TW416006B - Photoelectric tester and method for a printed circuit board - Google Patents

Photoelectric tester and method for a printed circuit board Download PDF

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Publication number
TW416006B
TW416006B TW88100015A TW88100015A TW416006B TW 416006 B TW416006 B TW 416006B TW 88100015 A TW88100015 A TW 88100015A TW 88100015 A TW88100015 A TW 88100015A TW 416006 B TW416006 B TW 416006B
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Taiwan
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board
hole
printed circuit
scope
circuit board
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TW88100015A
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Chinese (zh)
Inventor
Shwu-Tyng Lee
Jin-Chang Cheng
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Optron Corp
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Abstract

The invention relates to a photoelectric testing system and method for a printed circuit board (PCB), which comprises the image sensor, the image controller, hole set analyzer and hole position detector. The tester is applied with high speed, high precision photoelectric image sensing and control equipment capable of automatically receiving and processing the codes of image signals, ensuring to significantly increase the efficiency of testing operation and to secure the precision for the image data of PCB hole positions. In addition, the photoelectric testing method of the invention provides the automatic testing procedures to compare the hole positions on the reference board and board to be tested such that the inspection with human eyes can be replaced. The hole position tester provides a man-machine interface along with menu selection and event driven methods to input the conditions and ranges configured for the board to be tested and display the resulting configuration as well as the testing result and statistical information regarding the board to be tested. The displayed information can be shown in forms of color graphics and numeric values to provide the effect of easy operation and contrast adjustment.

Description

416006 五 '發明說明(i) 發明領域 本發明係有關於印刷電路板(printed circuit board > PCB)的檢測。特別地,係相關於一種自動化之印 刷電路板的光電檢測系統與方法》 發明背景 習知 下簡稱待 來作比對 一般是以 徑(h ο 1 e 比對,並 大於孔偏 則視為不 整。傳統 板作逐孔 著科技的 馬達的帶 等,然而 速率、及 板光電檢 印刷電路板的檢測,是以待測的印刷電路板(以 測板)和一標準的印刷電路板(以下簡稱基準板) 。待測板被檢测為不良板(d e f e c t i v e b 〇 a r d), 該待測板之板上的孔位(h〇ie coordinate)和孔 d i ame t er ) ’來和基準板的孔位和孔徑作逐孔的 以基準板的要檢條件和範疇作為參考基準,如果 谷忍度(of f grid tolerance)或其瑕疵容忍度, 良板。基準板的要檢條件和範疇視需要而作調 的人為目檢方式,是將待測板與基準板的塑膠模 的比對。不僅作業效率差,也難確保精準度。隨 演進,雖有自動化的印刷電路板檢測系統,包括 動待測板和彩色顯示於監視器畫面的顯示結果 ,仍無一套對系統的使用者而言,有高精度、高 自動化、人性化、易操作等兼備功能的印刷電路 測系統。416006 Five 'Description of the Invention (i) Field of the Invention The present invention relates to the inspection of a printed circuit board (PCB). In particular, it is related to an automated photoelectronic detection system and method for printed circuit boards. BACKGROUND OF THE INVENTION It is generally referred to as the to-be-compared comparison, which is generally based on the diameter (h ο 1 e comparison, and is larger than the hole deviation is considered uneven) The traditional board is used as a motor-by-hole motor technology belt, etc. However, the speed and board photodetection of the printed circuit board are based on the printed circuit board to be tested (the test board) and a standard printed circuit board (hereinafter referred to as the short board) (Reference plate). The board under test is detected as a defective board, and the hole position (h oie coordinate) and the hole diameter of the board under test are used to match the hole position of the reference board. The hole-by-hole and hole-by-hole reference conditions and categories of the reference plate are used as reference references. If the valley tolerance (of f grid tolerance) or its defect tolerance is good, it is a good plate. The artificial inspection method for adjusting the conditions and scope of the reference plate according to need is to compare the test plate with the plastic mold of the reference plate. Not only the work efficiency is poor, but it is difficult to ensure accuracy. With the evolution, although there is an automated printed circuit board inspection system, including moving test boards and color display results on the monitor screen, there is still no set of high-precision, high-automation, and humanization for the users of the system And easy-to-operate printed circuit test system.

A:\inspectl224. ptd 第4頁 416006 五、發明說明(2) 發明概要 本發明克服上述印刷電路板之孔位和孔偏檢測系統的 缺點。其目的之一是,提供一種印刷電路板的檢測系統’ 該系統為一自動化之光電檢測系統,且備有一人性化、易 操作的人機介面。藉由此人機介面,來設定基準板的要檢 條件和範略’並且經由此人機介面,即時顯示待測板的檢 測結果和統計資料。 本發明的另一目的是,提供一印刷電路板的檢測系 統’而此檢測系統是使用自動化取像,以高速度、高精度 的光電影像感應和控制的設備,來接收和處理影像訊號的 編碼。使用高速度、高精度之自動化的設備,大幅提高檢 測作業效率,又可確保印刷電路板原始孔位影像資料的精 度。所以,在設定之要檢條件和範疇裡,來進行組孔分析 和孔位檢測’可以正確高速地檢出瑕疵板。 根據本發明’組孔分析或孔位檢測的元件皆可使用一 中央處理單元和一記憶體單元來實施功能和作為所需要的 資料儲存空間’以消除購置特殊設備的高成本。 而 根據本發明’孔位檢測的元件備有一人機介面,以輸A: \ inspectl224. Ptd Page 4 416006 V. Description of the invention (2) Summary of the invention The present invention overcomes the shortcomings of the above-mentioned printed circuit board hole position and hole deviation detection system. One of the objectives is to provide a printed circuit board inspection system. The system is an automated photoelectric inspection system and is provided with a humanized, easy-to-operate human-machine interface. By using this man-machine interface, set the inspection conditions and outline of the reference board ’, and through this man-machine interface, display the test results and statistical data of the board to be tested in real time. Another object of the present invention is to provide a printed circuit board detection system ', and the detection system uses automatic image acquisition, high-speed, high-precision photoelectric image sensing and control equipment to receive and process image signal encoding . The use of high-speed, high-precision automated equipment can greatly improve the efficiency of inspection operations, and can also ensure the accuracy of the original hole image data of the printed circuit board. Therefore, under the set conditions and categories to be inspected, group hole analysis and hole position detection 'can accurately detect the defective plate at high speed. According to the present invention, the elements of the set of hole analysis or hole detection can use a central processing unit and a memory unit to implement functions and serve as required data storage space 'to eliminate the high cost of purchasing special equipment. The component for detecting the hole position according to the present invention is provided with a human-machine interface for inputting

416006 五、發明說明(3) 入設疋基準板的要檢條件和範疇,和顯示出基準板的設定 結果及待測板的檢測結果與統計資料。 本發明的又一目的是,提供上述之印刷電路板光電檢 測系統的自動檢測方法,包含有設定基準板的步驟、基準 板與待測板之孔位比對的自動化檢測程序,以及人機介面 的處理方式。本發明之自動光電檢測方法,取代傳統人為 之目檢方式’並提供多項新穎的檢測功能,大幅提昇檢測 的精準度和作業效率。 本發明之印刷電路板檢測的系統與方法,其檢測結果 顯示的資訊’包含有繞孔瑕疵數、缺孔數、缺孔孔位和孔 徑、多孔數、多孔孔位和孔徑、孔塞(of f size)數、孔塞 孔位和孔徑’和其基準板和待測板的孔位和孔徑大小、及 良板數和瑕蘇板數的統計資訊等β 在本發明之印刷電路板檢測系統的一個實施例裡,藉 由使用一般合適的輸入和輸出元件,以人機互動之交談方 式,將基準板的設定輸入及顯示,並且將待測板的檢測結 果和統計資訊以彩色圖形和數值方式來表示出,以提供易 操作和對比的調整效果。 茲配合下列圖式、實施例之詳細說明及專利申請範 圍,將上述及本發明之其他目的與優點詳述於后。416006 V. Description of the invention (3) Enter the inspection conditions and scope of the reference plate, and display the setting result of the reference plate and the test results and statistical data of the plate to be tested. Another object of the present invention is to provide the above-mentioned automatic detection method for a printed circuit board photoelectric detection system, which includes a step of setting a reference board, an automatic detection program for comparing hole positions between the reference board and the board to be tested, and a human-machine interface. Approach. The automatic photoelectric detection method of the present invention replaces the traditional artificial visual inspection method and provides a number of novel detection functions, which greatly improves the detection accuracy and operation efficiency. According to the system and method for testing a printed circuit board of the present invention, the information displayed in the test results includes the number of flaws around the holes, the number of missing holes, the positions of the missing holes and the pore diameter, the number of the holes, the positions of the porous holes and the pore diameter, and the plug f size) number, hole plug hole position and hole diameter 'and the hole position and hole size of the reference plate and the board under test, and statistical information of the number of good plates and defective plates. β In the printed circuit board inspection system of the present invention In an embodiment, by using generally suitable input and output components, in a human-computer interactive manner, the settings of the reference board are input and displayed, and the test results and statistical information of the board under test are displayed in color graphics and numerical values. To display, to provide easy-to-operate and contrast adjustment effects. The above and other objects and advantages of the present invention are described in detail below in conjunction with the following drawings, detailed description of the embodiments, and the scope of patent applications.

A:\inspectI224.ptd 第6頁 416006 五、發明說明(4) "'~' ---- 圖式之間要說明 圖1係本發明之印刷電路板檢測系統的方塊示意圖。 圖2係本發明之印刷電路板檢測系統之影像感應單元擷取 一印刷電路板上的孔位影像的結構示意圖。 圖3係本發明之印刷電路板檢測系統之影像控制單元的結 構不思、圖。 圖4係本發明之印刷電路板檢測系統之組孔分析單元 構示意圖。 圖5係本發明之印刷電路板檢測系統之孔位檢測單元社 構示意圖。 ' 圖6係本發明之檢測印刷電路板的運作流程圖。 圖7係說明圖6中設定基準板的步驟與流程。 圖8係說明本發明之藉由圖5中孔位檢測單元裡的人機介 面’來設定基準板的一個實施例。 ;A: \ inspectI224.ptd Page 6 416006 V. Description of the invention (4) " '~' ---- Explanation between drawings Figure 1 is a block diagram of the printed circuit board inspection system of the present invention. FIG. 2 is a schematic structural diagram of capturing an image of a hole position on a printed circuit board by an image sensing unit of the printed circuit board detection system of the present invention. Fig. 3 is a diagram showing the structure of an image control unit of the printed circuit board inspection system of the present invention. FIG. 4 is a schematic diagram of a group hole analysis unit of the printed circuit board inspection system of the present invention. FIG. 5 is a schematic diagram of the structure of a hole position detecting unit of the printed circuit board detection system of the present invention. 'FIG. 6 is an operation flowchart of the inspection printed circuit board of the present invention. FIG. 7 illustrates steps and processes of setting a reference plate in FIG. 6. Fig. 8 illustrates an embodiment of the present invention for setting a reference plate through the man-machine interface 'in the hole detection unit in Fig. 5. ;

A:\inspectl224.ptd 第7頁 416006A: \ inspectl224.ptd Page 7 416006

圖9係圖6之運作流程 位比對的法則。 的檢測鞋序中,基準板與待測板之孔 圖號說明 1 01衫像感應單元 1 〇 2影像控制單元 103組孔分析單元104孔位檢測單元1〇5人機介面 CLK像素脈衝訊號 SP線同步訊號SIG孔位影像訊號 ACT開始感應訊號 2 0 1待測板或基準板2 0 2傳動馬達的輪送帶 301驅動電路302編碼電路303儲存單元 3 0 4編碼後的資訊Figure 9 is the operating flow of Figure 6. In the sequence of testing shoes, the hole numbers of the reference board and the board to be tested are illustrated. 01 01 shirt image sensor unit 102 image control unit 103 group hole analysis unit 104 hole position detection unit 105 human machine interface CLK pixel pulse signal SP Line synchronization signal SIG hole position image signal ACT start sensing signal 2 0 1 DUT or reference board 2 0 2 Carousel of drive motor 301 drive circuit 302 encoding circuit 303 storage unit 3 0 4 encoded information

416006 五、發明說明(6) 4 0 3 孔位和孔徑資訊 401、501中央處理單元 402、5 02記愫體單元 發明之詳細說明 圖1為本發明之印刷電路板光電檢測系統的方塊示意 圖。本印刷電路板檢測系統包含有一影像感應單元丨01、 一影像控制單元1 〇 2、一組孔分析單元1 〇 3,和一孔位檢測 單元104。如圖1所示,孔位檢測單元104具有一人機介面 1 05。本發明之印刷電路板檢測系統的使用者藉由此人機 介面1 0 5 ’設定基準板的要檢條件和範_。透過孔位檢測 單元1 0 4,將開始感應訊號ACΐ發出給影像控制單元丨〇 2, 再由影像控制單元1 0 2來驅動影像感應單元丨〇 1 ^影像感應 單元1 0 1感應及擷取一印刷電路板上的孔位影像後,送出 該孔位影像訊號。由影像控制單元1〇2來接收這些孔位影 像訊號,及處理該影像訊號的編碼。組孔分析單元丨〇3接 收來自影像控制單元1〇2的編碼,對該編碼進行組孔分 析,產生孔位和孔徑資訊。孔位檢測單元1〇4接收產生的 孔位和孔徑資m ’作為基準板的設定,並且進行待測板的 檢測》待測板的檢測結果和統計資料,經由此人機介面 1 0 5 H元屮。416006 V. Description of the invention (6) 4 0 3 Hole position and aperture information 401, 501 Central processing unit 402, 5 02 Recording unit Detailed description of the invention Fig. 1 is a schematic block diagram of a printed circuit board photoelectric detection system of the present invention. The printed circuit board detection system includes an image sensing unit 01, an image control unit 10, a set of hole analysis units 103, and a hole position detection unit 104. As shown in FIG. 1, the hole detection unit 104 has a man-machine interface 105. The user of the printed circuit board detection system of the present invention sets the inspection conditions and specifications of the reference board through the man-machine interface 105 '. Through the hole detection unit 104, the start sensing signal ACΐ is sent to the image control unit 丨 〇2, and the image control unit 102 drives the image sensing unit 丨 〇1 ^ image sensing unit 1 0 1 senses and captures After a hole image is printed on a printed circuit board, the hole image signal is sent. The image control unit 102 receives the image signals of the holes and processes the encoding of the image signals. The group hole analysis unit 丨 03 receives the code from the image control unit 102 and performs group hole analysis on the code to generate hole position and hole diameter information. The hole position detection unit 104 receives the generated hole position and the hole diameter m ′ as the reference plate settings, and performs the test of the board to be tested. The test results and statistical data of the board to be tested are passed through this man-machine interface 1 0 5 H Yuan Zhen.

A:\inspectl224. ptd 第9頁 416006 五、發明說明(7) 人機介面可使用一般合適的輪入和輸出元件,如,鍵 盤(keyboard),監視器的顯示畫面(CRT)等。顯示畫面更 可以將欲顯示的資料以彩色圖形和數值方式來表示出,以 提供易操作和對比調整的效果。 ’ 接下來,將本發明之印刷電路板檢測系統的主要單元 1 0 1〜1 0 4的運作和功能結構·--詳細說明。 圖2說明本發明之影像感應單元1 〇 1如何操取一印刷電 路板上的孔位影像。如圖2所示’影像控制單元丨〇2發出驅 動訊號’像素(pixel)脈衝訊號CLK和線同步訊號SP,來驅 動影像感應單元101 ’經由傳動馬達的輸送帶2〇2,待測板 或基準板2 01向前趨動,影像感應單元1〇2感應並擷取該待 測板或基準板上的孔位影像後,將該孔位影像訊號s丨G送 出’由影像控制單元1 0 2來接收β影像控制單元丨〇 2係一將 光訊號轉換為電流電壓訊號的感應裝置,可以使用一般合 適的光學影像感應裝置,包括有接觸式影像感應器 (contact image sensor,CIS)和充電式電耦合裝置 (charged coupled device , CCD)等 « 圖3為本發明之影像控制單元的結構示意圖 示,影像控制單元102包含有一驅動電路3〇1、一編碼電路 302和一儲存單元303。影像控制單元1〇2收到開始感應訊 號ACT後’即發出驅動訊號’包括有像素脈衝訊號ακ和線A: \ inspectl224. Ptd Page 9 416006 V. Description of the invention (7) The human-machine interface can use generally suitable wheel input and output components, such as keyboard, monitor display (CRT), etc. The display screen can also display the data to be displayed in color graphics and numerical values to provide easy operation and contrast adjustment effects. ’Next, the operation and functional structure of the main units 1101 to 104 of the printed circuit board inspection system of the present invention will be described in detail. Fig. 2 illustrates how the image sensing unit 101 of the present invention can manipulate images of holes on a printed circuit board. As shown in Figure 2, the 'image control unit 丨 〇2 sends a driving signal' pixel pulse signal CLK and line synchronization signal SP to drive the image sensing unit 101 ′ through the conveyor belt 202 of the drive motor, the board under test or The reference plate 2 01 moves forward, and the image sensor unit 102 senses and captures the image of the hole on the board under test or the reference plate, and sends out the image signal s 丨 G of the hole. 'The image control unit 1 0 2 to receive β image control unit 丨 〇2 is a sensing device that converts optical signals into current and voltage signals. Generally suitable optical image sensing devices can be used, including a contact image sensor (CIS) and charging. Charge coupled device (CCD), etc. «FIG. 3 is a schematic structural diagram of an image control unit of the present invention. The image control unit 102 includes a driving circuit 301, an encoding circuit 302, and a storage unit 303. After receiving the start sensing signal ACT, the image control unit 102 issues a driving signal and includes a pixel pulse signal ακ and a line.

第10頁 A:\inspectl224.ptd 416006 五'發明說明(8) " 同步訊號SP,來驅動影像感應單元1〇1。影像控制單元1〇2 之編碼電路302接收來自影像感應單元1〇1的孔位影像訊號 SIG後,將該孔位影像訊號SI(J編碼,經編碼後的資訊 送,儲存單元303儲存,並送至組孔分析單元1〇3。該編碼 技術可以使用一般的編碼技術,例如,區段長度編碼( length coding)。 圖4係本發明之組孔分析單元的結構示意圖。如前所 述,組孔分析單元1 〇3可以使用一中央處理單元和一記憶 體單το來實施其功能和作為所需要的資料儲存空間,以 除購置特殊設備的高成本。 如圖4所示組孔分析單元1〇3包含有一中央處理單元 4〇1和一記憶體單元402❶中央處理單元4〇1接收來自影像 控制單元102的編碼資訊後,對該編碼資訊進行組孔分 ^,產生孔位和孔徑資訊403 ^並將其送至記憶體單元4〇2 來儲存,同時該孔位和孔徑資訊4〇3也被送至孔位檢測 元 1 0 4。 圖5係本發明之孔位檢測單元的結構示意圖。孔位檢 j單元1(H備有機介面1〇5,且包含有—中央處理單元 和一圮憶體單凡502。如前所示述,本發明之光電檢測 系統的使用者藉由此人機介面105,來設定基準板的要檢 條件和範疇。透過孔位檢測單元1〇4之中央處理單元5〇1,Page 10 A: \ inspectl224.ptd 416006 Five 'invention description (8) " Sync signal SP to drive the image sensing unit 101. After the encoding circuit 302 of the image control unit 102 receives the hole image signal SIG from the image sensing unit 101, it sends the hole image signal SI (J code, the encoded information is sent, and the storage unit 303 stores it, and Send to the group hole analysis unit 103. This coding technology can use common coding techniques, such as length coding. Figure 4 is a schematic diagram of the structure of the group hole analysis unit of the present invention. As mentioned before, The group hole analysis unit 1 03 can use a central processing unit and a memory unit το to implement its functions and as a required data storage space, in addition to the high cost of purchasing special equipment. As shown in Figure 4 group hole analysis unit 103 includes a central processing unit 401 and a memory unit 402. After the central processing unit 401 receives the encoded information from the image control unit 102, it performs grouping of the encoded information ^ to generate hole position and aperture information. 403 ^ and send it to the memory unit 402 for storage, and at the same time, the hole position and the aperture information 403 are also sent to the hole position detection unit 104. Figure 5 shows the result of the hole position detection unit of the present invention. Schematic diagram of hole position detection unit 1 (H prepared organic interface 105), and includes-a central processing unit and a memory body danfan 502. As mentioned above, the user of the photoelectric detection system of the present invention uses This man-machine interface 105 is used to set the inspection conditions and scope of the reference plate. Through the central processing unit 501 of the hole position detection unit 104,

A:\inspectl224. ptd 第11頁 416006A: \ inspectl224.ptd p. 11 416006

將開始感應訊號ACT發出給影像控制單元1〇2。 另外’中央處理單元501並接收來自組孔分析單元1〇4 位和孔徑資訊,和執行待測板的檢測程序和基準板的 又疋程序。a己憶體單元5〇2就是用來儲存中央處理單元 所接收的孔位和孔徑資訊,並作為該孔位檢測單元執行該 待測板之檢測程序和基準板之設定程序時,所需要的資料 ,以下將逐次說明本發明之光電檢測系統的運作流程和 檢測程序的孔位比對的法則^並且,經由一人機介面1 〇 5 以人機互動之交談方式,將設定基準板的一個較佳實施 例,和待測板之檢測結果及統計資訊的一個較佳實施例,The start sensing signal ACT is sent to the image control unit 102. In addition, the 'central processing unit 501 also receives 104-bit and aperture information from the group hole analysis unit, and executes the test program of the test board and another program of the reference board. A Jiyi body unit 502 is used to store the hole position and aperture information received by the central processing unit, and it is required for the hole position detection unit to execute the test program of the board to be tested and the setting program of the reference board. Data, the following will successively explain the operation flow of the photoelectric detection system of the present invention and the rules of hole location comparison of the detection procedure ^ Moreover, through a human-machine interface 105, a comparative method of human-machine interaction will be used to set a comparison of the reference board A preferred embodiment, and a preferred embodiment of the test results and statistical information of the board under test,

作進一步的描述D 圖6為本發明之印刷電路板光電檢測系統的運作流程 圖。首先,使用人機介面1〇5,來設定一基準板與其要檢 條件和範疇(步驟6〇1)。經由影像感應單元1〇2來掃瞄和感 應待測板’以擁取該待測板的鑽孔影像資訊(步驟6〇2)。 有了鑽孔影像資訊後,進而編碼和分析該鑽孔影像資訊, 並求出該待測板的孔位和孔徑資訊(步驟6 〇 3 )。以該基準 板的設定要檢條件和範疇為參考基準,進行待測板的檢測 程序(步驟604)。最後,經由人機介面1〇5,顯示該待測板 並將該待測板作良品和瑕疵品的 的檢測結果和統計資料For further description D FIG. 6 is a flow chart of the operation of the printed circuit board photoelectric detection system of the present invention. First, use the human-machine interface 105 to set a reference board and its inspection conditions and scope (step 601). Scanning and sensing the board to be tested 'via the image sensing unit 102 to capture the drilling image information of the board to be tested (step 602). After the drilling image information is obtained, the drilling image information is further encoded and analyzed, and the hole position and aperture information of the board to be tested are obtained (step 603). Based on the setting conditions and scopes of the reference board to be inspected, the test program of the board to be tested is performed (step 604). Finally, through the human-machine interface 105, the test board and the test results of the board under test are displayed as good and defective products and statistical data.

A:\inspectl224. ptd 第12頁 416006 五、發明說明(10) 分類(步驟60 5 )。如此,則完成一塊待測印刷電路 測工作。回到步驟6 0 2 ’依前述程序’以檢測下一塊印刷 電路板。 圖7係說明圖6中設定基準板的步驟與流程。如圖7所 不,設定基準板的步驟,可依選擇輸入方式(步驟7〇a)的 不同’更包含有下列步驟: 方式1 : (步驟701)選擇一標準的印刷電路板為基準板. (步驟702)掃瞄和感應該基準板,以擷取該基準板之 鑽孔影像資訊; (步驟7 0 3 )編碼和組孔分析該錢孔影像資訊· (步驟704)取得該基準板的孔位和孔徑資訊;’ (步驟705)設定該基準板的要檢條件和範疇、以及, (步驟706)儲存該基準板的孔位、孔徑和設定的資 訊。 方式1中之步驟7〇1至703的輸入方式取代為讀取鑽 孔檔案(步驟70b),即成為方式2的輸入方式。 圖8係經由-人機介面m,根據圖7之設定基準板的 步驟,以選單操作的事件驅動(menu 〇perated eventA: \ inspectl224. Ptd Page 12 416006 V. Description of the invention (10) Classification (step 60 5). In this way, the test of a printed circuit under test is completed. Go back to step 6 2 'Follow the procedure described above' to inspect the next printed circuit board. FIG. 7 illustrates steps and processes of setting a reference plate in FIG. 6. As shown in Figure 7, the steps of setting the reference board can be based on the choice of the input method (step 70a), and includes the following steps: Method 1: (step 701) select a standard printed circuit board as the reference board. (Step 702) Scan and sense the reference plate to retrieve the drilling image information of the reference plate; (Step 703) Code and group hole analysis of the money hole image information. (Step 704) Obtain the reference plate Hole position and aperture information; (Step 705) Set the conditions and scope of the reference plate to be inspected, and (Step 706) Store the hole position, hole diameter, and setting information of the reference plate. The input method of steps 701 to 703 in method 1 is replaced by reading the drilling file (step 70b), which becomes the input method of method 2. Figure 8 is a menu-driven event (menu 〇perated event) through the human-machine interface m, according to the steps of setting the reference board in Figure 7.

A:\inspectl224_ptd 第13頁 五、發明說明(11) dhve㈦方式,來設定基準板的一個較佳實施例 根據本發明, 待測板的孔位與基 程的檢測程序中, 印刷電路板的之檢測 準板的"孔位作比對β 基準板與待測板之孔 程序的步驟,是將 圖9為圖6之運作流 位比對的法則。 參考圖9之孔位比對的法則,在步驟9〇1時,由 的孔位和孔徑資訊,尋找出待測板上對應的基準孔,接 著,在步驟902時,平移旋轉待測板,使其基準孔與舉 板的基準孔校準。兩板孔位作比對之前,於步驟9(^時’ 排除該覆蓋孔和位於覆蓋區及覆蓋徑範圍内的孔。然後, 將兩板進行逐孔比對(步驟9〇4)。 以下是逐孔比對之判定法則的一個實施例子。若該基 準板存在的孔,在該待測板不存在,則判定為缺孔。若^ 基準板不存在的孔’在該待測板存在,則判定為多孔。若 该兩板的孔位在孔偏容忍度之内,而孔徑分屬不同的孔徑 範圍’則判定為孔塞《若該兩板的孔位大於孔偏容忍度, 而孔徑分屬於相同的孔徑範圍孔則判定為孔偏。孔偏時, 位於該基準板的孔,則判定為缺孔。而位於該待測板的 孔,則判定為多孔。 至於待測板是否為瑕疵板,是取決於使用者設定的瑕 疯容忍度。而決定瑕疵容忍度的參數,包括待測板的缺孔A: \ inspectl224_ptd Page 13 V. Description of the invention (11) A preferred embodiment of the dhve㈦ method to set a reference plate. According to the present invention, in the inspection procedure of the hole position and the basis of the test board, The step of the "hole position comparison of the detection standard plate" and the hole procedure of the β reference plate and the plate to be tested is the same as that shown in Fig. 9 for the operation flow level comparison. Referring to the rule of hole position comparison in FIG. 9, in step 901, the corresponding reference hole on the board under test is found based on the hole position and aperture information. Then, in step 902, the board under test is translated and rotated. Align the reference hole with the reference hole of the lifting plate. Before the hole positions of the two plates are compared, the covering hole and the holes located in the covering area and the covering diameter are excluded in step 9 (^). Then, the two plates are compared hole by hole (step 904). Following It is an implementation example of the determination rule of hole-by-hole comparison. If the hole in the reference plate does not exist in the board to be tested, it is determined as a missing hole. If the hole that does not exist in the reference board exists in the board to be tested If the pores of the two plates are within the pore deviation tolerance, and the pore diameters belong to different pore diameter ranges, then it is determined as a hole plug. If the pores of the two plates are greater than the pore deviation tolerance, and Holes that belong to the same pore size range are judged to be misaligned. When the holes are misaligned, the holes in the reference plate are judged to be missing. And the holes in the board to be tested are judged to be porous. The defect board is determined by the user's tolerance for defects, and the parameters that determine the tolerance of the defect include the holes in the board to be tested.

A:\inspectl224. ptd 第14頁 416006 五、發明說明(12) 數、多孔數和塞孔數。若待測板的缺孔數、多孔數和塞孔 數大於瑕疫容忍度,則判定該待測板為瑕庇板,否則判定 該待測板為良板。 圖1 0係經由一人機介面1 0 5 ’來顯示待測板之檢測結 果和統計資訊一個較佳實施例。人機介面1 〇 5的畫面是以 彩色圖形和數值方式來表示出,以提供易操作和對比調整 的效果。在圖10所示的實施例裡’檢測結果顯示的資訊包 含有繞孔瑕疵數、缺孔數、缺孔孔位和孔徑、多孔數 孔=位和孔徑、孔塞數、孔塞孔位和孔徑、其基準板 :则板的孔位和孔徑大小’及良板數和瑕疵板數的統計資 萏fL 。 不二述者,本發明之較佳實施例而已,當 此限疋本發明實施之範圍。即大凡依本發明申 之範圍内。寺變化與修飾’皆應仍屬本發明專利涵蓋 第15頁 A:\inspectl224. ptdA: \ inspectl224. Ptd Page 14 416006 V. Description of the invention (12) Number, number of holes and number of plugs. If the number of holes, holes, and plugs in the board under test is greater than the tolerance for defects, the board under test is judged to be a defective board, otherwise the board under test is judged to be a good board. FIG. 10 is a preferred embodiment of displaying test results and statistical information of a board to be tested through a human-machine interface 105 ′. The screen of the human-machine interface 105 is displayed with color graphics and numerical values to provide easy operation and contrast adjustment effects. In the embodiment shown in FIG. 10, the information displayed by the test results includes the number of flaws around the hole, the number of missing holes, the position of the missing hole and the pore diameter, the number of holes and the pore diameter, the number of plugs, the number of plug holes, and Aperture, its reference plate: the plate's hole position and hole size 'and the statistical data of the number of good and defective plates fL. It goes without saying that the preferred embodiment of the present invention is only limited by the scope of the present invention. That is, within the scope of application of the present invention. Temple changes and modifications ’should still be covered by the invention patent. Page 15 A: \ inspectl224. Ptd

Claims (1)

六 '申請專概ss " ~ — 1 ’ —種印刷電路板的光電檢測系統,包含有: ~影像感應單元,用來感應並擷取一印刷電路板上的 孔位影像; 一影像控制單元,用來驅動該影像感應單元和接收來 自該影像感應單元的孔位影像訊號,並且處理該影像訊號 的編碼; 一組孔分析單元,用來接收來自該影像控制單元裡的 編碼’並且對該編碼進行組孔分析;以及, 孔位檢測單元,備有一人機介面’該孔位檢測單元 f收來自經該組孔分析產生的孔位和孔徑資訊以作為基 準板的設定,並且,進行待測板的檢測; ;其中’該檢測系統的使用者藉由該人機介面,設定基 準板的要檢條件和範疇,並且經由該人機介面,得以顯示 該待測板的檢測結果和統計資料。 ,/、 2.如申請專利範圍第丨項所述之印刷電路板的光電檢 統’其中該影像控制單元更包含有: 、、 一驅動電路’用來產生驅動該影像感應單元的訊藏; 一。編碼電路’用來接收來自該影像感應單元的孔位多 像訊號,並將該孔位影像訊號編碼;以及, 〜 一儲存單元’用來儲存該孔位影像訊號的編碼資訊。 3.如專利申請範圍第2項所述之印刷電路板的光電檢挪系 統’其中’該驅動訊號包含有像素脈衝訊號和線同步訊Six 'application profile ss " ~ — 1' — a photoelectric detection system for printed circuit boards, including: ~ image sensing unit for sensing and capturing images of holes on a printed circuit board; an image control unit For driving the image sensing unit and receiving the hole image signal from the image sensing unit and processing the code of the image signal; a set of hole analysis units for receiving the code from the image control unit and Code for group hole analysis; and, the hole position detection unit is provided with a man-machine interface 'the hole position detection unit f receives hole position and hole diameter information generated by the group hole analysis as a reference plate setting, and Detection of the test board; 'The user of the detection system sets the test conditions and scope of the reference board through the man-machine interface, and through the man-machine interface, can display the test results and statistical data of the test board . 、 /, 2. The photoelectric inspection system of the printed circuit board described in item 丨 of the scope of application for patent, wherein the image control unit further includes: ,, a driving circuit for generating a signal driving the image sensing unit; One. The encoding circuit is used to receive the hole position multi-image signal from the image sensing unit and encode the hole position image signal; and, ~ a storage unit is used to store the encoding information of the hole position image signal. 3. The photoelectric detection system of a printed circuit board according to item 2 of the scope of patent application, wherein the driving signal includes a pixel pulse signal and a line synchronization signal. _______ …$請專利範圍 鱿。一, • 、 .'·. \ ' _· 4 · ^如申請專利範圍第1項所述之印刷電路板的光電檢測 系統,\羡步該組孔分析單元包含有: ~中央處理單元,用來用來接收來自該影像控制單元裡 ^蝙螞,和對該編碼進行組孔分析’並且產生孔位和孔徑 資訊;以及, 一記憶體單元,用來儲存該孔位和孔徑資訊。 •如申請專利範圍第1項所述之印刷電路板的光電檢測系 έή 社 J 其中該孔位檢測單元包含有: 中央處理單元,用來接收來自該組孔分析單元裡的孔 位和孔徑資訊,並執行該待測板的檢測程序和基準板的設 定程序;以及, 〜記憶體單元’用來儲存該中央處理單元所接收的孔位 。孔徑資訊,並作為該孔位檢測單元執行該待測板之檢測 基準板之設定程序時,所需要的資料儲存空間。 ^ 專利範圍第5項所述之印刷電路板的光電檢測 糸統,人機介面包含有: 及一輸入單元,用來設定該基準板的要檢條件和範疇;以 6“:輪出單元’用來顯示該基準板的設定結果和該待測板 的払測結果與統計資料。_______… $ Please patent scope Squid. First, •,. '·. \' _ · 4 · ^ As described in the first patent application scope of the printed circuit board photoelectric detection system, \ Xianbu This set of hole analysis units includes: ~ Central processing unit, used It is used to receive bats from the image control unit, and perform group hole analysis on the code and generate hole position and aperture information; and a memory unit for storing the hole position and aperture information. • The photoelectric detection system of the printed circuit board described in item 1 of the scope of patent application, where the hole position detection unit includes: a central processing unit for receiving hole position and aperture information from the group of hole analysis units And execute the test program of the board to be tested and the setting program of the reference board; and ~ the memory unit is used to store the hole positions received by the central processing unit. The aperture information is used as the data storage space required when the hole position detection unit executes the setting procedure of the reference plate for the board under test. ^ The photoelectric detection system of the printed circuit board described in item 5 of the patent scope, the man-machine bread contains: and an input unit for setting the inspection conditions and scope of the reference board; It is used to display the setting results of the reference board and the speculative results and statistical data of the board under test. A:\inspectl224. ptdA: \ inspectl224. Ptd 第17頁 416006 六、申請專利範圍 ϋ ‘ 請專利範圍第1項所述之印刷電路板的光電檢測 系統,\ 該影像感應單元係一將光訊號轉換為電流和電 壓訊號應裝置。 8. 一種印刷電路板的光電檢測方法,該方法包含下列步 驟: 設定一基準板的要檢條件和範疇; 掃瞄和感應待測板,以擷取該待測板的鑽孔影像資訊; 編碼和分析該鑽孔影像資訊’以擷取該待測板的孔位 和孔徑資訊; 以該基準板的設定要檢條件和範疇為參考基準,進行 該待測板的檢測程序;以及, 顯示該待測板的檢測結果和統計資料,並將該待測板 作良品和瑕疵品的分類。 9 ·如申請專利範圍第8項所述之印刷電路板的光電檢測方 法’其中之設定該基準板的步驟’更包含下列步驟· 選擇一印刷電路板為該基準板; 掃瞄和感應該基準板,以擷取該基準板之鑽孔影像資 訊; ' 編碼和組孔分析該鑽孔影像資訊,並取得該基準板的 孔位和孔徑資訊; 設定該基準板的要檢條件和範鳴;以及,Page 17 416006 VI. Scope of patent application ϋ ‘Please use the photoelectric detection system of printed circuit board described in item 1 of the patent scope. The image sensing unit is a device that converts optical signals into current and voltage signals. 8. A photoelectric detection method for a printed circuit board, the method comprising the following steps: setting the inspection conditions and scope of a reference board; scanning and sensing the board to be tested to retrieve drilling image information of the board to be tested; encoding And analyze the drilling image information 'to capture the hole position and aperture information of the board to be tested; use the set test conditions and scope of the reference board as a reference basis to perform the test procedure of the board to be tested; and, display the Test results and statistical data of the board under test, and classify the board under test as good and defective. 9 · Photoelectric detection method of printed circuit board as described in item 8 of the scope of patent application 'The step of setting the reference board' further includes the following steps · Select a printed circuit board as the reference board; Scan and sense the reference Plate to capture the drilling image information of the reference plate; 'code and group holes to analyze the drilling image information and obtain the hole position and aperture information of the reference plate; set the inspection conditions and Fan Ming of the reference plate; and , A:\inspectl224. ptd 第18頁 416006 ——--------- 六'申請專利範ϊ " --- 儲存該基準板的孔位、孔徑和設定的資訊。 方,如申凊專利範圍第8項所述之印刷電路板的光1 去’其中’決定該基準板之要檢條件和範疇的步 1入方式是以一人機介面的方式來處理。 ’如申印專利範圍第8項所述之印刷電路板的光1 =法,其中,該檢測結果顯示的方式是依一人機介 早操作的事件驅動方式來顯示。1 2.、如申請專利範圍第8項所述之印刷電路板的光$ 法’、中該鑽孔影像資訊的編碼和分析,為區段 碼和組孔分析。 13. 如申請專利範圍第8項所述之印刷電路板的光气 方法,其中之檢測程序的步驟,係將該待測板的孔 基準板的孔位比對。 14. 如申請專利範圍第1 〇項所述之印刷電路板的光 方法,其中,該人機介面的處理方式包含下列步驟 設定該基準板的基準孔位要檢條件和範嘴; &又定該基準板的輸入方式; 設定掃描該基準板的速度;以及, 設定該基準板的孔偏容忍度和瑕疵容忍度。 t檢測 驟,其 :檢測 面之選 ί檢測 長度編 t檢測 位與該 電檢測A: \ inspectl224. Ptd Page 18 416006 ——--------- Six 'Patent Application Range " --- Store the hole position, hole diameter and setting information of the reference plate. For example, as described in item 8 of the patent application, the light of the printed circuit board 1 is used to determine the conditions and scope of the reference board. The step-in method is a human-machine interface. ‘The light 1 = method of the printed circuit board as described in item 8 of the scope of the patent application, wherein the detection result is displayed in an event-driven manner based on an early operation of a human-machine interface. 1 2. According to the light method of the printed circuit board described in Item 8 of the scope of the patent application, the coding and analysis of the drilling image information are section code and group hole analysis. 13. The phosgene method for a printed circuit board as described in item 8 of the scope of patent application, wherein the step of the detection procedure is to compare the hole positions of the holes of the test board with those of the reference board. 14. The light method for a printed circuit board as described in Item 10 of the scope of patent application, wherein the processing method of the man-machine interface includes the following steps to set the inspection conditions and fan nozzles of the reference hole position of the reference board; An input method of the reference plate; setting a scanning speed of the reference plate; and setting hole tolerance and defect tolerance of the reference plate. t detection step, which: the choice of detection surface ί detection length code t detection bit and the electrical detection A:\inspectl224. ptd 第19頁 416006 六、申請專利範圍 15. 如申請專利範圍第14項所述之印刷電路板的光電檢 測方法,其中,該基準板的基準孔位要檢條件和範疇包含 有設定基準孔、覆蓋孔、覆蓋區、覆蓋徑和刀具孔徑範 圍β 16. 如申請專利範圍第1 3項所述之印刷電路板的光電檢測 方法’其中,該孔位比對的檢測包含下列步驟·· 由待測板的孔位和孔徑資訊,尋找出偵測待測板的基 準孔; 將該待測板的基準孔,校準該基準板的基準孔; 排除該覆蓋孔和位於覆蓋區及覆蓋徑範圍内的孔,然 後將該兩板作逐孔比對;以及, 若該基準板存在的孔,在該待測板不存在,則判定為 缺孔; 若該基準板不存在的孔,在該待測板存在,則判定為 多孔; ~ 若該兩板的孔位在孔偏容忍度之内,而孔徑分屬不同 的孔徑範圍,則判定為孔塞; 若該兩板的孔位大於孔偏容忍度,而孔徑分屬於相同 的孔徑範圍孔則判定為孔偏; 孔偏時,位於該基準板的孔,則判定為缺孔,而位於 該待測板的孔,則判定為多孔。 、A: \ inspectl224. Ptd page 19 416006 6. Application for patent scope 15. The photoelectric detection method of printed circuit board as described in item 14 of the scope of application for patent, wherein the reference hole position of the reference board shall be inspected under conditions and scope including There are set reference hole, cover hole, cover area, cover diameter and tool aperture range β 16. Photoelectric detection method of printed circuit board as described in item 13 of the scope of patent application ', wherein the detection of the hole position comparison includes the following Steps · Find the reference hole for detecting the board from the hole position and aperture information of the board to be tested; calibrate the reference hole of the board to be tested with the reference hole of the reference board; exclude the covering hole and locate in the coverage area And cover the holes in the diameter range, and then compare the two plates hole by hole; and, if the holes in the reference plate do not exist in the test board, it is determined as a hole; if the reference plate does not exist, If the holes in the board to be tested exist, it is judged to be porous; ~ If the holes of the two plates are within the tolerance of the holes, and the pores belong to different pore diameter ranges, they are determined to be plugs; Hole position is greater than hole deviation Tolerance, and pores with the same pore size range are judged as hole deviation; when the holes are deviation, holes on the reference plate are judged as missing holes, while holes on the test board are judged as porous. , A:\inspectl224. ptd 第20頁 416006 六、申請專利範圍 17·如申請專利範圍第14項所述之印刷電路板的光電檢測 方法,其中,該設定方式是以圖形和符號方式來設定。 18. 如申請專利範圍第1 4項所述之印刷電路板的光電檢測 方法’其中,該設定方式是以數值方式來設定。 19. 如申請專利範圍第1 1項所述之印刷電路板的光電檢測 方法,其中,該顯示方式是以圖符和數值方式來處理。 2 0.如申請專利範圍第1 9項所述之印刷電路板的光電檢測 方法’其中’該檢測結果顯示的資訊包含有繞孔瑕症數、 缺孔數、缺孔孔位和孔徑、多孔數、多孔孔位和孔徑、孔 塞數、孔塞孔位和孔徑、其基準板和待測板的孔位和孔徑 大小,及良板數和瑕疵板數的統計資訊。 21·如申請專利範圍第16項所述之印刷電路板的光電檢測 方法’其中’若該待測板的缺孔《'多孔數和塞孔數大於 瑕庇f忍度,則判定該待測板為瑕純,否則判定該待測A: \ inspectl224. Ptd Page 20 416006 6. Scope of patent application 17. The photoelectric detection method of printed circuit board as described in item 14 of the scope of patent application, in which the setting method is set by means of graphics and symbols. 18. The photoelectric detection method of a printed circuit board according to item 14 of the scope of patent application ', wherein the setting method is set by a numerical method. 19. The photoelectric detection method for a printed circuit board according to item 11 of the scope of patent application, wherein the display mode is processed by icons and numerical values. 2 0. Photoelectric detection method for printed circuit board as described in item 19 of the scope of patent application 'wherein' the information displayed in the test result includes the number of defects around the hole, the number of holes, the position and diameter of the hole, and the Statistics, number of porous holes and pores, number of plugs, number of holes and pores, number of holes and pore sizes of the reference plate and the plate to be tested, and the number of good and defective plates 21 · According to the photoelectric detection method of printed circuit board described in item 16 of the scope of the application for patent, where 'if' the lack of holes in the board under test 'and the number of holes and plug holes are greater than the tolerance of flaw f The board is pure, otherwise it is determined that it is to be tested
TW88100015A 1999-01-04 1999-01-04 Photoelectric tester and method for a printed circuit board TW416006B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7643650B2 (en) 2005-10-28 2010-01-05 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. System and method for calibrating a feeder for a surface mounting device
CN102213591A (en) * 2010-04-01 2011-10-12 安鹏科技股份有限公司 Digital image analysis device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7643650B2 (en) 2005-10-28 2010-01-05 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. System and method for calibrating a feeder for a surface mounting device
CN102213591A (en) * 2010-04-01 2011-10-12 安鹏科技股份有限公司 Digital image analysis device
CN102213591B (en) * 2010-04-01 2013-10-23 安鹏科技股份有限公司 Digital Image Analysis Device

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