TW482335U - Chip carrier to reduce the wear of pressing tool - Google Patents

Chip carrier to reduce the wear of pressing tool

Info

Publication number
TW482335U
TW482335U TW090207356U TW90207356U TW482335U TW 482335 U TW482335 U TW 482335U TW 090207356 U TW090207356 U TW 090207356U TW 90207356 U TW90207356 U TW 90207356U TW 482335 U TW482335 U TW 482335U
Authority
TW
Taiwan
Prior art keywords
wear
reduce
chip carrier
pressing tool
pressing
Prior art date
Application number
TW090207356U
Other languages
Chinese (zh)
Inventor
Jia-Yi Lin
Jr-Tsung Hou
Kuen-Ming Huang
Ching-Kuen Ye
Original Assignee
Siliconware Precision Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siliconware Precision Industries Co Ltd filed Critical Siliconware Precision Industries Co Ltd
Priority to TW090207356U priority Critical patent/TW482335U/en
Publication of TW482335U publication Critical patent/TW482335U/en

Links

TW090207356U 2001-05-07 2001-05-07 Chip carrier to reduce the wear of pressing tool TW482335U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW090207356U TW482335U (en) 2001-05-07 2001-05-07 Chip carrier to reduce the wear of pressing tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW090207356U TW482335U (en) 2001-05-07 2001-05-07 Chip carrier to reduce the wear of pressing tool

Publications (1)

Publication Number Publication Date
TW482335U true TW482335U (en) 2002-04-01

Family

ID=21683578

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090207356U TW482335U (en) 2001-05-07 2001-05-07 Chip carrier to reduce the wear of pressing tool

Country Status (1)

Country Link
TW (1) TW482335U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI646608B (en) * 2016-03-17 2019-01-01 東芝記憶體股份有限公司 Semiconductor device manufacturing method and semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI646608B (en) * 2016-03-17 2019-01-01 東芝記憶體股份有限公司 Semiconductor device manufacturing method and semiconductor device

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model