TW520577B - Manufacturing method of coaxial semiconductor laser and its apparatus - Google Patents

Abstract

A manufacturing method of coaxial semiconductor laser and its apparatus are disclosed in the present invention. The invention relates to the coaxial technique between the laser light axis of the semiconductor laser and the mechanical axis of the positioning surface, and includes the followings: a fast and precise coaxial correction fixture, a monitor for monitoring coaxial property between laser light axis and the mechanical axis, machine tools for processing coaxial semiconductor laser and its coaxial semiconductor laser product. The invention is capable of making the precision of laser light axis for the semiconductor laser coincide with that of the mechanical axis in a few minutes. When the invented semiconductor laser is adopted in the instrument product, the instrument structure can be simplified, and the procedures of assembling and correcting can be accelerated so as to reduce production cost and increase product reliability

Description

520577 Case No. 91106258 Λ_

V. Description of the invention (l) Background of the invention: The present invention relates to a method and a device for manufacturing a co-radiator, and relates to a method and a device for manufacturing a semiconductor laser that is coaxial with a laser optical axis and a positioning outer circle mechanical vehicle. 'Especially the method of rectifying the beam emitted by a semiconductor laser with respect to two different fixed points, and the method and equipment for cutting the outer circle of the semiconductor laser to make the laser optical axis coaxial with the mechanical axis. The light beam emitted by the previous technology will be guided in the Canada. At present, since the light beam emitted by the semiconductor laser light emitter is a scattered beam, only the internal lens converges into a parallel beam, so the laser beam of the semiconductor laser and its outer mechanical axis There is no coaxiality. In order to realize the coaxiality of the laser instrument, there are two schemes: '(1) The instrument 1§ is equipped with a semiconductor laser adjustment mechanism, and the laser light axis is correctly aligned with the instrument during assembly. Optical axis of the optical system. (2) Make coaxial requirements for semiconducting and body lasers. Solution (1) complicates the instrument's behavior and structure. After calibration is completed, the difference is lost during use, which makes the reliability of the instrument low. 7 ί (2) # Use the following two methods to make the semiconductor laser coaxial. • 彳 &#; semiconductor lasers of Jixi one by one with a V-shaped frame to observe its co-rotation + t ί selected half of the laser optical axis and the mechanical outer axis are better coaxial, prostitute, unsatisfactory semiconductor laser The re-use of the device to other products will result in a lot of non-coaxial semiconductor laser booster jackets, and the use of different eccentricity (including parallel deflection of the axis and the intersection of the axis) of-^^ body laser and Its effort, using the choice

520577 T number 91106258 Description of the fifth invention (2) — Used :: Compensation of the coaxial axis of the machine's external axis and the laser's optical axis-only the semiconductor laser takes about half an hour to be handled by a dedicated technician. i: I learned that this kind of manual selection or correction is not only time-consuming and labor-intensive, but it may not be correct. If you can develop a quick and accurate correction, therefore, technology ' To reduce costs and increase production. D .: "One of the great gospels of axial opinion. After the crime is born, it will be the outline of the invention of the business owner: In view of this, in order to improve the above-mentioned shortcomings, the inventor finally developed and designed a semiconductor laser after long research and experiment; I method and its decoration. The object of the invention is to: (1) provide a method for accurately integrating a semiconductor laser with a base axis and a laser beam; (2) provide a device for manufacturing such a semiconductor laser. In order that the review committee can further understand and understand the purpose, shape, structure characteristics, and effects of the present invention, the following examples are given in conjunction with the illustrations, and the detailed description is as follows: Foreign description · The present invention is an R The method of manufacturing axon conductor lasers and their methods is as follows: The device 5 can be used to quickly and accurately integrate the circular axis of the base of the semiconductor laser 201 with the laser optical axis. It includes: (1 ) A lathe-like cutting equipment; (2) Special spindle fixture with translation and fixed-point axis movement

520577

Revision of the main track ★ Monitor the screen of the semiconductor laser optical axis and the mechanical axis (0-0); (4) One: the coaxial & placement of the laser optical axis of the Gong 201 and the mechanical axis (〇-〇); a 彳 π, which is characterized by 'placing the semiconductor laser 20 1 in a special spindle clamp, and adjusting the laser optical axis (1-1) and the mechanical axis of the machine ^ One owner, chief: 1 pair of semiconductor lasers A cylindrical surface is cut out by the emitter 201, and the center axis of the device 201 and the laser light axis (L-L) produce high-precision coaxiality; ^ i2 ^ 〇iVt ΛΤα; f # ^ # ^ ^ ^ ^ t The Chidingyou axis (Ll) is precisely moved to the mechanical axis (〇_〇) of the processing equipment through two independent and non-interfering mechanical movements. The method steps are as follows: f. The spindle clamp 101 clamps the semiconductor laser 201. At this time, the initial position of the laser light axis (L_L) of the semiconductor laser 201 is (Lo-Lo); 嗣, first translate the semiconductor laser 201 in the dedicated spindle. The position of the fixture 101 is such that the laser light axis (L-L) intersects the mechanical axis (0-0) at? Point (the center of the dedicated spindle fixture ιοί), the position of the laser light axis (LL) of the semiconductor laser device 201 is (li-L1); then the laser light axis (LL) starts with the P point as a certain point. Swing until the laser light axis (LL) is moved from the position (u-u) to the position (L2-L2), that is, the laser light axis (Bu l) and the mechanical axis (0-0) completely coincide; To sum up, the research and development concept of the present invention is based on the idea that two points are in line, so that the laser light axis (LL) and the mechanical axis (0-10) meet at the p point, and then the f point is taken as One fixed axis to fine-tune the two axes. See page 6 520577 _ Case No. 91106258 Rev. V. Description of the invention (4) The angles of intersection until they overlap each other, according to this step, you can achieve fast and accurate Coaxial technology, in order to achieve this concept, the following is a detailed description of the hardware facilities and the location of the application required by Pei Benben: Another object of the camera 5 0 2 is located at point P, and the camera 5 0 1 leaves It is a distance, the beam splitter 401 enables the two cameras 501, 502 to be coaxially recorded, and the screen of the display 601 is impressive. In the case of a two-point axis, after the laser light axis (LL) and the mechanical axis (0-〇) coincide, the turning tool 301 is advanced and cutting is performed. The resulting cylindrical surface will be coaxial with the laser light axis; the structure principle of the machine tool is shown in the figure As shown in Figures 1 and 2, the special spindle clamp 101 can rotate at a high speed on the mechanical shaft (0-〇). The end is equipped with a universal swivel head 102, and the universal swivel head 102 is equipped with a translation gripper 103. It can clamp the semiconductor laser 201 'and move it in parallel in the vertical plane. The rotation center of the special spindle clamp 101 is p. The vertical axis is equipped with a spectrometer 稜鏡 4 〇 丄. The emitted 201 light is divided into a vertical beam and a weaker beam with the same optical path along the direction of the incident light. The two beams pass through the attenuation of the frosted glass 40 2, 40 3 and are projected on the camera 5101, 5〇. 2 while transmitting the two beams to the display 6 0 1 at the same time; processing ... ah, the sister Miao Miao device 201 is fixed to the translation holder ι〇2, the dedicated main vehicle is turned back and forth from the fixture 101 through another camera 5. 2 On the display, measure the process of the intersection of the two axes' to learn the deviation of the p point from the dedicated spindle fixture 101 Phenomenon, through the translation to the holder 103 out of the (L-L) to the mechanical axis (0 ten) intersect at the point p, the rotation of the ring ^ ^ dedicated master, designated laser spot on another ground glass 403. Stop, swing ^, turn head 102, move the light spot to the center of the circle ’, start the camera 501 on the display 601 of the display ^ Observe the laser light axis W: III! 丨 wish trip coffee ______________ ^ --- 520577

Case No. 91106258 V. Description of the invention (5) Rotation, explaining the laser beam (L-L) and the machine. Inch 1 is processed on the surface of the semiconductor laser 201 with a turning tool 30; = j line and laser light axis Hop-'Machine's special design ': Car m blows to the cutting area of the semiconductor laser 201, the damage of the two-conductor laser 201; ^ The independent correction of the axis-alignment of the semi-finished wool moonshell Here, first intersect the Emperor's axis (LL) and the mechanical axis (0-〇) at a point (p), and look for the laser beam axis (LL) to move the laser beam to a certain distance. Axis ⑺-0 ) Coincidence, due to the mechanical characteristics of the machine tool, when the second mechanical axis (LL) position is already coincident with the mechanical axis (〇_〇) / the point of the positive light is lost, the coincidence process of one axis is short, no need to repeatedly adjust it again The photoelectric system and system of CCD camera TV amplification are combined with the precision machine tool. The precision of the coincidence of the light axis (LL) on the cylindrical surface of the cylindrical surface by using the semiconductor laser 201 obtained by cutting is high. The semiconductor laser device 201 processed by the invention is installed in the light wind, and the laser light axis (LL) correction mechanism can be omitted. Simplify the instrumentation] is a quick installation process to reduce costs and increase reliability. Σ According to the above, it is only one of the best specific embodiments of the present invention. The structural features of s are not limited to this. Anyone familiar with this Within the scope of technology page c, you can easily consider the changes or: The scope of patents in this case.

Page 8 520577 Case No. 91106258 _Ά Name Amendment Brief description of the drawing Illustration: The first drawing is the technical principle diagram of the present invention. The second figure is a schematic diagram of the structure of the processing equipment of the present invention. The main components are numbered. Knife ... 301 Frosted Glass ......... 402 Camera ... ... 501 Display ......... 601 Dedicated Spindle Clamp ... 101 Translational Gripper ......... 103 Semiconductor laser ......... 201 Spectrometer ......... 401 Another frosted glass ......... 403 Another camera ......... 502

Page 9

Claims (1)

520577 m 91JU1R9R8 years The scope of the patent application is 1. A method of manufacturing a laser device, two methods of the semiconductor laser device: the mechanical movements that do not interfere with each other, and are accurately moved to each other (0-〇), the t The steps for each are as follows: When the mechanical vehicle is gripped first / clamping the two and a half with a special spindle clamp, the φ shot of the semiconductor laser Φr IT ~ each shot state (Lo-Lo); shot ^ (H) initial The position is 嗣, first translate the semiconductor laser on the dedicated main position, so that its laser light axis (LL) intersects the mechanical axis (0_ = two position), and this point is the center of the dedicated spindle 'fixture. At this time, Let ’s take a look at the position of the laser light axis α-L of p. 导体 M conductor laser, and then swing the laser light axis (L-L) to (L1-L1) at a small angle around the point (P), The actress was shy by r TT, 170 r. n 、 —The degree of entry of the light beam (ll) and the mechanical axis (0-0) coincide with each other to occupy the position L2_L2. The system includes: The machine tool is equipped with a dedicated spindle fixture, and the dedicated spindle has one axis. The center of rotation is provided with a universal swivel head. The universal direction is provided with a translation gripper. The translation gripper can clamp a device and make it act on the vertical surface of the translation gripper. Yiping uses the universal swivel head to make a multi-angle arc surface rotation. The tool is used to cut the semiconductor laser; the two cameras can take in a straight line formed by the semiconductor laser. Laser light axis; can be taken by the two cameras and the two types of one machine tool can be used as a rotary head + conductor laser line movement, and the machine is also equipped with a bed Laser light of two cameras, —display 520577 _Case No. 91106258_ Amendment _ Sixth, the scope of the patent application for the intersection of a hypothetical mechanical axis formed by the spindle clamp outwards appears on the display; a beam splitting prism, the beam splitter can The laser light emitted by the semiconductor laser is divided into a vertical light beam and a weaker straight light beam that has the same optical path along the direction of the incident light. The two light beams can be projected on the camera through the attenuation of one ground glass and the other ground glass. , And simultaneously transmit the two beams to the display. Page 11