TW516809U - Integrated heat dissipating device - Google Patents

Integrated heat dissipating device

Info

Publication number
TW516809U
TW516809U TW090216178U TW90216178U TW516809U TW 516809 U TW516809 U TW 516809U TW 090216178 U TW090216178 U TW 090216178U TW 90216178 U TW90216178 U TW 90216178U TW 516809 U TW516809 U TW 516809U
Authority
TW
Taiwan
Prior art keywords
heat dissipating
dissipating device
integrated heat
integrated
heat
Prior art date
Application number
TW090216178U
Other languages
Chinese (zh)
Inventor
Ming-Ruei Chen
Ching-Shou Chi
Jiun-Liang Chen
Ming-Huei Lai
Original Assignee
Leadtek Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leadtek Research Inc filed Critical Leadtek Research Inc
Priority to TW090216178U priority Critical patent/TW516809U/en
Priority to KR1020020032483A priority patent/KR20030025788A/en
Publication of TW516809U publication Critical patent/TW516809U/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW090216178U 2001-09-21 2001-09-21 Integrated heat dissipating device TW516809U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW090216178U TW516809U (en) 2001-09-21 2001-09-21 Integrated heat dissipating device
KR1020020032483A KR20030025788A (en) 2001-09-21 2002-06-11 Integrated apparatus for thermal dissipation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW090216178U TW516809U (en) 2001-09-21 2001-09-21 Integrated heat dissipating device

Publications (1)

Publication Number Publication Date
TW516809U true TW516809U (en) 2003-01-01

Family

ID=27802194

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090216178U TW516809U (en) 2001-09-21 2001-09-21 Integrated heat dissipating device

Country Status (2)

Country Link
KR (1) KR20030025788A (en)
TW (1) TW516809U (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107969099A (en) * 2018-01-02 2018-04-27 深圳市德彩光电有限公司 A kind of radiator

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR910005648Y1 (en) * 1988-12-16 1991-07-27 대우전자 주식회사 Heat Sink for Circuit Elements
JPH0621283A (en) * 1992-07-03 1994-01-28 Nec Corp Semiconductor package with heat sink
US5927386A (en) * 1998-08-24 1999-07-27 Macase Industrial Group Ga., Inc. Computer hard drive heat sink assembly
KR100498300B1 (en) * 1998-09-25 2005-09-15 엘지전자 주식회사 High efficiency heat sink structure
KR100317450B1 (en) * 1998-11-04 2001-12-24 이태랑 Heatsink for electronic component, and apparatus for manufacturing the same

Also Published As

Publication number Publication date
KR20030025788A (en) 2003-03-29

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees