TW424272B - Post-CMP wet-HF cleaning station - Google Patents

Post-CMP wet-HF cleaning station Download PDF

Info

Publication number: TW424272B
Authority: TW; Taiwan
Prior art keywords: workpiece; container; fluid; cleaning; item
Prior art date: 1998-04-10

Application number

TW088101929A

Other languages

English (en)

Chinese (zh)

Inventor

Anand Gupta

Chris Karlsrud

Periya Gopalan

Daniel R Trojan

Jeffrey B Cunnane

Original Assignee

Speedfam Ipec Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1998-04-10

Filing date

1999-02-09

Publication date

2001-03-01

1998-04-10 Priority claimed from US09/058,647 external-priority patent/US6125861A/en

1999-02-09 Application filed by Speedfam Ipec Corp filed Critical Speedfam Ipec Corp

2001-03-01 Application granted granted Critical

2001-03-01 Publication of TW424272B publication Critical patent/TW424272B/zh

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

Cleaning Or Drying Semiconductors (AREA)
Cleaning By Liquid Or Steam (AREA)

TW088101929A 1998-04-10 1999-02-09 Post-CMP wet-HF cleaning station TW424272B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US09/058,647 US6125861A (en)	1998-02-09	1998-04-10	Post-CMP wet-HF cleaning station

Publications (1)

Publication Number	Publication Date
TW424272B true TW424272B (en)	2001-03-01

Family

ID=22018078

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW088101929A TW424272B (en)	1998-04-10	1999-02-09	Post-CMP wet-HF cleaning station

Country Status (2)

Country	Link
TW (1)	TW424272B (fr)
WO (1)	WO1999053531A2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI406327B (zh) *	2008-12-31	2013-08-21	台灣積體電路製造股份有限公司	半導體濕式製程及其系統
DE102013100040A1 (de)	2013-01-03	2014-07-03	E-Lead Electronic Co., Ltd.	Führungsverfahren einer Rückwärtsparkhilfe

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5370741A (en) *	1990-05-15	1994-12-06	Semitool, Inc.	Dynamic semiconductor wafer processing using homogeneous chemical vapors
JPH0521413A (ja) *	1991-07-10	1993-01-29	Matsushita Electric Ind Co Ltd	半導体基板洗浄装置及び半導体基板洗浄方法
US5345639A (en) *	1992-05-28	1994-09-13	Tokyo Electron Limited	Device and method for scrubbing and cleaning substrate
US5442828A (en) *	1992-11-30	1995-08-22	Ontrak Systems, Inc.	Double-sided wafer scrubber with a wet submersing silicon wafer indexer
JP3341033B2 (ja) *	1993-06-22	2002-11-05	忠弘大見	回転薬液洗浄方法及び洗浄装置
JPH08187660A (ja) *	1994-12-28	1996-07-23	Ebara Corp	ポリッシング装置
US5885138A (en) *	1993-09-21	1999-03-23	Ebara Corporation	Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
JP3080834B2 (ja) *	1994-03-30	2000-08-28	株式会社東芝	半導体基板洗浄処理装置
US5609719A (en) *	1994-11-03	1997-03-11	Texas Instruments Incorporated	Method for performing chemical mechanical polish (CMP) of a wafer
US5655954A (en) *	1994-11-29	1997-08-12	Toshiba Kikai Kabushiki Kaisha	Polishing apparatus
WO1997013590A1 (fr) *	1995-10-13	1997-04-17	Ontrak Systems, Inc.	Procede et appareil de distribution de produits chimiques a travers une brosse
JP2002509643A (ja) *	1996-07-08	2002-03-26	スピードファム−アイピーイーシーコーポレイション	ウェハー洗浄、リンスおよび乾燥方法および装置

1999
- 1999-02-08 WO PCT/US1999/002483 patent/WO1999053531A2/fr not_active Ceased
- 1999-02-09 TW TW088101929A patent/TW424272B/zh not_active IP Right Cessation

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI406327B (zh) *	2008-12-31	2013-08-21	台灣積體電路製造股份有限公司	半導體濕式製程及其系統
DE102013100040A1 (de)	2013-01-03	2014-07-03	E-Lead Electronic Co., Ltd.	Führungsverfahren einer Rückwärtsparkhilfe

Also Published As

Publication number	Publication date
WO1999053531A2 (fr)	1999-10-21
WO1999053531A3 (fr)	2000-03-09

Similar Documents

Publication	Publication Date	Title
US6125861A (en)	2000-10-03	Post-CMP wet-HF cleaning station
JP4108941B2 (ja)	2008-06-25	基板の把持装置、処理装置、及び把持方法
JP3979464B2 (ja)	2007-09-19	無電解めっき前処理装置及び方法
CN1319130C (zh)	2007-05-30	半导体基片处理装置及处理方法
TW514999B (en)	2002-12-21	Wafer cleaning apparatus and wafer cleaning method
CN101923286A (zh)	2010-12-22	涂覆、显影装置和基板的背面清洁方法
US6806193B2 (en)	2004-10-19	CMP in-situ conditioning with pad and retaining ring clean
JPH1058314A (ja)	1998-03-03	化学機械研磨装置及び方法
JP2008534774A (ja)	2008-08-28	半導体基板上への金属の無電解堆積のための装置
JP2003502840A (ja)	2003-01-21	半導体ウェハを洗浄するための方法及びシステム
JP2000077373A (ja)	2000-03-14	基板の洗浄方法及び研磨装置
EP1582269A1 (fr)	2005-10-05	Un répartiteur de proximité pour des ménisques de fluide
WO2003105201A1 (fr)	2003-12-18	Dispositif de traitement de substrat, procede de traitement de substrat et dispositif de mise au point
CN1933759B (zh)	2010-12-15	利用相容化学品的基板刷子擦洗和接近清洗干燥程序、接近基板制备程序和实施前述程序的方法、设备和系统
JP4628623B2 (ja)	2011-02-09	ウェハ洗浄システムの処理前調整を実施する方法
US7067015B2 (en)	2006-06-27	Modified clean chemistry and megasonic nozzle for removing backside CMP slurries
JPH11354480A (ja)	1999-12-24	ウエハ洗浄方法及びウエハ洗浄装置
EP1459363B1 (fr)	2010-08-11	Procede d'enlevement des residus de bande et de traitement apres gravure sur les films de corail
CN101853781B (zh)	2015-08-19	利用相容化学品的基板刷子擦洗和接近清洗干燥程序、接近基板制备程序和实施前述程序的方法、设备和系统
JPH07283184A (ja)	1995-10-27	処理装置
US7878144B2 (en)	2011-02-01	Electroless plating apparatus and electroless plating method
WO1999053531A2 (fr)	1999-10-21	Nettoyage par solution de fluorure d'hydrogene apres aplanissement chimiomecanique
JP3426866B2 (ja)	2003-07-14	半導体装置の製造装置および製造方法
KR100840127B1 (ko)	2008-06-20	웨이퍼 백사이드 세정시스템 및 이를 이용한 웨이퍼백사이드 세정방법
JPH08153656A (ja)	1996-06-11	ワークの処理方法および装置

Legal Events

Date	Code	Title	Description
2001-07-13	GD4A	Issue of patent certificate for granted invention patent
2004-02-21	MM4A	Annulment or lapse of patent due to non-payment of fees