TW434080B - Lead-free solder and soldered article - Google Patents
Lead-free solder and soldered article Download PDFInfo
- Publication number
- TW434080B TW434080B TW88105603A TW88105603A TW434080B TW 434080 B TW434080 B TW 434080B TW 88105603 A TW88105603 A TW 88105603A TW 88105603 A TW88105603 A TW 88105603A TW 434080 B TW434080 B TW 434080B
- Authority
- TW
- Taiwan
- Prior art keywords
- lead
- solder
- free solder
- weight percent
- tin
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 90
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910052709 silver Inorganic materials 0.000 claims abstract description 23
- 239000004332 silver Substances 0.000 claims abstract description 23
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000004020 conductor Substances 0.000 claims abstract description 20
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 19
- 229910052723 transition metal Inorganic materials 0.000 claims abstract description 14
- 150000003624 transition metals Chemical class 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 20
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229910052787 antimony Inorganic materials 0.000 claims description 5
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 18
- 230000032683 aging Effects 0.000 abstract description 3
- 230000003628 erosive effect Effects 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 12
- 230000035939 shock Effects 0.000 description 10
- 229910052797 bismuth Inorganic materials 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 150000002736 metal compounds Chemical class 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 229910017692 Ag3Sn Inorganic materials 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 2
- 229910018082 Cu3Sn Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910008996 Sn—Ni—Cu Inorganic materials 0.000 description 2
- WIKSRXFQIZQFEH-UHFFFAOYSA-N [Cu].[Pb] Chemical compound [Cu].[Pb] WIKSRXFQIZQFEH-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000497 Amalgam Inorganic materials 0.000 description 1
- 241000239290 Araneae Species 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910018471 Cu6Sn5 Inorganic materials 0.000 description 1
- 208000003251 Pruritus Diseases 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000739 chaotic effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- JUWSSMXCCAMYGX-UHFFFAOYSA-N gold platinum Chemical compound [Pt].[Au] JUWSSMXCCAMYGX-UHFFFAOYSA-N 0.000 description 1
- PQTCMBYFWMFIGM-UHFFFAOYSA-N gold silver Chemical compound [Ag].[Au] PQTCMBYFWMFIGM-UHFFFAOYSA-N 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- -1 tin transition metal Chemical class 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1614198 | 1998-01-28 | ||
| JP02004499A JP3575311B2 (ja) | 1998-01-28 | 1999-01-28 | Ｐｂフリー半田および半田付け物品 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW434080B true TW434080B (en) | 2001-05-16 |
Family
ID=26352400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW88105603A TW434080B (en) | 1998-01-28 | 1999-04-08 | Lead-free solder and soldered article |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3575311B2 (ja) |
| TW (1) | TW434080B (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI386272B (zh) * | 2006-03-09 | 2013-02-21 | 新日鐵住金高新材料股份有限公司 | Lead-free solder alloy, soft solder ball and electronic components and used in automotive electronic components of the lead-free solder alloy, soft alloy ball and electronic components (a) |
| TWI465312B (zh) * | 2005-07-19 | 2014-12-21 | 日本斯倍利亞股份有限公司 | 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法 |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3296289B2 (ja) * | 1997-07-16 | 2002-06-24 | 富士電機株式会社 | はんだ合金 |
| JP3036636B1 (ja) * | 1999-02-08 | 2000-04-24 | 日本アルミット株式会社 | 無鉛半田合金 |
| JP3544904B2 (ja) * | 1999-09-29 | 2004-07-21 | 株式会社トッパンＮｅｃサーキットソリューションズ | はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法 |
| JP2001143960A (ja) * | 1999-11-17 | 2001-05-25 | Murata Mfg Co Ltd | セラミック電子部品およびセラミック電子部品の実装構造 |
| JP2002057177A (ja) * | 2000-08-09 | 2002-02-22 | Hitachi Metals Ltd | はんだボールおよびその製造方法 |
| JP4560874B2 (ja) * | 2000-03-28 | 2010-10-13 | 株式会社村田製作所 | セラミック電子部品 |
| JP3786251B2 (ja) | 2000-06-30 | 2006-06-14 | 日本アルミット株式会社 | 無鉛半田合金 |
| JP4152596B2 (ja) * | 2001-02-09 | 2008-09-17 | 新日鉄マテリアルズ株式会社 | ハンダ合金、ハンダボール及びハンダバンプを有する電子部材 |
| US7029542B2 (en) * | 2002-07-09 | 2006-04-18 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
| JP3724486B2 (ja) * | 2002-10-17 | 2005-12-07 | 千住金属工業株式会社 | 鉛フリーはんだボール用合金とはんだボール |
| JP2005040847A (ja) * | 2003-07-25 | 2005-02-17 | Hitachi Metals Ltd | はんだボールの製造方法 |
| KR20050030237A (ko) * | 2004-11-13 | 2005-03-29 | 삼성전자주식회사 | 무연 솔더 합금 |
| WO2007081006A1 (ja) * | 2006-01-16 | 2007-07-19 | Hitachi Metals, Ltd. | はんだ合金、はんだボールおよびそれを用いたはんだ接合部 |
| JP5019764B2 (ja) * | 2006-03-09 | 2012-09-05 | 新日鉄マテリアルズ株式会社 | 鉛フリーハンダ合金、ハンダボール及び電子部材 |
| JP5030442B2 (ja) * | 2006-03-09 | 2012-09-19 | 新日鉄マテリアルズ株式会社 | 鉛フリーハンダ合金、ハンダボール及び電子部材 |
| CN100409996C (zh) * | 2006-08-28 | 2008-08-13 | 北京航空航天大学 | 一种能在空气中进行无焊剂焊接的抗氧化锡基无铅焊料 |
| US8975757B2 (en) * | 2008-03-05 | 2015-03-10 | Senju Metal Industry Co., Ltd. | Lead-free solder connection structure and solder ball |
| WO2012131861A1 (ja) * | 2011-03-28 | 2012-10-04 | 千住金属工業株式会社 | 鉛フリーはんだボール |
| MX2013009113A (es) * | 2012-05-10 | 2013-11-01 | Senju Metal Industry Co | Aleacion de soldadura para audio. |
| BR112014032941A2 (pt) * | 2012-06-30 | 2017-06-27 | Senju Metal Industry Co | bola de solda sem chumbo |
| JP6222375B2 (ja) | 2014-10-17 | 2017-11-01 | 富士電機株式会社 | 鉛フリー半田付け方法及び半田付け物品 |
| JP6165294B2 (ja) * | 2016-04-25 | 2017-07-19 | 株式会社日本スペリア社 | アルミニウム用はんだ及びはんだ継手 |
| JP6389553B2 (ja) * | 2017-09-15 | 2018-09-12 | 株式会社日本スペリア社 | アルミニウム用はんだ及びはんだ継手 |
| CN113953709B (zh) * | 2021-12-01 | 2022-11-11 | 东莞市千岛金属锡品有限公司 | 一种表面弥散硬化的无铅焊料的制备方法 |
-
1999
- 1999-01-28 JP JP02004499A patent/JP3575311B2/ja not_active Expired - Lifetime
- 1999-04-08 TW TW88105603A patent/TW434080B/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI465312B (zh) * | 2005-07-19 | 2014-12-21 | 日本斯倍利亞股份有限公司 | 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法 |
| TWI386272B (zh) * | 2006-03-09 | 2013-02-21 | 新日鐵住金高新材料股份有限公司 | Lead-free solder alloy, soft solder ball and electronic components and used in automotive electronic components of the lead-free solder alloy, soft alloy ball and electronic components (a) |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3575311B2 (ja) | 2004-10-13 |
| JPH11277290A (ja) | 1999-10-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MK4A | Expiration of patent term of an invention patent |