TW434113B - Polishing apparatus - Google Patents
Polishing apparatus Download PDFInfo
- Publication number
- TW434113B TW434113B TW89102874A TW89102874A TW434113B TW 434113 B TW434113 B TW 434113B TW 89102874 A TW89102874 A TW 89102874A TW 89102874 A TW89102874 A TW 89102874A TW 434113 B TW434113 B TW 434113B
- Authority
- TW
- Taiwan
- Prior art keywords
- slurry
- arm
- polishing
- polishing pad
- patent application
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 173
- 239000002002 slurry Substances 0.000 claims abstract description 112
- 238000004140 cleaning Methods 0.000 claims description 106
- 239000007788 liquid Substances 0.000 claims description 59
- 238000005406 washing Methods 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 12
- 230000002079 cooperative effect Effects 0.000 claims description 7
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 230000007246 mechanism Effects 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims 3
- 239000008186 active pharmaceutical agent Substances 0.000 claims 2
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- 238000007689 inspection Methods 0.000 claims 1
- 239000003595 mist Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract description 13
- 239000007921 spray Substances 0.000 abstract description 7
- 239000012530 fluid Substances 0.000 abstract description 5
- 239000000126 substance Substances 0.000 abstract description 5
- 230000009977 dual effect Effects 0.000 abstract description 3
- 238000009736 wetting Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007670 refining Methods 0.000 description 2
- 241001252567 Chrysothamnus viscidiflorus Species 0.000 description 1
- 101100062121 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) cyc-1 gene Proteins 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US27064299A | 1999-03-16 | 1999-03-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW434113B true TW434113B (en) | 2001-05-16 |
Family
ID=23032186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW89102874A TW434113B (en) | 1999-03-16 | 2000-02-18 | Polishing apparatus |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP1038635A3 (ja) |
| JP (1) | JP2000280165A (ja) |
| TW (1) | TW434113B (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI548483B (zh) * | 2011-07-19 | 2016-09-11 | 荏原製作所股份有限公司 | 研磨裝置及方法 |
| TWI770533B (zh) * | 2020-02-14 | 2022-07-11 | 南亞科技股份有限公司 | 研磨輸送設備 |
| TWI777630B (zh) * | 2020-06-24 | 2022-09-11 | 美商應用材料股份有限公司 | 用於拋光液體傳輸臂的清潔裝置、工具及方法，及其拋光組件 |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6379229B1 (en) * | 1999-05-17 | 2002-04-30 | Ebara Corporation | Polishing apparatus |
| KR100494145B1 (ko) * | 2000-12-15 | 2005-06-10 | 주식회사 하이닉스반도체 | 화학기계적 연마장치 및 그를 이용한 웨이퍼 연마방법 |
| US6409580B1 (en) * | 2001-03-26 | 2002-06-25 | Speedfam-Ipec Corporation | Rigid polishing pad conditioner for chemical mechanical polishing tool |
| WO2003018256A1 (en) * | 2001-08-31 | 2003-03-06 | Koninklijke Philips Electronics N.V. | Method and apparatus for chemical mechanical planarization end-o f-polish optimization |
| TW200517478A (en) * | 2003-05-09 | 2005-06-01 | Sanyo Chemical Ind Ltd | Polishing liquid for CMP process and polishing method |
| CN100490084C (zh) * | 2003-05-09 | 2009-05-20 | 三洋化成工业株式会社 | Cmp方法用研磨液及研磨方法 |
| JP4901301B2 (ja) | 2006-05-23 | 2012-03-21 | 株式会社東芝 | 研磨方法及び半導体装置の製造方法 |
| JP2011167800A (ja) * | 2010-02-18 | 2011-09-01 | Disco Corp | 切削装置 |
| JP5791987B2 (ja) * | 2011-07-19 | 2015-10-07 | 株式会社荏原製作所 | 研磨装置および方法 |
| JP5775797B2 (ja) * | 2011-11-09 | 2015-09-09 | 株式会社荏原製作所 | 研磨装置および方法 |
| JP5911786B2 (ja) * | 2012-10-31 | 2016-04-27 | 株式会社荏原製作所 | 研磨装置 |
| CN113471108B (zh) * | 2021-07-06 | 2022-10-21 | 华海清科股份有限公司 | 一种基于马兰戈尼效应的晶圆竖直旋转处理装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2622069B2 (ja) * | 1993-06-30 | 1997-06-18 | 三菱マテリアル株式会社 | 研磨布のドレッシング装置 |
| US5885147A (en) * | 1997-05-12 | 1999-03-23 | Integrated Process Equipment Corp. | Apparatus for conditioning polishing pads |
| US6139406A (en) * | 1997-06-24 | 2000-10-31 | Applied Materials, Inc. | Combined slurry dispenser and rinse arm and method of operation |
| WO1999033612A1 (en) * | 1997-12-26 | 1999-07-08 | Ebara Corporation | Polishing device |
-
2000
- 2000-02-18 TW TW89102874A patent/TW434113B/zh active
- 2000-03-13 EP EP00302005A patent/EP1038635A3/en not_active Withdrawn
- 2000-03-16 JP JP2000074510A patent/JP2000280165A/ja not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI548483B (zh) * | 2011-07-19 | 2016-09-11 | 荏原製作所股份有限公司 | 研磨裝置及方法 |
| TWI770533B (zh) * | 2020-02-14 | 2022-07-11 | 南亞科技股份有限公司 | 研磨輸送設備 |
| TWI777630B (zh) * | 2020-06-24 | 2022-09-11 | 美商應用材料股份有限公司 | 用於拋光液體傳輸臂的清潔裝置、工具及方法，及其拋光組件 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000280165A (ja) | 2000-10-10 |
| EP1038635A2 (en) | 2000-09-27 |
| EP1038635A3 (en) | 2003-05-14 |
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