TW391992B - A method and apparatus for sequentially metalizing polymeric films and products made thereby - Google Patents

Abstract

An electrolytic cell comprised of a tank for holding electrolytic solution, and a drum rotatable about a horizontal axis having a non-conductive cylindrical outer surface disposed within the tank, and a plurality of elongated, like anodes arranged about the outer surface of the drum. The anodes together form a generally continuous cylindrical surface spaced from, and generally conforming to, the outer surface of the drum. Each of the anodes has at least one end projecting through the tank. A plurality of power sources is provided together with connection means for connecting groups of one or more of the projecting ends of the anodes to each power source.

Description

Attachment 2A: Chinese Patent Application No. 85 106570 Chinese Version Zhao 5 Straight Basket Amendment 2-e——9 with one of each pattern exposed to form a conductive layer extending along the length of the strip A continuous exposed area; c) moving the strip with a pattern thereon along a predetermined path, wherein the strip first moves through an electrolytic solution, passes through a plurality of anodes placed in the solution, and then passes through electrolysis On a conductive cathode outside the solution, the exposed area of the conductive layer on the strip faces the anode in the solution and joins the surface of the conductive cathode; and d) electrically excite one or more of the groups at different levels Adjacent anodes, in which the anodes of the rear group each have a higher excitation level than the front group. According to another aspect of the present invention, a method for forming a printed circuit on a non-metallic electrically non-conductive substrate is provided, comprising the steps of: a) printing a layer of resist on one of the long strips of flexible non-conductive material On one side of the conductive material layer, one continuous area of the conductive layer along the length of the strip is exposed, and this area contains multiple printed circuit patterns; printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

V. Description of the invention ((Please read the precautions on the back before filling in this page) b) Move the strip with printed circuits along a predetermined path, where the strip first moves through an electrolytic solution and passes A plurality of anodes placed in the solution, and then through a conductive cathode outside the electrolytic solution, the continuous area of the conductive layer on the strip faces the anode in the solution and joins the surface of the conductive cathode; and c ) Electrically excite one or more adjacent anodes in groups at different levels', wherein the anodes of the latter group each have a higher excitation level than the former group. It is an object of the present invention to provide a method and apparatus for electrodepositing a metal on a non-metallic electrically insulating substrate. Another object of the present invention is to provide one of the above-mentioned devices. This greatly reduces the scale of the paper and applies the Chinese National Standard (cys) A4 standard (210X297 mm) -12-Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 __B7_ V. Description of the invention (1) Background of the invention This application is a follow-up part (CIP) of US patent application serial number 08 / 347,850 filed on February 1, 1984. * This is 193 years. The part of the US patent application serial number 0/8 / 098,440 filed on July 27th, this is the US patent application serial number 0 7/9 0 7, 0 6 filed after July 1, 1992. Part. SUMMARY OF THE INVENTION The present invention relates to an electrodeposited gold tincture, and more specifically, to a metallization method of a flexible polymer sheet. The present invention is particularly applicable to a method and apparatus for electroplating a gold-plated layer on a non-gold-plated electrically insulating substrate having a wiper attached to it. Current status of the art The electrodeposition of metals from aqueous solutions is familiar to this art. In short, the method includes using a cathode, an anode (collectively referred to as electrode #), an aqueous solution containing gold ions to be deposited, and an external current source. When current is supplied to the anode, metal ions are reduced and electrodeposited from the aqueous solution. Almost any metal (usually a metal salt) that is soluble in water can be electrodeposited by the device described above. Electrolytic copper is widely used in the electronics industry. Traditionally, copper is deposited by electroforming into rolls, cut into thin slices, bonded to a polymer plate, and etched. Then, the separated electronic parts are adhered to the circuit board, and the circuit board is inserted into the paper. The size of the paper is applicable to the Chinese National Standard (CNS) A4 specification (210X297). --.---? --Order (Please read the notes on the back before filling this page) ~ 4-A7 _____B7_ V. Description of the invention (2) Centering (Please read the notes on the back before filling this page) When the insulating base is a flexible polymer sheet, gold tincture (such as copper) can be directly deposited on the tincture by sputtering, vapor deposition, electroless deposition on a metal, or attached by a similar method. Flexible polymer matrix. This method eliminates the intermediate step of removing the need to adhere the metal foil to the substrate. The flexible polymer sheet can be treated before the gold foil is deposited on it. Once the polymer has been deposited with gold, the metal can be deposited on the gold-plated metal, increasing the thickness of the electrodeposited metal to a normal thickness, that is, from about 0.250 to about 2oz (equivalent to about 0 of the electrodeposited metal). 3mil to about 2.8 mi 1). The flexible gold-coated polymer film is used for flexible circuits, automatic adhesive tapes, electromagnetic interference shielding, and other aspects where gold-coated metal substrates can be used. The following US patents describe polymers and other non-gold The invention of the method of gold deposits. US Pat. No. 4,6 8 3,0 3 6 printed by Maurice et al. Printed by the Central Standards Bureau of the Ministry of Economic Affairs and Industrial Cooperatives describes a non-conductive substrate electroplating method using a photoresist and hydrogen reduction in a gold catalyst Energy, the catalyst is placed on a substrate to be plated with metal. Bian et al. Patent No. 4,897,164 describes a method for plating a wall surface through holes in a laminated brush plate. "Brighton US Patent No. 4,9 1 9, 7 6 8 describes a plating-manufacturing article. Method. Penton's Beauty Patent No. 5,0 1 5, 3 3 9 describes a method for electroplating a metal layer on the surface of a non-conductive material. The paper & size uses Chinese National Standard (CNS) A4 specifications (210X297 mm) ~ " Printed with A7 __B7_ by the Central Standards Bureau of the Ministry of Economic Affairs __B7_ V. Description of the Invention (3) US Patent No. 4,9 5 2, 2 8 6 of Brayton et al. describes a surface for plating non-conductive objects Method. U.S. Patent No. 4,6 7 3, 4 6 9 of Bis et al. Describes a method and apparatus for depositing gold tincture on an object, including initiating an automatic catalytic process followed by a plating step. US Patent No. 4,32,2,80 by Heski et al. Describes an electrolytic device for electrolyzing gold on at least one surface of a belt, and the belt has been coated with gold on the surface. The US Patent No. 4,576,685 of Godfodor et al. Describes a method and apparatus for depositing metal on a substantially flat surface through an electroless deposition process followed by an electrodeposition process. DeRoeb US Patent No. 3,963,590, describes a method for pre-etching, etching, neutralizing, and treating the surface of polyoxymethylene for electroless deposition of a metal, followed by a plating step. Common methods of electrodepositing copper onto flexible polymer sheets use current densities from about 25 to 50 amps per square foot. This current density results in long deposition times, especially when copper thicknesses greater than lmi 1 are required. In this regard, the amount of common electrodeposited copper on a flexible polymer sheet is commonly referred to as | oz ^. One ounce is the copper replacement of a square foot of copper sheet (this means that the average thickness of copper is 1.35mi 1). Using the conventional electrodeposition method known heretofore, it takes about 40 to 60 minutes to call in an ounce of copper on a square foot of flexible polymer sheet. The deposition rate of gold ions in this electrodeposition method basically depends on the current of gold ions that can be applied to the polymer matrix. This metal actually becomes the guide of the current. The paper size applies the Chinese National Standard (CNS) A4 specification ( 210X297 mm) I. ^^ 1 —-1 1 «! 1 — —— ---- 1-% I. ^ Ϋ (Please read the notes on the back before filling this page) -6-A7 ____B7_ V. Invention Description (4) Body. On the one hand, the current of the diaphragm is limited by the thickness of the gold tincture on the substrate and the current carrying characteristics of the gold tincture on the substrate. On the other hand, the current applied to the gold tincture substrate is designed and arranged by the anode. The current density that can be generated at the anode surface and the thermal power loss generated during the sinking period are determined. The previously known methods and devices are usually limited by the design of the current device that can be applied to the polymer-based hip, and on the other hand are limited by the channeling current applied to the substrate, which is determined by the thickness of the initial metal layer on the substrate . The invention overcomes the limitation of the previously known devices, and provides a method and a device for electro-sinking gold on a non-metallic electrically insulating substrate. The device and method greatly reduce the time of the electro-settling. By reducing the gap between the surface of the active anode and the moving substrate, thereby reducing the thermal power loss by reducing the voltage, and by increasing the current density that can be applied to the surface of the active anode, and carrying the energy by the current using a sinking metal, for convenience This is achieved by applying a higher current in the matrix. Summary of the invention Printed by the Shellfish Consumer Cooperative of the Central Standards Bureau of the Ministry of Economics (please read the notes on the back before filling in this card) According to one aspect of the present invention, an electrolytic cell is provided, which contains a tank to hold the electrolytic solution. It rotates around a horizontal axis, has a non-conductive outer surface, is placed in the tank, and a plurality of elongated same anodes are arranged around the outer surface of the drum. The anodes together form a generally continuous cylindrical surface, separated from the outer surface of the drum, and generally conform to the outer surface. The anodes each have at least one end protruding through the slot. There are multiple power supplies and connection fixtures, each for connecting one or more of the protruding ends of the anodes. This paper size is in accordance with Chinese National Standard (CNS) A4 (210X297 mm). 7 Printed by the Shellfish Consumer Cooperative of the Central Bureau of the Ministry of Economic Affairs. __B7. 5. Description of the invention (5) According to another aspect of the present invention, a paper is provided. The device for electrodepositing gold tincture includes a tank for holding electrolytic solution, a drum is installed in the tank, and a plurality of elongated same anodes are arranged side by side around the drum in the tank. The anodes each have at least one end protruding through the slot for connection to a power source, and at least two different acting anode surfaces extending along the length of the anode. The anode is installed in the tank, wherein one of at least two different anode surfaces is disposed facing the drum. According to another aspect of the present invention, a device for electroplating gold on an electrically insulating substrate other than gold is provided. The substrate has a layer of gold tincture on it. The device includes a tank for holding an electrolyte, and has the degree of gold ion to be deposited. A cylindrical drum is installed in the groove. The drum has a non-conductive outer surface and is rotatable about a fixed axis to pass a substrate through the groove. A plurality of elongated anodes are housed in the tank and are arranged side by side around the non-conductive outer surface of the drum. The anodes each extend along an axis substantially parallel to the drum axis and have a uniform cross-section defining at least two active anode surfaces. Anodes are installed in the tank, wherein at least one of the active anode surfaces of each anode faces the drum and is aligned with adjacent anodes to define a generally continuous active anode forming surface adjacent to the drum on the circumference. The active anode forming surface and the outer surface of the drum define voids of substantially uniform thickness. At least one power source is connected to the anode. One of the cathode members outside the tank engages the metal part of the base when the substrate leaves the tank. According to another aspect of the present invention, there is provided an electrolytic cell for electroplating gold alloy on a substrate, the substrate having a gold alloy layer on the substrate. The electrolytic cell contains a tank to hold the electrolytic solution, and a non-conductive curved flat surface is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) on this paper scale. ---- Ί-:- -Packing ----- ϊ--Order (please read the notes on the back before filling this page) -8-Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperatives, printed A7 B7 V. Description of the invention (6) In the tank, A path is defined, the substrate moves along the path, and a plurality of elongated identical anodes each have a uniform prismatic cross-section, defining at least two active anode surfaces. The anodes are each installed in the slot, wherein one of the at least two active anode surfaces faces the non-conductive surface of the drum, and wherein a portion of the anode extends through the slot. The anodes are densely arranged side by side * to define a substantially uniform gap between the non-conductive surface of the drum and the active anode surface of the anode. The connecting fixture connects one or more adjacent anodes in a group to their respective power sources. "Cathode members outside the tank, when the substrate leaves the tank, joins the metal part of the substrate. According to another aspect of the present invention, a method is provided. A method for electrodepositing gold tin on a non-metallic electrically insulating substrate, comprising the steps of: setting a plurality of elongated anodes and arranging them in a dense package in an electrolytic solution, each of the anodes having a functioning anode surface aligned with an adjacent anode Acting on the anode surface to form a generally continuous action forming surface; moving one of the non-conductive backing layers to wipe the thin gold through the electrolytic solution, forming the surface by the continuous action, while maintaining the metal and forming as it passes along it One of the surfaces is predetermined to have a uniform gap below 1 "; the gold tin is picked up on a roller by a cathode outside the electrolytic solution when it leaves the electrolytic solution; and one or more adjacent anodes are electrically excited so that The anodes of the rear group each have a higher excitation level than the front group. According to another aspect of the present invention, a method for electroplating gold on a non-metallic electrically insulating substrate is provided. The method includes the following steps: The paper size applies the Chinese National Standard (CNS) Α4 specification (210X297 mm) L ---..---: ---- 'Installation ----- · --Order (please Read the precautions on the back before filling this page) A7 B7 V. Description of the invention (7) a) Deposit a thin layer of metal on one side of the non-golden electrically insulating base hip; b) along one of the lines defined by a non-conductive surface The substrate is moved in a predetermined direction on the path, the gold surface of the substrate is facing away from the surface, the non-conductive surface is placed in an electrolytic solution, and a plurality of anodes are opposite and adjacent to the surface, which is uniformly defined by it For each of the gaps, the anodes can be charged separately by a power source, wherein groups containing one or more adjacent anodes can be charged at different current levels; c) passing the metal surface of the substrate through a conductive cathode outside the electrolytic solution; and d) when the substrate is passed through the electrolytic solution, the electrodes of each group have different levels of current density, and the metal is continuously deposited on the moving substrate. According to another aspect of the present invention, an electrodeposited metal Method on gold tincture electric insulation substrate, package Steps: a) moving a non-conductive substrate with a wipe of metal along a predetermined path, wherein the substrate first moves through an electrolytic solution, passes through a plurality of anodes disposed in the solution, and then passes outside the electrolytic solution On one of the surfaces of the conductive cathode, the wiped metal on the substrate faces the anode in solution, and joins the surface of the conductive cathode; and b) electrically excited one or more adjacent anodes in groups at different levels, Paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) L ---: ·-: ---- M-- (Please read the notes on the back before filling this page) Set the central standard of the Ministry of Economic Affairs Printed by the Bureau Cooperative Consumer Cooperative -10-A7 __B7_ of the Consumer Cooperative Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the Invention (8) The anodes of the rear group each have higher incentive levels than the previous group. According to another aspect of the present invention, a method for manufacturing a printed circuit on a non-metallic electrically insulating substrate is provided, comprising the steps of: a) printing a layer of resist on a long strip of flexible non-conductive material On one side of a conductive material layer, a continuous strip exposing one of the conductive layers extending over the length of the strip and one or more patterns of a printed circuit communicating with the strip are exposed; b) along A predetermined path moves the strip with a printed circuit thereon, wherein the strip is first moved through an electrolytic solution, through anodes placed in the solution, and then through a conductive cathode surface outside the electrolytic solution Above, the continuous strip of the conductive layer on the strip faces the anode in solution and joins the surface of the conductive cathode; and c) one or more anodes in groups are electrically excited at different levels, wherein the rear group The anodes each have a higher excitation level than the previous group. According to another aspect of the present invention, a method for forming a printed circuit on a non-metallic electrically insulating substrate is provided, comprising the steps of: a) providing flexible non-conductive properties material One of the long strips, which is coated with a conductive layer; b) printing a layer of resist on the conductive layer, so that multiple patterns and paper sizes are applicable to the Chinese National Standard (CNS) A4 specification (210 X 297) (Please read the notes on the back before filling out this page) Binding-Ordering Annex II A: No. 85 106570 Patent Application Chinese Language Zhao 5 Straight Basket Amendment 2-e—— 9 with each pattern A strip is exposed to form a continuous exposed area of one of the conductive layers extending along the length of the strip; c) moving the strip with a pattern thereon along a predetermined path, wherein the strip first moves past a The electrolytic solution passes through the anodes placed in the solution and then through a conductive cathode outside the electrolytic solution. The exposed area of the conductive layer on the strip faces the anode in the solution and joins the surface of the conductive cathode. And d) electrically exciting one or more adjacent anodes in groups at different levels, wherein the anodes of the rear group each have a higher excitation level than the previous group. According to another aspect of the present invention, a method for forming a printed circuit on a non-metallic electrically non-conductive substrate is provided, comprising the steps of: a) printing a layer of resist on one of the long strips of flexible non-conductive material On one side of the conductive material layer, one continuous area of the conductive layer along the length of the strip is exposed, the area contains multiple printed circuit patterns; printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

V. Description of the invention ((Please read the precautions on the back before filling in this page) b) Move the strip with printed circuits along a predetermined path, where the strip first moves through an electrolytic solution and passes A plurality of anodes placed in the solution, and then through a conductive cathode outside the electrolytic solution, the continuous area of the conductive layer on the strip faces the anode in the solution and joins the surface of the conductive cathode; and c ) Electrically excite one or more adjacent anodes in groups at different levels', wherein the anodes of the latter group each have a higher excitation level than the former group. It is an object of the present invention to provide a method and apparatus for electrodepositing a metal on a non-metallic electrically insulating substrate. Another object of the present invention is to provide one of the above-mentioned devices. This greatly reduces the scale of this paper. The Chinese national standard (cys) A4 scale (210X297 mm) is applied. -12-Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 89.1. 2 〇 A7 ____B7 _ V. Description of the invention () 10 Electrodeposition time of the device known before. Another object of the present invention is to provide one of the above-mentioned devices, which establishes a precise and uniform void between the surface of the anode and the substrate of the moving gold alloy. Another object of the present invention is to provide one of the above-mentioned devices including a plurality of anodes. Each anode is arranged to form a substantially continuous anode surface. Another object of the present invention is to provide one of the above devices, which has a plurality of anodes, each anode can be separately excited, and the adjacent anodes have different current densities. Another object of the present invention is to provide one of the above devices, wherein the device loses less electricity as heat. Another object of the present invention is to provide one of the above-mentioned devices, wherein the anodes are arranged in groups, one or more anodes in each group, and a current density applied to a specific group of anodes is greater than an adjacent group. Still another object of the present invention is to provide one of the above devices, wherein the deposited metal is used as a conductor to increase the current density applied to the anode thereafter. Another object of the present invention is to provide one of the above devices, wherein the current flowing from the anode to the diaphragm is reduced by reducing the interval therebetween. Another object of the present invention is to provide a method for depositing metal on a moving non-conductive substrate. Another object of the present invention is to provide one of the methods described above, wherein the metal deposited on the substrate is used as a cathode. Another object of the present invention is to provide one of the above methods, wherein the current of the sinking metal carries energy to sequentially increase the current level applied to the moving substrate. This paper size applies Chinese National Standard (cys) A4 specification (210 X297 mm) '-13-(Please read the precautions on the back before filling this page)

«B, ii, 2〇 A7 B7 V. Description of the invention (11) Another object of the present invention is to provide one of the methods described above, wherein different current levels can be applied to different parts of the substrate at the same time. (Please read the precautions on the back before filling this page) Another object of the present invention is to provide one of the methods described above, wherein the current level increases in the direction of the substrate movement. Another object of the present invention is to provide a flexible polymer sheet having a metal deposited thereon for manufacturing a flexible electronic circuit. Another object of the present invention is to provide one of the above-mentioned flexible polymer / metal sheets, in which the gold layer is wirelessly traced in a cross section. Another object of the present invention is to provide one of the above-mentioned flexible polymer / gold foils, wherein the foils have increased flexibility. Another object of the present invention is to provide one of the above-mentioned flexible polymer / metal sheets, wherein the sheet has high elongation characteristics. Another object of the present invention is to provide one of the above methods and apparatuses for continuously manufacturing a printed circuit by an electrodeposition method. These and other objects of the present invention will be apparent from the above description of preferred embodiments and with reference to the accompanying drawings. Brief Description of the Drawings The printing of this invention by some employees and cooperatives of the Intellectual Property Bureau of the Ministry of Economics may take actual shapes in some parts and arrangements. A more suitable embodiment is described in detail in this specification and shown in In the drawings, the drawings constitute a part of the description, and in which: Figures 1A and 1B-a sectional end view of a device for electrodepositing gold tincture on a moving diaphragm, showing the present invention A preferred embodiment; Figure 2 is an enlarged cross-sectional view taken along line 2-2 of Figure 1 'shows a typical anode installed according to the present invention; this paper size applies Chinese National Standard (CNS) A4 specifications ( 210X297 males) • / -14-1 :. 2Α7 ------- Β7__ 5. Description of the invention (12) Figure 3 is a first end view of one of the anodes shown in Figure 2; Figure 4 is shown in Figure 2 An elevation view of the anode; Fig. 5 is a top view of the anode shown in Fig. 2; Fig. 6 is a view of the second end of the anode shown in Fig. 2; Electrical connector; 阖 8 is a cross-sectional view taken along line 8-8 of FIG. 5; FIG. 9 is an electrodeposited copper foil according to the present invention Side view of a photomicrograph; 阖 10 is a side view of a photomicrograph of a commercially available copper foil on a polymer substrate, showing the different copper layers deposited by a method known in the market ; Figure 11 is a top plan view of a film with a shielded metal layer to define a circuit pattern, showing another aspect of the present invention; Figure 1 2 A is an enlarged cross-sectional view, which is schematically shown before the metal deposition method of the present invention Figure 1 2B is an enlarged cross-sectional view of the film shown in Figure 12A, showing the metal deposited according to the present invention; and Figure 13 is a top plan view of a film with a shielded metal layer to A plurality of identical circuit patterns are defined to be connected to extend over the length of the diaphragm. Component comparison table 10: Electrodeposition device, 12: substrate, 20: trough, 50: drum, 60: anode, 28: plate, 34: overflow channel, 36: bukou'44: transverse web, 46: leg, 52: Non-conductive outer surface, 24, 26: End wall, 62: Long body, 64: Inner core, 66: Outer cover, 92 '76: Hole, This paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling out this page) 'Installation ------- ^-Order ..-------- Employee Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Printing -15-Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 89.1. 2 〇 Α7 __Β7__ V. Description of the invention (13) 72: Pin, 94: Plug '96 ·· Hole '74: Collar, 102: Seal Device, 82: connector, 84: flat part, 112: roller, 114: cathode pick-up roller, 90: gap, 200: film, 204: resist shielding material, 206: circuit pattern, 202: substrate Metal layer, 208: belt, 214: accumulated gold tin, 216: detailed description of preferred embodiment of the pattern will now be described with reference to the accompanying drawings, wherein the purpose is to exemplify the preferred embodiment of the present invention and not to limit it. FIG. 1 shows an electrodeposition device 10 for electrodepositing metal on a substrate 12. The present invention relates to a device and method for electrodepositing a metal on a non-metallic electrically insulating substrate, preferably a polymer film, having a gold foil attached thereto. The invention is illustrated by a flexible polymer sheet having a thickness ranging from about 0.5 to about 7 mils. Although the polymer film is a more suitable substrate for use in the device and method of the present invention, as will be clear from further reading of this description, other non-metallic electrical insulating materials may be used, such as ceramic tape or · ^ 青 # 带, Its leaking fabric and so on. As used herein, a " wiping " metal is defined as a thinly coated metal having a thickness ranging from about 500 angstroms to about 3000 angstroms. A layer of gold is generally sprayed, electrolessly deposited, or deposited by ordinary chemical vapor deposition, but other methods can also be considered. Although the present invention is particularly useful for electrodepositing metals on a non-gold metal electrically insulating polymer substrate, and with particular reference to this description, it should be understood that the present invention can also be advantageously applied to depositing gold metal on other continuous surfaces. on. Broadly speaking, the device 10 includes a tank 20, which is suitable for holding an electrolytic solution: a drum 50, part of which is in the electrolytic solution in the tank 20; and a plurality of identical anodes, number 60, placed in the tank Within 20, surround the drum 50. Chinese paper standard (CNS) A4 (210 X 297 mm) applies to this paper size (please read the precautions on the back before filling this page) ---- Line-16-Printed by A7 ____B7_ of the Consumer Cooperatives of the Central Procurement Bureau of the Ministry of Economic Affairs 5. In the embodiment shown in the description of the invention (14), the groove 50 is entirely cylindrical and conforms to the cylindrical shape. Drum 5 0. The groove 20 is composed of a substantially semi-cylindrical bottom wall 22 and two end walls 2 4 and 26, which are best seen in FIG. 2. The end walls 24, 26 are each provided with an arc-shaped reinforcing plate 28, as best seen in circles 1A and 2. The tank 20 defines a semi-cylindrical cavity, which is suitable for receiving the drum 50 and the electrolytic solution. The supply duct 3 2 is provided at the lowermost part of the tank 20 to supply the electrolyte body to the tank 20. An overflow channel 34 is provided along the upper edge of the tank 20 to collect the overflowed electrolytic solution and recover it through the port 36, as is generally known. The trough 20 is supported on a support structure 42, which comprises a plurality of transverse webs 4 4 supported by legs 4 6. The drum 50 is cylindrical and has a non-conductive outer surface 52 according to the present invention. For this purpose, the drum 50 can be made entirely of a sturdy plastic or polymer material, or made of a metallic material, with a non-conductive material housing. In the embodiment shown, the drum 50 is rotatable on a shaft 54 which is supported in the end walls 24, 26 of the groove 20 by bearings (not shown). The drum 50 should be driven by a suitable motor (not shown), as is generally known in the art, wherein the drum 50 can be rotated at a variable peripheral speed, so that the base body 12 can remain in contact with the body for a sufficient period of time. The electrolytic solution in the tank is contacted to produce the required foil thickness, as explained in more detail below. A number of identical anodes 60 are arranged in the tank 20, adjacent to the drum 50 on the circumference. The anode 60 should be a long rod with a uniform prismatic cross-section, each defining a plurality of flat anode surfaces. In the illustrated embodiment, the anode is a thin rod with a uniform rectangular cross-section, as shown See Figures 3-6. The anodes 60 are each composed of an elongated body 6 2 with an inner core 64. They are made of high-quality paper and are suitable for China National Standards (CNS) A4 (2 丨 〇-x297 mm) (please read the notes on the back first) Please fill in this page for more information.) --J-- iwai. -Order- -17-Printed bags A7 B7 of the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (15) Made of conductive materials, and a jacket or shell 66 is made of conductive gold, which is dimensionally stable in an electrolytic solution, as shown in FIG. 8. In the illustrated embodiment, as previously described, the anode body 62 is constructed with a core 64, which is a copper alloy material, and an outer envelope 66, which is a titanium. The titanium-clad copper body 60 of the anode 60 can be manufactured by co-extrusion, as is generally known in the art. One of the rectangular plates 6 is made of the same material as the package 6 6 (ie, titanium in the illustrated embodiment). 8 should be fixed to one end of the body 62 by welding to cover the core 64. The anode 60 has a rectangular delimiting surface that acts on the opposite anode surface and is numbered 80a and 80b in the figure. As will be understood from further reading of this description, anodes with square or triangular cross sections (not shown) can also be used without departing from the invention. A positioning pin 72 is provided on the plate 68, which is aligned with the longitudinal axis of the body 62, and a circular collar 74 is provided at the opposite end. Pin 7 2 and collar 7 4 are also made of titanium. At the other end of the body 62, that is, adjacent to the collar 7, 4 are formed with two threaded holes 7 6 into the core 6 4. Core 64 bursts at this end of anode 60. The anodes 60 are arranged side by side in the groove 20 to form a half-cylindrical electro-galvanized surface 58, which conforms to the surface 52 of the drum 50, as best seen in Fig. 1B. More specifically, the anodes 60 are arranged side by side and extend over the length of the groove 20. The anodes 60 extend parallel to each other and parallel to the axis of the drum 50 and are in close proximity but not substantially in contact. Each anode 60 is arranged opposite to the non-conductive surface 52 of the drum 50, and a uniform gap 90 is formed between the anode 60 and the drum. According to the present invention, the gap 90 is preferably less than 1 inch and more preferably about three-quarters. Time. According to another aspect of the present invention, the size of the paper is applicable to the Chinese National Standard (CNS) A4 (210X297 mm) (please read the precautions on the back before filling this page). 1 Order. II -18 Printed by the Consumer Cooperatives of the Ministry of Standards of the People's Republic of China A7 __B7_ ___ V. Description of the invention (16) The poles 60 each extend through slot 20 along a fixed axis (labeled in Figure 2) and are installed at the end of slot 20 At least one of the walls 22, 24 is supported by it, and one end of the anode 60 extends beyond the groove 20. In the embodiment shown, the anode 60 is adapted to be placed in the tank 20, as shown in FIG. In this respect, the spacing between the side walls 22, 24 of the slot 20 and the size of the anode 60 are designed so that the anode 60 extends through the slot 20 between the end walls 22, 24, and the end of the anode 60 is placed on the end wall 22, 24 and supported by it. Specifically, the end walls 22, 24 are formed with a plurality of cylindrical holes 92 which are separated from each other. The sizes of the holes 92 are respectively on the pins 7 2 which are adapted to be attached to the anode 60, as shown in FIG. A plug 9 4 should be inserted and welded to the outer end of the hole 92 to seal the hole. A plurality of separated large holes 96 are formed in the side walls 22, 24 to receive the collar end of the anode 60. The holes 9 6 each include a first cylindrical portion 9 6 a, the size of which is suitable for the collar 7 4 that can fit the 贴 anode 60, and a second cylindrical portion 9 6 b of a larger diameter. . The hole 92 and the hole 96 are located on a circle center line, and the circle center is located on the axis 'A' of the drum 50, and the anodes 60 are arranged in a semicircular shape, as described above. The holes 92 are arranged along the center line of the circle at the midpoint between the holes 96. The center lines of each end wall 22, 24 are aligned with each other in the axial direction. In the illustrated embodiment, one of the holes 96 in the side wall 22 is coaxially aligned with one of the holes 92 in the side wall 24, and vice versa. Thus, in the embodiment shown, adjacent anodes 60 are inserted into the slot 20 from their opposite ends. In other words, the holes 96 and 92 in the respective end walls 22, 24 are offset from each other, and the pin end 'of the anode 60 is adjacent to the > collar end' of the adjacent anode 60. This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) I ^-V ».------- 'installation -------- order. (Please read the first Note for refilling this page) -19-Printed by A7 _B7_ of the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the invention (17)-Sealing device 102 is located around the collar 7 4 of each anode 60. The sealing device 102 is composed of a pair of ring-shaped seals 104 and is made of an elastic and compressible material. This is placed between the inner surface of the collar 74 and the second cylindrical portion 9 6b. A compression ring 106 is screwed into the threaded hole 108 of the plate 28. The sealing member 104 is compressed by the compression ring 106 to form a fluid-tight seal between the inner surface of the collar 74 of the anode 60 and the second circle-shaped portion 9 6b of the hole 96. Importantly, each anode 60 is symmetrical with respect to the axis ι ", which enables it to be placed in the groove 20 with the anode surface 80a or 80b facing the drum 50. As shown in Fig. 2, when installed in the groove 20, a portion of the anode 60 (that is, a portion outside the collar 74) protrudes from the groove 20. An electrical connector 8 2 is fixed to one end of the anode 60. As shown in FIG. 7, the connector 8 2 includes a flat plate portion 8 4 with separated holes therethrough. The holes in the plate 8 4 are aligned with the holes 76 in the core 64 of the anode 60. The holes 7 6 are designed to receive fixings or screws 7 8. The fixing member or screw 7 8 is adapted to fix the plate 8 4 of the electrical connector 8 2 on the anode 60. Connectors 8 2 are each connected to a power source (not shown). Importantly, the plate 8 4 of the connector 8 directly contacts the copper core 64 of the anode 60 »A guide roller 1 1 2 is provided on the entrance side of the device 10 to keep the position of the relationship between the base 12 and the drum 50 in. The cathode pick-up roller 1 1 4 is provided on the outlet side of the device 10, above and outside the tank 20 and the electrolytic solution contained therein. The cathode pick-up roller 1 1 4 is disposed on the gold surface of the bonding substrate 12 and is in electrical contact with it when it leaves the groove 20. The cathode pick-up roller 1 1 4 is conductive and designed to conduct and can be applied to the anode 6 0 This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling in this Page) · '' -20-Printed A7 ______B7 by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. The maximum current in the description of the invention (18) is discussed in more detail below. The function of the radon device 10 and the method of electrodepositing gold on a moving substrate are discussed. A polymer substrate 12 with a metal wipe is introduced into the electrodeposition device 10, and the metal on the substrate 12 is exposed. In the electrolytic cell of the tank 20, the other side of the substrate 12 is placed on the non-conductive outer surface 52 of the drum 50. Almost any flexible polymer sheet and preferably a thermoplastic sheet can be used, as long as a touch of conductive gold foil can be attached to the flexible polymer sheet. Examples of such polymer flakes are polyimide flakes (Kapton, DuPont), or polyester flakes, sprayed with about 2,000 angstroms of gold, such as tin, brass, zinc, copper, chromium, and the like. The base body 12 passes on the guide roller 112 and enters the drum 50. The substrate 12 is advanced on the drum 50 through the electrolytic solution in the tank 20. The substrate 12 passes through the gap defined between the drum 50 and the anode 60, and the gold pad thereon faces the function of the anode 60. The anode surface 8 0 »The substrate 1 2 leaves on the cathode pick-up roller 1 1 4 In the electrolytic solution, the metallized surface of the substrate 12 contacts the roller 1 1 4. According to the present invention, the anodes 60 are excited in groups, and each group contains One or more anodes 60, in which the anodes 60 of the rear group each have a higher excitation level than the front group in the moving direction of the substrate 12. When the metal is sunk from the anode 60 of the starting group on the starting metal of the substrate 12, the larger current of the thicker metal is used to carry energy to make the anodes of the latter group have a higher excitation level and a thicker thickness. Zhijin's role in picking up the roller 1 1 4 is as a guide. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page) 衮. Order I · «Γ— -21-A7 ______B7 printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. The invention description (19) system, and a higher level of incentives can be used. In other words, the wiped metal on the substrate 12 is initially used as a cathode to pick up the conductance of the rollers 1 4 to accumulate, i.e., deposit the metal on the substrate 12. The increasing thickness of the metal on the substrate 12 and its increased current carrying energy are then used to carry energy based on the current of the accumulated gold tincture of the anode in the previous group 60, and the gold electrodeposition of the anode 60 in the subsequent group is continuously increased, that is, the current is increased. Of course, it should be clear that the original metal on the polymer substrate 12 has a limited current carrying energy, and therefore, different current levels cannot be applied to the anode 60 of the array immediately or immediately. Initially, the current density that can be applied to the substrate 12 is limited by the current carrying energy of the wiped metal, that is, the current limit that it can conduct to the cathode pick-up roller 1 1 4. The excessive current density applied to the anode 60 actually only blows the wiped metal off the polymer matrix 12. Therefore, it is necessary to gradually increase the thickness of the gold substrate on the substrate 12 by sequentially stimulating the anodes 60 in each group. Specifically, the first group of anodes 60, that is, the group that first encountered the matrix 12 entering the tank 20, is excited at a level that the metal on the polymer matrix 12 can carry. The anodes of this first group therefore deposit gold ions from the electrolytic solution on the gold trowel, thereby increasing the thickness of the gold ions on the polymer substrate 12. When the substrate 12 moves through the groove 20 at a predetermined speed When the electrolytic solution is used, a continuously thickened metal layer finally reaches the cathode to pick up the roller 1 1 4, thereby increasing the current that can be applied to the substrate 12 to carry energy. At this time, the anode 60 of the second group can be excited at a higher level than the anode of the first group. The excitation level of this second group is based on the current carrying energy of the metal accumulated in the anode 60 of the first group. The gold 靥 deposited by the first group of anodes 60 is used as a conductor, so that the higher current level can be applied to the substrate. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read first Note on the back, please fill in this page again.) Clothes · Order *--22-A7 B7 Printed by the Consumers' Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. The invention description (9n) 1 2 is transmitted to the cathode pickup roller 1 1 4. After a predetermined period, the accumulated metal deposited by both the first group of anodes 60 and the second group of anodes 60 reaches the cathode to pick up the rollers 1 1 4. The gold alloy deposited by the first group of anodes 60 and the second group of anodes 60 produces sufficient thickness to excite the third group of anodes 60 at a higher excitation level than the first two groups of anodes 60. Moreover, the increase made by the third group of anodes 60 (the deposited gold maggots on the gold maggots deposited by the first and second groups of anodes) finally reaches the pickup cathode, which makes the fourth group of anodes 60 Can motivate at a higher level than the first three groups. In this regard, the anode 60 of each group basically increases the energy carrying capacity of the base 10, so that the anode 60 of the latter group can apply a higher excitation level to the anode 60 of the subsequent group, thereby generating a higher Electron sink rate is on each subsequent group. Finally, by sequentially energizing the above, each group of anodes 60 of the device 10 can be energized at their required operating level. As previously used, 'the group of anodes 60' is intended to indicate that each group of anodes 60 can contain one or More anodes 6 0 »In this respect, the design of the device 10 allows each anode 60 to be connected to its own power source, namely a rectifier. The following examples are used to illustrate specific embodiments of the present invention. These are merely examples, and do not limit the present invention in this way. "People skilled in the art know that process parameters, materials, technologies, and operations can be used for Various modifications. All parts and percentages specified in the examples are by weight unless otherwise specified. Although the present invention has been found to be beneficially applied to many electrodeposited gold alloys, including, but not limited to, copper, gold, silver, nickel, zinc, tin, brass, chromium, platinum, and tungsten, copper is typically used in electronics Applied metal. Copper 髙 conductive system This paper size 逋 Cai Guan Guan scale ([called 44 specifications (21 (^ 297 mm) — -23-(Please read the precautions on the back before filling in this page) • _ clothing · order A7 ____B7 V. Description of the invention (21) Number, weldability and easy electroplating make copper the most suitable gold alloy. In order for copper deposition to occur effectively, a sufficient amount of copper (usually copper sulfate) and chlorine are required in the sinking pond Compounds, and sulfuric acid. According to the present invention, the electrolytic solution includes copper sulfate in a range from about 50 to about 80 g / 1, chloride ion in a range from about 0 to about 30 p pm, and from about 50 to about Sulfuric acid in the range of 700. The temperature of the bath is also a parameter, which will affect the performance of the electrodeposition process. In this regard, the ordinary temperature operating window ranges from about 200 ° C to about 95 ° C. According to the present invention, The preferred temperature range extends from about 35.0 to about 80 ° C and the most suitable range extends from about 50 ° C to about 70 ° C. The following examples are used before this and the drawings The device shown is based. As shown in FIG. 1, 2 8 anodes 60 are provided in the slot 2 0. The anodes 60 are connected into 7 groups, of which each group The poles are connected to their own separate power source. Specifically, each group of seven anodes 60 is connected to a rectifier, causing the same current to be delivered to a specific group of anodes. Four groups of anodes constitute the processing zone, in a circle Marked as " A ,, " B ", " C ", and printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page), 1T-D ". In the following example, the drum 50 is made of rubber and has a length of 26 hours and a diameter of 30 hours. A 3 mi1 thick Kapton polymer sheet is spray-coated with about 2,000 angstroms of copper and the polymer sheet is 14 hours wide. The water-containing electric sink includes: 1) copper sulfate pentahydrate 400g / l 2) sulfuric acid 6 5 g / 1

A7 B7 V. Description of the invention () 22 3) Chloride 25ppm. The temperature of the pool is maintained at about 55 ° (: to about 65 ° (: between). As those skilled in the art can understand, the final thickness of the electrodeposited copper depends on the linear speed of the device, that is, the speed of the substrate passing area A_D, And the current density supplied by the anode 60 to the electrolytic cell. The following examples show that the device described above operates at different "line speeds" and different excitation levels of the anode 60. (Please read the precautions on the back before reading (Fill in this page) • I ", 1T, printed by the Employees 'Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs This paper is printed to the Chinese National Standard (CNS) A4 specification (210X297 mm) -25-printed by the Employees' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (23) Example 1 (Substrate speed 3. 15 feet / minute) Zone A Zone B Zone C Zone D Length (inches) 10.500 10.500 10.500 10.500 A / zone 150 150 150 150 Hour / zone (seconds) 16.677 16.677 16.677 16.677 Area current density (A / ft2) 146.939 146.939 146.939 146.939 Copper weight (g) 0 825 1.650 0.117 0.156 Copper thickness (mi 1 1) 0.039 0.078 0.117 0.156 Diaphragm current density 274793 274793 274793 274793 (A / inch 2) (Please read the notes on the back before filling in this page) Wave-This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) -26-Staff Consumption of Central Standards Bureau, Ministry of Economic Affairs Printed by the cooperative A7 B7 V. Description of the invention () 24 Example 2 (substrate speed 2. 6 feet / minute) Zone A Zone B Zone C Zone D Length (inch) 10.500 10.500 10.500 10.500 A / zone 150 400 660 840 hours / zone (Seconds) 20.192 20.192 20. 192 20. 192 District current density (A / ft2) 146.939 391.837 646.531 822.857 Copper weight (g) 0.999 3. 664 8. 061 13.657 Copper thickness (mi 1 1) 0. 047 0. 173 0.381 0.646 Diaphragm current density 226814 226814 226814 226814 (A / inch2) (Please read the precautions on the back before filling out this page) Clothing · Order *-This paper size applies to China National Standard (CNS) A4 specification (210X297) %) -27-A7 B7 V. Explanation of the invention () 25 Example 3 (Substrate speed 1.6 ft / min) Printed area A area B area C area D of the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs Length (inches) 10.500 10.500 10.500 10.500 A / zone 270 500 900 900 / Zone (second) 32.813 32.813 32.813 32.813 zone current density (A / sq. 2) 231.429 489.796 881.633 881.833 copper weight (g) 2.557 7. 970 17.713 2 7.456 copper thickness (mi 1 1) 0.121 0. 277 0. 837 1.298 film Chip current density (Amp / inch2) 159517 145976 142457 141435 In the table above, '" Amps / Area " indicates the total current applied to a specific area. '" time / zone' indicates the time (in seconds) that the substrate is exposed to a particular zone. % Zone current density # indicates the current density measured on the surface of the active anode in a particular zone. % Copper weight 〃 indicates that after a specific area is deposited on this paper scale, the Chinese National Standard (CNS) A4 specification (210X297 mm) is applied (please read the precautions on the back before filling this page). I Order f · -28 -B7 V. Description of the invention (26) Cumulative copper weight on the base 12 in ounces. ^ Copper thickness 〃 indicates the cumulative copper thickness deposited on the substrate 12 after a specific area, in terms of m i 1. | Diaphragm Current Density 'indicates the current density of the gold ions flowing through the membrane, that is, through the substrate 12. The comparison of the tables shows the effects of | linear velocity 'and | current density ^ on the final thickness of electrodeposited copper, and the advantages of the present invention. In Example 1, the substrate was moved through the device 10 at a speed of 3.15 feet per minute. At this speed, the substrate was exposed to each zone for approximately 16.7 seconds. In Example 1, 150 amps were applied to each zone. In this regard, each anode in each zone is excited by a current of about 21 to 22 amps. The current density in each zone is approximately 146.9 amps. In this respect, the difference between the current applied to the printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) and the actual current on the anode surface is very small. In other words, very little energy is dissipated or lost to become hot. ”In this case, the accumulation of copper is almost proportional. In other words, each zone adds about 0.825 grams of copper to the substrate 12 and a thickness of 0.039 mi 1. The actual current density of the gold ions accumulated on the substrate 12 is detected by the cathode element 114, which is about 274,793 amps. If it is predicted that the current in each zone is equal, the copper accumulated on the substrate is uniform and equal in each zone. Example 2 shows that the speed of the substrate 12 is about 2. 6 feet / minute, and is applied in each zone. The situation where the current increases in the back zone. In this regard, 150 amps are applied to area A, 400 amps are applied to area B, 660 amps are applied to area C, and 840 amps are applied to area D. At the same operating speed, the base body 12 is exposed to about 20.2 seconds in each zone. "In these cases, the paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm). -29-B7 V. Invention Explain (27) 'The copper accumulated on the substrate 12 has increased sharply. As shown in Example 2, .999 g of copper was deposited on the substrate 12 in zone A. At the end of zone B, the weight of copper was increased to 3.664 grams. At the end of zone C, the weight of copper increased to 8. 061 grams, with a thickness of 0.381 mi 1. When the substrate 12 left the area D, thorium deposited 13. 657 grams of copper, resulting in a copper thickness of 0.646 mil. In Example 3, the line speed was reduced to 1.6 feet / minute. At this rate, the substrate is exposed to 32.813 seconds in each zone. In this example, 270 A is applied to Zone A, 500 A is applied to Zone B, and 900 A is applied to Zones C and D. Even at this high current distribution level, the actual current density on the surface of the active anode is quite close to the applied on each area. In this regard, due to the arrangement and operating characteristics of the present invention, the power loss applied to the anode · 60 is less than 2% of the heat. In Example 3, 2.557 grams of copper was electrodeposited on the substrate 12 in area A to accumulate 0.121 mil of copper on the substrate. After the area B, it is printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (Please read the precautions on the back before filling out this page). The copper electrodeposited on the substrate 12 has a copper thickness of 0. 377mi 1. 873mi 1。 At the end of zone C, 17. 713 grams of copper 巳 was deposited on the substrate 12 to produce a thickness of 0.873mi 1. 3mi1。 When the substrate 12 left the region D, 27.456 grams of copper sampan was deposited thereon, with a final thickness of about 1.3 mi1. As shown in Example 3, at a lower linear velocity, the copper accumulated on the substrate 12 in each zone increases sharply, and as a result of the increase in copper, a much higher current can be applied to the substrate 12 to further Speed up the electrodeposition process. The present invention produces, for example, a copper coating, which has little or no edge effect, that is, the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -30 A7 __B7_ V. Description of the invention (28) The thickness of the copper coating is uniform on the coating body and its edges. The advantage of copper electrodeposited by the method described herein is the improvement in physical properties. The elongation of an ounce copper foil exceeds 15%, which represents this improvement. Compared with ordinary electro-deposited one ounce copper foil on a flexible polymer matrix, this improvement shows that the elongation is about three times greater. Moreover, according to the present invention, electro-sinking copper exhibits better ductility, thereby reducing the tendency of copper to crack or fail during processing and use to a minimum. Other silly points achieved by the present invention include the superior properties of the final product produced. One advantage is that the deposited copper foil produced by the method and apparatus of the present invention exhibits much greater ductility than a conventionally deposited copper box. For example, the elongation of an ounce of copper foil is about 28 percent. Moreover, as mentioned above, the electrodeposited copper-gold layer exhibits no edge effect, and therefore, the thickness of the electrodeposited copper is substantially uniform throughout the copper plating area. It is believed that the higher elongation of the metal-coated polymer film and the The large ductility is caused by the uniform accumulation of electrosinks and gold cymbals. Unlike ordinary methods (which usually require several passes through multiple electrolytic cells), the method of the present invention does not expose each layer of gold to the air. The metal layer deposited is uniform, continuous, and without any streaks, the metal layer can be identified. Therefore, the deposited metal area of the present invention does not contain metal oxides or airborne pollutants, any of which will cause the layer to be fragile or generate a stress concentration area. Therefore, the electrodeposited metal of the present invention is less likely to cause cracking than a polymer film made of an electrodeposited gold-coated coating made by a conventional method. FIG. 9 shows a side view of a photomicrograph of an electrodeposited copper foil manufactured on Ka p t ο η according to the method of Example 1. FIG. This photomicrograph shows that the Chinese paper standard (CNS) Α4 (210X297 mm) is applied to the paper size of the substrate. M -m HI a 1 ^ 1 rn 1 ^ 1 I · In ml 1 ^ 1 1 ^ 1 0¾, ve ( Please read the notes on the back before filling out this page) -31-Printed by A7 __ B7 of the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs V. A single uniform copper metal layer on the description of the invention (29) 1 2 This is different from the micrograph in Figure 10. Fig. 10 is a microphotograph of a common product made by a common market electroplating method. Fig. 10 clearly shows the different copper-gold rhenium layers deposited on the substrate. Each mark corresponds to the end of one electrodeposition cycle and the start of the next electrodeposition cycle in a multi-cell installation. These streaks are likely to be high stress concentration areas. The present invention will be described using electrodeposited gold on a non-conductive polymer film, which is later used to construct flexible electronic circuits. According to another aspect of the present invention, the device 10 can be used to directly plate a printed circuit pattern on a moving film, as shown in Figs. 1-13, where the film is marked as. According to this aspect of the invention, the membrane W generally comprises a thin flexible strip or film 200 of a non-conductive material, one side of which is covered with a thin layer of gold foil 202, as best shown in Figure 1 1_1 2b. The gold foil covering surface of the thin film 200 is shielded by a conventionally known method with a coating of a resist shielding material 2 04 to define a plurality of circuit patterns 2 06. The pattern 2 0 6 is defined by the exposed unshielded area of the base gold layer 2 2. In the embodiment shown in FIG. 11, the center portion of the diaphragm W is shielded, and the exposed unshielded substrate 2 is a continuous strip 208 extending along two edges of the diaphragm W. The exposed unshielded area of the base metal layer 202 constituting each pattern 206 is in communication with the exposed unshielded area of the base metal layer 2 202 constituting the band 208. In the embodiment shown in FIG. 11, the adjacent patterns 206 have opposite orientations, and the adjacent patterns 206 extend toward opposite sides of the film W. The strip 2 0 0 can be made of any flexible non-conductive material, and the paper size is applicable to China National Standard (CNS) A4 (210X297 mm) ^ —r—- L j.---- 1 mi · 1 ^ 1 — ^ 1. I (Please read the notes on the back before filling out this page) -32-A7 B7 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs V. Invention Description (30) 1 I above The layer 2 0 2 can be any electroplatable metal. The number of gold slabs with approximately 1 7 0 0 1 1 I angstrom (A) applied to it m 1 1 thick 1 ~~. Plastic or polymer 1 1 film provides satisfactory results in the electroplating pattern of the present invention. Although 9 can be used for any gold plating that can be electroplated with 1 1, the gold coating 2 D 2 should be copper 0. Important readers should read I I ♦ Circuit pattern 2 0 6 The general structure makes it every 2 ~~ branches 2 0 6 a or —- the back 1 | part communicates with the band 2 0 8 〇 As explained in more detail below, the circuit pattern note ancient 1 »I 2 0 8 A small part can be« T »rt Xing pattern 2 0 6 of the succession of branches or legs to complete the main item tr 1 1 isolation 〇 Figure 1 2 A generally (19. Show Figure 1 1 Sectional view of diaphragm W, showing Mabenz I non-conductive polymer film or strip Sheet 2 0 0 > gold layer 2 0 2 »and boundary sheet 1 1 fixed pattern 2 0 6 branch 2 0 6 a plating resist shielding material 1 1 2 0 4 (> 1 now discussed In the method of making the circuit pattern 2 0 6, the diaphragm W is introduced into the device 10 according to the manner shown in Fig. 1A, I, and 1 B. Specifically, the film 1 I and the sheet W are guided on the roller 1 1 2 and Enter the drum 50 and advance on the drum 1 1 I 50 through the electrolytic solution in the tank 20. In this respect, the diaphragm W 1 1 passes through the gap 9 0 defined between the drum 50 and the anode 60 in a circuit pattern. 1 2 0 6 (that is, the unshielded area of the base metal layer 2 0 2) Facing the anode • 1 6 0 Effect of the anode surface 8 0 e The diaphragm W leaves the electrolysis on the cathode picking roller 1 1 4 1 1 Solution * Where the exposed part of the extra metal layer 2 0 2 is in contact with the roller 1 I 1 1 4. During the electric sinking process, when the current supply rrhs should be on the anode 1 1 pole 6 0, the layer 2 0 The exposed metal action of 2 is as cathode 0 1 1 1 in the manner described above. 9 Excite 1 1 with 6 or more anodes in groups of 6 0 » > In the direction of movement of the diaphragm W, the 9 m group after the m pole 1 1 6 0 has a higher excitation level than the .V, /. National Standard (CNS) A4 Specification (210X297 mm) -33-A7 __B7__ V. Description of Invention (31) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) When the pattern 2 06 and the exposed portion of the metal layer 2 0 2 with 208, the increased current carrying energy of this thicker metal makes the anode of the rear group have a higher excitation level. In this respect, since the pattern 2 06 has continuous branches 2 0 6 a and the strip 2 8, there is a continuity along the length of the diaphragm, which allows a larger current to be conducted through the circuit branch 2 0 6 a and pick up the roller 1 1 4 through the belt 2 8 to the cathode. Due to the success of the circuit case 206 and the gold case with 2008, the current level in the back zone can be increased to a higher level, thereby increasing the metal plating to form the circuit pattern 206. As mentioned above, the case 206 may contain a small isolation region, which is indicated by 2 0 6 b in the figure, which is not connected with the branch 2 0 6 a or the band 208 of the circuit pattern 2 6. In these areas, it is believed that the underlying metal layer 202, that is, the area of the layer 202 below the coated resist 204 can provide sufficient current to carry energy to conduct this increased current level to the minute Branches 2 6 a and bands 2 0 8 can accumulate metal in these communities without burning or rupturing the diaphragm W. In this regard, since most of the current applied by the anode 60 to the diaphragm W is conducted through the branches 206 a and the band 208 of the pattern 2 06 to the cathode 1 1 4, the The huge area of the base metal layer 2 0 2 can sufficiently dissipate the currents in the pattern branches 2 6 a and the gathering area with 2 0 8 so that the area 2 6 b can resist higher current levels. However, if it can be It is clear that the continuity and increased current carrying energy of the golden maggots accumulated on the branches 2 0 a and 2 0 8 enables the higher excitation level to be applied to the area behind the device, and the area 2 0 6 b Only a relatively small part of the total exposed metal layer 202 is formed. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) " Consumption Cooperation by Employees of the Central Standards Bureau of the Ministry of Economic Affairs, printed A7 B7 V. Description of the invention () 32 Figure 1 2 B outline shows how Jin Wei accumulated in The exposed unshielded portion of the base metal layer 2 0 2. In FIG. 12B, the accumulated gold 靥 is indicated by 2 1 4. After the circuit 2 0 巳 has accumulated to the required thickness, the shielding material 2 0 4 can be removed by a commonly known method to expose the layer of gold 靥 from the substrate. 202 Extended Cumulative Copper Pattern. This substrate layer 202 is then removed by etching, leaving a cumulative copper pattern 206 on the film 2000. The copper strip 208 can then be removed (ie, separated) from the pattern 206 to leave the exposed pattern 206 on the film 200. FIG. 13 shows another embodiment of the film W, in which a plurality of identical patterns 2 1 6 At the center of the film W, they communicate with each other to form a continuous band of the pattern 2 1 6. The patterns 2 1 6 each include a central portion 216a with a plurality of legs or branches 216b protruding therefrom. The patterns 2 1 6 are generally symmetrical, and the adjacent patterns 2 1 6 are arranged so that their legs 2 1 6b communicate. In FIG. 13, a separated line is indicated and identified by a separation line 2 1 6. This arrangement of the patterns 2 1 6 creates a continuous path of the exposed metal 2 2 on the diaphragm W. In the manner described above, this continuous performance of the exposed metal is used to facilitate the application of an increased current to the diaphragm W. To be clear, the gold electrode deposited on the pattern 2 1 6 by the anode 60 of the starting group provides the increased current carrying energy of the diaphragm 60, so that the anode 60 of the latter group has a higher excitation level. As can be understood from the above, the exposed gold foil needs to be continuous along the diaphragm W to conduct the current applied by the anode 60 through the diaphragm W to the cathode to pick up the roller 1 1 4. After the pattern 2 1 6 is established according to the present invention, the shielding material 2 0 4 and the base metal layer 2 2 2 are removed by ordinary methods to expose the paper standard deposited in accordance with Chinese National Standard (CNS) A4 specifications ( 210X297 mm) (Please read the precautions on the back before filling out this page) Clothing _ order -35-A7 ____B7___ V. Copper pattern formed by the metal of the invention description (33). The patterns 2 1 6 are then separated from each other along the separation lines ~ to form separate individual circuits. The present invention therefore provides a method for constructing circuits on flexible, non-conductive polymer strips. This method, in addition to reducing manufacturing time, provides circuits with improved elongation and flexibility.说明 The invention will be described with reference to preferred embodiments. Those skilled in the art can come up with other modifications and changes after reading and understanding this instruction. All modifications and alterations within the scope of the appended patent application which are equivalent to them shall be included in the present invention. (Please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs This paper is sized to the Chinese National Standard (CNS) A4 (210X297 mm) -36-

Claims (1)

AS --E cf \ ϋ- Λ ^ Ό [1 Article 6. Application for Patent Application Year g 89.1. 2 0 Gray Ten Pieces-Printed a Chinese application for 丨 No. 85106570 Patent Application for Employee Consumer Cooperatives of the Ministry of Economic Affairs Intellectual Property Bureau The scope of the patent was amended in the Republic of China in January 1989. 1. A device for electro sinking metal, including:-a tank to hold the electrolytic solution; a drum installed in the tank; The anodes are arranged side by side in the groove, and around the drum, each of the anodes has at least one end protruding through the groove for connecting to a power source, and at least two different acting anode surfaces extend along the length of the anode; and-a bonding mechanism As the junction of the anode and the tank, the anode may be combined with the tank in at least two different orientations, and one of the at least two different active anode surfaces is different from each of the at least two The orientation is set to face the drum. 2. The device as described in item 1 of the scope of patent application, wherein the anodes are rods, have a uniform cross-section, include an inner core, are composed of a highly conductive first metal material, and a casing, It is made of a conductive metal material and is inert to the electrolytic solution. 3. The device according to item 1 of the scope of patent application, wherein the anode has a rectangular cross section, the active anode surface is defined by the opposite surface, and is made of titanium-copper co-extrusion, wherein copper forms the inner core , And titanium constitute the shell. 4. The device according to item 1 of the scope of patent application, wherein the anodes are each symmetrical with respect to a central axis' and are parallel to the axis of the drum when installed in the tank. This paper size applies to China National Standard (CNS) A4 (210 * 297 mm) -1-J J .----, -'i ------- ιβ, τ · ------ -^-/ ((Please read the precautions on the back before filling in this page) AS --E cf \ ϋ- Λ ^ Ό [1 Article 6. Application for patent year g 89.1. 2 0 Gray ten pieces-for丨 Patent No. 85106570 Patent application printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed in Chinese Amended the scope of the Republic of China 1989 January 1. Amended a device for electro sinking metal, including: Maintain the electrolytic solution; a drum installed in the tank; multiple anodes of the same shape are arranged side by side in the tank, and around the drum, each of the anodes has at least one end protruding through the tank for connection to a power source And at least two different functioning anode surfaces extend along the length of the anode; and-a bonding mechanism for joining the anode to the slot, wherein the anode can be combined with the slot in at least two different orientations, and wherein the One of the at least two different active anode surfaces is provided facing each of the at least two different orientations 2. The device as described in item 1 of the scope of patent application, wherein the anodes are rods, have a uniform cross-section, include an inner core, are composed of a highly conductive first metal material, and a casing It is made of conductive metal material, which is inert to the electrolytic solution. 3. The device according to item 1 of the scope of patent application, wherein the anode has a rectangular cross-section, and the surface of the anode is defined by the opposite surface and is defined by Titanium-copper is co-extruded, in which copper constitutes the inner core and titanium constitutes the outer shell. 4. The device as described in item 1 of the scope of patent application, wherein the anodes are each symmetrical with a central axis as the reference. When installed in the groove, it is parallel to the axis of the drum. This paper size applies to China National Standard (CNS) A4 (210 * 297 mm) -1-J J .----, -'i ----- --ιβ, τ · ------- ^-/ ((Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs __ _§_ VI. Patent Application Scope 5 · The device described in item i of the patent application scope, wherein each anode can be connected to a single Self-power. 6. A device for electroplating a metal onto a non-metallic electrically insulating substrate. The substrate has a layer of gold tincture on it. The device includes:-a tank to hold an electrolyte with the metal to be deposited. Concentration of ions; a cylindrical drum installed in the tank, the drum has a non-conductive outer surface 'and can be rotated about a fixed axis to pass the substrate through the tank; a plurality of long anodes are installed in the tank, and Placed side by side around the non-conductive surface of the drum, the anodes each extend along an axis substantially parallel to the drum axis, and have a uniform cross-section to define at least two active anode surfaces; Bonded, wherein the anode can be combined with the slot in at least two different orientations, and wherein one of the at least two active anode surfaces of each anode faces the drum in each of the at least two different orientations, The anode is arranged to define a generally continuous acting anode formed on the peripheral surface of the drum, and the acting anode forms a surface, which is generally defined by the outer surface of the drum. A gap of a uniform thickness; at least one power source, connected to the anode; and a cathode member outside the grooves, when the substrate exits the trough, adjusted to engage the base of the metal part. 7. The device according to item 6 in the scope of patent application, wherein the anodes are rectangular bars with a rectangular cross section * 8. The device according to item 6 in the scope of patent application, wherein the paper size Applicable to China National Standard (CNS) A4 specification (210 X 297 mm) I (Please read the precautions on the back before filling this page) -2-A8B8C8D8 Printed by the Consumers' Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 6. The scope of patent application Anodes are installed in the tank, one end of each anode passes through the tank Extend, this end can be connected to a power source. 9 The device according to item 8 of the patent application, wherein one or more adjacent anodes in a group are connected to the same power source. 10. The device as described in item 6 of the scope of the patent application, wherein the anode includes an inner core made of a highly conductive first metal material, and a case made of a conductive second metal material This is inert to electrolytic solutions. 11. The device according to item 10 of the scope of patent application, wherein the anode is made of titanium-copper co-extrusion, wherein copper forms an inner core and titanium forms an outer shell. 12. The device according to item 6 of the scope of patent application, wherein the distance between the anode and the drum is less than 1 inch. 1 3. — An electrolytic cell for electroplating gold on a substrate with a metal layer on the substrate, the electrolytic cell containing: — a tank to hold the electrolytic solution; a non-conductive curved flat surface, Inside the tank, a path is defined, and the substrate moves along the path; most of the long anodes, each anode has a uniform rhombic cross section and at least two active anode surfaces, each of which has a bonding mechanism to In two different orientations, each of the anodes is engaged with the slot, wherein one of the at least two active anode surfaces faces the non-conductive surface with one of the two orientations, and wherein a portion of the anode extends through In this slot, the anode is closely constructed side by side so that the anode surface of the anode and the non-this paper size apply the Chinese National Standard (CNS) A4 specification (210 X 297 public love) '-3-illll'-s ^ ·! 丨Order --------- line (please read the precautions on the back before filling this page) A8 B8 C8 D8 VI. Patent application scope Define a general continuous uniform gap between conductive surfaces; connection mechanism for connecting Connect one or more adjacent anodes in a group to a separate power source; and (Please read the precautions on the back before filling this page) Cathode member, outside the tank, when the substrate leaves the tank, adjusted to bite the substrate Metal parts. 14. The electrolytic cell according to item 13 of the scope of patent application, wherein the curved flat surface is defined by a drum rotatable about a fixed axis, and the anodes are each symmetrical with respect to an anode axis, and the axis Parallel to the axis of the drum. 15. The electrolytic cell according to item 13 of the scope of patent application, wherein the anode includes an inner core, which is made of a highly conductive first gold alloy material, and an outer shell, which is a conductive second gold alloy. Made of materials, this is inert to electrolytic solutions. 16. The electrolytic cell according to item 15 of the scope of patent application, wherein the anode is made of titanium-copper coextrusion, wherein copper forms the inner core and titanium forms the outer shell. Printed by the Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 17. The electrolytic cell as described in item 13 of the scope of patent application, wherein the interval between the anode and the drum is less than 1 inch. 18. The electrolytic cell according to item 13 of the scope of patent application, wherein the anode has a rectangular cross-section, the active anode surface is defined by the opposite surface, and is made of titanium-copper co-extrusion, wherein copper Forms the inner core, and titanium forms the outer shell. ^ 1 9. A method for electroplating a metal onto a non-golden electrically insulating substrate, comprising the steps: The paper size is applicable to China National Standard (CNS) A4 (210x 297 mm)-4-A8 B8 C8 D8 Scope of patent application a) A thin layer of thin gold is deposited on one side of a non-golden electrically insulating substrate I (please read the precautions on the back before filling this page) b) along the path containing a non-conductive surface, apply The substrate passes through a solution having a plurality of anodes, and the anodes are adjacent to and face the surface. The anode defines a thin uniform gap with the surface. The substrate is faced with the metal side of the substrate and passes through The anode then leaves the solution to move the substrate along the surface; c) passing the gold surface of the substrate through a conductive cathode other than the electrolytic solution: and d) passing the anode through the electrolytic solution to continuously electrolyze and form When the gold tin is on the side of the gold tin of the moving base, one or more of the adjacent anode groups have different current density levels, and the current density level of the specific anode group is greater than along the The path of the previous group of anode current level, and the current level present in the system according to the current range of the wiping gold dimple on the substrate between the anode and cathode or a specific group of the dimple is formed of gold carrying capacity. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The method described in item 19 of the scope of patent application, wherein the current density level of one group of anodes is higher than that of the anode group directly passing through the path. The current density level of the group is large. 21. The method according to item 19 of the scope of patent application, wherein the non-conductive surface is substantially cylindrical, and the anode is a thin and long rod extending parallel to the substantially cylindrical surface. 22. —A method of electro sinking gold metal on a non-metallic metal insulating substrate, including the steps: This paper size applies the Chinese National Standard (CNS) A4 specification (210 x 297 mm) -5-Intellectual Property Bureau, Ministry of Economic Affairs Printed by employees 'consumer cooperatives A8 B8 C8 D8 Sixth, the scope of the patent application sets up a number of long anodes, arranged in a dense package and listed in the electrolytic solution' Each of these anodes has a function of the anode surface to align the adjacent anode Anode surface to form a substantially continuous action to form a surface; move one of the non-conductive backing layers on top of it and spread a thin layer of non-conductive watch ® with an electrolytic solution, and form a surface by this continuous action, while passing along it When the wiped metal facing the anode, keep a uniform space below 1 "between the gold alloy and the forming surface; make the metal pick up the roller through a cathode outside the electrolytic solution when it leaves the electrolytic solution; And applying electrical energy to one or more adjacent anode groups to continuously deposit and form metal on the wiped metal, each successive group of the anode has A higher energy level than the previous group, the current density level of the particular anode group depends on the gold trowel or the forming metal present on the substrate between the anode specific group and the cathode 2 3. —A method of electrodepositing a metal on a non-metallic electrically insulating substrate, comprising the steps of: a) moving a non-conductive substrate with a wipe of metal thereon along a predetermined path, wherein the The substrate first moves over a non-conductive surface of an electrolytic solution, passes through a plurality of anodes placed in the solution, and then passes through a conductive cathode surface located outside the electrolytic solution. The wiped metal on the substrate faces The anode in the solution, and the surface of the conductive cathode; and b) applying electrical energy at different levels to one or more adjacent anodes in a group to continuously deposit or form gold dust on the wiped metal of the anode In the above, the anodes of the rear group each have a higher energy level than the previous group. The paper size of each specific anode applies the Chinese National Standard (CNS) A4 specification (210 x 297 mm) -6-«— IJIJ1IIJ · —! — I Clothing · III / | \ (Please read the precautions on the back before filling this page) Order --------- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A8 B8 C8 D8 The energy level of the group depends on the current carrying capacity of the wiped metal or the gold formation on the substrate between the specific group of the anode and the anode. 24_ — A kind of non-metal used to make printed circuits A method for electrically insulating a substrate, comprising the steps of: a) printing a layer of resist on a layer of conductive material on one side of a generally continuous length of flexible non-conductive material to extend over the strip A continuous strip exposed by one of the conductive layers over the length and one or more patterns of a printed circuit communicating with the strip exposed; b) moving the strip having the printed circuit thereon along a predetermined path, The strip is first immersed in the electrolyte, and moves in a solution on a non-conductive surface by constructing a plurality of side-by-side anodes in the solution to form a generally uniform intermediate electrode gap having a strip shape and then leaves the Dissolve the solution and move it to the surface of the anode and cathode located outside the electrolytic solution. The continuous stripe of the conductive layer on the strip faces the anode of the solution and engages with the surface of the conductive cathode. The exposed part of the conductive layer is continuous. Stripes to form a conductive path along the path from the anode to the cathode; and c) electrically energize one or more adjacent anodes in groups at different levels to deposit or form metal in succession On the exposed continuous stripe of the layer, the anodes of the rear group each have a higher excitation level than the previous group, and the energy level of the specific anode group depends on the existence of the anode group and the specific group. The current carrying capacity of the formed metal between the cathodes. 2 5. The method described in item 24 of the scope of patent application, including the additional steps: This paper size applies to China National Standard (CNS) A4 (210x297 mm) -7- ---------- Clothing --------- 1 Order --------- line xf \ (Please read the precautions on the back before filling this page) I Apply for a patent to remove this layer of anti-etching to the substrate. If applied Special d) e) 2 6 Steps: Make printed circuit and conducting 2 7. If you apply for a specific set of anodes to stimulate and carry the metal current of 2 8. — Kind of illegal, including steps: A8 B8 C8 D8 Etchant ; And the non-patterned area of the second range of the second range of the electric layer of the electric layer is the conductive layer based on the band energy. The method described in item 5 further includes continuous band separation. The method according to item 4, wherein the strip passes through the specific group to form a printed circuit on an electrically insulating substrate of a metal foil. A) Provide a long, generally continuous, conductive layer on which A flexible non-conductive J, · ^ ---- "----; wave --- / IV (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The conductive c) of each figure is extended by moving away from the electrical surface through the construction surface, positioning the anode and continuing the stripes, printing one of the resistive layers, one of the exposed layers, and polymerizing the material along a path in the solution. To form a decomposing solution, and polymerize the material from the anode along the strip along the conductive cathode; the etchant is conductive to form a continuous exposed area; and a plurality of patterns with patterns in it are immersed in One of the strips is moved to the bite electrode located on the surface of the conductive layer to the cathodic layer, so that multiple patterns and extensions along the length of the polymeric material-electrolysis side by side and uniformly dissolve the continuum, among which Gathering on the path In the liquid electrode, the stripe is a conductive layer on the outer side of the middle electro-hydraulic layer to form a composite material, and the exposed surface of the anode cathode facing the solution is connected with a conductive path behind the gap between the non-conductive surface electrode of the solution. China National Standard (CNS) A4 specification (210 x 297 mm)-»-Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A8 B8 C8 ___ D8 VI. Application scope of patents d) Apply electrical energy to different levels One or more adjacent anodes in order to continuously sink or form the gold ridges on the exposed continuous stripe of the conductive layer, wherein the anodes of the latter group each have a higher energy level than the former group, and among the specific anodes The energy level of the group is determined by the current carrying capacity of the gold ions formed between the specific group of the anode and the cathode. 2 9. The method described in item 28 of the scope of patent application, and The method comprises the steps of: d) removing the layer of resist; and e) etching away the conductive layer on the unpatterned area of the substrate. 30. The method according to item 28 of the patent application scope, wherein a specific group The excitation level of the anode is determined according to the energy carried by the current of the gold maggot exposed when the strip passes through the specific group. "3 1. — A method for constructing a printed circuit on a continuous length of a non-metal maggot electrically insulating substrate, including Steps: a) Print a layer of resist on a conductive layer material on one side of a strip of flexible conductive material of generally continuous length to make one of the conductive layers continuous along the length of the strip The area is exposed, the area contains a plurality of printed circuit patterns; b) the strip with the printed circuit thereon is moved along a path, wherein the strip is first immersed in an electrolytic solution, and the structure is passed through the solution Most of the anodes in the solution move side by side on a non-conductive surface to form a generally uniform intermediate electrode gap with a stripe shape, then leave the electrolytic solution, and move the surface of the anode cathode on the outside of the electrolytic solution, located in the The exposed area of the conductive layer on the polymeric material is the size of the paper facing the solution. It is applicable to China National Standard (CNS) A4 (210 x297 mm). -----line? ) (Please read the notes on the back before filling this page)