the fracture surface is shown in Figure 8 圊, and the microstructure of the cutting surface is shown in Figure 9, where the surface of the substrate and diamond particles can be observed There is a strong chemical bond between them to form a thin carbonized layer on the surface of diamond particles. The properties are shown in Table 2. Example 5 Coarse ground soft material (marble) .. According to the description of the specific embodiment, the diamond particle size of the method of the present invention is + 180mesh / -170mesh, and the diamond concentration is 40%. The relative weight ratio is Cu-29.02M〇- 23.99W-6.81Ti-4.54Cl.57Sn. About 2wt% of paraffin ball mill is added to the tool to granulate it. After dry pressing (100 MPa), it is formed in a vacuum furnace (< 1 〇-5 torr) medium-liquid phase sintering, the temperature rise curve is shown in the first one, in which the sintering completion temperature is 980 ° C. 'The microstructure of the fracture surface is shown in Figure 10, and the microstructure of the cutting surface is shown in Figure 11. Figure, in which strong chemistry can be observed between the substrate and the surface of the diamond particles

I 旁訂私紙張巾@目家標準（CNS ) Α4^ΐ格（210X 29^^ 14 A7 B7 經濟郎中央標準局員工消費合作社印製Next to I Order Private tissue @ 目家标准（CNS） Α4 ^ ΐ 格（210X 29 ^^ 14 A7 B7

S 五、發明説明（yj ) 鍵結接合，其性質詳見於表二。實例六細磨軟質材(大理石）根據具體實施例之描述，使用本發明製法之鑽石顆粒大小為+ 180mesh/- 170mesh，鑽石濃度為40%，使用於此塊狀複合材料之元素的相對重量比例為Cu-15.5Ti-9.5Sn，經由加入此工具約2wt%的石蠟球磨造粒，經乾壓（lOOMPa) 成形後，於真空爐(<1〇-5 torr)中液相燒結，昇溫曲線如圖一所示，其中燒結完成溫度為950°C，破斷面顯微結構如第12圖，切削面之顯微結構如第13圖，其性質詳見於表二。表二、實例中之工具性質比較工具元素成份鑽石濃度鑽石顆粒大小加工形態抗彎強度 Cu43.32Ti-8.74C-5.64Sn 40%(10V〇1%) 3040 mesh Hv577 最高的曝出切刃 330MPa W-25.93Mo-21.31Cu- 4.26Ti-2.84Sn-2.8C 40%(10V〇1%) 17CK180mesh Hv205 較高的曝出切刃 330MPa Mo-34Cu-6.8Ti4.53Sn 100%(25V〇1%： 170-180 mesh Hvl41 最低的曝出切刃 610MPa Mo-28.88Cu-5.78Ti-3.85Sn 40%(10V〇1%) 3(M0mesh Hv262 次高的曝出切刃 260MPa Cu-29.02Mo-23.99W- 6.81Ti4.54C-1.57Sn 40%(10Vol%) 170~180mesh Hv211 較次高的曝出切 266Ma Cu-15.5Ti-9.5Sn 120%(30V〇1%) 170~180mesh Hvl50 夂低的曝出切刃 250MPa 根據本發明實例之描述，本發明是一種金屬基材與鑽石顆粒結合的塊狀複合材料的切割及研磨工具的製作方法。依本發明製程及粉末的調配，具有適用切削及研磨材質範圍廣、鑽石顆粒與基材結合力強、基材硬度可大幅調整及低製造成本等優點。本發明所具有傑出的特性，茲列 ^尺„國國1標準((210χ29⑽ (請先閱讀背面之注意事項再填寫本頁)S V. Description of the invention (yj) Bonding, the properties are shown in Table 2. Example 6 Finely ground soft material (marble) According to the description of the specific embodiment, the diamond particle size of the method of the present invention is + 180mesh / -170mesh, the diamond concentration is 40%, and the relative weight ratio of the elements used in this block composite material It is Cu-15.5Ti-9.5Sn. It is granulated by paraffin ball milling with about 2wt% of this tool. After forming by dry pressing (100MPa), it is sintered in liquid phase in a vacuum furnace (< 10-5 torr). As shown in Figure 1, the sintering completion temperature is 950 ° C, the microstructure of the fracture surface is shown in Figure 12, and the microstructure of the cutting surface is shown in Figure 13, and its properties are shown in Table 2. Table 2: Comparison of tool properties in the examples Tool element composition Diamond concentration Diamond particle size Processing morphology Bending strength Cu43.32Ti-8.74C-5.64Sn 40% (10V〇1%) 3040 mesh Hv577 Highest exposed cutting edge 330MPa W -25.93Mo-21.31Cu- 4.26Ti-2.84Sn-2.8C 40% (10V〇1%) 17CK180mesh Hv205 Higher exposure cutting edge 330MPa Mo-34Cu-6.8Ti4.53Sn 100% (25V〇1%: 170 -180 mesh Hvl41 Lowest exposed cutting edge 610MPa Mo-28.88Cu-5.78Ti-3.85Sn 40% (10V〇1%) 3 (M0mesh Hv262 Second highest exposed cutting edge 260MPa Cu-29.02Mo-23.99W- 6.81 Ti4.54C-1.57Sn 40% (10Vol%) 170 ~ 180mesh Hv211 Lower exposure cut 266Ma Cu-15.5Ti-9.5Sn 120% (30V〇1%) 170 ~ 180mesh Hvl50 Low exposure cut 250MPa According to the description of the example of the present invention, the present invention is a method for manufacturing a cutting and grinding tool for a block composite material combining a metal substrate and diamond particles. According to the process of the present invention and the preparation of powder, it has a wide range of suitable cutting and grinding materials. , The strong binding force between diamond particles and the substrate, the substrate hardness can be adjusted greatly, and the manufacturing cost is low. The invention has outstanding Characteristics, hereby foot column ^ "State National Standard 1 ((210χ29⑽ (Please read the Notes on the back to fill out this page)

*1T 經濟部中央標準局員工消費合作社印策 15* 1T Imprint by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs 15

五、發明説明（β 舉如下反應_二=:::=粗產生劇烈的广質，製程參數控制範圍:廣，迅速，=自㈣程步驟簡單且/·ί發明之基材有成份分佈均勾、融點低的優點，而塊:改變’而生產不同形式的鑽石切削及研磨的且製程燒結操作溫度低，可選擇較低 =人工^石，節省原料成本支出。再因為較低級的鑽石 f加=角鈍化後可輕易地經由崩裂而產生新的加工銳 ’、、，保持良好的加工性，直至鑽石顆粒—層一層地崩叔漸脫出。不像錄減心卫具是在加卫銳角純化及將整顆鑽石顆粒拉出而暴露其下層鑽石顆粒之新加工銳角的機構。 3·可輕易的調整鑽石顆粒大小及基材元素比例，以利 .句削與研磨條件之控制;如為切削時，採用顆粒大之鑽石，研磨日守採用較小之錢石顆粒。 4.活性及低融點元素的使用，與基材對於鑽石顆粒的潤濕角小於10。，卻不會產生泛濕而造成熔融金屬溢流出，而與燒結置具產生強的化學反應。同時，活性金屬在基材與鑽石顆粒間形成一個擴散障礙層，避免鑽石持續反應。低融點元素可調整基材之液化溫度及由硬度調整元素 (兩融點元素鈦、鎢、鉬）的使用，除可以調整基材的硬度V. Explanation of the invention (β gives the following reaction_Ⅱ = ::: = coarse produces a wide range of quality, process parameter control range: wide, rapid, = simple self-processing steps and / or invented substrate has a uniform distribution of ingredients The advantages of low melting point and low melting point, while the block: change 'to produce different forms of diamond cutting and grinding and the process sintering operation temperature is low, you can choose lower = artificial ^ stone, saving raw material cost expenses. Because of the lower grade Diamond f plus = corner passivation can easily generate new processing sharps through cracking, and maintain good processability until the diamond particles-layer by layer, gradually break out. Unlike the recording of heart reduction gear is A mechanism for purifying and sharpening sharp corners of diamonds and exposing the entire diamond grains to expose the sharp corners of the underlying diamond grains. 3. It is easy to adjust the size of diamond grains and the proportion of substrate elements to facilitate the control of cutting and grinding conditions. For cutting, use diamonds with large particles, and smaller stones for grinding. 4. Use of active and low melting point elements, the wetting angle of the diamond particles with the substrate is less than 10., but It will produce moisture The molten metal overflows and generates a strong chemical reaction with the sintering fixture. At the same time, the active metal forms a diffusion barrier between the substrate and the diamond particles to prevent the diamond from reacting continuously. The low melting point element can adjust the liquefaction temperature of the substrate and The hardness of the substrate can be adjusted by the use of hardness adjustment elements (two melting point elements: titanium, tungsten and molybdenum)

A 7 B7 16 五、發明説明（〆）外，其碳化物兼具有輔助切削的功用。從先前本發明具體化的描述，可以了解到實用的例子不勝枚舉，而本發明優越的特性’較習知以熱壓製法與銘基基材製成之鑽石研磨工具’具有多項優越性，其並未見諸公開使用，合於專利法之規定’墾請賜與專利’實為德便0 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製本紙張尺度適用中國國家標準（CMS > A4規格（210/297¾•釐〉A 7 B7 16 V. Description of the invention (ii) In addition, its carbides also have the function of assisting cutting. From the previous description of the present invention, it can be seen that practical examples are endless, and the superior characteristics of the present invention 'have a number of advantages over the conventional diamond grinding tools made by the hot pressing method and Ming base material, It has not been used in public, and it is a good rule to comply with the provisions of the Patent Law. "Please read the notice on the back before filling out this page." Paper size applies Chinese national standard (CMS > A4 specification (210 / 297¾ • centi)

Claims

-Hehe diamond block composite material cutting and grinding work = element adjustment melting point, active element and hardness change = only = = combined base powder and diamond particles t = with appropriate adjustment, the granulation of the mixture Dry a certain material name i or reduce the liquid phase sintering in a vacuum to produce metal earth material. Diamond particle block composite cutting and grinding tool. Personnel, please manufacture method of metal base material combined with diamond block compound tool in item 1 of the patent scope, wherein the metal base material uses several elements selected from copper, tin, iron, titanium, tungsten, carbon, etc. . 3. According to the method of manufacturing patented diamond particles in the scope of the patent item No. 8 of the method of making diamond particles, wherein the weight percentage of the element, the weight percentage of copper is between 18.25 ~ 75, and the weight percentage of tin is between 2 4 ~ 15, ㈣ weight percentage between 0 ~ 61.5, titanium weight percentage between 35 ~ 44, crane weight percentage between 0 ~ 74, carbon weight percentage between 0 ~ 8 8 . ..4. The method according to item 3 of the scope of patent application, wherein diamond particles are used for cutting and grinding, and diamond particles between 2G ~ 50 mesh are used for cutting iron particles between 150 ~ 400 mesh. $ 4GG mesh diamond particles used for primary grinding are better for precision grinding and polishing. ^ 5. The method according to item 4 of the scope of patent application, wherein the diamond particle size is used, and the concentration of diamond required for cutting is preferably between 20% and 100%, and the concentration of diamond required for grinding is 40. % ~ 200% is better. 17 This paper size applies to Chinese National Standards (CNS) ... M Regulations (210 × 297 mm)