TW483832B - Silicone rubber composition for key pad and key pad made thereform - Google Patents
Silicone rubber composition for key pad and key pad made thereform Download PDFInfo
- Publication number
- TW483832B TW483832B TW88115237A TW88115237A TW483832B TW 483832 B TW483832 B TW 483832B TW 88115237 A TW88115237 A TW 88115237A TW 88115237 A TW88115237 A TW 88115237A TW 483832 B TW483832 B TW 483832B
- Authority
- TW
- Taiwan
- Prior art keywords
- minutes
- silicone rubber
- rubber composition
- hollow
- composition
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 48
- 229920002379 silicone rubber Polymers 0.000 title claims description 35
- 239000004945 silicone rubber Substances 0.000 title claims description 34
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 35
- 229920001971 elastomer Polymers 0.000 claims abstract description 12
- 239000002245 particle Substances 0.000 claims abstract description 12
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 8
- -1 polysiloxane Polymers 0.000 claims description 41
- 230000005484 gravity Effects 0.000 claims description 20
- 239000011796 hollow space material Substances 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 11
- 239000003054 catalyst Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 125000003342 alkenyl group Chemical group 0.000 claims description 7
- 238000011049 filling Methods 0.000 claims description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 238000007259 addition reaction Methods 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 3
- 229920005591 polysilicon Polymers 0.000 claims description 3
- 239000000945 filler Substances 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 34
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 20
- 238000003756 stirring Methods 0.000 description 16
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 11
- 239000004205 dimethyl polysiloxane Substances 0.000 description 10
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 10
- 235000012239 silicon dioxide Nutrition 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 8
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 8
- 229910052697 platinum Inorganic materials 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 229910002012 Aerosil® Inorganic materials 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 239000003431 cross linking reagent Substances 0.000 description 4
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- WKWOFMSUGVVZIV-UHFFFAOYSA-N n-bis(ethenyl)silyl-n-trimethylsilylmethanamine Chemical compound C[Si](C)(C)N(C)[SiH](C=C)C=C WKWOFMSUGVVZIV-UHFFFAOYSA-N 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- 229910002018 Aerosil® 300 Inorganic materials 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000006260 foam Substances 0.000 description 3
- 239000004088 foaming agent Substances 0.000 description 3
- 150000002430 hydrocarbons Chemical group 0.000 description 3
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 230000002079 cooperative effect Effects 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004005 microsphere Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 229910002016 Aerosil® 200 Inorganic materials 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 1
- HGTYEBNTDPDGIC-UHFFFAOYSA-N [N].[Au] Chemical class [N].[Au] HGTYEBNTDPDGIC-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000005998 bromoethyl group Chemical group 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- XENVCRGQTABGKY-ZHACJKMWSA-N chlorohydrin Chemical compound CC#CC#CC#CC#C\C=C\C(Cl)CO XENVCRGQTABGKY-ZHACJKMWSA-N 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 229940090961 chromium dioxide Drugs 0.000 description 1
- IAQWMWUKBQPOIY-UHFFFAOYSA-N chromium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Cr+4] IAQWMWUKBQPOIY-UHFFFAOYSA-N 0.000 description 1
- AYTAKQFHWFYBMA-UHFFFAOYSA-N chromium(IV) oxide Inorganic materials O=[Cr]=O AYTAKQFHWFYBMA-UHFFFAOYSA-N 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000002050 diffraction method Methods 0.000 description 1
- 229940008099 dimethicone Drugs 0.000 description 1
- UBHZUDXTHNMNLD-UHFFFAOYSA-N dimethylsilane Chemical compound C[SiH2]C UBHZUDXTHNMNLD-UHFFFAOYSA-N 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000009661 fatigue test Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229920001821 foam rubber Polymers 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052909 inorganic silicate Inorganic materials 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002731 mercury compounds Chemical class 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000004344 phenylpropyl group Chemical group 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 150000003057 platinum Chemical class 0.000 description 1
- 150000003058 platinum compounds Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000006884 silylation reaction Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- IAQRGUVFOMOMEM-ONEGZZNKSA-N trans-but-2-ene Chemical group C\C=C\C IAQRGUVFOMOMEM-ONEGZZNKSA-N 0.000 description 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
經 濟 部 智 慧 財 產 局 員 工 消 費 合 一作 社 印 製 483832 A7 ___B7__ 五、發明說明(!) 發明所屬的技術領域 本發明係有關電腦用鍵盤、遙控器、行動電話等各種 機器操作盤之〇N/〇F F開關用所用的按鍵墊用聚矽氧 椽膠組成物及由此而得的按鍵墊。 習知技術及發明欲解決的課題 加熱固化型液狀聚矽氧橡膠組成物,由成形性優越, 成形後耐久性、耐熱性、電氣絕緣性等優越,係被使用於 各種領域。其中尤以由耐久性(動態疲勞特性)、反彈特 性優越可被廣泛使用於電腦用鍵盤、遙控器、電話等按鍵 墊材料。 於利用此等按鍵墊之機器,如筆記型個人電腦或行動 電話般增加攜帶行走性,因此機器方面乃被要求短小輕薄 。然而,習用的聚矽氧橡膠按鍵墊幾乎比重全在1 · 0以 上者。例如爲使此低比重化,向來在材料上有已利用氣體 之輕量性的聚矽氧橡膠發泡體(泡沫塑膠或海棉體),已 知有添加熱分解型發泡劑之方法或利用固化時副產的氫氣 並成形的方法等。然而,添加熱分解型發泡劑之方法,其 分解氣體之毒性或臭氣被指有問題,又在固化觸媒內使用 鉑觸媒者利用發泡劑之固化障礙即被指成爲問題所在。再 者,於使用固化時副產的氫氣之方法,氫氣之爆炸性,未 固化物之保存時的處理上有需予注意等的問題。而且,製 得的成形物(海棉狀發泡體)亦由於氣泡並不均勻,強度 上不足夠,有用作按鍵墊材料之耐久性上低劣等的問題點 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)-4 - W------------------訂--------- (請先閱讀背面之注意事項再填寫本頁) 483832 A7 ___ B7 五、發明說明e ) 存在。 本發明係爲改善上述問題而完成者,以提供能給予質 輕且耐久性優越的按鍵墊之按鍵墊用聚矽氧橡膠組成物及 •採用此組成物而得的按鍵墊爲目的。 解決課題而採的手段及發明之實施形態 本發明人爲達成上述目的經進行精心檢討之結果,發 現藉由於熱固化性有機聚矽氧烷組成物(聚矽氧橡膠組成 物)內,配合平均粒子徑2 0 0 //m以下的微小中空塡料 ,固化此物而得的聚矽氧橡膠硬化物之比重小,加上疲勞 耐久性優越,作爲按鍵墊用材料優越者,以至完成本發明 〇 因此,本發明係提供以於熱固化性有機聚矽氧烷組成 物1 0 0重量分內配合平均粒子徑2 0 0 //m以下的中空 塡料0 · 1〜1 0 0重量分而成爲特徵之按鍵墊用聚矽氧 橡膠組成物及按鍵墊。 以下進一步詳細說明本發明。. 經濟部智慧財產局員工消費合作社邱製 本發明之按鍵墊用聚矽氧橡膠組成物,係於熱固化性 有機聚矽氧烷組成物內配合中空塡料而成者。 在此,至於中空塡料,係以於固化物內具有氣體部分 且如橡膠泡棉般使導熱係數降低者,此種材料有玻璃中空 球、二氧化矽中空球、碳中空球、酚樹脂中空球、丙烯腈 中空球、偏二氯乙烯中空球、氧化鋁中空球、二氧化鉻中 空球、矽中空球等不論任者均可。此等之中以中空塡料本 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)-5 - 483832 A7 B7 五、發明說明ο ) 身具有彈性者,亦即以熱塑性樹脂製中空球,尤指偏二氯 乙烯、丙烯腈、甲基丙烯腈、丙烯酸酯、甲基丙烯酸酯之 聚合物或此等之中二種以上的共聚物等而成者爲較合適。 •又,爲使具有中空塡料之強度等的理由,使於表面上附著 無機塡料等者即可。此情形,在聚矽氧橡膠組成物內進行 足夠導熱性,中空塡料之真比重以在Ο · Ο 1〜0 . 8爲 宜,較宜爲0 .01〜0.5,尤宜爲0.02〜0.5 。若真比重過小時,則配合,處理僅較難,或中空塡料之 耐壓強度不足夠,成形時會受破壞,未能達到輕量化,導 熱係數降低。又,比重若較大時,則中空塡料之殻的厚度 變大,生成導熱性之降低並不足的情形。Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and the Consumer Consumption Monograph 483832 A7 ___B7__ V. Description of the Invention (!) Technical Field to which the Invention belongs The present invention relates to a computer keyboard, a remote control, a mobile phone, and other operation panels of a machine. Silicone rubber composition for key pads used for FF switches and key pads obtained thereby. Problems to be Solved by the Conventional Technology and Invention The heat-curable liquid silicone rubber composition is used in various fields because of its superior moldability, durability, heat resistance, and electrical insulation after molding. Among them, it is widely used in keyboard pads, keyboards, remote controllers, telephones and other key pad materials due to its durability (dynamic fatigue characteristics) and superior rebound characteristics. Machines using these keypads, such as notebook PCs or mobile phones, have increased portability, so they are required to be short and thin. However, the conventional silicone rubber key pads have a specific gravity of almost all above 1.0. For example, in order to reduce this specific gravity, there has been a conventional method of adding a thermally decomposable foaming agent or a lightweight silicone rubber foam (foam or sponge) to the material. A method of forming by using hydrogen produced as a by-product during curing. However, in the method of adding a thermal decomposition type foaming agent, the decomposition gas toxicity or odor is pointed to a problem, and the use of a platinum catalyst in the curing catalyst to use the curing barrier of the foaming agent is pointed to a problem. Furthermore, in the method using hydrogen produced as a by-product during curing, there are problems such as the explosive nature of hydrogen and the handling of uncured materials during storage. In addition, the formed product (sponge-like foam) is not uniform due to uneven air bubbles, and has insufficient strength. The durability of the material used as a key pad is inferior. The paper dimensions are subject to Chinese national standards (CNS). ) A4 size (210 X 297 mm) -4-W ------------------ Order --------- (Please read the precautions on the back first Fill out this page again) 483832 A7 ___ B7 V. Invention Description e) Exist. The present invention has been made in order to improve the above-mentioned problems, and has as its object to provide a silicone rubber composition for a key pad that can provide a light-weight and excellent durability key pad, and a key pad obtained by using the composition. Means taken to solve the problem and the embodiment of the invention As a result of careful review in order to achieve the above-mentioned object, the inventor found that the heat-curable organic polysiloxane composition (polysiloxane composition) was blended with an average Small hollow aggregates with a particle diameter of less than 2 0 // m. The cured silicone hardened product has a small specific gravity and excellent fatigue durability. As a material for key pads, the invention is completed. 〇 Accordingly, the present invention provides a hollow aggregate with an average particle diameter of 2 0 0 // m or less in a weight ratio of 100 to 10 parts by weight of the thermosetting organic polysiloxane composition. The keypad features a silicone rubber composition and a keypad. The present invention is described in further detail below. . Made by Qiu, a staff consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The silicone rubber composition for key pads of the present invention is made by mixing a hollow curable material with a thermosetting organic silicone composition. Here, as for the hollow material, it is a material having a gas portion in the cured product and reducing the thermal conductivity like rubber foam. Such materials include glass hollow balls, silicon dioxide hollow balls, carbon hollow balls, and phenol resin hollow. Balls, acrylonitrile hollow balls, vinylidene chloride hollow balls, alumina hollow balls, chromium dioxide hollow balls, silicon hollow balls, etc. may be used. Among these, the hollow paper material is used in the paper size of the Chinese National Standard (CNS) A4 (210 X 297 mm)-5-483832 A7 B7. 5. Description of the invention) Those with elasticity, that is, made of thermoplastic resin Hollow spheres, especially polymers of vinylidene chloride, acrylonitrile, methacrylonitrile, acrylates, methacrylates, or copolymers of two or more of these are more suitable. • For reasons such as the strength of hollow concrete, inorganic concrete and the like may be adhered to the surface. In this case, sufficient thermal conductivity is performed in the silicone rubber composition, and the true specific gravity of the hollow material is preferably 0 · 0 1 to 0.8, more preferably 0.01 to 0.5, and most preferably 0.02 to 0.5. . If the true specific gravity is too small, it will only be difficult to co-operate, or the compressive strength of the hollow concrete will not be sufficient, and it will be damaged during the forming process, failing to reduce the weight and reduce the thermal conductivity. In addition, if the specific gravity is large, the thickness of the shell of the hollow material becomes large, and a decrease in thermal conductivity may be insufficient.
經濟部智慧財產局員工消費合作社印製 I 又,中空塡料之平均粒子徑爲2 0 0 //m以下,宜爲 1 5 0 /zm以下,較宜爲9 0 //m以下,平均粒子徑若過 大時,則由於成形時之射出壓力會使中空塡料受破壞,導 熱係數變高,有按鍵墊在成形後的表面之粗糙度會變大的 等等問題生成,中空塡料之平均粒子徑的下限並未予特別 限制,惟通常爲1 0//m,尤其爲2 0//m,且,在此的 平均粒子徑,通常係利用雷射光繞射法之重量平均値(或 中徑)予以求取。 再者,在本發明,至於中空塡料係以使用下述方法測 定的彈性特性在1 0 %以上,宜爲1 5 %以上者爲較有效 的。彈性特性若未滿1 0 %時,則中空塡料本身因較堅硬 ,故有未能獲得足夠的衝擊吸收特性之情形。且,此彈性 特性之上限通常爲5 0%,宜爲4 5%即可。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -6 - 經濟部智慧財產局員工消費合作社印製 483832 A7 ~~ --SZ_ 五、發明說明4 ) 彈性特性之測定方法: 彈性特彳生係指中空球不受破壞下且可逆的或重複的可 •變形的範圍,如下述般予以測定。 將中空塡料及在25 °c之黏度爲1000c S (釐史 ’ ceimstoke,以下相同)之二甲基矽氧油混合成其體積比爲 50:50,將此注入5.〇〇(:針筒內3.〇(:(:後,將尖端封 閉,測定在施加2 〇 k g f之力時的變形率。例如以 3 · 〇c c成爲2 · 4c c時的變形率作爲(1 一 2·4/3·0)xiq〇=20%。惟在去除20 kgf之力時’須予復原至3·〇cc爲止。 上述中空塡料之配合量,對熱固化性有機聚矽氧烷組 成物100重量分爲〇·1〜1〇〇重量分,宜爲 0·2〜100重量分,較宜爲〇·5〜100重量分。 此情形爲中空塡料之按鍵墊用聚矽氧橡膠組成物中的含有 量以配合成體積比計爲1 〇〜8 0%,1 5〜7 5%爲尤 宜。體積比例若過少時,則導熱係數之降低並不足,又若 過多時,則不僅較難配合,有成形物亦有形成橡膠彈性所 無的脆弱性者之顧慮。 另一方面,至於熱固化性有機聚矽氧烷組成物,可使 用形成按鍵墊之聚矽氧橡膠層的公知組成之熱固化性有機 聚矽氧烷組成物,不論有機過氧化物硬化型者或加成反應 硬化型者均可,惟 (A )於一分子中含有至少二個與砂原子鍵結的嫌基之有 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)~~ -I —.1 I--------i — — — — — — ^« — — 1 —---- (請先閱讀背面之注意事項再填寫本頁) 483832 經 濟 部 智 慧 財 產 局 員 工 消 費 合 ―作 社 印 製 A7 _ B7____ 五、發明說明§ ) 機聚矽氧烷 100重量分 (B)於一分子中含有至少二個與矽原子鍵結的氫原子之 有機氫二烯聚矽氧烷 〇·1〜50重量分 •(C)加成反應觸媒 觸媒量 爲主成分之加成反應.硬化型之有機聚矽氧烷組成物爲尤宜 〇 在此,至於(Α)成分之於一分子中含有至少二個烯 基之有機聚矽氧烷,可採用下述平均組成式(1 )表示者Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs I. The average particle diameter of the hollow material is below 2 0 // m, preferably below 15 0 / zm, more preferably below 9 0 // m, average particle. If the diameter is too large, the hollow material will be damaged due to the injection pressure during molding, and the thermal conductivity will be increased. There will be problems such as the roughness of the surface of the key pad after forming will increase. The lower limit of the particle diameter is not particularly limited, but it is usually 10 // m, especially 20 // m, and the average particle diameter here is usually a weight average using laser light diffraction method (or Middle diameter). Furthermore, in the present invention, as for the hollow concrete, it is more effective that the elastic properties measured by the following method are 10% or more, preferably 15% or more. If the elastic characteristics are less than 10%, the hollow concrete itself is relatively hard, so it may not be possible to obtain sufficient impact absorption characteristics. In addition, the upper limit of this elastic characteristic is usually 50%, preferably 45%. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -6-Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 483832 A7 ~~ --SZ_ V. Description of the invention 4) Method for measuring elastic properties : Elasticity refers to the range in which the hollow ball can be reversibly or repeatedly deformed without being damaged. It is measured as follows. Hollow aggregate and dimethyl silicone oil with a viscosity of 1000 c S (centimeter 'ceimstoke, the same below) at 25 ° c were mixed to a volume ratio of 50:50, and this was injected into a 5.0% (: syringe Within 3.0 (::, the tip is closed, and the deformation rate when a force of 20 kgf is applied is measured. For example, the deformation rate when 3 · cc becomes 2 · 4 c c is (1-2 · 4 / 3 · 0) xiq〇 = 20%. However, when the force of 20 kgf is removed, it must be restored to 3.0 cc. The amount of the above-mentioned hollow aggregate is 100 weight of the thermosetting organic polysiloxane composition. It is divided into 0.1 to 100 weight points, preferably 0.2 to 100 weight points, and more preferably 0.5 to 100 weight points. This case is a silicone rubber composition for a key pad of a hollow material. The content of 5% by volume is preferably 10 to 80%, and 15 to 75% is particularly suitable. If the volume ratio is too small, the reduction in thermal conductivity is not sufficient, and if it is too large, it is not only difficult. There are concerns about the formation of the molded product and the fragility of rubber elasticity. On the other hand, as for the thermosetting organopolysiloxane composition, The heat-curable organic polysiloxane composition of the known composition of the polysiloxane rubber layer of the pad may be either an organic peroxide hardened type or an addition reaction hardened type, but (A) contains at least one molecule Two suspected bases bonded to sand atoms are the paper size applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) ~~ -I —.1 I -------- i — — — — — — ^ «— — 1 —---- (Please read the notes on the back before filling in this page) 483832 Consumption Cooperation of Employees of the Intellectual Property Bureau of the Ministry of Economic Affairs-Printed by the Press A7 _ B7____ V. Description of Invention §) 100 parts by weight of organic polysiloxane (B) Organic hydrodiene polysiloxane containing at least two hydrogen atoms bonded to silicon atoms in one molecule 0.1 to 50 parts by weight • (C) Addition reaction Addition reaction of catalyst amount as main component. Hardened organic polysiloxane composition is particularly suitable. Here, as for the component (A), organic polysilicon containing at least two alkenyl groups in one molecule. Oxane can be expressed by the following average composition formula (1)
RiaSi 〇(4-a)/2 (1) 式內,R1爲相互相同或不同的碳數1〜1 0宜爲1〜 8之非取代或取代之一價烴基,a爲1 · 5〜2 · 8,宜 爲1 · 8〜2 . 5,較宜爲1 · 9 5〜2 · 0 5之範圍之 正數。以上述R1表示矽原子上鍵結的非取代或取代之一價 烴基,可舉出有:甲基、乙基、丙基、異丙基、丁基、異 丁基、第三丁基、戊基、新戊基、己基、環己基、辛基、 壬基、癸基等烷基、苯基、甲苯基、二甲苯基、萘基等芳 香基、苄基、苯乙基、苯丙基等芳烷基、乙烯基、烯丙基 、丙烯基、異丙烯基、丁烯基、己烯基、環己烯基、辛烯 基等烯基、或此等基之氫原子之一部分或全部爲氟、氯、 溴等鹵原子、氰基等所取代者,例如氯甲基、氯丙基、溴 乙基、三氟丙基、氰乙基等。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)-8 _ —·------------------訂--------- (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 483832 A7 ____ B7 五、發明說明$ ) 此情形,R1之中至少二個需爲烯基(以碳數2〜8者 爲宜,更宜爲2〜6)。且烯基之含有量,爲R1中 0·001〜10莫耳%,以設成0·01〜5莫耳%爲 |尤宜。此烯基不論鍵結於分子鏈終端,或鍵結於分子鏈中 途的砂原子或鍵結於兩者均可。 此有機聚矽氧烷之構造係基本上具有鏈狀構造,惟部 分具有柱鏈狀構造,環狀構造等亦可。至於分子量,並未 予特別限定。由黏度較低的液狀者至黏度較高的生橡膠狀 者雖可使用,惟因固化會形成橡膠狀彈性體,故在2 5 °C 之黏度爲1 00 c p以上,通常1 〇〇〜 1,000,000,尤宜爲 500 〜100,000。 至於(B )於一分子中含有與至少二個,宜爲三個以 上之矽原子鍵結的氫原子(亦即S i Η基)之有機氫二烯 聚矽氧烷,係可採用以下述平均組成式(2 )表示者。 R 2 b He S i Ο ( 4 - b - 〇 ) / 2 ( 2 ) (式內,R2爲碳數1〜1 〇之非取代或取代之一價烴基, 可舉出與上述R1同樣的基,惟宜爲不具有脂肪族不飽和鍵 結之基。又,b爲0 · 7〜2 · 1,宜爲1 · 0〜2 · 〇 ,(:爲0 · 〇〇 1 〜1 · 〇5,宜爲 0 · 01 〜1 · 0, 且b + c爲〇 · 8〜3 · 0,宜爲1 · 0〜2 . 5之正數 )〇 此有機氫二烯聚矽氧烷係一分子中至少二個,需爲宜 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)· 9 - —------------------訂--------- (請先閱讀背面之注意事項再填寫本頁) 483832 A7 B7 經濟部智慧財產局員工消費合-^社印製 五、發明說明f ) 爲2〜100,較宜3〜50個之矽原子鍵結氫原子。至 於此種有機氫二烯聚矽氧烷,可舉出有:兩終端三甲基矽 氧基封閉甲基氫二烯聚矽氧烷,兩終端三甲基矽氧基封閉 二甲基矽氧烷、甲基氫二烯矽氧烷共聚物、雨終端二甲基 氫二烯矽氧基封閉二甲基聚矽氧烷、兩終端二甲基氫二烯 矽氧基封閉二甲基矽氧烷、甲基氫二烯矽氧烷共聚物、兩 終端三甲基矽氧基封閉甲基氫二烯矽氧烷、二苯基矽氧烷 共聚物、兩終端三甲基矽氧基封閉甲基氫二烯矽氧烷、二 苯基矽氧烷、二甲基矽氧烷共聚物、(CH3)2HSi〇w2單位及 Si〇4/2單位而成之共聚物、(CH3)2HSi〇1/2 單位及S i〇4/2單位與(C6H5) Si〇3/2單位而成 的共聚物、(CHdsHSiCU/s單位及(CH + SiOm與 S i 0 2單位而成之共聚物等。 又,此有機氫二烯聚矽氧烷,以在常溫爲液體較宜, 其黏度在25°C爲0 · 1〜lOOOcp,宜爲〇 · 1〜 500cp,尤宜爲〇 · 5〜300cp,又分子中矽原 子之數通常爲3〜3 0 0個,宜爲4〜1 0 0個程度者即 可。 上述(B )成分之有機氫二烯聚矽氧烷之配合量,對 (A)成分之有機聚矽氧烷1 〇 〇重量分爲〇 . 1〜5 0 重量分’宜爲0 · 3〜3 0重量分。此情形,已鍵結於( B )成分之矽原子的氫原子(亦即S i Η基)之量,對已 鍵結至(A )成分所含的矽原子之烯基以莫耳比計成爲 0 · 4〜5之量,以在〇 · 8〜2莫耳/莫耳之範圍爲尤 先 閱 讀 背 之 注 意RiaSi 〇 (4-a) / 2 (1) In the formula, R1 is an unsubstituted or substituted monovalent hydrocarbon group having the same or different carbon number 1 to 10, preferably 1 to 8, and a is 1.5 to 2 · 8, preferably 1 · 8 to 2.5, more preferably a positive number in the range of 1 · 9 5 to 2 · 0 5. The above-mentioned R1 represents an unsubstituted or substituted monovalent hydrocarbon group bonded to a silicon atom, and examples thereof include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, third butyl, and pentyl. Alkyl, neopentyl, hexyl, cyclohexyl, octyl, nonyl, decyl and other alkyl groups, phenyl, tolyl, xylyl, naphthyl and other aromatic groups, benzyl, phenethyl, phenylpropyl, etc. Aralkyl, vinyl, allyl, propenyl, isopropenyl, butenyl, hexenyl, cyclohexenyl, octenyl and other alkenyl groups, or part or all of the hydrogen atoms of these groups are Substituted by halogen atoms such as fluorine, chlorine, and bromine, and cyano, such as chloromethyl, chloropropyl, bromoethyl, trifluoropropyl, and cyanoethyl. This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) -8 _ — · ------------------ Order ------- -(Please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 483832 A7 ____ B7 V. Invention Description $) In this case, at least two of R1 need to be alkenyl (with The number of carbon atoms is preferably 2 to 8 and more preferably 2 to 6). And the content of alkenyl group is 0 · 001 ~ 10 mol% in R1, and it is particularly preferable to set it to 0.001 ~ 5 mol%. This alkenyl group may be bonded to the terminal of the molecular chain, or to a sand atom in the middle of the molecular chain, or to both. The structure of this organic polysiloxane basically has a chain structure, but part of it has a columnar structure, and a ring structure may be used. As for the molecular weight, it is not particularly limited. Although it can be used from those with low viscosity to those with high viscosity and raw rubbery ones, the rubbery elastomer will be formed due to curing, so the viscosity at 25 ° C is more than 100 cp, usually 100 ~ 1,000, 000, more preferably 500 to 100,000. As for (B) an organohydrodiene polysiloxane containing at least two, preferably three or more silicon atoms, hydrogen atoms (that is, Si fluorenyl groups) bonded in one molecule, the following can be used: Expressed by the average composition formula (2). R 2 b He S i 〇 (4-b-〇) / 2 (2) (In the formula, R 2 is an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms. Examples of the same group as the above-mentioned R 1 , But it is preferably a group without an aliphatic unsaturated bond. In addition, b is 0 · 7 ~ 2 · 1, preferably 1 · 0 ~ 2 · 〇, (: is 0 · 〇〇1 ~ 1 · 〇5 , Preferably 0 · 01 ~ 1 · 0, and b + c is 0 · 8 ~ 3 · 0, preferably 1 · 0 ~ 2. 5 is a positive number) 〇 This organohydrodiene polysiloxane is in one molecule At least two, it is necessary to apply the Chinese National Standard (CNS) A4 specification (210 X 297 mm) for this paper size. 9-—------------------ Order- -------- (Please read the notes on the back before filling out this page) 483832 A7 B7 Employee Consumption of the Intellectual Property Bureau of the Ministry of Economic Affairs-printed by the company 5. Inventive Note f) is 2 ~ 100, more appropriate 3 to 50 silicon atoms are bonded to hydrogen atoms. As for such an organohydrodiene polysiloxane, two-terminal trimethylsiloxy-blocked methylhydrodiene polysiloxane and two-terminal trimethylsiloxy-blocked dimethylsiloxane can be cited. Alkane, methylhydrodiene siloxane copolymer, rain-terminated dimethylhydrodiene siloxane blocked dimethylpolysiloxane, two-terminal dimethylhydrodiene siloxane blocked dimethylsiloxane Alkane, methylhydrodiene siloxane copolymer, two-terminal trimethylsiloxy blocked methylhydrodiene siloxane, diphenylsiloxane copolymer, two-terminal trimethylsiloxy closed methacrylate Hydroxydiene siloxane, diphenyl siloxane, dimethyl siloxane copolymer, (CH3) 2HSi〇w2 unit and SiO4 / 2 unit copolymer, (CH3) 2HSi〇1 Copolymers of / 2 units and Sio4 / 2 units and (C6H5) Si03 / 2 units, (CHdsHSiCU / s units and (CH + SiOm and S0 02 units of copolymers, etc.). In addition, the organohydrodiene polysiloxane is preferably a liquid at normal temperature, and its viscosity at 25 ° C is from 0.1 to 1,000 cp, preferably from 0.1 to 500 cp, and particularly preferably from 0.5 to 300 cp. Of the silicon atom in the molecule Usually, it is 3 to 300, preferably 4 to 100. The compounding amount of the organohydrodiene polysiloxane of the component (B) mentioned above, and the organic polysiloxane of the component (A) The weight of the alkane 1 0.00 is 0.1 to 50 weight parts' preferably 0 · 3 to 30 weight parts. In this case, the hydrogen atom (that is, Si Η) which has been bonded to the silicon atom of the (B) component Based on the molar ratio of the alkenyl group bonded to the silicon atom contained in the component (A) to a molar ratio of 0.4 to 5 in the range of 0.8 to 2 mol / mol For the first reading
|4 頁I I I I I I訂 # 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)-1〇 - 483832 經 濟 部 智 慧 財 產 局 員 工 消 費 社 印 製 五、發明說明() 宜,此莫耳比過少時 氧橡膠之耐熱性有惡 氫反應引起的發泡之 響的顧慮。 (C )成分之加 的(A )成分及(B ,惟此爲公知者即可 化鉑酸、氯化鉑酸之 基矽氧烷或乙炔醇類 可使用铑錯合物等之 量係因應期望的固化 A )成分,以鉑量或 1,0 0 0 P p m, 於上述熱固化性 配合其他成分,視必 塡充劑、補強劑之矽 屬粉等之導電劑、含 腈化合物、羧酸鹽、 甲矽烷化反應控制劑 矽氧油等內部脫模劑 於本發明之上述 中空塡料之矽氧橡膠 所謂按鍵墊,需爲由 接ON / OFF開關 A7 B7 ,交聯密度變成過低,對已硬化的矽 劣影響,若過多的情形會生成由於脫 問題,仍舊有對耐熱性會給予惡劣影 成反應觸媒,係被使用作爲促進前述 )成分之固化加成反應而用的觸媒者 。因此,於其中可例示有:鉑黑、氯 醇改質物、氯化鉑酸及烯烴醛、乙烯 等之錯合物等鉑或鉑化合物。再者亦 鉑族金屬化合物之使用。且,此添加 速度予以適當增減即可,惟通常對( 铑等鉑族金屬之量設成0 . 1〜 宜爲1〜2 0 0 p pm之範圍即可。 有機聚矽氧烷組成物內,被指可任意 要時可爲二氧化矽微粒子、碳酸鈣類 氧系樹脂、碳黑、導電性氧化鋅、金 氮化合物或乙炔化合物、磷化合物、 錫化合物、汞化合物、硫化合物等氫 、氧化鐵、氧化鈽類耐熱劑、二甲基 、賦黏劑、搖變性賦與劑等。 熱固化性有機聚矽氧烷組成物內配合 組成物,係被使用作按鍵墊。且在此 圓頂(dome)形狀而成,不僅可達成直 之作用者,亦包含與其他橡膠或樹脂 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公釐)-11 - I I I — — — — — — — — ·1111111 ^0 — — — — — — — (請先閱讀背面之注意事項再填寫本頁) 五、發明說明癸 間之貼合或複合 以使用者,不論 此情形’爲 膠組成物之必要 般而言在1 0 0 ,再者在1 8 0 cure )爲宜。 在此,固化 矽氧橡膠),其 尤宜。且其下限 483832 Α7 Β7 成形,或與金屬圓頂部之組合之一部分予 何者,均可充分活用其輕量性。 形成有關的按鍵墊,有固化上述聚矽氧橡 ,惟其固化條件係並未予特別限制的。一 〜1 5 0 °C使加熱固化1 0分鐘〜1小時 〜2 0 0 °C進行2〜4小時後固化(post 上述聚矽氧橡膠組成物而得的硬化物(聚 比重在0.95以下,以0·90以下爲 爲0·2以上,以〇·3以上爲尤其適合 實施例 以下,表示出實施例及比較例,具體的說明本發明, 惟本發明並非受下述的實施例所限制者。且,下述的例子 係表示重量分。又,例中之>1 0 0%伸長疲勞壽命"係 表示依下述方法之測定結果者。. 100%伸長疲勞壽命 使用彎曲疲勞試驗機〔東洋精機股份有限公司製〕並 測定,測試啞鈴形試片係採用J I s K 6 3 0 1第1, 3節指定的3號啞鈴形試片,在室溫以5 Η z重複進行 1 0 0%伸長,以至裂斷爲止的次數表示。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)-12 - 請 先 閱 讀 背 面 之 注 意 項| 4 页 IIIIII 定 # This paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm)-10-483832 Printed by the Consumers' Office of the Intellectual Property Bureau of the Ministry of Economic Affairs When the ear ratio is too small, the heat resistance of the oxygen rubber may cause a foaming noise caused by an toxic hydrogen reaction. (C) Addition of component (A) component and (B, but it is known that the platinum acid, chloroplatinic acid-based siloxane or acetylene alcohol can be used in accordance with the amount of rhodium complex and the like. Desirable curing A) component, with platinum content or 1, 0 0 0 P pm, and other components with the above-mentioned thermosetting properties, depending on the conductive agent, silicon-containing compound, carboxylate, etc. Salt, silylation reaction control agent, silicone oil and other internal release agents in the above-mentioned hollow rubber silicone rubber so-called key pads of the present invention need to be connected to the ON / OFF switch A7 B7, the crosslinking density becomes too low To the inferior effect of the hardened silicon, if there are too many cases, due to the problem of delamination, there is still a poor reaction catalyst that will give a bad effect on the heat resistance, which is used to promote the curing addition reaction of the aforementioned components. Matchmaker. Therefore, platinum or a platinum compound such as platinum black, a chlorohydrin modified product, a chlorinated platinum acid, a complex of an olefin aldehyde, and ethylene can be exemplified. Furthermore, the use of platinum group metal compounds is also mentioned. In addition, the addition speed may be appropriately increased or decreased, but generally, the amount of the platinum group metal such as rhodium is set to a range of 0.1 to 1 and preferably 1 to 2 0 0 p pm. Organic polysiloxane composition It is said that it can be hydrogen such as silicon dioxide fine particles, calcium carbonate-based oxygen-based resin, carbon black, conductive zinc oxide, gold nitrogen compounds, acetylene compounds, phosphorus compounds, tin compounds, mercury compounds, sulfur compounds, etc. , Iron oxide, hafnium oxide-based heat-resistant agent, dimethyl, tackifier, shaking modifier, etc. The thermosetting organic polysiloxane composition is compounded with the composition and is used as a key pad. And here The shape of the dome is not only able to achieve a straight effect, but also contains other rubber or resin. This paper applies the Chinese National Standard (CNS) A4 specification (210x297 mm) -11-III — — — — — — — — · 1111111 ^ 0 — — — — — — — (Please read the precautions on the back before filling out this page) V. Description of the invention The bonding or compounding of guima is used by the user, regardless of this situation. Necessarily in 1 0 0, and more preferably at 180 cure). Here, silicone rubber is cured), which is particularly suitable. And its lower limit 483832 Α7 Β7 is formed, or any combination with metal round top can be used to make full use of its lightweight. The related key pads are formed to cure the above silicone rubber, but the curing conditions are not particularly limited. 1 ~ 1 50 ° C for 10 minutes ~ 1 hour ~ 2 0 ° C for 2 ~ 4 hours and post-curing (post hardened product obtained from the above silicone rubber composition (poly specific gravity below 0.95, 0 · 90 or less is 0.2 or more, and 0.3 or more is particularly suitable for the following examples. Examples and comparative examples are shown to specifically illustrate the present invention, but the present invention is not limited by the following examples. In addition, the following examples indicate weight points. Also, "> 100% elongation fatigue life" in the examples indicates measurement results according to the following methods: 100% elongation fatigue life using a bending fatigue test Machine [manufactured by Toyo Seiki Co., Ltd.] and measured. The dumbbell-shaped test piece was tested using JI s K 6 3 0 1 No. 3 dumbbell-shaped test piece specified in sections 1, 3, and repeated at room temperature at 5 5 z 1 0 0% elongation, expressed as the number of times until it breaks. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -12-Please read the notes on the back first
頁 經濟部智慧財產局員工消費合作社印製 - 483832 經 濟 部 智 慧 財 產 局 員 工 消 費 合 一作 社 印 製 A7 ______ B7__ 五、發明說明(〇 ) i施例1 在室溫將兩終端爲二甲基乙烯基矽氧基封閉的2 5 t 之黏度爲1萬泊(poise )之二甲基聚矽氧烷(1)68分 •’比表面積2 0 0m2/g之二氧化矽烟(日本aerosil公 司製造,Aerosil 200) 32分、六甲基二矽氮烷5分 、二乙烯基四甲基二矽氮烷〇 · 5分,水2 . 0分混合 3 0分鐘後,升溫至1 5 0 °C繼續攪拌3小時並冷卻,而 得聚矽氧橡膠基底。將於此聚矽氧橡膠基底1 〇 〇分內添 加有二甲基聚矽氧烷(1) 30分,比重0 · 04,平均 粒徑4 0 // m,以上述方法測定的 < 彈性特性 > 爲3 8 % 之熱塑性樹脂製中空塡料(Expancel公司)製造, Expancel DE ) 2分(對組成物相當於約3 0容積% )放入行星式混 合機內,繼續攪拌3 0分鐘後,再添加交聯劑之於分子鏈 雨終端及側鏈上有S i - Η基之甲基氫二烯聚矽氧烷(2 )(聚合度 17.Si— Η 量 0.0060mol/g) 2 · 5分,反應控制劑之乙炔基環己醇0 · 0 5分,繼續 攪拌1 5分鐘而得聚矽氧橡膠組成物。於此聚矽氧橡膠組 成物內混合鉛觸媒(P t濃度1 % ) 0 · 1分,利用進行 1 2 0 °C / 1 0分鐘之後固化而得2 m m板片,並測定比 重、硬度、100%伸長疲勞壽命。結果示於表1。 實施例2 · 在室溫將實施例1之二甲基聚矽氧烷(1 ) 6 5分, 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ~13 - " 請 先· 閱 讀 背、 面 注 項Page Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs-483832 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 ______ B7__ V. Description of the Invention (〇) i Example 1 The two terminals are dimethylethylene at room temperature Dimethylpolysiloxane (1) with a viscosity of 10,000 poise (25 t) based on siloxy-blocked silicon dioxide (1) 68 minutes • 'Surface area of 200 m2 / g of silicon dioxide (manufactured by Japan Aerosil Corporation) , Aerosil 200) 32 minutes, hexamethyldisilazane 5 minutes, divinyltetramethyldisilazane 0.5 minutes, 2.0 minutes of water 30 minutes after mixing, and the temperature was raised to 150 ° C Stirring was continued for 3 hours and cooling was performed to obtain a silicone rubber substrate. Dimethicone (1) was added to this silicone rubber substrate for 100 minutes, the specific gravity was 0.04, the average particle diameter was 4 0 // m, and the elasticity measured by the method described above was < Features > It is made of 38% thermoplastic resin hollow material (Expancel), Expancel DE) 2 points (equivalent to about 30% by volume of the composition) is placed in a planetary mixer, and stirring is continued for 30 minutes After that, a cross-linking agent is further added to the methyl chain terminal and the side chain of the methyl hydrodiene polysiloxane (S)-(2) (polymerization degree 17.Si- Η amount 0.0060mol / g) 2.5 minutes, the ethynylcyclohexanol of the reaction control agent was 0.5 minutes, and stirring was continued for 15 minutes to obtain a silicone rubber composition. A lead catalyst (Pt concentration 1%) was mixed in this silicone composition with 0 · 1 minute, and then cured at 120 ° C / 10 minutes to obtain a 2 mm plate, and the specific gravity and hardness were measured. , 100% elongation fatigue life. The results are shown in Table 1. Example 2 · The dimethyl polysiloxane (1) 65 of Example 1 was taken at room temperature for 65 minutes. The paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm) ~ 13-" Please read the back and face notes first
訂Order
II
483832 A7 -----B7 五、發明說明(1 ) 比表面積3 0 0m2/g之二氧化矽烟(日本Aerosil公司 製造,Aero sil 300) 35分、六甲基二矽氮烷6分、二 乙烯基四甲基二矽氮烷0·5分、水2·0分混合30分 鐘後、升溫至1 5 0 °C,繼續攪拌3小時並冷卻,而得聚 矽氧橡膠基底。將於.此聚矽氧橡膠基底1 〇 〇分內添加有 二終端爲二甲基乙烯基矽氧基封閉的2 5 °C之黏度爲1 0 萬泊之二甲基聚矽氧烷(3) 35分,比重0 · 02,平 均粒徑9 0 // m,以上述方法測定的 < 彈性特性 > 爲 4 0%之熱塑性樹脂製中空塡料(松本油脂公司製造, Microsphere F-80ED ) 1_ · 2分(對組成物相當於約3 3容 積%)放入行星式混合機內,繼續攪拌3 0分鐘後,再添 加交聯劑之於分子鏈兩終端及側鏈上有S i - Η基之甲基 氫二烯聚矽氧烷(2)聚合度17,Si - Η量〇 · 00 60mo1/g) 2.5分,反應控制劑之乙炔基環己醇 〇· 0 5分,繼續攪拌1 5分鐘而得聚矽氧橡膠組成物。 於此聚矽氧橡膠組成物內混合鉑觸媒(P t濃度1 % )483832 A7 ----- B7 V. Description of the invention (1) Silicon dioxide (specifically, Aerosil 300 manufactured by Japan Aerosil Corporation) with a specific surface area of 300m2 / g 35 minutes, hexamethyldisilazane 6 minutes, Divinyltetramethyldisilazane was mixed with 0.5 minutes of water and 2.0 minutes of water for 30 minutes, and then the temperature was raised to 150 ° C. The mixture was stirred for 3 hours and cooled to obtain a silicone rubber substrate. The silicone rubber base is added with dimethyl vinylsiloxy, which has two terminals terminated by dimethylvinyloxy, at a temperature of 25 ° C. ) 35 points, specific gravity 0 · 02, average particle size 9 0 // m, < elasticity > as measured by the method described above, 40% of a thermoplastic resin hollow material (manufactured by Matsumoto Oil & Fat Co., Microsphere F-80ED ) 1_ · 2 points (corresponding to about 33% by volume of the composition) put into the planetary mixer, continue stirring for 30 minutes, and then add a crosslinking agent to the two ends of the molecular chain and S i on the side chain -Methionyl methylhydrodiene polysiloxane (2) Polymerization degree 17, Si-Η Amount: 0.0060mo1 / g) 2.5 minutes, ethynylcyclohexanol of reaction control agent 0.05 minutes, continue Stir for 15 minutes to obtain a silicone rubber composition. A platinum catalyst is mixed in the silicone rubber composition (P t concentration 1%)
經濟部智慧財產局員工消費合作社印製 I 0 · 1分,利用進行1 2 0 °C / 1. 0分鐘之後固化而得2 m m板片,並測定比重、硬度,1 〇 〇 %伸長疲勞壽命。 結果示於表1。 實施例3 在室溫將實施例1之二甲基聚矽氧烷(1 ) 7 0分, 比表面積3 0 〇m2/g之二氧化矽烟(日本Aerosil公司 製,Aerosil 300) 30分、六甲基二矽氮烷5分、二乙 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)-14 - 483832 經 濟 部 智 慧 財 產 局 員 工 消 費 合 -一作 社 印 製 A7 五、發明說明(2 ) 烯基四甲基二矽氮烷0·5分,水2·0分混合30分鐘 後,升溫至1 5 0 °C,繼續攪拌3小時並冷卻,而得聚矽 氧橡膠基底。將於此聚矽氧橡膠基底1 〇 〇分內添加有實 施例2之二甲基聚矽氧烷(3) 30分,比重0 . 02 , 平均粒徑9 0 // m,以上述方法測定的 < 彈性特性 > 爲4 0 %之熱塑性樹脂製中空塡料(松本油脂公司製造, Microsphere F-80ED ) 3 · 0分(對組成物相當於約3 0容 積%放入行星式混合機內,繼續攪拌3 0分鐘後,再添加 交聯劑之於分子鏈兩終端及側鏈上有S i - Η基之甲基氫 二烯聚矽氧烷(2)(聚合度17,Si - Η量0· 0060 mol/g ) 2 · 5分,反應控制劑之乙炔基環己醇〇 · 〇 5分 ,繼續攪拌1 5分鐘而得聚矽氧橡膠組成物,於此聚矽氧 橡膠組成物內混合鉑觸媒(P t濃度1 % ) 0 · 1分,利 用進行1 2 0°C/1 0分鐘之後固化而得2mm板片,並 測定比重、硬度、1 0 0 %伸長疲勞壽命,結果示於表1 實施例4 在室溫將實施例1之二甲基聚矽氧烷(1 ) 6 5分, 比表面積3 0 0m2/g之二氧化矽烟(日本Aerosil公司 製造,Aero sil 300) 35分,六甲基二矽氧烷6分,二 乙烯基四甲基二矽氮烷0.5分,水2·0分混合30分 鐘後,升溫至1 5 0 °C,繼續攪拌3小時並冷卻,而得聚 矽氧橡膠基底。將於此聚矽氧橡膠基底1 0 0分內添加有 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)-15 - (請先閱讀背面之注意事項再填寫本頁)The Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed I 0 · 1 point, and it was cured at 120 ° C / 1.0 minutes to obtain a 2 mm plate, and the specific gravity and hardness were measured. The elongation fatigue life was 100%. . The results are shown in Table 1. Example 3 The dimethyl polysiloxane (1) of Example 1 at 70 minutes and a specific surface area of 300 m2 / g of silicon dioxide (Aerosil 300, manufactured by Japan Aerosil Corporation) at 30 minutes, Hexamethyldisilazane 5 points, Diethyl paper size Applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) -14-483832 Intellectual Property Bureau, Ministry of Economic Affairs, Consumer Consumption-Printed by Izakusha A5 2. Description of the invention (2) Alkenyltetramethyldisilazane 0.5 minutes, water 2.0 minutes after mixing for 30 minutes, the temperature was raised to 150 ° C, and stirring was continued for 3 hours and cooled to obtain polysiloxane Rubber base. The dimethylpolysiloxane (3) of Example 2 was added to this polysiloxane rubber substrate for 100 minutes, and the specific gravity was 0.02, and the average particle diameter was 90 / m. ≪ Elasticity > A thermoplastic resin hollow material (manufactured by Matsumoto Grease Co., Ltd., Microsphere F-80ED) with a content of 40% is equivalent to about 3.0% (about 30% by volume of the composition is placed in a planetary mixer) Then, after stirring for 30 minutes, a cross-linking agent was added to the two terminals of the molecular chain and the methyl hydrodiene polysiloxane (S) having a Si-fluorenyl group on the side chain (degree of polymerization 17, Si- Amount of 0 · 0060 mol / g) 2 · 5 minutes, ethynyl cyclohexanol of the reaction control agent 0.5 · 5 minutes, and continued to stir for 15 minutes to obtain a silicone rubber composition. Here, the silicone rubber composition Mixed platinum catalyst (Pt concentration 1%) 0 · 1 minute, 2mm plate was obtained after curing at 120 ° C / 10 minutes, and specific gravity, hardness, and 100% elongation fatigue life were measured. The results are shown in Table 1. Example 4 The dimethylpolysiloxane (1) of Example 1 was obtained at room temperature for 65 minutes, and the specific surface area was 300 m2 / g of silicon dioxide (Aerosil, Japan). (Manufactured by the company, Aero sil 300) 35 minutes, hexamethyldisilazane 6 minutes, divinyltetramethyldisilazane 0.5 minutes, water 2.0 minutes after mixing for 30 minutes, and the temperature was raised to 150 ° C , Continue to stir for 3 hours and cool down to obtain a silicone rubber substrate. This silicone rubber substrate will be added within 100 minutes of this paper. The paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm). -15-(Please read the notes on the back before filling this page)
483832 A7 B7 五、發明說明<3 ) 實施例1之二甲基聚矽氧烷(1) 30分,比重0 · 22 ,平均粒徑7 4 // m以下,以上述方法測定的 < 彈性特性 >爲2%之玻璃製中空塡料(住友3M,Scotchlite S22 ) Έ 5分(對組成物相當於約5 0容積% )放入行星式混合 機內,繼續攪拌3 0分鐘後,再添加交聯劑之於分子鏈兩 終端及側鏈上有S i - Η基之甲基氫二烯聚矽氧烷(2) (聚合度 1 7,Si— Η量 0.0060mol/g) 2 · 5分,反應控制劑之乙炔基環己醇0 · 0 5分,繼續 攪拌1 5分鐘而得聚矽氧橡膠組成物,於此聚矽氧橡膠組 成物內混合含鉑觸媒t濃度1 % ) 0 · 1分,利用進 行1 5 0 °C / 1小時之烘箱固化(oven cure )而得2mm板 片,並測定比重、硬度,1 0 0 %伸長疲勞壽命。結果示 於表1。 比較例1 在室溫將實施例1之=甲基聚矽氧烷(1 ) 6 8分, 比表面積2 0 0m2/g之二氧化砂烟(日本Aerosil公司 製造,人61:(^12 0 0 ) 3 2分,六甲基二砂氮院5分,二 乙烯基四甲基二矽氮烷0 · 5分,水,2 · 0分混合· 30 分鐘後,升溫至1 5 0 °C,繼續攪拌3小時並冷卻’而得 聚矽氧橡膠基底。將於此聚矽氧橡膠基底1 0 0分內添加 二甲基聚矽氧烷(1 ) 3 0分後放入行星式混合機,繼續 攪拌3 0分鐘後,再添加於分子鏈兩終端及側鏈上有S i 一 Η基之甲基氫二烯聚矽氧烷(2)(聚合度17 ’Si 本^張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐1 ~-16- (請先閱讀背面之注意事項再 ----I I I I ^- — — — — — —1— · 本頁)483832 A7 B7 V. Description of the invention < 3) The dimethyl polysiloxane (1) of Example 1 30 minutes, specific gravity 0 · 22, average particle size 7 4 // m or less, measured by the above method < Elastic characteristics> 2% glass hollow material (Sumitomo 3M, Scotchlite S22) Έ 5 minutes (equivalent to about 50% by volume of the composition) put in a planetary mixer, and after stirring for 30 minutes, A cross-linking agent is further added to the two terminals of the molecular chain and the methylhydrodiene polysiloxane having S i -fluorenyl groups on the side chains (2) (degree of polymerization 17, Si—fluorene amount 0.0060mol / g) 2 · 5 minutes, ethynylcyclohexanol of the reaction control agent 0 · 0 5 minutes, continue to stir for 15 minutes to obtain a silicone rubber composition, and the silicone rubber composition is mixed with a platinum catalyst t concentration of 1 %) 0 · 1 minute, 2 mm sheet was obtained by oven curing at 150 ° C / 1 hour, and the specific gravity and hardness were measured, and the fatigue life at 100% was extended. The results are shown in Table 1. Comparative Example 1 Sand dioxide of Example 1 = methyl polysiloxane (1) 6 8 and specific surface area of 200 m2 / g (made by Japan Aerosil Corporation, person 61: (^ 12 0) at room temperature 0) 2 points, 5 points for hexamethyldisarza nitrogen institute, 0 · 5 points for divinyltetramethyldisilazane, water, 2 · 0 points for mixing · After 30 minutes, warm up to 150 ° C , Continue to stir for 3 hours and cool down to obtain a silicone rubber substrate. Add dimethyl polysiloxane (1) to this silicone rubber substrate within 100 minutes and put it into the planetary mixer after 30 minutes After continuing stirring for 30 minutes, add methyl hydrodiene polysiloxane (S) with two terminals Si and fluorenyl on the side chain of the molecular chain (degree of polymerization 17 'Si, this standard applies to China) National Standard (CNS) A4 Specification (210 X 297 mm 1 ~ -16- (Please read the precautions on the back first ---- IIII ^-— — — — — — 1 — · This page)
經濟部智慧財產局員工消費合作社印製 I 483832 A7 - B7 五、發明說明(K ) 一 Η量ο ·〇〇6〇ιη〇 1/g) 2 · 5分,反應控制劑 之乙炔基環己醇0 · 〇 5分,繼續攪拌1 5分鐘而得聚矽 氧橡膠組成物。於此聚矽氧橡膠組成物內混合鉑觸媒(P • t濃度1 % ) 〇 · 1分,利用進行1 2 0 °C / 1 〇分鐘之 模壓固化而得2mm板片,並測定比重、硬度,1 〇 〇% 伸長疲勞壽命。其結果示於表1。Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs I 483832 A7-B7 V. Description of the invention (K) Amount ο · 〇〇〇〇〇〇ηη1 / g) 2 · 5 minutes, the reaction control agent acetylene cyclohexyl The alcohol was 0.55 minutes, and stirring was continued for 15 minutes to obtain a silicone rubber composition. A platinum catalyst (P • t concentration of 1%) was mixed in the silicone rubber composition 〇 · 1 minute, and a 2 mm plate was obtained by press curing at 120 ° C / 10 minutes, and the specific gravity, Hardness, 100% elongation fatigue life. The results are shown in Table 1.
比較例2 將實施例1之二甲基聚矽氧烷(1 ) 1 〇 〇分,石英 粉(Cystalite VX-ST ) _50分,表面經予疏水化處理的二氧 化矽烟(日本Aerosil公司製造,Aerosil R - 9 7 2 )放 入行星式混合機內,攪拌3 0分鐘後,再加入下式(3 ) 【化1】 ch3 h ch3Comparative Example 2 The dimethyl polysiloxane (1) of Example 1 was 100 minutes, quartz powder (Cystalite VX-ST) was _50 minutes, and the surface was hydrophobized silicon dioxide (manufactured by Japan Aerosil Corporation). , Aerosil R-9 7 2) Put into the planetary mixer and stir for 30 minutes, then add the following formula (3) [Chemical formula 1] ch3 h ch3
I I I CH3-Si〇-( Si-0 )20 Si-CH3 (3) CH3 ch3 ch3 經濟部智慧財產局員工消費合作社印製 - 表示的有機氫二烯矽氧烷7分,再加入終端爲羥基二甲基 矽氧基封閉的下式(4) CH3 (4)III CH3-Si〇- (Si-0) 20 Si-CH3 (3) CH3 ch3 ch3 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs-7 points of organohydrodiene siloxane indicated, and then added to the terminal is hydroxydi Methylsiloxy blocked formula (4) CH3 (4)
HO-f Si-O-^H CH, 表示的二甲基矽氧烷6分,乙炔基環己醇0 · 1分並繼續 混合1 5分鐘。於此聚矽氧橡膠組成物內加入氯化鉑酸之 1 %異丙醇溶液0 . 5分,經攪拌,脫泡後,將在1 2 0 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)-17 _ 483832 A7 B7 五、發明說明〇5 ) °〇烘箱內使發泡成海棉狀,並予固化者裁切成厚度2 mm 之板片狀,測定比重、硬度,100%伸長疲勞壽命。結 果示於表1。 〔表1〕 實施例 實施例 實施例 實施例 比較例 比較例 1 2 3 4 1 2 比重(25)°C 0.72 0.83 0.61 0,65 1.07 0.62 硬度(JISA) 40 43 39 50 39 32 100%伸長疲 60萬 9-0萬 40萬 12萬 300萬 2.5萬 勞壽命(次) 發明之功效 依本發明,可得質輕且耐久性優越的按鍵墊 (請先閱讀背面之注意事項再填寫本頁) 經 濟 部 智 慧 財 產 局 員 工 消 費 合 --作 社 印 製 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 18-HO-f Si-O- ^ H CH, 6 minutes for dimethylsilane, 0.1% for ethynylcyclohexanol, and continue mixing for 15 minutes. Add 0.5% of 1% isopropyl alcohol solution of chloroplatinic acid to this silicone rubber composition. After stirring and defoaming, the paper size will be in accordance with China National Standard (CNS) A4. (210 X 297 mm) -17 _ 483832 A7 B7 V. Description of the invention 0 5) ° 〇 Foamed into a sponge shape in an oven and cut into a sheet thickness of 2 mm by the cured person, and measured the specific gravity, Hardness, 100% elongation fatigue life. The results are shown in Table 1. [Table 1] Example Example Example Example Comparative Example Comparative Example 1 2 3 4 1 2 Specific gravity (25) ° C 0.72 0.83 0.61 0,65 1.07 0.62 Hardness (JISA) 40 43 39 50 39 32 100% fatigue fatigue 609,000-104,400,123,230, 25,000 labor-life (times) The effect of the invention According to the invention, a light-weight and durable keypad can be obtained (please read the precautions on the back before filling this page) Consumption Cooperation of Employees of the Intellectual Property Bureau of the Ministry of Economic Affairs--printed by Zuosha Co., Ltd. This paper applies Chinese National Standard (CNS) A4 (210 X 297 mm) 18-
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11841199A JP2000309710A (en) | 1999-04-26 | 1999-04-26 | Silicone rubber composition for keypad and keypad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW483832B true TW483832B (en) | 2002-04-21 |
Family
ID=14735991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW88115237A TW483832B (en) | 1999-04-26 | 1999-09-03 | Silicone rubber composition for key pad and key pad made thereform |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2000309710A (en) |
| TW (1) | TW483832B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4762389B2 (en) * | 1998-10-15 | 2011-08-31 | 信越化学工業株式会社 | Hollow filler-containing silicone rubber composition |
| JP2001164111A (en) * | 1999-12-10 | 2001-06-19 | Dow Corning Toray Silicone Co Ltd | Silicone rubber composition and silicone rubber composition for keypad |
| JP2004101851A (en) * | 2002-09-09 | 2004-04-02 | Sony Corp | Display device and electronic apparatus having the display device |
| JP4114050B2 (en) * | 2002-10-15 | 2008-07-09 | 信越化学工業株式会社 | Silicone heat insulating sheet for electronic equipment and heat insulating method using the same |
| JP2016023259A (en) * | 2014-07-23 | 2016-02-08 | 信越化学工業株式会社 | Curable silicone rubber composition and silicone rubber member |
-
1999
- 1999-04-26 JP JP11841199A patent/JP2000309710A/en active Pending
- 1999-09-03 TW TW88115237A patent/TW483832B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000309710A (en) | 2000-11-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW555794B (en) | Method for the preparation of low specific gravity silicone rubber elastomers | |
| TW500766B (en) | Thermal conductive silicone rubber compositions and method of making | |
| TW593476B (en) | Electromagnetic wave absorbing silicone rubber compositions | |
| JP3543663B2 (en) | Thermal conductive silicone rubber composition and method for producing the same | |
| JP5015436B2 (en) | Thermally conductive silicone elastomer, thermal conductive medium and thermally conductive silicone elastomer composition | |
| TW574094B (en) | Hollow filler-containing silicone rubber and method of production | |
| TWI225080B (en) | Silicone rubber compositions | |
| JP4588285B2 (en) | Thermally conductive silicone rubber composition | |
| TWI513770B (en) | Thermally conductive silicone rubber composition | |
| JP6194861B2 (en) | Thermally conductive silicone composition and thermally conductive silicone molding | |
| JP4144998B2 (en) | Material for heat dissipation | |
| JP2011089079A (en) | Heat conductive silicone composition and cured product of the same | |
| JPH06155517A (en) | Manufacture of heat conductive/composite sheet | |
| TW200813137A (en) | High-open cell-content silicone rubber sponge | |
| TWI477559B (en) | Thermally conductive silicone oxygen elastomer and method of manufacturing the same | |
| JP5115716B2 (en) | Low specific gravity silicone rubber adhesive composition | |
| JP4114050B2 (en) | Silicone heat insulating sheet for electronic equipment and heat insulating method using the same | |
| JP3521781B2 (en) | Heat dissipation member | |
| CN1923900B (en) | Heating solidified low density liquid silicon rubber composition and low density silicon rubber formed object | |
| JP2023183384A (en) | Thermally conductive silicone composition and method for producing a thermally conductive member using the composition | |
| JP2009263433A (en) | Silicon-containing polymer, its manufacturing method, and curable polymer composition | |
| JP2000309710A (en) | Silicone rubber composition for keypad and keypad | |
| JP6919634B2 (en) | Silicone rubber composition for making keypads and keypads | |
| TWI679245B (en) | Curable polysiloxane rubber composition and polysiloxane rubber member | |
| JP2007063389A (en) | Heat curable low specific gravity liquid silicone rubber composition and low specific gravity silicone rubber molding |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |