TW507245B - Process for manufacturing assemblies comprising a base and a device integrating the functions of cathode and getter for miniaturized x-ray emitters and assemblies so produced - Google Patents

Process for manufacturing assemblies comprising a base and a device integrating the functions of cathode and getter for miniaturized x-ray emitters and assemblies so produced Download PDF

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TW507245B
TW507245B TW090116052A TW90116052A TW507245B TW 507245 B TW507245 B TW 507245B TW 090116052 A TW090116052 A TW 090116052A TW 90116052 A TW90116052 A TW 90116052A TW 507245 B TW507245 B TW 507245B
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TW090116052A
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Paolo Battilana
Alessandro Gallitognotta
Alessio Corazza
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Getters Spa
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Priority claimed from IT2001MI000630A external-priority patent/ITMI20010630A1/en
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Abstract

A process is described for manufacturing with exact and reproducible geometry devices integrating the functions of cathode and getter for miniaturized X-ray emitters (10), which have an application in the medical field; some variants of the basic method as well as the resulting devices (40; 60; 80; 100) are also described. A process for the production of assemblies (40; 60; 80; 100) comprising a metal piece (12; 12') and a device (41; 61; 81; 101) integrating the functions of cathode and getter for miniaturized X-ray emitters (10), which comprises the steps of: (a) preparing a first die (30) of an inert material, with at least one recess (31) in a flat upper surface (32) thereof, said recess having an axis perpendicular to said upper surface; (b) scrape filling said recess with at least one mixture (33; 33') comprising powders of at least one sintering material and at least one material selected between a getter material and diamond; (c) placing over said first die a second die (34) of an inert material having at least one through hole (35), so that said through hole is coaxial with said recess in the first die; (d) introducing into said through hole a metal piece (12; 12'), having previously provided for a layer (36) of a material (37; 51) favoring, in a subsequent thermal treatment, the adhesion between said at least one mixture of powders and said metal piece; (e) introducing the assembly formed of said dies and of powders and pieces therein contained into an oven and subjecting it to a thermal treatment for sintering said at least one mixture of powders (33; 33'); (f) at the end of the sintering thermal treatment, extracting from the dies the resulting assembly formed of the device integrating cathode and getter functions and the metal piece.

Description

507245 A7 B7 五、發明説明(ί 本發明有關一種製造組合體之方法,該組合體包括一 個與一金屬基座組合而且具有陰極與吸氣劑雙重功能的部 件,其用於小型化之X射線發射器,特別是用於醫療領域 ;更明確地說,本發明提供具有非常高幾何精密度之此等 組合體,其對於X射線發射器適當地作用而言極爲重要。 本發明亦有關以該方法製造之組合體。爲求簡明起見,下 文中亦將本發明部件稱爲吸氣劑陰極。 已習知以X射線治療會造成人體組織壞死。可使用此 種效果治療某些形式之腫瘤或再狹窄一即,於機械性去除 血管梗塞手術後的動脈壁增厚作用。 很明顯地,在此等治療方法中,重要的是儘可能避免 身體健康部分也進行該治療。因此,正在深入硏究將小型 化X射線發射器安裝在剛性薄管或導管頂部的系統。然後 將該管或導管導入病患的身體裡,使X射線源儘可能接近 欲照射範圍。以此種方式可以使治療的效率最大化,同時 避免波及相鄰健康組織。 安裝在剛性管頂部的小型化X射線發射器(特別是用 於腦瘤治療者)揭示於例如美國專利5,1 5 3,9 0 〇 、5,369,679、5,422,926、5,56 6,221、5,621,780與5,748,699 ’此等專利均由美國公司hotoelectron Corporation所申請。 美國專利 5,729,583、5,816,999 與 6,0 6 9,9 3 8號、歐洲專利申請案E P — A — 8 6 0 1 8 1與國際專利申請案W〇一A — 9 7/ 本紙張尺度適用中國國家標準(CNS ) A4規格(2i〇X297公釐) (請先閱讀背面之注意事項再填寫本頁) 訂 線表 經濟部智慧財產局員工消費合作ri'甲故 :4- 經濟部智慧財產局員工消費合作社印製 507245 A7 ___ B7 五、發明説明(j 07740 、W〇一 A— 99/36938 、W〇一 A — 99/44687 、W〇一A -99/45562 與W〇 一 A - 9 9 / 4 5 5 6 3揭示的系統中,小型化X射線源 係安裝在一撓性導管上,因此其適於照射可經由血管或人 體其他腔室可到達的區域。 此等專利的小型化X射線發射器細部不同,但是一定 包括一個用以發射電子的陰極部分以及一個陽極(通常由 重金屬製造),當其被這兩個電極間的電位差加速之電子 束撞擊時,會發出X射線。該電極容納在抽空的護罩中, 以避免陰極發出之電子被氣體分子吸收。此一需求大致上 包括必須使用一種吸氣劑材料注入該護罩,其可吸收作用 期間因電子撞擊而過熱之X射線小型發射器相同組份(諸 如該護罩或陽極)所釋放的微量氣體。 插入X射線小型化發射器之吸氣劑部件描述於美國明 尼蘇達州聖保羅XRT Corporation所申請的某些文件。 歐洲專利申請案E P — A - 8 6 0 1 8 0描述可具有 環繞該陰極的小環形吸氣劑部件;或者,該陰極部分本身 可由一種吸氣劑材料形成,其上澱積一層金剛石(diamond )薄層,此部分是發射電子的主動元件。該金剛石層係進 行化學蒸發澱積作用(通常以其頭字語C V D稱之)所形 成,即,一種由氣相先質澱積材料層之技術;或是藉由「 雷射切除」,其包括藉由雷射加熱產生需要澱積之材料蒸 氣,然後將此等蒸氣澱積在適當基板上。不過,至少該吸 氣劑具有小環圍繞陰極情況下,因爲可用的空間非常小之 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) ' -5- (請先閲讀背面之注意事項再填寫本頁)507245 A7 B7 V. Description of the invention (ί) The invention relates to a method for manufacturing an assembly, which comprises a component combined with a metal base and having the dual functions of a cathode and a getter, which is used for miniaturized X-rays Transmitters, especially in the medical field; more specifically, the present invention provides such assemblies with very high geometric precision, which are extremely important for the proper functioning of X-ray emitters. The present invention also relates to the use of this Combination made by the method. For the sake of brevity, the part of the present invention is also referred to as a getter cathode in the following. X-ray treatment is known to cause necrosis of human tissue. This effect can be used to treat some forms of tumors Or restenosis, that is, the thickening of the arterial wall after mechanical removal of vascular infarction. Obviously, in these treatment methods, it is important to avoid the health part of the body as much as possible. Therefore, deepening Investigate a system that installs a miniaturized X-ray emitter on top of a rigid thin tube or catheter. The tube or catheter is then introduced into the patient's body to make X-rays The source is as close as possible to the area to be irradiated. In this way, the efficiency of the treatment can be maximized while avoiding spreading to adjacent healthy tissues. Miniature X-ray emitters mounted on top of rigid tubes (especially for brain tumor patients) Disclosed in, for example, U.S. patents 5,15 3,900, 5,369,679, 5,422,926, 5,56 6,221, 5,621,780 and 5,748,699. Applied by American company hotoelectron Corporation. US Patents 5,729,583, 5,816,999 and 6,0 6 9,9 3 8, European patent application EP — A — 8 6 0 1 8 1 and international patents Application W〇A — 9 7 / This paper size applies the Chinese National Standard (CNS) A4 specification (2i × 297mm) (Please read the notes on the back before filling this page) Employee consumption cooperation ri'A Therefore: 4- Printed by the Employee Consumption Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 507245 A7 ___ B7 V. Description of the invention W〇A-99 / 45562 and W〇A-9 9/4 5 5 6 3 The X-ray source is mounted on a flexible catheter, so it is suitable for illuminating the area accessible through blood vessels or other chambers of the human body. The miniaturized X-ray emitters of these patents have different details but must include a The cathode part that emits electrons and an anode (usually made of heavy metal) emit X-rays when they are struck by an electron beam accelerated by the potential difference between the two electrodes. The electrode is housed in an evacuated shield to avoid the cathode The emitted electrons are absorbed by the gas molecules. This requirement roughly includes having to inject the shield with a getter material that absorbs the trace amounts of gas released by the same component of the small X-ray emitter (such as the shield or anode) that was overheated by an electron impact during the action . The getter parts inserted into the X-ray miniaturized emitter are described in certain documents filed by the XRT Corporation in St. Paul, Minnesota, USA. European patent application EP — A-8 6 0 1 8 0 describes that it may have a small ring-shaped getter member surrounding the cathode; alternatively, the cathode portion itself may be formed of a getter material on which a layer of diamond (diamond) is deposited. ) Thin layer, this part is the active element that emits electrons. The diamond layer is formed by chemical evaporation deposition (commonly referred to as its initial CVD), that is, a technique of depositing a material layer from a gas phase precursor; or by "laser ablation", which includes The vapor of the material to be deposited is generated by laser heating, and this vapor is then deposited on a suitable substrate. However, at least the getter has a small ring surrounding the cathode, because the available space is very small. The paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) '-5- (Please read the note on the back first (Fill in this page again)

507245 A7 _____ 五、發明説明(3 故,所以很難進行澱積作用。 因此,該吸氣劑部件亦整合陰極功能爲佳。 (請先閲讀背面之注意事項再填寫本頁) 美國專利5,8 5 4,8 2 2描述亦進行陰極功能的 吸氣劑部件。此等吸氣劑陰極係燒結吸氣劑材料所製得, 因此具有顆粒表面:已習知所形成之微型尖端(相當於該 吸氣劑材料的顆粒形態)發射電子的優先點。根據該專利 ’爲了改善陰極發射特性,亦可於陰極製造期間混合金剛 石粉末與與該吸氣劑材料粉末。 最後’國際專利申請案WO - A - 0 9 5 8 0揭示各 種陰極’其具有吸氣劑功能而且具有光滑或顆粒狀表面, 其中可以在該吸氣劑材料表面的界定範圍上澱積一層金剛 石薄層,或是在燒結吸氣劑材料之前,混合金剛石與該吸 氣劑材料之粉末,以提高發射電子效率。 經濟部智慧財產局員工消費合作社印製 不過’因爲必須以醫療用途的小型化X射線發射器之 非常低容忍度確保該幾何精密度與電子位置安定性之故, 所以上述專利中所述的所有陰極吸氣劑均有嚴重之構造問 題。事實上,藉由在陽極與陰極之間施加好幾萬伏特的差 異’以發射X射線,其中該陽極與陰極排列之距離不大於 1 · 5毫米,小於一毫米爲佳;在此等條件下,存在非常 高的電場,而且即使與陰極和陽極互換排列的理論幾何形 狀偏差(在距離與橫向偏差兩方面)即使只有十分之一毫 米或以下,都可能導致所發射的X射線數量明顯變化,因 而具有該輻射太弱而無法有效治療,或是太強.因此而超出 欲治療範圍,並且損壞相鄰健康組織的風險。因此,該陰 本紙張尺度適用中顚家縣(CNS ) A4規格(210X 297公釐) 507245 A7 B7 五、發明説明(4 極與陽極絕對必須位於精密距離,並且與最小發射器的軸 對準。 上述專利的製造方法無法保證所以之絕對幾何精密度 。根據習知技藝’將適當數量粉末導入一個上開式模中, 並對該粉末進行燒結熱處理,製備該吸氣劑部件。該處理 期間,會發生粉末總體積減少現象,其與粉末水準減少( 雖然已是最低限度情況)以及其自由上表面重路排列。該 自由表面係次一步驟欲使用之表面,其使該吸氣劑陰極與 最終部件基座連接,其最好形成該小型化X射線發射器護 罩內壁之一爲佳。該經燒結粉末的自由表面不規則形狀反 映出該陰極吸氣劑尖端與該基座距離的不精確;而且與該 基座表面呈垂直;然後此等不精確分別形成介於陰極與陽 極之間的距離以及與該發射器非同軸之陰極定向距離的變 化,導致上述缺點。 本發明目的係提供一種小型化X射線發射器用之組合 體的製造方法,該組合體包括一個整合陰極以及與一金屬 基座結合之吸氣劑功能的部件,其避免習知方式的問題與 困難,以及提供所形成之組合體。 以包括下列步驟的方法可以達成本發明目的: a )製備一種情性材料的第一模,其平坦上表面中具 有至少一個凹口,該凹口的軸與該上表面垂直。 b )以至少一種混合物刮塡該凹□,該混合物包括至 少一種燒結材料之粉末以及選自吸氣劑材料與金剛石中至 少一種材料之粉末; 本纸張尺度適用中國國家標準(CNS ) A4規格(210、/297公釐) (請先閲讀背面之注意事項再填寫本頁) 、11 經濟部智慧財產局員工消費合作社印製 -7- 經濟部智慧財產局員工消費合作社印製 507245 A 7 B7 五、發明説明(3 C )在該第一模上放置一種惰性材料的第二模’其具 有至少一個通孔,如此該通孔與該第一模的凹口同軸。 d )在該通孔內導入一金屬零件,該金屬零件事先具 備一種材料層,該層有利於後續熱處理中至少一種粉末的 混合物與該金屬零件之黏合性; e)將由該等模以及粉末形成的組合體與其中包含的 零件送入一個爐中,並對其進行熱處理,以燒結該粉末的 至少一種混合物; f )在燒結熱處理結束時,自該模抽出由該整合陰極 與吸氣劑功能的部件與該金屬零件所形成的組合體。 “刮塡”的定義意指粉末處理領域中相當常用的方法 ,以塡滿模中的凹處表面;該方法包括將該粉末導入一個 凹處中,直到其完全塡滿爲止,並以刮刀淸潔該模上表面 ,以去除該凹處外的多餘粉末部分。 現在茲將參考圖式說明本發明,其中: 圖1槪略地放大顯示小型化X射線發射器的橫剖面; 圖2顯示本發明組合體的金屬零件; 圖3顯示本發明第一方法的主要步驟結果; 圖4顯示根據圖3所示方法製造的組合體; 圖5顯示根據本發明第二可能方法的兩個步驟結果; 圖6顯示根據圖5方法所製造的組合體; 圖7顯示根據本發明其他方法的兩個步驟結果; 圖8顯示根據圖7方法所製造的組合體; 圖9顯示根據本發明另外方法的四個步驟結果;以及 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 訂 -8- 507245 A7 B7 五、發明説明( 圖1 0顯示根據圖9方法所製造的組合體 經濟部智慧財產局員工消費合阼yl.pt 元件對照表 10 X射線發射器 11 壁 12 零件 13 陰極 14 零件 1 5,1 6 1 17 空間 18 表面 19 部分 3 0 模 3 1 凹口 3 2 表面 3 3 混合物 3 4 模 3 5 通孔 3 6 元件 4 0 組合體 41 吸氣劑陰極 3 7 材料 5 0 低凹處 5 1 焊銅材料 區與1 6區 (請先閱讀背面之注意事項再填寫本頁) 訂 本紙張尺度適用中國國家標準(CNS ) Μ規格(210X297公釐) -9- 507245 A7 B7 五、發明説明(、 6 0 組合體 1 2 ^ 零件 低凹處 突出部分 組合體 吸氣劑材料 尖端 糢 凹口 上表面 混合物 模 通孔 上表面 0 組合體 1 吸氣劑陰極 2 主體 3 尖端部分 7 7 8 8 4 9 9 9 9 經濟部智慧財產局員工消費合作社印製 射 常 另 常 010120 12 3 4 5 6 0 〇 0 〇 器 由 由 4 圖1槪略顯示小型化x射線發射器1 〇之橫剖面。發 1 0係由側壁1 1形成,其通常爲圓柱形,一端被通 金屬製成的零件1 2封住,形成基座支撐陰極1 3, 端爲重金屬製成的零件1 4,其形成陽極。壁1 1通 焊接焊至分別位於1 5區與1 6區的零件1 2與陽極 (或是承載該陽極的零件),因此界定一密封空間 本紙張尺度適用中國國家標準(CNS ) A4規格(BOX297公釐) 二 10 - (請先閲讀背面之注意事項再填寫本頁)507245 A7 _____ V. Description of the invention (3) Therefore, it is difficult to perform the deposition. Therefore, it is better that the getter part also integrates the cathode function. (Please read the precautions on the back before filling this page) US Patent 5, 8 5 4, 8 2 2 describes getter parts that also perform the cathode function. These getter cathodes are made of sintered getter materials and therefore have a particle surface: microtips (equivalent to microtips) The particle form of the getter material) has priority for emitting electrons. According to the patent 'in order to improve the cathode emission characteristics, diamond powder and the getter material powder can also be mixed during the manufacture of the cathode. Finally' International Patent Application WO -A-0 9 5 8 0 reveals various cathodes that have a getter function and have a smooth or granular surface, where a thin layer of diamond can be deposited on a defined range of the surface of the getter material, or sintered Before the getter material, diamond and the powder of the getter material were mixed to improve the efficiency of emitting electrons. It is not printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. In order to ensure the geometric precision and electronic position stability with the very low tolerance of the miniaturized X-ray emitter for medical purposes, all cathode getters described in the above patents have serious structural problems. Facts In order to emit X-rays by applying a difference of tens of thousands of volts between the anode and the cathode, the distance between the arrangement of the anode and the cathode is not more than 1.5 mm, preferably less than one mm; under these conditions, There is a very high electric field, and even if the theoretical geometric deviation (in terms of distance and lateral deviation) of the interchangeable arrangement with the cathode and anode is only a tenth of a millimeter or less, it may cause a significant change in the number of X-rays emitted, Therefore, the radiation is too weak to be effectively treated, or is too strong. Therefore, the radiation is beyond the scope of treatment and the risk of damaging adjacent healthy tissues. Therefore, the paper size of this paper is applicable to the Zhongshan County (CNS) A4 specification ( 210X 297 mm) 507245 A7 B7 V. Description of the invention (4 poles and anodes must be located at a precise distance and aligned with the axis of the smallest transmitter The manufacturing method of the above-mentioned patent cannot guarantee all absolute geometric precision. According to the conventional technique, an appropriate amount of powder is introduced into an open mold, and the powder is heat-treated to prepare the getter part. During this process, There will be a reduction in the total volume of the powder, which decreases with the powder level (although it is a minimum case) and its free top surface realignment. The free surface is the surface to be used in the next step, which makes the getter cathode and the The final component base is preferably connected to form one of the inner walls of the miniaturized X-ray emitter shield. The irregular shape of the free surface of the sintered powder reflects the distance between the cathode getter tip and the base. Inaccurate; and perpendicular to the surface of the base; then these inaccurate changes in the distance between the cathode and the anode, and the non-coaxial orientation of the cathode to the emitter, respectively, cause the above disadvantages. The object of the present invention is to provide a method for manufacturing a miniaturized X-ray emitter assembly. The assembly includes an integrated cathode and a getter function combined with a metal base, which avoids the problems and difficulties of the conventional method. , And provide the resulting combination. The purpose of the present invention can be achieved by a method including the following steps: a) A first mold of an emotional material is prepared with at least one notch in its flat upper surface, and the axis of the notch is perpendicular to the upper surface. b) scraping the recess with at least one mixture, the mixture including powder of at least one sintered material and powder of at least one material selected from the getter material and diamond; the paper size applies to the Chinese National Standard (CNS) A4 specification (210, / 297 mm) (Please read the notes on the back before filling out this page), 11 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs -7- Printed by the Employee Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 507245 A 7 B7 5. Description of the invention (3C) A second mold 'in which an inert material is placed on the first mold has at least one through hole so that the through hole is coaxial with the notch of the first mold. d) introducing a metal part into the through hole, the metal part is provided with a material layer in advance, which is beneficial to the adhesion of the mixture of at least one powder and the metal part in the subsequent heat treatment; e) will be formed by the mold and the powder The combined body and the components contained therein are sent into a furnace and heat-treated to sinter at least one mixture of the powder; f) at the end of the sintering heat treatment, withdraw the function of the integrated cathode and getter from the mold The combination of the components and the metal parts. The definition of "scraping" means a method commonly used in the field of powder processing to fill the recessed surface in a mold; the method includes introducing the powder into a recess until it is completely filled and scraping with a spatula Clean the upper surface of the mold to remove excess powder outside the recess. The invention will now be described with reference to the drawings, in which: FIG. 1 shows a slightly enlarged cross-section of a miniaturized X-ray emitter; FIG. 2 shows metal parts of the assembly of the invention; FIG. 3 shows the main features of the first method of the invention Step results; Figure 4 shows the combination manufactured according to the method shown in Figure 3; Figure 5 shows the results of the two steps according to the second possible method of the present invention; Figure 6 shows the combination manufactured according to the method of Figure 5; Results of the two steps of other methods of the present invention; Figure 8 shows the assembly manufactured according to the method of Figure 7; Figure 9 shows the results of the four steps of another method according to the present invention; and this paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page) Order-8- 507245 A7 B7 V. Description of the invention (Figure 10 shows the consumption of employees of the Intellectual Property Bureau of the Ministry of Economics, which is manufactured according to the method of Figure 9 Combined yl.pt component comparison table 10 X-ray emitter 11 Wall 12 Part 13 Cathode 14 Part 1 5, 1 6 1 17 Space 18 Surface 19 Part 3 0 Mold 3 1 Notch 3 2 Surface 3 3 Mixed 3 4 mold 3 5 through hole 3 6 element 4 0 combination 41 getter cathode 3 7 material 5 0 low recess 5 1 copper material area and 1 6 area (please read the precautions on the back before filling this page) The paper size of the edition applies to the Chinese National Standard (CNS) M specification (210X297 mm) -9- 507245 A7 B7 V. Description of the invention (, 60 0 Assembly 1 2 ^ Low recessed part protruding part Combination getter material tip The upper surface of the mold notch The upper surface of the mold through hole 0 The assembly 1 The getter cathode 2 The main body 3 The tip part 7 7 8 8 4 9 9 9 9 5 6 〇00 〇 The device is shown in Fig. 1 and shows a small cross-section of the miniaturized x-ray emitter 10. The hair 10 is formed by the side wall 11 which is generally cylindrical and one end is made of metal. The part 12 is sealed to form a base supporting the cathode 13 and the end is made of a heavy metal part 1 4 which forms an anode. The wall 11 is welded to the parts 12 and 16 respectively located in zones 15 and 16 (Or the part that carries the anode), thus defining a sealed space Zhang scale applicable Chinese National Standard (CNS) A4 size (BOX297 mm) 2:10 - (Please read the Notes on the back to fill out this page)

、1T 507245 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明(έ 1 7,其必須保持抽空狀態,以保證陰極1 3所發射的電 子可到達陽極14 零件12具有面向空間17之表面 1 8,並構成此空間的壁。該圖式並未顯示可以整合在陰 極1 3內部或是可存在成爲獨立構件的吸氣劑部件。發射 器1 0的外徑通常小於3毫米,小於1 · 5毫米爲佳’而 且長度大於5毫米,且小於3毫米爲佳。由前述專利已知 將發射器10安裝與電連接在一導管上或在一薄管頂部( 該圖式中未顯示出來)。壁11通常是由包含低原子量之 原子的材料所製得,諸如金剛石或氮化硼,以確保X射線 向大透射率最大;陰極基座1 2通常由金屬製得,諸如鉬 或鎢,然而陽極係由重金屬製得,諸如鎢或鉑。 圖2顯示金屬零件1 2,其係圖1所示之發射器1 0 定向的倒置;該圖式顯示表面1 8與欲連接吸氣劑陰極之 部分1 9。 圖3顯示構成本發明方法最簡單變化的主要步驟之結 果橫剖面。 步驟a中,製備一種惰性材料的第一模3 0,其具有 至少一個凹口 3 1。凹口 3 1具有一個與該凹口平坦上表 面3 2垂直之軸。凹口 3 0係由一種可以承受本發明方法 熱處理,不會改變而且不會與其中所含之材料交互作用的 材料製得,其中本發明方法之熱處理通常係在介於約 7 5 0與1 1 〇 之真空下進行。適用於此目的之材料 係例如石墨、鉬或陶瓷材料,諸如氮化硼。 步驟b中’以包括至少一種吸氣劑材料粉末與至少一 本紙張尺^用中國國家標準((:]^)八4規格(210\ 297公釐) ~ ~~ - -11 - (請先閱讀背面之注意事項再填寫本頁) 訂 線 507245 A7 B7 五、發明説明(合 種燒結材料粉末之混合物3 3刮塡凹口 3 1。該吸氣劑材 料通常爲一種合金,其包括鉻或鈦與一或多種選自過渡元 素與鋁之元素,諸如例如美國專利3,2 0 3,9 0 1所 揭示之Z r - A 1合金,特別是由該案申請人所製造並以 St 1 0 1名稱販售之合金,其重量百分比組成係Z r 8 4 % - A 1 16%;美國專利 4,312,669 所 揭示之Z r - F e合金,特別是由該案申請案所製造並以 St 707名稱販售之合金,其重量百分比組成係Zr 70% — V 24·6%— Fe 5.4%;以及美國專 利4,457,89 1所揭示之Ti— V— Μη合金。該 燒結材料通常爲锆、鈦、其氫化物或其混合物。本發明該 目的用之較佳混合物係以重量計,包括7 0 % T i與 3 0 % St 101合金的混合物;包括70% T i 與30%合金707的混合物;包括40% z r與60 %合金S t 7 0 7的混合物;以及包括6 0 % T i與 4 0 %合金S t 7 0 7的混合物。至少1 0 %鈦或鍩被 其氫化物替代爲佳,其於熱處理期間釋放出氧,如此有助 於該粒子表面的洋氧化,並促進燒結作用。形成混合物 3 3之粉末粒徑小於5 0微米:較大粒徑會使吸氣劑陰極 具有非常不均勻表面(因爲難以控制電子發射之故)以及 過多孔(因爲電子發射率差的問題之故)。 第一次塡滿混合物3 3的粉末之後,可用適當之.沖壓 機稍微壓入凹口 3 1,然後可進行新的刮塡,以改善該凹 口內的粉末緻密度。藉由振動該模亦有助於改善緻密度: 本紙張尺度適用中國國家標準(CMS ) A4規格(210X29?公釐) --------r I -- (請先閱讀背面之注意事項再填寫本頁) 訂 線 經濟部智慧財產局員工消費合作社印製 -12- 507245 A7 B71T 507245 A7 B7 printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (17, which must be evacuated to ensure that the electrons emitted by the cathode 1 3 can reach the anode 14. The part 12 has a space facing 17 The surface 18 and the wall constituting this space. The drawing does not show that the getter part can be integrated inside the cathode 13 or can be a separate component. The outer diameter of the emitter 10 is usually less than 3 mm, less than 1.5 mm is preferred 'and the length is greater than 5 mm and preferably less than 3 mm. It is known from the aforementioned patent to mount and electrically connect the transmitter 10 on a conduit or on top of a thin tube (not shown in the figure) Out). The wall 11 is usually made of a material containing low atomic weight atoms, such as diamond or boron nitride, to ensure maximum X-ray transmission to the maximum; the cathode base 12 is usually made of a metal, such as molybdenum or Tungsten, however, the anode is made of a heavy metal, such as tungsten or platinum. Figure 2 shows the metal part 12, which is the inverted orientation of the emitter 10 shown in Figure 1; the figure shows that the surface 18 is connected to the suction to be connected Cathode Points 1 to 9. Figure 3 shows a cross section of the results of the main steps constituting the simplest variation of the method of the present invention. In step a, a first mold 30 of an inert material is prepared, which has at least one notch 31. Notch 3 1 It has an axis perpendicular to the flat upper surface 32 of the notch. The notch 30 is made of a material that can withstand the heat treatment of the method of the present invention, does not change, and does not interact with the materials contained therein. The heat treatment of the inventive method is usually carried out under a vacuum between about 750 and 110. Materials suitable for this purpose are, for example, graphite, molybdenum, or ceramic materials such as boron nitride. In step b, 'to include at least one Powder of getter material and at least one paper ruler ^ Use Chinese national standard ((:) ^) 8 size 4 (210 \ 297 mm) ~ ~~--11-(Please read the precautions on the back before filling in this Page) 507245 A7 B7 V. Description of the invention (mixture of sintered material powder mixture 3 3 scraping notch 3 1. The getter material is usually an alloy that includes chromium or titanium and one or more selected from transitions Elements and elements of aluminum, such as examples The Zr-A1 alloys disclosed in U.S. Patent No. 3,203,910, especially the alloys manufactured by the applicant in this case and sold under the name St 1 01, have a weight percentage composition of Z r 8 4%-A 1 16%; Z r-F e alloys disclosed in U.S. Patent 4,312,669, especially alloys manufactured by this application and sold under the name St 707, have a weight percentage composition of Zr 70%-V 24.6%-Fe 5.4%; and Ti-V-Mn alloy disclosed in U.S. Patent 4,457,89 1. The sintered material is usually zirconium, titanium, a hydride thereof, or a mixture thereof. The preferred mixtures for this purpose of the invention are by weight, including a mixture of 70% T i and 30% St 101 alloy; a mixture of 70% T i and 30% alloy 707; 40% zr and 60% A mixture of alloy S t 7 0 7; and a mixture including 60% T i and 40% alloy S t 7 0 7. At least 10% of titanium or hafnium is preferably replaced by its hydride, which releases oxygen during the heat treatment, which helps the oxidation of the surface of the particles and promotes sintering. The particle size of the powder forming the mixture 3 3 is less than 50 microns: the larger particle size makes the getter cathode have a very uneven surface (because it is difficult to control the electron emission) and too porous (because of the poor electron emission rate) ). After filling the powder of the mixture 3 3 for the first time, the recess 3 1 can be slightly pressed with a suitable punching machine, and then a new scraping can be performed to improve the powder density in the recess. The mold also helps to improve the density by vibrating: This paper size applies the Chinese National Standard (CMS) A4 specification (210X29? Mm) -------- r I-(Please read the note on the back first (Please fill in this page for matters) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs-12- 507245 A7 B7

五、發明説明()Q 此舉造成粉末沉降,並降低其於凹口 3 1之水平。最後, 可以進行這兩種方法,首先藉由振動該模使該粉末壓實, 然後將彼稍微壓入該凹口內。 步驟c中,在模3 0上放置由在本發明熱處理條件下 呈惰性材料所製得之第二模3 4 ;該材料通常(但不一定 )與模3 0相同。模3 4具有至少一個通孔3 5,其直徑 相當於零件1 2,而且排列在模3 0上,其位置使孔3 5 與凹口 3 1同軸。以習知之“插腳連接”方法確使模3 0 與3 4的精確互換定位爲佳,根據該方法,此等模具有至 少兩個(三個或四個更佳)薄通孔,其在不同模中位於相 當的位置,其中於該處裝入高度至少等於所有置於上方之 模的高度總和之插腳。 步驟d中,將零件12裝入孔35,其表面18面向 模3 0,而且事先具備一層可以促進混合物3 3與金屬零 件1 2之間黏合性的材料層,如該圖式中之元件3 6。該 促進黏合性層3 6可呈以適當技術塗覆於零件1 2之薄膜 形式,或是呈粉末層形式,將於下文詳細說明彼。 步驟e (圖3中未顯示),將如此形成的組合體送入 一個爐,並進行熱處理以燒結混合物3 3之粉末。該熱處 理係於真空(壓力低於1 0 — 6毫巴)下進行爲隹,而且通 常需要1分鐘至2小時。該處理溫度通常介於7 5 0與 1 1 0 0 °C。該精確値由所使用的特定混合物之功能而定 。該處理期間,進行該混合物之材料以及用以形成層3 6 之材料間四固態交互擴散作用,結果在熱處理結束時,使 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 訂 丨線一 經濟部智慧財產局員工消費合作杜印泛 -13- 507245 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明()彳 零件1 2與燒結混合物3 3所形成部分結合在一起。 最後,該方法的步驟f (圖3中未顯示)中包括自該 爐取出該f吴的組合體,並自此等模中取出最終產物。該產 物圖4所不之$且合體4 0 (側視圖),其包括經由層 3 6與吸氣劑陰極4 1連接之零件1 2。因其製造方法之 故,組合體4 0確保介於吸氣劑陰極4 1的尖端(該圖式 中以4 2表示)與零件1 2表面1 8之間的距離精密度與 重現ί'生’因此確保介於發射:g§: 1 〇的陰極與陽極之間的距 離精愁度與重現性;組合體4 0亦確保表面1 g與吸氣劑 陰極4 1的軸垂直,因此確保後者與發射器1 〇之間的同 軸條件。此種高度幾何精密度與重現性使得可以精確地控 制與適當操作發射器1 〇。 在本發明第一重要具體實施例中,層3 6候呈塗覆於 零件1 2之材料3 7的薄膜形式。該薄膜可使用上述 CVD技術、電鍍或是藉由物理蒸氣澱積(PvD,通常 §亥領域中亦稱爲濺鍍)形成。層3 6可在整個表面1 8上 (圖3未顯示該可能性),但是由於該掩模技術於薄膜澱 積領域中已習知,故藉由掩模技術僅在該表面的1 9部分 上形成爲佳(圖3中未顯示具體實施例;爲求淸楚起見, 大幅誇大材料3 7之薄膜厚度)。形成層3 6的較佳技術 係P V D,其比其他引用技術更容易進行。已發現形成促 進與零件1 2黏合性薄膜的適用材料3 7可選自金屬T i 、Ni 、Cu、Co ;雙組份合金Mi— Cr、C〇一 Cr或Fe—Cr ;三組份合金Ni—Cr— Ni或Co 本纸張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐〉 (請先閲讀背面之注意事項再填寫本頁) • ! -1---1 - .......- - .....- - II ................. ili -.............—5. Description of the invention () Q This will cause the powder to settle and reduce its level in the notch 3 1. Finally, both methods can be performed, first compacting the powder by shaking the mold, and then pressing them slightly into the recess. In step c, a second mold 3 4 made of an inert material under the heat treatment conditions of the present invention is placed on the mold 30; this material is usually (but not necessarily) the same as the mold 30. The die 34 has at least one through hole 35, the diameter of which is equivalent to the part 12, and is arranged on the die 30 in a position such that the hole 3 5 is coaxial with the notch 31. The conventional "pin connection" method is used to ensure that the precise interchangeable positioning of the molds 30 and 34 is better. According to this method, these molds have at least two (three or four better) thin through holes, which are different in different The mold is located at a corresponding position, in which pins are inserted at a height at least equal to the sum of the heights of all the molds placed above. In step d, the part 12 is inserted into the hole 35, the surface 18 of which faces the mold 30, and a layer of material that can promote the adhesion between the mixture 33 and the metal part 12 is provided in advance, such as the element 3 in the drawing 6. The adhesion-promoting layer 36 may be in the form of a film applied to the part 12 by an appropriate technique, or in the form of a powder layer, which will be described in detail below. In step e (not shown in Fig. 3), the thus-formed assembly is sent to a furnace and heat-treated to sinter the powder of the mixture 33. The heat treatment is carried out under vacuum (pressure below 10-6 mbar) to krypton, and it usually takes 1 minute to 2 hours. The processing temperature is usually between 7 50 and 1 100 ° C. The accuracy depends on the function of the particular mixture used. During this treatment, the four-solid cross-diffusion between the material of the mixture and the material used to form the layer 36 was performed. As a result, at the end of the heat treatment, the paper size was adapted to the Chinese National Standard (CNS) A4 specification (210X297 mm) ( Please read the notes on the back before filling this page.) Order 丨 Line 1 Consumer Cooperation of Intellectual Property Bureau of the Ministry of Economic Affairs Du Yinfan-13- 507245 Printed A7 B7 by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The parts 12 and the parts formed by the sintered mixture 33 are joined together. Finally, step f (not shown in Fig. 3) of the method includes removing the f Wu combination from the furnace and removing the final product from these molds. The product shown in FIG. 4 is not shown in FIG. 4 and is integrated 40 (side view), and includes a part 12 connected to a getter cathode 41 through a layer 36. Because of its manufacturing method, the assembly 40 ensures the precision and reproduction of the distance between the tip of the getter cathode 41 (represented by 4 2 in the drawing) and the surface of the part 12 2 18 Therefore, the distance between the cathode and the anode between emission: g§: 10, precision and reproducibility are ensured; the assembly 40 also ensures that the surface 1 g is perpendicular to the axis of the getter cathode 41, so Ensure the coaxial condition between the latter and the transmitter 10. This high degree of geometric precision and reproducibility allows precise control and proper operation of the transmitter 10. In the first important embodiment of the invention, the layer 36 is in the form of a thin film of the material 37 which is applied to the part 12. The thin film can be formed using the above CVD technique, electroplating, or by physical vapor deposition (PvD, also commonly referred to as sputtering in the field). The layer 36 can be on the entire surface 18 (the possibility is not shown in FIG. 3), but since the masking technique is already known in the field of thin film deposition, the masking technique is only applied to 19th part of the surface The upper layer is better (the specific embodiment is not shown in FIG. 3; for the sake of clarity, the film thickness of the material 37 is greatly exaggerated). The preferred technique for forming layer 36 is P V D, which is easier to perform than other cited techniques. It has been found that suitable materials for forming an adhesion-promoting thin film to parts 12 may be selected from the metals T i, Ni, Cu, Co; a two-component alloy Mi-Cr, Co-Cr or Fe-Cr; a three-component alloy Ni—Cr— Ni or Co This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X 297 mm) (Please read the precautions on the back before filling this page) •! -1 --- 1-.. .....--.....--II ....... ili -.............—

•I 訂 -14 - 507245 Μ Β7 五、發明説明()2 —C r — Μι ;以及四組份合金N i — C r — Μι — M2或 C 〇 - C r 一 Μι— M2,其中Μι與M2係第一過渡金屬列 之金屬或元素週期表的III或IV族。 根據本發明方法第二具體實施例,層3 6可爲焊接材 料四粉末層形式。在此種情況中,增加圖5所示的兩個額 外改良步驟圖3所述之方法。進行圖3之方法步驟b後, 此具體實施例中進行步驟g,藉由步驟g形成相對於表面 3 2的低凹處5 0 ’其係以適用沖壓機(該圖式中未顯示 )將混合物3 3稍微壓進凹口 3 1,藉由振動模3 0,或 是藉由上述兩種方法。 然後,在步驟h中以焊接5 1之粉末刮塡低凹處5 0 。此步驟亦可藉由振動模3 0達成。材料5 1的熔融溫度 必須與本方法隨後用以燒結混合物3 3之溫度相近。特別 是,該熔融溫度必須不低於混合物3 3之燒結溫度,以避 免熔融時材料5 1結合該聚合物之粉末,因此降低或取消 其變成氣體的吸氣效應;另一方面,材料5 1的熔融溫度 不高於燒結溫度1 0 - 1 5 °C爲佳,以利其焊接作用以及 在本方法的步驟e中黏合混合物3 3與金屬零件1 2。材 料5 1之粒徑小於約1 〇 〇微米爲佳:較大粒徑可能會使 燒結混合物3 3與金屬零件1 2所形成的主體之間難以接 觸。較佳焊接材料係銀、銀銅合金以及銀—銅一金合金, 在銀銅合金中,較佳者係銀含量大於約6 〇 %銀者,以包 含7 2 %銀之易熔組成物特佳。純銀與易熔組成物具有熔 融溫度分明的優點,因此可以使該方法參數的設定最佳, 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 訂 線▲ 經濟部智慧財產局員工消費合作社印製 -15- 507245 A7 B7 五、發明説明()3 (請先閲讀背面之注意事項再填寫本頁) 但是必須以不同於銀與易熔A g - C u組成物的熔融溫度 進行燒結作用時,則須選擇其他合金;特別是,必須進行 咼燒結溫度時,則使用A g — C u — A u組成物。 完成步驟h時,以上述步驟c - f繼續進行本方法, 其係將模3 4放置於塡滿混合物與焊接材料5 1的模3 0 上’並對此組合體進行上述燒結熱處理。 本發明方法第二具體實施例的結果係組合體6 〇,其 以側視圖示於圖6。組合體6 0包括藉由層3 6與吸氣劑 陰極6 1連接之金屬零件1 2,其中該層3 6係由焊接材 料5 1形成。 經濟部智慧財產局員工消費合作社印製 參考圖3與5所述之本方法改良中,可以使用具有表 面1 8部分(分別相當於部分1 9 )之金屬零件1 2 ’取 代零件1 2,該金屬零件1 2 ’比表面1 8突出;此改良 示於圖7,以圖3具體實施例之實例作爲參考。完成步驟 b時,進行步驟i ,藉由步驟i ,將混合物3 3稍微壓入 凹口 3 1 (或是振動模3 0 ),製得相對於表面3 2的低 凹處70。進行步驟c,將模34放置在模30上。另外 製備具有突出部分7 1 (相當於部1 9 )的零件1 2 ’ , 材料3 7之層3 6僅位於部分7 1的圓形表面上。然後進 行步驟d,如圖所示,將如此製得之零件1 2 ’插入模 3 4的通孔3 5,部分7 1伸入低凹處7 0 ’而層3 6接 觸混合物3 3。藉著對零件1 2 ’施加壓力(動態’例如 以沖壓機施加,或靜態’將重物置於其上)’確使燒結期 間其與混合物3 3接觸更爲良好,因此完成的組合體機械 一本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) 507245 A7 B7 五、發明説明()4 (請先閲讀背面之注意事項再填寫本頁) 強度更佳。然後,進行前述步驟e與f完成本方法。該基 本方法的此種改良結果係圖8所示之組合體8 0,其由吸 氣劑陰極8 1組成,該吸氣劑陰極8 1經由層3 6與零件 12 結合。使用步驟i以及步驟d中使用零件1 2,的 此種改良亦能以參考圖5所述之方法具體實施例爲基礎, 其中係在步驟h之後,在焊接材料5 1的粉末上表面中製 得另外的低凹處,並將一種零件1 2 ’ (其上沒有材料 3 7層)插入模3 4 ;後者方法改良以及以零件1 2,與 吸氣劑陰極所製得的組合體未顯示於圖式中。 經濟部智慧財產局w工消費合作社印製 爲了改善該吸氣劑陰極的電子發射性質(陰極功能性 ),可以利用上述“ C V D ”或“雷射切除”方法之一, 將目前爲止本發明方法所述之任何具體實施例或改良的金 剛石薄膜置於該吸氣劑陰極尖端(4 2 )。因爲此等技術 所製得的薄膜厚度値在千分之一毫米或以下,所以此操作 沒有改良所製得吸氣劑陰極與發射器1 〇中之陽極之間的 幾何關係。或者,可以使用將金剛石粉末摻入混合物3 3 所製得的混合物3 3 ’代替混合物3 3。該金剛石粉末的 粒徑介於約1與5 0微米爲佳,以約1 0微米更佳。 前述之本發明另外改良中,可以僅在該吸氣劑陰極的 尖端部分添加金剛石粉末,如前文所述並參考圖9,其顯 示出本發明方法最後一個改良之主要步驟結果的橫剖面。 根據此種改良方法,在步驟j中製備一種惰性材料的模 9 0,其具有凹口 9 1,凹口 9 1的軸與該模的上表面 9 2垂直,而且其深度僅爲欲製造吸氣劑陰極長度部分。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) :17- 507245 A7 _____ B7 __ 五、發明説明()5 以混合物9 3刮塡凹口 9 1 (步驟k ),該混合物係 由粒徑如前述之金剛石粉末以及容易燒結材料之粉末形成 ’該容易燒結材料粉末係粒徑小於5 0微米的氫化鈦爲佳 ’其粒徑介於約5與1 〇微米爲佳。混合物9 3亦可由金 剛石粉末以及上述混合物3 3之一的粉末形成。 在步驟1中,將一種惰性材料的模9 4置於模9 0上 ’該模9 4具有與凹口 9 1上部分相同直徑的通孔9 5 ; 將模9 0與9 4 (相當於模3 0 )與模9 4的上表面9 6 (相當於模.3 0的表面3 2 )放置在一起。 最後,在步驟m中,以前述相同混合物3 3之粉末刮 塡孔9 5。 完成步驟m時,製得一個組合體,包括塡滿混合物 9 3與3 3的模9 0與9 4,相當於圖3方法的步驟b結 果;然後對此組合體進行圖3所述之方法的步驟c - f、 進行圖5所述方法的步驟g (與後續步驟),或進行圖7 所述方法的步驟I (及後續步驟)。 圖1 0顯示根據本發明最後改良所製得的組合體的橫 視圖;此處所示的組合體1 〇 〇包括一個金屬零件i 2, 其藉由焊接材料5 1之層3 6與吸氣劑陰極丨〇丨結合; 然俟’吸氣劑陰極1 〇 1係由燒結混合物3 3所形成的主 體1 0 2形成,以及一個由上述混合物g 3形成的尖端部 分 1 0 3。 雖然到目前已參考在金屬零件與吸氣劑陰極之間的單 一組合體製造方法說明本方法(以不同具體實施例與改良 本ϋ尺度適用中國國家標準(CNS ) A4規格(210X297公釐) - 二 18- (請先閲讀背面之注意事項再填寫本頁) 訂 線 — 經濟部智慧財產局員工消費合作社印製 507245 A7 B7 ! --- 五、發明説明(凫 說明),但是因爲此等組合體的尺寸小,所以爲了提高生 產率,通常使用具有多個凹口與對應孔的模’一次生產一 個以上之組合體。 上述某些方法雖然參考本發明方法特定具體實施例或 改良,但是其可用於此等具體實施例或改良中任何一者: 例如,零件1 2 ’之一定是用以取代零件1 2,而使用材 料2 7薄膜的方法一定被使用焊接材料作爲黏合促進層 2 6之方法改變;所有模係由石墨、鉬或氮化硼製成爲佳 ,以插腳連接方法確保所有模之間的精確幾何關係;以及 ,藉由振動模有助於以粉末塡滿該模中之凹口或孔的任何 步驟。 (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 二 19-• I order -14-507245 Μ B7 V. Description of the invention (2) -C r-Μι; and four-component alloy Ni-C r-Μ-M2 or C 0-C r-Μι-M2, where Μι and M2 is a group III or IV of the periodic table of metals or elements of the first transition metal column. According to a second specific embodiment of the method of the present invention, layers 36 may be in the form of four powder layers of welding material. In this case, two additional improvement steps shown in FIG. 5 are added to the method described in FIG. After performing step b of the method of FIG. 3, step g is performed in this specific embodiment, and step g is used to form a low depression 50 ′ relative to the surface 32, which is applicable to a stamping machine (not shown in the figure). The mixture 3 3 is slightly pressed into the notch 3 1, by means of a vibrating die 30, or by the above two methods. Then, in step h, the low recess 5 0 is scraped with a powder of 5 1 welded. This step can also be achieved by the vibration mode 30. The melting temperature of material 51 must be close to the temperature that is subsequently used to sinter the mixture 33 in this method. In particular, the melting temperature must not be lower than the sintering temperature of the mixture 3 3 in order to avoid the material 5 1 binding to the polymer powder during melting, thereby reducing or eliminating its gettering effect of becoming a gas; on the other hand, the material 5 1 The melting temperature is preferably not higher than the sintering temperature of 10 to 15 ° C, to facilitate its welding effect and to bond the mixture 3 3 and the metal part 12 in step e of the method. The particle size of the material 51 is preferably less than about 1000 microns: a larger particle size may make it difficult for the sintered mixture 33 to contact the body formed by the metal part 12. The preferred soldering materials are silver, silver-copper alloys, and silver-copper-gold alloys. Among the silver-copper alloys, the preferred ones are those with a silver content greater than about 60% silver, with a fusible composition comprising 72% silver. good. Pure silver and fusible composition have the advantage of clear melting temperature, so the method parameters can be set optimally. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back first) (Fill in this page) ▲ Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs's Consumer Cooperatives -15- 507245 A7 B7 V. Invention Description () 3 (Please read the precautions on the back before filling this page) But it must be different from silver and When the melting temperature of the fusible Ag-Cu composition is sintered, other alloys must be selected; in particular, when the sintering temperature must be performed, the Ag-Cu-Au composition is used. When step h is completed, the method is continued with the above steps c-f, which is to place the mold 34 on the mold 30 filled with the mixture and the welding material 51 and perform the above-mentioned sintering heat treatment on the assembly. The result of the second specific embodiment of the method of the present invention is an assembly 60, which is shown in Fig. 6 in a side view. The assembly 60 includes metal parts 12 connected to the getter cathode 61 by a layer 36, wherein the layer 36 is formed of a welding material 51. In the improvement of the method described in the reference to Figures 3 and 5 by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, a metal part 12 having a surface portion 18 (corresponding to a portion 19 respectively) may be used instead of the part 12 The metal part 12 'is more prominent than the surface 18; this improvement is shown in FIG. 7, and an example of the specific embodiment of FIG. 3 is used as a reference. When step b is completed, step i is performed, and by step i, the mixture 3 3 is slightly pressed into the notch 3 1 (or the vibration mold 3 0) to obtain a low recess 70 with respect to the surface 32. Proceed to step c, placing the mold 34 on the mold 30. In addition, a part 1 2 ′ having a protruding portion 7 1 (equivalent to the portion 19) is prepared, and the layer 3 6 of the material 37 is located only on the circular surface of the portion 7 1. Then, step d is carried out. As shown in the figure, the thus-prepared part 1 2 'is inserted into the through hole 3 5 of the mold 34, the part 7 1 extends into the low recess 70 0' and the layer 3 6 contacts the mixture 33. By applying pressure to the part 12 (dynamically, for example with a punch, or statically placing a weight on it), the contact with the mixture 3 3 is better during sintering, so the completed assembly is mechanically This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) 507245 A7 B7 V. Description of the invention () 4 (Please read the notes on the back before filling this page) The strength is better. Then, the aforementioned steps e and f are performed to complete the method. The result of this improvement of the basic method is a combination 80 shown in FIG. 8, which is composed of a getter cathode 81 which is combined with the part 12 via the layer 36. This improvement using part 12 in step i and step d can also be based on the specific embodiment of the method described with reference to FIG. 5, where after step h, the powder is prepared in the upper surface of the powder of welding material 51. Get another low recess, and insert a part 12 '(without 37 layers of material on it) into the mold 3 4; the latter method is improved and the combination made with part 12 and the getter cathode is not shown In the drawing. Printed by the Industrial and Commercial Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. In order to improve the electron emission properties (cathode functionality) of the getter cathode, one of the above-mentioned "CVD" or "laser ablation" methods can be used. Any of the described embodiments or modified diamond films are placed on the getter cathode tip (42). Because the thickness of the thin film produced by these techniques is 千 thousandths of a millimeter or less, this operation does not improve the geometric relationship between the prepared getter cathode and the anode in the emitter 10. Alternatively, instead of the mixture 3 3, a mixture 3 3 'prepared by incorporating diamond powder into the mixture 3 3 may be used. The diameter of the diamond powder is preferably between about 1 and 50 microns, and more preferably about 10 microns. In the aforementioned another improvement of the present invention, diamond powder may be added only to the tip portion of the getter cathode, as described above and with reference to FIG. 9, which shows a cross section of the results of the main steps of the last improvement of the method of the present invention. According to this improved method, in step j, a mold 90 of an inert material is prepared, which has a notch 91, the axis of the notch 91 is perpendicular to the upper surface 92 of the die, and its depth is only to make suction Aerosol cathode length. This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm): 17- 507245 A7 _____ B7 __ V. Description of the invention (5) Scraping the notch 9 1 with the mixture 9 3 (step k), the mixture It is formed of diamond powder with a particle size as described above and powder of an easily sinterable material. The powder of the easily sinterable material is preferably titanium hydride having a particle size of less than 50 microns. The particle size is preferably between about 5 and 10 microns. The mixture 9 3 may also be formed of a diamond powder and a powder of one of the above-mentioned mixtures 3 3. In step 1, a mold 9 4 of an inert material is placed on the mold 90. The mold 9 4 has a through hole 9 5 of the same diameter as the upper part of the notch 9 1; the molds 9 0 and 9 4 (equivalent to The mold 30) is placed with the upper surface 9 6 of the mold 94 (equivalent to the surface 3 2 of the mold .30). Finally, in step m, the holes 95 are scraped with the powder of the same mixture 3 3 as previously described. When step m is completed, a combination is prepared, including molds 90 and 94 filled with mixtures 9 3 and 3 3, which is equivalent to the result of step b of the method of FIG. 3; then the method described in FIG. 3 is performed on this combination. Step c-f, perform step g (and subsequent steps) of the method described in FIG. 5, or perform step I (and subsequent steps) of the method described in FIG. 7. FIG. 10 shows a cross-sectional view of an assembly made according to the last modification of the present invention; the assembly 100 shown here includes a metal part i 2, which is passed through a layer 36 of a welding material 51 and a getter The catalyst cathode 丨 〇 丨 is combined; however, the 'getter cathode 010' is formed by a main body 102 formed by sintering the mixture 33, and a tip portion 103 formed by the above-mentioned mixture g3. Although the method has been described so far with reference to a single assembly manufacturing method between a metal part and a getter cathode (the Chinese National Standard (CNS) A4 specification (210X297 mm) is applied with different specific embodiments and improvements to this standard)- II 18- (Please read the precautions on the back before filling this page) Ordering—Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 507245 A7 B7! --- V. Description of the invention (凫), but because of these combinations The size of the body is small, so in order to improve productivity, a mold with multiple notches and corresponding holes is usually used to produce more than one combination at a time. Although some of the above methods refer to specific embodiments or improvements of the method of the present invention, they can be used Any of these specific embodiments or improvements: For example, the part 12 'must be used to replace the part 12, and the method using the material 27 film must be the method using the welding material as the adhesion promoting layer 26. Change; all mold systems are preferably made of graphite, molybdenum or boron nitride, with pin connection methods to ensure accurate geometric relationships between all molds; and , Vibrating mold helps to fill any notches or holes in the mold with powder. (Please read the precautions on the back before filling this page.) Order this paper from the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Standards apply to Chinese National Standard (CNS) A4 specifications (210X297 mm) II 19-

Claims (1)

507245507245 經濟部智慧財產局員工消費合作社印製 A8 B8 C8 ______D8 、申請專利範圍 附件1 a : 第90116052號專利申請案 中文申請專利範圍修正本 民國91年8月1日修正 1 · 一種組合體(40 ; 60 ; 80 ; 100)之製 造方法,該組合體包括一金屬零件(1 2 ; 1 2,)以及 一個整合陰極與吸氣劑以小型化X射線發射器(1 〇 )之 部件(4 1 ; 6 1 ; 8 1 ; 1 〇 1 ),其包括步驟: a )製備一種惰性材料的第一模(3 〇 ),其平坦上 表面(32)中具有至少一個凹口(31),該凹口的軸 與該上表面垂直; b )以至少一種混合物(3 3 ; 3 3,)刮塡該凹口 ,該混合物包括至少一種燒結材料之粉末以及選自吸氣劑 材料與金剛石中至少一種材料之粉末; c )在該第一模上放置一種惰性材料的第二模(3 4 · ),其具有至少一個通孔,如此該通孔(3 5 )與該第一 模的凹口同軸; d) 在該通孔內導入一金屬零件(12:12,), 該金屬零件事先具備一種材料(37 ; 51)之層(36 ),該層有利於後續熱處理中至少一種粉末的混合物與該 金屬零件之黏合性; e) 將由該等模以及粉末形成的組合體與其中包含的 零件送入一個爐中,並對其進行熱處理,以燒結該粉末的 至少一種混合物(3 3 ; 3 3 ’ ); f )在燒結熱處理結束時,自該模抽出由該整合陰極 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閱讀背面之注意事項再填寫本頁)Printed by A8, B8, C8, ______D8, Consumer Cooperatives of the Ministry of Economic Affairs and Intellectual Property, Annex 1a of the scope of patent application: Patent Application No. 90116052, Amendment of the scope of Chinese patent application, August 1, 1991 Amendment 1 · A combination (40; 60; 80; 100), the assembly includes a metal part (12; 12), and a part (4 1;) that integrates a cathode and a getter to miniaturize an X-ray emitter (10). 6 1; 8 1; 1 〇1), comprising the steps of: a) preparing a first mold (30) of an inert material, the flat upper surface (32) of which has at least one notch (31), the notch The axis is perpendicular to the upper surface; b) scraping the recess with at least one mixture (3 3; 3 3,), the mixture including powder of at least one sintered material and at least one material selected from the getter material and diamond Powder; c) placing a second mold (3 4 ·) of an inert material on the first mold, which has at least one through hole, so that the through hole (3 5) is coaxial with the recess of the first mold; d) introduce a metal part (1 2:12,), the metal part is provided with a layer (36) of a material (37; 51) in advance, which is conducive to the adhesion of the mixture of at least one powder and the metal part in the subsequent heat treatment; e) will be made by the mold And the powder-formed assembly and the parts contained therein are sent to a furnace and heat-treated to sinter at least one mixture of the powder (3 3; 3 3 ′); f) at the end of the sintering heat treatment, The die is drawn from the integrated cathode. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page) A8 B8 C8 - ———_______ DS 六、申請專利範圍^ ^ -- 與吸風劑功能的部件與該金屬零件所形成的組合體。 2 ·如申請專利範圍第1項之方法,其中促進粉末至 少一種混合物與該金屬零件黏合性的材料層(3 6)係選 自: 種材料(3 7 )之薄膜,其塗覆於該金屬零件的 表面或其一部分(19)上; 一 一種焊接材料(5 1 )的粉末層。 3 ·如申請專利範圍第2項之方法,其中該促進黏合 性材料係一種焊接材料,而且: -在步驟b之後進行步驟g ’藉由步驟g,係將粉末 混合物(3 3 ; 3 3 ,)稍微壓進該凹口、藉由振動第— 模,或是先振動第一模,然後壓該混合物形成相對於第一 模上表面的低凹處(5 〇 ); 一步驟g之後,進行步驟h,其中以焊接材料(51 )的粉末刮塡該低凹處; 一步驟h之後,進行步驟c 一 f。 4 ·如申請專利範圍第2項之方法,其中該促進黏合 性材料係一種材料(3 7 )之薄膜,其塗覆於該金屬零件 的表面(18)或其一部分(19)上,而且: 在步驟b與c之間進行步驟i ,藉由步驟i ,將粉末 之混合物(3 3 ; 3 3’ )稍微壓入該凹口、藉由振動第 一模3 0,或是先振動第一模,然後壓該混合物所形成製 得相對於該上表面的低凹處(7 〇 ); 步驟d中,金屬零件(12’ )具有表面(18)的 本紙張尺度適用中國國家標準(CNS ) A4規格(2丨〇><297公釐) ^^裝—I (請先聞讀背面之注意事項再填寫本頁) 、1T 經濟部智慧財產局員工消費合作社印製 507245 A8 B8 C8 D8 六、申請專利範圍 (請先閲讀背面之注意事項再填寫本頁) 中心部分(7 1 ),其比該表面剩餘部分突出,該部分亘 有相當於該凹口的部分,並插入第二模(3 4 )的孔( 35)內,突出部分(71)伸入該低凹處(70)內。 5 .如申請專利範圍第3項之方法,其中: -在步驟h與c之間進行步驟i ,藉由步驟丨,將該 焊接材料(5 1 )稍微壓入該凹口、藉由振動第一模或是 先振動第一模然後壓該焊接材料,形成相當於第一模上表 面低凹處(7 0 ); —步驟d中,金屬零件(12,)具有表面(18) 的中心部分(7 1 ),其比該表面剩餘部分突出,該部分 具有相當於該凹口的部分,並插入第二模(3 4 )的孔( 3 5 )內,突出部分(7 1 )伸入該低凹處(7 0 )內。 6 ·如申請專利範圍第1至5項任一項中之方法,其 中步驟a依序由下列步驟組成: 經濟部智慧財產局員工消費合作社印製 j )製備一種惰性材料的第三模(9 0 ),其平坦上 表面(92)具有至少一個凹口(91),該凹口的軸與 該上表面垂直,而且其深度僅爲欲製造吸氣劑陰極長度部 分; k )以混合物(9 3 )刮塡凹口( 9 1 ),該混合物 包括至少金剛石粉末以及一種容易燒結材料之粉末; 1 )將一種惰性材料的第四模(9 4 )置於第三模( 90)上,該第四模平坦上表面(96),而且其具有與 凹口 9 1上部分相同直徑的通孔9 5,該通孔的軸與該表 面垂直; 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -3^ 507245 A8 B8 C8 D8 六、申請專利範圍 m )以一種包括吸氣劑材料與燒結材料之混合物( 3 3 )刮塡第二通孔(9 5 )。 (請先閲讀背面之注意事項再填寫本頁) 7 ·如申請專利範圍第1至5項任一項中之方法,其 中該吸氣劑材料係一種合金,包括鉻或鈦與一或多種選自 過渡元素與鋁的元素。 8 .如申請專利範圍第7項之方法,其中該合金係選 自Zr— A1合金、Zi* — Fe合金與Ti— V — Mn合 金。 9 ·如申請專利範圍第8項之方法,其中該合金的重 量百分比組成爲Zr 8 4 % - A 1 16%。 1 0 .如申請專利範圍第8項之方法,其中該合金的 重量百分比組成爲Zr 70% - V 2 4 . 6 % — F e 5 · 4 % 〇 1 1 ·如申請專利範圍第1至5項任〜項中之方法, 其中該燒結材料係選自鉻、鈦、其氫化物或其混合物。 1 2 ·如申請專利範圍第1至5項任〜項中之方法, 其中該混合物(33; 33,)以重量計,包括7〇 % 經濟部智慧財產局員工消費合作社印製 T i與30%之重量百分比組成爲Z:r s 4 % - A \ 1 6 %的合金。 1 3 ·如申請專利範圍第1至5項任〜項中之方法, 其中該混合物(33;33,)以重量計,包括7〇% T i與3 0%之重量百分比組成爲z r 7 〇 % - Y 2 4 . 6 % - F e 5 · 4%的合金。 1 4 ·如申請專利範圍第1至5項任〜項中之方法, -4 - 507245 A8 B8 C8 _ D8 六、申請專利範圍 其中該混合物(3 3 ; 3 3 ’ )以重量計,包括4 〇 % Z r與6 0%之重量百分比組成爲Z r 7 0 % - V 2 4 . 6 % - F e 5.4%的合金。 1 5 ·如申請專利範圍第1至5項任一項中之方法, 其中該混合物(3 3 ; 3 3 ’ )以重量計,包括6 〇 % T i與4 0%之重量百分比組成爲Z r 70% - V 24.6%— Fe 5.4%的合金。 1 6 .如申請專利範圍第1之方法,其中該混合物( 3 3:3 3’ )的粉末粒徑小於5 0微米。 1 7 .如申請專利範圍第2項之方法,其中促進至少 •-種粉末混合物與該金屬零件黏合性之材料層(3 6 )係 一種材料(3 7 )的薄膜,該材料選自金屬τ i 、N i、 Cu、Co,雙組份合金 Ni— Cr、Co - Cr 或 Fe 一 Cr,二組份合金 Ni_Cr - Ni 或 Co — Cr— Mi :以及四組份合金N i — C r — Mi— M2或c o — C r - Mi —M2,其中Mi與M2係第一過渡金屬列之金屬或元素 週期表的I I I或I V族。 1 8 ·如申請專利範圍第1 7項之方法,其中該薄膜 係以選自化學蒸氣澱積、電鍍或物理蒸氣澱積作用之技術 所製得。 1 9 ·如申請專利範圍第2項之方法,其中促進至少 一種粉末混合物與該金屬零件黏合性之材料層(3 6 )係 焊接材料(5 1 )之粉末層。 2 0 ·如申請專利範圍第1 9項之方法,其中該焊接 本紙張尺度適用中國國家標準(CNS ) Α4規格(2Η>Χ297公釐) (請先閱讀背面之注意事項再填寫本頁} •m等 •訂 經濟部智慧財產局員工消費合作社印製 507245 A8 BB C8 __D8、申請專利範圍 材料之熔融溫度不低於混合物( 理溫度。 2 1 ·如申請專利範圍第2 材料之熔融溫度不高於混合物( 溫度1 5 °C以上。 2 2 ·如申請專利範圍第1 9項之方法 3 3 ; 3 3 ’ )之燒結處 〇項之方法’其中該焊接 3 3 ; 3 3 ’ )燒結處理 材料 )係選自銀、銀-銅合金與銀 2 如申請專利範圍第2 材料係一種銀-銅 經濟部智慧財產局員工消費合作社印製 2 4 材料係銀 2 5 材料(5 2 6 其中該方 用之技術 (42) 2 7 粉末的粒 2 8 粉末的粒 2 9 結材料係 3 0 .如申請 —銅合金 •如申請 1 )的粒 •如申請 法結束時 ,將金剛 上。 •如申請 徑介於約 •如申請 徑約爲1 •如申請 氫化鈦。 •如申請 合金’其銀含 專利範圍第2 ,其包含7 2 專利範圍第1 徑小於約1 〇 專利範圍第1 ,利用選自化 石澱積在整合 2項之方法 量高於6 〇 3項之方法 重量%銀。 9項之方法 0微米。 至5項任一 學蒸氣澱積 吸氣劑與陰 ,其中該焊接 銅金合金。 ,其中該焊接 重量%以上。 ’其中該焊接 ,其中該焊接 項中之方法, 與雷射切除作 極的部件尖端 專利範圍第6項之方法,其中該金剛石 1與5 0微米。 專利範圍第2 7項之方法,其中金剛石 0微米。 專利範圍第6項之方法,其中該容易燒 專利範圍第2 9項之方法,其中該氫 化 本紙張尺度適用中國國家標準(CNS > A4規格(210X297公釐) (請先聞讀背面之注意事項再填寫本頁)A8 B8 C8-———_______ DS VI. Scope of patent application ^ ^-A combination of a part with the function of a wind absorber and the metal part. 2. The method according to item 1 of the scope of patent application, wherein the material layer (36) that promotes adhesion of at least one mixture of powder and the metal part is selected from the group consisting of: a thin film of materials (37), which is coated on the metal On the surface or part of the part (19); a powder layer of a welding material (5 1). 3. The method according to item 2 of the patent application, wherein the adhesion-promoting material is a welding material, and:-performing step g 'after step b', and by step g, the powder mixture (3 3; 3 3, ) Slightly press the notch, vibrate the first mold, or first vibrate the first mold, and then press the mixture to form a low recess (50) relative to the upper surface of the first mold; after step g, proceed Step h, wherein the low recess is scraped with powder of the welding material (51); after step h, steps c to f are performed. 4. The method according to item 2 of the patent application, wherein the adhesion-promoting material is a thin film of a material (37), which is coated on the surface (18) or a part (19) of the metal part, and: Step i is performed between steps b and c, and by step i, the powder mixture (3 3; 3 3 ') is slightly pressed into the notch, by vibrating the first mold 30, or first by vibrating the first Mold, and then pressing the mixture to form a low recess (70) relative to the upper surface; in step d, the metal part (12 ') has a surface (18) and the paper size of this paper applies the Chinese National Standard (CNS) A4 specifications (2 丨 〇 > < 297 mm) ^^ equipment—I (please read the precautions on the back before filling out this page), 1T printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives 507245 A8 B8 C8 D8 6. Scope of patent application (please read the precautions on the back before filling this page) The central part (7 1), which is more prominent than the rest of the surface. This part has a part equivalent to the notch, and is inserted into the second mold. (3 4) Inside the hole (35), the protruding portion (71) extends into the A recess (70). 5. The method according to item 3 of the scope of patent application, wherein:-step i is performed between steps h and c, and by step 丨, the welding material (5 1) is slightly pressed into the recess, and One mold or first vibrate the first mold and then press the welding material to form a depression (7 0) corresponding to the upper surface of the first mold; in step d, the metal part (12,) has a central portion of the surface (18) (7 1), which protrudes from the remaining portion of the surface, the portion has a portion corresponding to the notch, and is inserted into the hole (3 5) of the second die (3 4), and the protruding portion (7 1) extends into the Within the low recess (7 0). 6 · The method in any one of claims 1 to 5, in which step a consists of the following steps in sequence: printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs j) preparing a third mold of an inert material (9 0), its flat upper surface (92) has at least one notch (91), the axis of the notch is perpendicular to the upper surface, and its depth is only the portion of the length of the cathode of the getter to be made; k) the mixture (9 3) scraping notch (91), the mixture includes at least diamond powder and a powder of easily sinterable material; 1) placing a fourth mold (9 4) of an inert material on a third mold (90), the The fourth die has a flat upper surface (96), and it has a through hole 9 5 with the same diameter as the upper part of the notch 91, the axis of the through hole is perpendicular to the surface; the paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -3 ^ 507245 A8 B8 C8 D8 6. Patent application scope m) The second through hole (9 5) is scraped with a mixture (3 3) including a getter material and a sintered material. (Please read the precautions on the back before filling out this page) 7 · If the method in any one of claims 1 to 5, the getter material is an alloy, including chromium or titanium and one or more options Self transition element with aluminum element. 8. The method according to item 7 of the scope of patent application, wherein the alloy is selected from Zr-A1 alloy, Zi * -Fe alloy and Ti-V-Mn alloy. 9. The method according to item 8 of the scope of patent application, wherein the weight percentage composition of the alloy is Zr 8 4%-A 1 16%. 10. The method according to item 8 of the scope of patent application, wherein the weight percentage composition of the alloy is Zr 70%-V 24.6%-F e 5 · 4% 〇1 1 · As the scope of patent applications 1 to 5 The method of any one of clauses to clauses, wherein the sintered material is selected from chromium, titanium, a hydride thereof, or a mixture thereof. 1 2 · The method in any one of items 1 to 5 of the scope of patent application, wherein the mixture (33; 33,) includes 70% by weight, printed by T i and 30 by the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs % By weight composition is Z: rs 4%-A \ 16% alloy. 1 3 · The method according to any one of items 1 to 5 in the scope of patent application, wherein the mixture (33; 33,) comprises 70% T i and 30% by weight, and the composition is zr 7 〇 %-Y 2 4. 6%-F e 5 · 4% alloy. 1 4 · As for the method in any one of items 1 to 5 of the scope of patent application, -4-507245 A8 B8 C8 _ D8 6. The scope of patent application where the mixture (3 3; 3 3 ') includes 4 by weight 〇% Zr and 60% by weight of the composition of Zr 70%-V 24.6%-F e 5.4% alloy. 15 · The method as described in any one of claims 1 to 5, wherein the mixture (3 3; 3 3 ′) comprises, by weight, 60% T i and 40% by weight. The composition is Z. r 70%-V 24.6%-alloy with 5.4% Fe. 16. The method as claimed in claim 1, wherein the powder particle size of the mixture (3: 3,3 ') is less than 50 microns. 17. The method according to item 2 of the scope of patent application, wherein the material layer (36) for promoting the adhesion of at least one of the powder mixture and the metal part is a thin film of a material (37), the material is selected from the metal τ i, Ni, Cu, Co, two-component alloy Ni—Cr, Co—Cr or Fe—Cr, two-component alloy Ni—Cr—Ni or Co—Cr—Mi: and four-component alloy Ni—Cr— Mi—M2 or co—Cr—Mi—M2, where Mi and M2 are metals in the first transition metal column or group III or IV of the periodic table. 18. The method according to item 17 of the scope of patent application, wherein the thin film is made by a technique selected from chemical vapor deposition, electroplating, or physical vapor deposition. 19 · The method according to item 2 of the scope of patent application, wherein the material layer (36) for promoting adhesion of the at least one powder mixture to the metal part is a powder layer of the welding material (5 1). 20 · If the method of item 19 in the scope of patent application is applied, wherein the paper size of this welding is applicable to the Chinese National Standard (CNS) Α4 specification (2Η > X297 mm) (Please read the precautions on the back before filling this page} • m, etc. • Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperative, printed 507245 A8 BB C8 __D8, the melting temperature of the patent-applied material is not lower than the mixture (physical temperature. 2 1) If the melting temperature of the second patent-applied material is not high Sintering at the mixture (temperature 15 ° C or more. 2 2) The method of sintering of item 0 in the method of item 19 of the scope of application for patent No. 19 'where the welding is 3 3; 3 3') Material) is selected from silver, silver-copper alloy, and silver. 2 If the scope of the patent application is the second, the material is a silver-copper printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 2 4 Materials are silver 2 5 materials (5 2 6 of which (42) 2 7 powdered granules 2 8 powdered granules 2 9 knotted material system 3 0. Such as the application—copper alloy • such as the application 1) • When the application method is completed, the diamond is loaded. • If applying a diameter between approximately • If applying a diameter of approximately 1 • If applying a titanium hydride. • If you apply for alloy 'The silver contains the second patent scope, which contains 7 2 The patent scope The first diameter is less than about 10 The patent scope is the first, using a method selected from the fossil deposits to integrate the two items The amount is higher than the 6.03 items Method weight% silver. Method of 9 items 0 micron. Any of 5 to 5 learn vapor deposition getter and anion, where the welding copper-gold alloy. , Where the welding weight% or more. 'Where the welding, wherein the method of the welding item, and the method of item 6 of the patent scope of the electrode tip with laser ablation, wherein the diamond 1 and 50 microns. The method of item 27 of the patent, wherein the diamond is 0 micron. The method of item 6 of the patent scope, of which the method of item 29 of the easy to burn patent scope, wherein the hydrogenated paper size is applicable to Chinese national standards (CNS > A4 size (210X297 mm)) (Please read the note on the back first (Fill in this page again) -6 507245 A8 B8 C8 ________ D8 ______ 六、申請專利範圍 鈦的粒徑小於5 0微米。 (請先閱讀背面之注意事項再填寫本頁) 3 1 ·如申請專利範圍第3 0項之方法,其中該氫化 鈦的粒徑介於約5與1 〇微米。 3 2 .如申g靑專利範圍第1至5項任一項中之方法, 其中該模的惰性材料係選自石墨、鉬或陶瓷材料。 3 3 ·如申請專利範圍第3 2項之方法,其中該陶瓷 材料係氮化硼。 3 4 ·如申請專利範圍第1項之方法,其中該燒結熱 處理係於介於7 5 0與1 1 〇 〇 °C之溫度與低於1 〇 - .6毫 巴之壓力下進行。 3 5 .如申請專利範圍第1至5項任一項中之方法, 其中在不同模中的相對應位置處提供至少兩個薄通孔,並 於此等孔內插入插腳,此等插腳的高度等於所有放置於上 方之模的高度總和,如此獲得此等模任何組合體的精確互 換定位。 3 6 . —種組合體,包括一具有部件(4 1 ; 6 1 ; 8 1 ; 1 0 1 )部件基座功能的零件(1 2 ; 1 2,), 經濟部智慧財產局員工消費合作社印製 該部件具有陰極與吸氣劑雙重功能,後小型化X射線發射 器(1 0 ;該部件係由至少一種經燒結混合物(3 3 ; 33’ ; 9 2 ),該混合物包括至少一種燒結材料粉末與 至少一種選自吸氣劑材料與金剛石之粉末,而且該部件係 經由一種材料層(3 6 )與該金屬零件的表面(1 8 )或 其一部分(1 9 )結合,其中該材料係選自: 種材料(3 7 )之薄膜,其塗覆於該金屬零件的 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 、申請專利範圍 表面或其 一一種 3 7 . 件(4 1 ; 幵多成,該混 材料組成。 3 8 . 部件尖端( 3 9 ·如申請專 件(1 0 0 )包括一 A8 B8 C8 D8 部分(1 焊接材料 如申請專利範圍第3 6項 6 1 ; 8 合物係由 9 )上; (5 1 )的粉末 層。 之組合體,其中該部 燒結混合物(3 3 ) 1 )係由一種經 至少一種吸氣劑材料與至少一種燒結 如申請專利範圍第3 7項 4 2 )上澱積一層金剛石 之組合體,其中在該 薄膜。 之組合體,其中該部 物(3 3 )所形成的 利範圍第3 6項 個由經燒結混合 中該混合物包括至少一種吸氣劑材料 主體(1 0 2 ),其 燒結材料之粉末;與一個由經燒結混合物( 之尖端部分(1 0 3 ),該混合物包括至少 與金剛石。 與至少一種 9 2 )形成 種燒結材料 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公釐)-6 507245 A8 B8 C8 ________ D8 ______ 6. Scope of patent application The particle size of titanium is less than 50 microns. (Please read the precautions on the reverse side before filling out this page) 3 1 · If you apply for the method in item 30 of the patent application, the titanium hydride has a particle size between about 5 and 10 microns. 32. The method as claimed in any one of claims 1 to 5 of the patent application, wherein the inert material of the mold is selected from graphite, molybdenum or ceramic materials. 33. The method according to item 32 of the scope of patent application, wherein the ceramic material is boron nitride. 34. The method according to item 1 of the scope of patent application, wherein the sintering heat treatment is carried out at a temperature between 750 and 1100 ° C and a pressure below 10.0-.6 mbar. 35. The method according to any one of claims 1 to 5, in which at least two thin through holes are provided at corresponding positions in different molds, and pins are inserted into these holes. The height is equal to the sum of the heights of all the molds placed above, thus obtaining the precise interchangeable positioning of any combination of these molds. 36. A kind of assembly, including a part (1 2; 1 2) with the function of the base of the part (4 1; 6 1; 8 1; 10 1), printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The component has the dual functions of cathode and getter, and is later miniaturized X-ray emitter (10; the component is composed of at least one sintered mixture (3 3; 33 '; 9 2), and the mixture includes at least one sintered material The powder is combined with at least one powder selected from a getter material and diamond, and the part is combined with the surface (1 8) or a part (1 9) of the metal part through a material layer (3 6), wherein the material is Selected from: a thin film of three kinds of materials (3 7), the paper size coated on the metal parts is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm), the surface of the scope of patent application or one of the 3 7. (4 1; more than 10%, the mixed material is composed. 3 8. Component tip (3 9 · If applying for a special part (1 0 0) includes an A8 B8 C8 D8 part (1 welding materials such as the scope of patent application No. 3 6 Item 6 1; 8 compounds from 9); (5 1 ). The composite body, wherein the part of the sintered mixture (3 3) 1) is a layer of diamond deposited on at least one getter material and at least one sintered as in the scope of the patent application No. 37 7 4 2) The combination, wherein the thin film. The combination, wherein the part (3 3) forms a range of interest. The 36th item is a sintered mixture, and the mixture includes at least one getter material body (1 0 2 ), The powder of its sintered material; and a sintered material consisting of a sintered mixture (the tip portion (103) of which includes at least with diamond. And at least one type of 9 2) (please read the precautions on the back first) (Fill in this page) Printed on the paper by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the paper size applies to China National Standard (CNS) A4 (210x297 mm)
TW090116052A 2000-07-19 2001-06-29 Process for manufacturing assemblies comprising a base and a device integrating the functions of cathode and getter for miniaturized x-ray emitters and assemblies so produced TW507245B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IT2000MI001645A IT1318202B1 (en) 2000-07-19 2000-07-19 PROCESS FOR THE PRODUCTION OF DEVICES THAT INTEGRATE THE FUNCTIONS OF CATADO AND GETTER FOR MINIATURIZED X-RAY AND
IT2001MI000630A ITMI20010630A1 (en) 2001-03-23 2001-03-23 PROCESS FOR THE PRODUCTION OF DEVICES THAT INTEGRATE THE CATHODE AND GETTER FUNCTIONS FOR MINIATURIZED X-RAY EMITTERS AND DEVICES
PCT/IT2001/000376 WO2002007183A1 (en) 2000-07-19 2001-07-17 Process for manufacturing assemblies comprising a base and a device integrating the functions of cathode and getter for miniaturized x-ray emitters and assemblies so produced

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