TW502102B - Thermal transfer devices - Google Patents

Thermal transfer devices Download PDF

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Publication number
TW502102B
TW502102B TW090125549A TW90125549A TW502102B TW 502102 B TW502102 B TW 502102B TW 090125549 A TW090125549 A TW 090125549A TW 90125549 A TW90125549 A TW 90125549A TW 502102 B TW502102 B TW 502102B
Authority
TW
Taiwan
Prior art keywords
heat transfer
transfer device
scope
item
patent application
Prior art date
Application number
TW090125549A
Other languages
English (en)
Chinese (zh)
Inventor
James Patrick Flint
Nancy F Dean
Original Assignee
Honeywell Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc filed Critical Honeywell Int Inc
Application granted granted Critical
Publication of TW502102B publication Critical patent/TW502102B/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW090125549A 2001-08-17 2001-10-16 Thermal transfer devices TW502102B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2001/025769 WO2003017365A2 (fr) 2001-08-17 2001-08-17 Dispositifs de transfert thermique

Publications (1)

Publication Number Publication Date
TW502102B true TW502102B (en) 2002-09-11

Family

ID=21742783

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090125549A TW502102B (en) 2001-08-17 2001-10-16 Thermal transfer devices

Country Status (3)

Country Link
AU (1) AU2001285013A1 (fr)
TW (1) TW502102B (fr)
WO (1) WO2003017365A2 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7746634B2 (en) 2007-08-07 2010-06-29 Cooligy Inc. Internal access mechanism for a server rack
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
US8157001B2 (en) 2006-03-30 2012-04-17 Cooligy Inc. Integrated liquid to air conduction module
US8250877B2 (en) 2008-03-10 2012-08-28 Cooligy Inc. Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US8602092B2 (en) 2003-07-23 2013-12-10 Cooligy, Inc. Pump and fan control concepts in a cooling system
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
TWI548852B (zh) * 2012-01-19 2016-09-11 建準電機工業股份有限公司 導熱塑膠所製成的散熱裝置與其製造方法
CN106793670A (zh) * 2015-11-24 2017-05-31 吴江市旭威电子科技有限公司 电子元件散热装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7027304B2 (en) 2001-02-15 2006-04-11 Integral Technologies, Inc. Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
FR2860368B1 (fr) * 2003-09-25 2007-07-27 Omwave Sas Appareil central de gestion de fonctions audio, video, et pc
CN103292629A (zh) * 2012-03-01 2013-09-11 欧司朗股份有限公司 热管及其制造方法
EP2713132A1 (fr) * 2012-09-26 2014-04-02 Alcatel Lucent Appareil de transfert de chaleur par évaporation
EP4114159A1 (fr) * 2021-06-29 2023-01-04 Siemens Aktiengesellschaft Dispositif de dissipation thermique des composants microélectroniques disposés dans un boîtier électronique

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986004982A1 (fr) * 1985-02-21 1986-08-28 Fujikura Ltd. Conduite thermique
JPS63254755A (ja) * 1987-04-10 1988-10-21 Mitsubishi Electric Corp 電子素子体の冷却装置の製造方法
JPH06102870B2 (ja) * 1987-06-16 1994-12-14 竹本油脂株式会社 炭素繊維用サイジング剤
US5076352A (en) * 1991-02-08 1991-12-31 Thermacore, Inc. High permeability heat pipe wick structure
CA2309630A1 (fr) * 1997-11-13 1999-05-27 James D. Miller Appareil de gestion thermique a caloduc

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8602092B2 (en) 2003-07-23 2013-12-10 Cooligy, Inc. Pump and fan control concepts in a cooling system
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
US8157001B2 (en) 2006-03-30 2012-04-17 Cooligy Inc. Integrated liquid to air conduction module
US7746634B2 (en) 2007-08-07 2010-06-29 Cooligy Inc. Internal access mechanism for a server rack
US8250877B2 (en) 2008-03-10 2012-08-28 Cooligy Inc. Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
TWI548852B (zh) * 2012-01-19 2016-09-11 建準電機工業股份有限公司 導熱塑膠所製成的散熱裝置與其製造方法
CN106793670A (zh) * 2015-11-24 2017-05-31 吴江市旭威电子科技有限公司 电子元件散热装置

Also Published As

Publication number Publication date
WO2003017365A3 (fr) 2003-09-04
AU2001285013A1 (en) 2003-03-03
WO2003017365B1 (fr) 2004-04-22
WO2003017365A2 (fr) 2003-02-27

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees