^1UU27 五、發明說明（1) 【發明領域】 本發明係有關於一種用於半導體封膠製程之消除模塑產 t表面著電的方法’其特別有關於消除因模塑產物與封膠 鑄模摩擦而形成於該模塑產物表面之靜電之方法。 【先前技術】 在半導體製造t，靜電放t(electrostatic ischarge，ESD) —直是造成積體電路損壞的主要原因。 $緣材質之物體表面經常因著與其它物體摩擦或碰觸而產 # f電（static electricity)，而此時帶有靜電之該表面 觸具有積體電路之晶片，該表面上之靜電會向該晶片 /、，而造成該晶片不可逆之損壞。在電子的裝置中，當 ，子裝置越小且越快速時，其對靜電放電的敏感度也會增 σ二f此，電放電成為半導體製造業界亟欲解決之問題。 體的：膠ί Ϊ製造的方法(㈣1。叫meth〇d)廣泛用.於半導 艚、t夕T王，该方法將粉末狀或塊狀之塑膠材料置 該塑膠材料加熱至溶化，然後將該溶 是即;冓造之模上 封裝構造以降低製造】本“什到具有固定品質之半導體’ 穴模塑產物從該封膠铸模之模 (該複數個釘針之一山 ^複數個頂針 卞之鳊可移動出入該模穴）將該模穴中之模 P01-ll7.ptd 第4頁 —-—^ 五、發明說明（2) 塑產物頂出。 該模3:::模f膠的方法’，固化後的該模塑產物自 塑產物的塑二鉍晳5f模塑產物與該模穴之摩擦可能使該模 2膠材免表面帶靜 ;電放電而造成晶片“壞而 它製程的浪費而提高成本。m使仟^降低並造成其 【發明概要】 塑= ΐ係Ϊ供-種用於半導體封膠製程之模 提高製造;率；，保護半導體元件，以 封= = 本發明提供-種用於半導體 先，ΐίίΐί靜電消除方法，其包含下列步驟：首 表面設有至J:模$ 2:7模之塑模裝置，該下模之上 之半導體元件置於該半接著，將欲封膠 緊，再將熔融之封膠材料注入各個模:;模J ::莫密$ 柱滿封膠材料後，使該封膠材料硬“ _ 形成-模塑產物；然後，打開該模且，^ ^導體兀件 物自該模穴中移出的同時提供具有正 ^離y模產 離子風，使該離子風吹拂該模塑產物之表空氣之 ?表面；最後，於該模塑產物完全自該模穴中移：：： 下模之上表面。 之人拂方向係大致平行於該 較佳地，上述將模塑產物自封膠鑄模中移出之步驟係利 POl^in.ptd 第5頁 训〇27 五、發明說明（3) 用—頂出製程達成。詳細古之，哕下握於a 頂針，直中兮if齡徊了百力丄〇 以 、車乂佳另具有複數個 程用ΐ= 端可移動出入該模穴。該頂 穴頂^係利用吕亥複數個頂針將模塑產物由封‘膠鑄模中之模 本發明之特徵在於該模塑產物被頂 2模塑產物之表面及其周圍之模具表面；； 4:之離子R，用以中和該模塑產物因被頂出時盘該模 八摩擦而形成於表面之靜電。 ^ 才、 本發明之上述和其它特徵、目的，你 一 詳細說明中將能更容易瞭解： ’、圖不關聯的丨 【發明說明】 ^圖所示為-離子風系㈣設於—普遍使用於半導體 傳遞模塑裝置(transfer — 之間要側視圖。該模塑襄置10具有一工板1〇2及一下板 =。該下板104係可向上及向下移動。該上板1〇2及下 104之間具有一柱106。具有一加熱裝置112之一上模基_ 108及一下模基座110分別配置於該上板1〇2及下板ι〇4。^ > 一亡模114配置於該上模基座1〇8中，一下模116配置於 該下模基座1 1 0中，在本發明中亦以封膠鑄模或模具統稱 該上模1 1 4及下模1 1 6。如第2圖所示該上模丨丨4及該下模丨 1 1 6分別具有複數個模穴丨2 2，封膠塑料可在該模穴中固化 以形成具有半導體封裝構造外型之模塑產物。第丨圖中之 編號1 1 8及1 2 0分別標示出傳遞活塞及液壓圓柱。 該位於上模基座108之上模丨14具有一對稱之位於下模美^ 1UU27 V. Description of the invention (1) [Field of the invention] The present invention relates to a method for eliminating the surface electrification of a molding compound used in a semiconductor sealing process, which is particularly related to the elimination of molding products and sealing molds. Method of forming static electricity on the surface of the molded product by rubbing. [Previous Technology] In semiconductor manufacturing, electrostatic discharge (ESD) is always the main cause of damage to integrated circuits. The surface of an object with a marginal material is often produced by friction or contact with other objects. At this time, the surface with static electricity touches a wafer with integrated circuits, and the static electricity on the surface will The wafer /, which causes irreversible damage to the wafer. In electronic devices, when the sub-device is smaller and faster, its sensitivity to electrostatic discharge will also increase. This is the problem that the semiconductor manufacturing industry is desperately trying to solve. Physical: The method of making glue (㈣1. Called meth〇d) is widely used in semiconducting alloys, T and T. This method puts powder or block plastic material on the plastic material and heats it to melt, then The solution is immediately; the packaging structure on the mold is reduced to reduce the production] the "even semiconductors with fixed quality" cavity molding products from the mold of the sealing mold (one of the plurality of staples ^ plural The pin of the thimble can be moved into and out of the cavity.) The mold in the cavity P01-ll7.ptd Page 4 — — — — — 5. Description of the invention (2) The plastic product is ejected. The mold 3 ::: 模 f Glue method ', after curing, the molded product self-plasticized product dibismuth 5f friction between the molded product and the cavity may prevent the surface of the mold 2 glue from static; the electrical discharge caused the wafer to be "bad and It wastes the process and raises costs. m reduces 仟 ^ and causes it [Summary of the invention] Plastic = ΐ system Ϊ supply-a kind of mold used in semiconductor sealing process to improve the manufacturing rate; protection of semiconductor components to seal = = the present invention provides-a kind of semiconductor First, a method for eliminating static electricity, which includes the following steps: a first surface is provided with a plastic mold device to J: mold $ 2: 7 mold; the semiconductor element on the lower mold is placed in the half; Then inject the molten sealant material into each mold: after the mold J :: Mo Mi $ is filled with the sealant material, make the sealant material hard "_ formation-molding product; then, open the mold and ^ ^ conductor While the elements are removed from the cavity, a positive ion-generating ion wind is provided to cause the ion wind to blow the surface of the surface air of the molded product; finally, the molded product is completely removed from the cavity Middle shift :: The upper surface of the lower mold. The direction of the person's whisker is approximately parallel to this. Preferably, the above-mentioned step of removing the molded product from the self-sealing plastic mold is POl ^ in.ptd. 、 Explanation of the invention (3) It is achieved by using the ejection process. In ancient times, hold it under a thimble, straight Xiif age lingering Baili 乂 0, Che 乂 jia also has a number of process ΐ = end can be moved in and out of the mold cavity. The top of the cavity is using Lu Hai multiple thimbles to seal the molded product from the rubber The mold of the present invention is characterized in that the surface of the molding product is topped 2 and the surface of the mold around it; 4: the ion R is used to neutralize the mold product when it is ejected The static electricity formed on the surface due to the friction of the mold. ^ The above and other features and purposes of the present invention will be easier to understand in your detailed description: ', the picture is not related 丨 [invention description] ^ The picture shows -Ionic wind system is installed in-generally used in semiconductor transfer molding equipment (transfer-side view between. The molding Xiang 10 has a working plate 102 and lower plate =. The lower plate 104 can be upward There is a column 106 between the upper plate 102 and the lower plate 104. An upper mold base 108 and a lower mold base 110 having a heating device 112 are respectively disposed on the upper plate 102 and the lower plate. Plate ι04. ^ ≫ A die 114 is arranged in the upper die base 108, and a lower die 116 is arranged under the lower die 116. In the mold base 1 10, the upper mold 1 1 4 and the lower mold 1 1 6 are also collectively referred to in the present invention as a sealing mold or mold. The upper mold 丨 4 and the lower mold 丨 as shown in FIG. 2 1 1 6 has a plurality of mold cavities 丨 2 2 respectively, and the sealing plastic can be cured in the mold cavities to form a molded product with the appearance of the semiconductor package structure. The numbers 1 1 8 and 1 2 0 in the figure 丨 respectively The transfer piston and the hydraulic cylinder are marked. The upper die located on the upper die base 108 has a symmetrically located lower die beauty.
P01-117.ptd 510027 五、發明說明（4) 座110之下模116。該上模114及下模116之對應模穴122合 併起來可形成一半導體封裝構造之外形。 如第2圖所示，一罐124用於放置一封膠塑。料丨26，各個 膠道128用以連接該罐124的部份與每一模穴122 , 一禱膠 口 130形成於該膠道128與該模穴122之間。 夕 如第3圖所示，一模穴122、一膠道128及一鑄膠口13〇係 形成於該下模116之上表面132，一模塑產物134形成於該 模穴122中。複數個頂針136貫穿下模116之部份。該頂針 136之上部份通到該該下模丨16之上表面132之該模穴122及 該膠道128。利用該頂針136之上下移動可使該頂針136之· 上部份凸出於該模穴122及該膠道之表面，使得封膠過之 模塑產物1 3 4藉此被頂出。 設於該模塑裝置1 〇， 離子空氣之離子風， 第1及第3圖所示之離子風系統2〇， 能提供該模塑裝置1 〇具有正離子及負 其較佳為一離子風扇。P01-117.ptd 510027 V. Description of the invention (4) The die 116 under the seat 110. The corresponding mold cavities 122 of the upper mold 114 and the lower mold 116 are combined to form a shape of a semiconductor package structure. As shown in FIG. 2, a can 124 is used for placing a piece of plastic. Material 26, each glue channel 128 is used to connect a part of the tank 124 and each mold cavity 122, and a prayer glue opening 130 is formed between the glue channel 128 and the mold cavity 122. As shown in FIG. 3, a mold cavity 122, a glue path 128, and a casting port 130 are formed on the upper surface 132 of the lower mold 116, and a molded product 134 is formed in the mold cavity 122. A plurality of thimbles 136 penetrate through a portion of the lower die 116. The upper part of the thimble 136 leads to the mold cavity 122 and the rubber path 128 of the upper surface 132 of the lower mold 162. By using the thimble 136 to move up and down, the upper part of the thimble 136 can protrude from the surface of the cavity 122 and the glue path, so that the molded product 1 3 4 that has been sealed can be ejected therefrom. Located in the molding device 10, the ionic wind of ion air, the ion wind system 20 shown in Figs. 1 and 3, can provide the molding device 10 with positive ions and negative, preferably an ion fan .
以下為利用本發明之方法進行半導體封膠製程的步_| •T先，將欲封裝之半導體元件分別置於該下模116之複f 個模穴122中，移動該下板1〇4帶動該下模基座11〇及該 模116使該下模116與對應之上模114密合夾緊。接著，以 該加熱系統1 12將該上模i 14及下模】16加熱至一予員先決定 ，溫度後’、該罐124中熔4匕之封膠塑料126會被連結於液壓 圓柱1 2 0，活塞1 1 8推動緩慢地經過該膠道丨2 8及各鑄膠口 130注入每一模穴122中。各模穴122中之該封膠塑料工以硬 化之後’便得到-内含半導體元件之模塑產物i 38。之The following are the steps of the semiconductor sealing process using the method of the present invention. First, the semiconductor components to be packaged are respectively placed in the plurality of mold cavities 122 of the lower mold 116, and the lower plate 104 is moved to drive The lower mold base 11 and the mold 116 tightly clamp the lower mold 116 and the corresponding upper mold 114. Then, the heating system 1 12 is used to heat the upper mold i 14 and the lower mold] 16 to a predetermined number. After the temperature, the sealing plastic 126 melted in the tank 124 will be connected to the hydraulic cylinder 1 20, the piston 1 1 8 pushes slowly through the glue channel 28 and each of the casting ports 130 and injects into each cavity 122. After the sealant plastic in each cavity 122 is hardened, a molded product i 38 containing a semiconductor element is obtained. Of
P01-117.ptd 第7頁 510027 五、發明說明（5) 後，再移動該下板104將該模具打開’使 模116分開。 供m、a广 利用該複數個頂針136將該模塑產物134自^模穴i22頂 m緊密接觸的該模塑產物134與該模穴122會因會此相 擦’該模塑產物134的摩擦表面大致為絕 Ϊ物134内八Λ易因而形成靜電於該表Φ，而有對該模塑 危險。3半導體70件靜電放電造成不可逆之損壞的 因此本發明利用設於該模塑裝置丨0之離子風 開始將該模塑產物134頂出該模穴122的同時，提供一 =ί :1^8負：圍子空氣之離子風’吹拂於該模塑產物及該模 :產物138周圍之封膠鑄模表面，或 表面U2。以該離子風在該模塑產物134被頂出：過=P01-117.ptd Page 7 510027 V. Description of the invention (5), then move the lower plate 104 to open the mold 'to separate the mold 116. For m and a, the plurality of thimbles 136 can be used to mold the molded product 134 from the mold cavity i22. The molded product 134 and the mold cavity 122 that are in close contact with each other will rub against each other. The friction surface is approximately 内 in the insulator 134, and thus static electricity is formed on the surface Φ, and there is a danger of the molding. 3 70 semiconductors caused irreversible damage due to electrostatic discharge. Therefore, the present invention uses the ionic wind provided in the molding device 丨 0 to start ejecting the molded product 134 out of the cavity 122 while providing one = ί: 1 ^ 8 Negative: The ionic wind of the surrounding air blows on the molding product and the mold: the surface of the sealing mold around the product 138, or the surface U2. The ionized wind is ejected from the molded product 134:
m產物m因與該模穴122摩擦而形成於表面之靜 二==:示’該離子風之吹拂方向較佳係平行 於这下模116之上表面137。 、 伸力:熱系統112加熱未完成時即給予-離子風，將 ::模=達到預熱溫度而無法順利使該封膠材料126 Ϊ因ίΐΓ員利使熔融之封膠塑料126柱入各個模穴I” 3因此較佳於該封膠塑料126注入各摸穴122並 後’始提供離子風；更佳地，在開始 U模塑產物134頂出該模穴122的 ::於該模塑產鍵完全自該模穴122取出後停：以The m product m is formed on the surface due to friction with the cavity 122. ==: Shows that the blowing direction of the ion wind is preferably parallel to the upper surface 137 of the lower mold 116. Extending force: Ion wind is given when the heating system 112 is not heated, and the mold temperature reaches the preheating temperature, and the sealant material 126 cannot be made smoothly. The melted sealant plastic 126 columns are put into each column because of the benefits The mold cavity I ”3 is therefore better than when the sealing plastic 126 is injected into each of the mold cavities 122 and then the ion wind is provided; more preferably, at the beginning of the U-molded product 134, the mold cavity 122 is ejected ::: in the mold The plastic production key is completely removed from the cavity 122 and stopped:
510027 五、發明說明（6) 雖然本發明已以前數較佳實施例揭示，然其並非用以限 定本發明，任何熟習此技藝者，在不脫離本發明之精神和 範圍内，當可作各種之更動與修改。因此本¥明之保護範 圍當視後附之申請專利範圍所界定者為準。510027 5. Description of the Invention (6) Although the present invention has been disclosed in the previous preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various changes without departing from the spirit and scope of the present invention. Changes and modifications. Therefore, the protection scope of this ¥ Ming shall be determined by the scope of the attached patent application.
P0M17.ptd 第9頁 510027 圖式簡單說明 【圖示說明】 第1圖：根據本發明一較佳實施例之設有離子風系統之 傳遞模塑裝置（transfer molding apparatus)簡要側視 圖； 第2圖：根據本發明第1圖傳遞模塑裝置之模具立體透視 圖；以及 第3圖：根據本發明第1圖傳遞模塑裝置之下模剖視圖， 其圖示一離子風系統之吹拂方向係大致平行於該下模之上 表面。 【圖號說明】 10 塑模裝置 20 離子風裝置 102 上板 104 下板 106 柱 108 上模基座 110 下模基座 112 加熱系統 114 上模 116 下模 118 活塞 120 液壓圓柱 122 模穴 124 罐 126 封膠塑料 •丨 128 膠道 130 鑄膠口 132 上表面 134 模塑產物 136 頂針P0M17.ptd Page 9 510027 Brief description of the drawings [Illustration] Figure 1: A schematic side view of a transfer molding apparatus with an ion wind system according to a preferred embodiment of the present invention; Figures: perspective perspective view of the mold of the transfer molding device according to Figure 1 of the present invention; and Figure 3: a cross-sectional view of the lower mold of the transfer molding device according to Figure 1 of the present invention, which illustrates the general blowing direction of an ion wind system. Parallel to the upper surface of the lower mold. [Illustration of drawing number] 10 Moulding device 20 Ion wind device 102 Upper plate 104 Lower plate 106 Column 108 Upper mold base 110 Lower mold base 112 Heating system 114 Upper mold 116 Lower mold 118 Piston 120 Hydraulic cylinder 122 Cavity 124 Tank 126 Sealing plastics 丨 丨 128 Glue path 130 Casting port 132 Upper surface 134 Molded product 136 Thimble
P01-117.ptd 第10頁P01-117.ptd Page 10