TW432130B - Process for controlling thermal history of Czochralski-grown silicon - Google Patents
Process for controlling thermal history of Czochralski-grown silicon Download PDFInfo
- Publication number
- TW432130B TW432130B TW086111381A TW86111381A TW432130B TW 432130 B TW432130 B TW 432130B TW 086111381 A TW086111381 A TW 086111381A TW 86111381 A TW86111381 A TW 86111381A TW 432130 B TW432130 B TW 432130B
- Authority
- TW
- Taiwan
- Prior art keywords
- ingot
- switch
- rate
- thermal history
- pulling
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/14—Heating of the melt or the crystallised materials
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/20—Controlling or regulating
- C30B15/206—Controlling or regulating the thermal history of growing the ingot
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Switch Cases, Indication, And Locking (AREA)
Description
M432130 六、申請專利範圍: 動開關用固定支架,可使一觸動開關設置在-電 該電磁開關包括有一上、下殼體’該下殼體内 接觸器及一熱動繼電器,且接續多數電線使 ^ Θ、熱動繼電器與觸動開關的接點組成為電連 接’该固定支架,包括: —上延伸部份,可連結該觸動開關; —下延伸部份,可固定於該下殼體;及 上延;連接部份,位於該上、下延伸部份之間,使該 由於,;二下延伸部份及轉折連接部份連接成為-體; si觸的接點組位置被提高,可有效增加配線 二間,且安裝便利,可縮短組立工時。 2中如申請專利範圍g !項所述之觸動 盆 二訂殼體的内壁面設有-插座可用以接納該ΐ:伸部 中二圍、第2項所述之觸動開關用固定支架,其 住於i插座的=的兩側邊緣㈣延伸有—擔止部,可抵 ⑶開關用固定支架,其 面作表面接觸。 Ί有夕個凸點可與該插座的内壁 7 M4321.30 七、圖式·
10
圖 M432130
2 M432130
3 M432130
Pi
M432130 四、指定代表圖: (一) 本案指定代表圖為:第(二) (二) 本代表圖之元件符號簡單說明: 觸動開關用固定支架20 下延伸部份22 擋止部25 電磁開關30 下殼體32 熱動繼電器34 快速端子36 圖。 上延伸部份21 轉折連接部份23 上殼體31 電磁接觸器33 觸動開關35 M432130 101年4月丨0曰修正替換頁 五、新型說明: 【新型所屬之技術領域】 本創作有關一種觸動開關用固定支架,尤指一種設置 於電磁開關中,而可提高觸動開關之接點組位置之固定支 架。 【先前技術】 一般而言,電磁開關廣泛用作電力的斷開和控制電 路在^到控制負載的電器,所以經常運用於電 控制對象。 所示,傳統電磁開關1〇包括有—上、下殼體, 安裝有一電磁接觸器12、一觸動開關13、 2= ’最後接續電線15使該電磁接觸器& 3 = ff繼電器14成為電連接。該下殼體11形 成有承接槽16可接納該觸動開,並 電線15與該電磁接觸器12及 ;条 該接點組設置在該承接槽16巾,’由於, 空間狹小,㈣¥致電線15的配線 J f線15易月文洛在該觸動 方,進而影_ 17的操作,此缺失須加以Li 【新型内容】 位置本:==固且定安\=^^ 以解决的習知技術所存在的固有問題。、m工時, 為達上述之目的及功效’本創作觸動開關用固定支 3 M432130 101年4月10曰修正替換頁 架,可使一觸動開關設置在一電磁開關中,該電磁開關包 括有一上、下殼體,該下殼體内安裝有一電磁接觸器及一 熱動繼電器,且接續多數電線使該電磁接觸器、熱動繼電 器與觸動開關的接點組成為電連接,該固定支架,包括有 一上延伸部份,可連結該觸動開關;一下延伸部份,可固 定於該下殼體;及一轉折連接部份,位於該上、下延伸部 份之間,使該上延伸部份、下延伸部份及轉折連接部份連 接成為一體。 【實施方式】 茲有關本創作之詳細内容及技術說明,現以實施例作 進一步說明,但應瞭解的是,該等實施例僅為例示說明之 用,而不應被解釋為本創作實施之限制。 請參閱圖二至圖五所示,本創作觸動開關用固定支架 20,可將一觸動開關35設置在一電磁開關30中,該電磁 開關30包括有一上、下殼體31、32,該下殼體32内安裝 有一電磁接觸器33、一熱動繼電器34。該觸動開關35具 有二片快速端子36可作為電線之連接。該下殼體32的内 壁面設有一插座37可用以接納該固定支架20。 該固定支架20具有一上延伸部份21,可連結該觸動 開關35 ; —下延伸部份22,可插入於該下殼體32的插座 37内,使該固定支架20安裝於下殼體32 ;及一轉折連接 部份23位於該上、下延伸部份21、22之間,並使該上延 伸部份21、下延伸部份22及轉折連接部份23連接成為一 該下延伸部份22的表面具有二只凸點24可與插座37 M4.32130 101年4月10日修正替換頁 的内壁面作表面接觸,及兩側邊緣向外延伸有二只擋止部 25可限制該下延伸部份22的插入深度。 該觸動開關35可利用鉚合或其它連接方式來與該固 定支架20的上延伸部份21成為連結,最後將該固定支架 20的下延伸部份22插入於下殼體32的插座37内,直到 該擋止部25抵住插座37的頂端為止。由於,該觸動開關 35被組裝在固定支架20的上延伸部份21,而提高該快速 端子36的接點位置,可有效增加配線空間,且安裝便利, 可縮短組立工時。 惟以上所述者,僅為本創作之較佳實施例而已,當不 能以此限定本新型實施之範圍,即大凡依本創作申請專利 範圍及創作說明内容所作之簡單的等效變化與修飾,皆仍 屬本創作專利涵蓋之範圍内。 【圖式簡單說明】 圖一為傳統電磁開關之平面不意圖。 圖二為本創作固定支架結合有觸動開關且安裝於電磁開關 之下殼體之立體圖,其下殼體未與上殼體組合。 圖三為本創作固定支架結合有觸動開關且安裝於電磁開關 之下殼體之平面圖。 圖四為圖三之右側視圖。 圖五為本創作觸動開關用固定支架未插入於下殼體之插座 之分解圖。 上延伸部份21 【主要元件符號說明】 觸動開關用固定支架20 M432130 下延伸部份22 凸點24 電磁開關3 0 下殼體32 熱動繼電器34 快速端子36 101年4月10日修正替換頁 轉折連接部份23 擋止部25 上殼體31 電磁接觸器33 觸動開關35 插座37
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/694,157 US5779791A (en) | 1996-08-08 | 1996-08-08 | Process for controlling thermal history of Czochralski-grown silicon |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW432130B true TW432130B (en) | 2001-05-01 |
Family
ID=24787640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW086111381A TW432130B (en) | 1996-08-08 | 1997-09-05 | Process for controlling thermal history of Czochralski-grown silicon |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5779791A (zh) |
| EP (2) | EP1148158A3 (zh) |
| JP (1) | JPH1095698A (zh) |
| KR (1) | KR19980018538A (zh) |
| DE (1) | DE69707781T2 (zh) |
| SG (1) | SG54540A1 (zh) |
| TW (1) | TW432130B (zh) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH10194890A (ja) * | 1996-12-27 | 1998-07-28 | Komatsu Electron Metals Co Ltd | シリコン単結晶の製造方法 |
| US6503594B2 (en) | 1997-02-13 | 2003-01-07 | Samsung Electronics Co., Ltd. | Silicon wafers having controlled distribution of defects and slip |
| SG64470A1 (en) * | 1997-02-13 | 1999-04-27 | Samsung Electronics Co Ltd | Methods of manufacturing monocrystalline silicon ingots and wafers by controlling pull rate profiles in a hot zone furnace and ingots and wafers manufactured thereby |
| US6485807B1 (en) | 1997-02-13 | 2002-11-26 | Samsung Electronics Co., Ltd. | Silicon wafers having controlled distribution of defects, and methods of preparing the same |
| US6045610A (en) * | 1997-02-13 | 2000-04-04 | Samsung Electronics Co., Ltd. | Methods of manufacturing monocrystalline silicon ingots and wafers by controlling pull rate profiles in a hot zone furnance |
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| US6340392B1 (en) | 1997-10-24 | 2002-01-22 | Samsung Electronics Co., Ltd. | Pulling methods for manufacturing monocrystalline silicone ingots by controlling temperature at the center and edge of an ingot-melt interface |
| EP0947611A3 (en) * | 1998-03-17 | 2002-03-20 | Shin-Etsu Handotai Company Limited | A method for producing a silicon single crystal and the silicon single crystal produced thereby |
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| JP4567192B2 (ja) | 1998-06-26 | 2010-10-20 | エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド | 結晶成長装置用電気抵抗ヒータ及びその使用方法 |
| KR100581305B1 (ko) * | 1998-09-02 | 2006-05-22 | 엠이엠씨 일렉트로닉 머티리얼즈 인코포레이티드 | 저결함 밀도 단결정 실리콘으로부터의 soi 구조체 |
| EP1713121A3 (en) * | 1998-09-02 | 2007-08-15 | MEMC Electronic Materials, Inc. | Silicon on insulator structure from low defect density single crystal silicon |
| EP1127175B1 (en) * | 1998-10-14 | 2002-08-14 | MEMC Electronic Materials, Inc. | Process for preparing defect free silicon crystals which allows for variability in process conditions |
| JP4233651B2 (ja) * | 1998-10-29 | 2009-03-04 | 信越半導体株式会社 | シリコン単結晶ウエーハ |
| TW505710B (en) * | 1998-11-20 | 2002-10-11 | Komatsu Denshi Kinzoku Kk | Production method for silicon single crystal and production device for single crystal ingot, and heat treating method for silicon single crystal wafer |
| US6632277B2 (en) | 1999-07-14 | 2003-10-14 | Seh America, Inc. | Optimized silicon wafer gettering for advanced semiconductor devices |
| US6454852B2 (en) | 1999-07-14 | 2002-09-24 | Seh America, Inc. | High efficiency silicon wafer optimized for advanced semiconductor devices |
| US6395085B2 (en) | 1999-07-14 | 2002-05-28 | Seh America, Inc. | Purity silicon wafer for use in advanced semiconductor devices |
| US6458202B1 (en) * | 1999-09-02 | 2002-10-01 | Memc Electronic Materials, Inc. | Process for preparing single crystal silicon having uniform thermal history |
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| EP1346086A2 (en) * | 2000-11-30 | 2003-09-24 | MEMC Electronic Materials, Inc. | Process for controlling thermal history of vacancy-dominated, single crystal silicon |
| US20040055527A1 (en) * | 2000-11-30 | 2004-03-25 | Makoto Kojima | Process for controlling thermal history of vacancy-dominated, single crystal silicon |
| DE10102126A1 (de) * | 2001-01-18 | 2002-08-22 | Wacker Siltronic Halbleitermat | Verfahren und Vorrichtung zum Herstellen eines Einkristalls aus Silicium |
| US6514337B2 (en) * | 2001-02-07 | 2003-02-04 | Seh America, Inc. | Method of growing large-diameter dislocation-free<110> crystalline ingots |
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| US7132091B2 (en) * | 2001-09-28 | 2006-11-07 | Memc Electronic Materials, Inc. | Single crystal silicon ingot having a high arsenic concentration |
| US6669775B2 (en) | 2001-12-06 | 2003-12-30 | Seh America, Inc. | High resistivity silicon wafer produced by a controlled pull rate czochralski method |
| JP4193503B2 (ja) * | 2003-01-31 | 2008-12-10 | 株式会社Sumco | シリコン単結晶の製造方法 |
| US7282094B2 (en) * | 2003-05-28 | 2007-10-16 | Sumco Corporation | Method of simulation with respect to density distribution and size distribution of void defect within single crystal and oxygen precipitation nucleus within single crystal |
| KR100835293B1 (ko) * | 2006-12-29 | 2008-06-09 | 주식회사 실트론 | 실리콘 단결정 잉곳의 제조방법 |
| KR100977627B1 (ko) * | 2008-01-02 | 2010-08-23 | 주식회사 실트론 | 석영 도가니의 변형을 방지하는 구조를 가진 단결정성장장치 및 이를 이용한 단결정 성장방법 |
| US7922817B2 (en) * | 2008-04-24 | 2011-04-12 | Memc Electronic Materials, Inc. | Method and device for feeding arsenic dopant into a silicon crystal growing apparatus |
| JP5907045B2 (ja) * | 2012-11-13 | 2016-04-20 | 信越半導体株式会社 | シリコン単結晶の引き上げ方法 |
| KR102384041B1 (ko) * | 2014-07-31 | 2022-04-08 | 글로벌웨이퍼스 씨오., 엘티디. | 질소 도핑 및 공공 지배 실리콘 잉곳 및 그로부터 형성된, 반경방향으로 균일하게 분포된 산소 석출 밀도 및 크기를 갖는 열 처리 웨이퍼 |
| JP6987057B2 (ja) | 2015-12-04 | 2021-12-22 | グローバルウェーハズ カンパニー リミテッドGlobalWafers Co., Ltd. | 低酸素含有シリコンを生産するシステム及び方法 |
| JP6202119B2 (ja) | 2016-03-14 | 2017-09-27 | 株式会社Sumco | シリコン単結晶の製造方法 |
| JP6642410B2 (ja) * | 2016-12-20 | 2020-02-05 | 株式会社Sumco | シリコン単結晶の製造方法 |
| JP6699620B2 (ja) * | 2017-05-26 | 2020-05-27 | 株式会社Sumco | シリコン単結晶の製造方法 |
| KR102011210B1 (ko) * | 2018-01-18 | 2019-08-14 | 에스케이실트론 주식회사 | 단결정 잉곳 성장용 인상제어장치 및 이에 적용된 인상제어방법 |
| CN108441942B (zh) * | 2018-02-13 | 2020-09-29 | 中山大学 | 晶体旋转温度波动的原位探测方法、控制方法及控制系统 |
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| US5487355A (en) * | 1995-03-03 | 1996-01-30 | Motorola, Inc. | Semiconductor crystal growth method |
-
1996
- 1996-08-08 US US08/694,157 patent/US5779791A/en not_active Expired - Lifetime
-
1997
- 1997-08-06 SG SG1997002798A patent/SG54540A1/en unknown
- 1997-08-07 DE DE69707781T patent/DE69707781T2/de not_active Expired - Fee Related
- 1997-08-07 EP EP01106027A patent/EP1148158A3/en not_active Withdrawn
- 1997-08-07 EP EP97306023A patent/EP0823497B1/en not_active Expired - Lifetime
- 1997-08-08 JP JP9214725A patent/JPH1095698A/ja not_active Withdrawn
- 1997-08-08 KR KR1019970038023A patent/KR19980018538A/ko not_active Ceased
- 1997-09-05 TW TW086111381A patent/TW432130B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP0823497A1 (en) | 1998-02-11 |
| KR19980018538A (ko) | 1998-06-05 |
| EP1148158A2 (en) | 2001-10-24 |
| DE69707781T2 (de) | 2002-04-25 |
| DE69707781D1 (de) | 2001-12-06 |
| SG54540A1 (en) | 1998-11-16 |
| EP1148158A3 (en) | 2003-08-27 |
| EP0823497B1 (en) | 2001-10-31 |
| JPH1095698A (ja) | 1998-04-14 |
| US5779791A (en) | 1998-07-14 |
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