TW530079B - Resin composition curable with actinic energy ray - Google Patents
Resin composition curable with actinic energy ray Download PDFInfo
- Publication number
- TW530079B TW530079B TW089127271A TW89127271A TW530079B TW 530079 B TW530079 B TW 530079B TW 089127271 A TW089127271 A TW 089127271A TW 89127271 A TW89127271 A TW 89127271A TW 530079 B TW530079 B TW 530079B
- Authority
- TW
- Taiwan
- Prior art keywords
- energy ray
- resin
- curable resin
- weight
- activation energy
- Prior art date
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- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
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- 239000000539 dimer Substances 0.000 description 1
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- 239000000975 dye Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 238000009313 farming Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
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- 150000002500 ions Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
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- 239000012860 organic pigment Substances 0.000 description 1
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- WKGDNXBDNLZSKC-UHFFFAOYSA-N oxido(phenyl)phosphanium Chemical compound O=[PH2]c1ccccc1 WKGDNXBDNLZSKC-UHFFFAOYSA-N 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical class NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
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- NKTOLZVEWDHZMU-UHFFFAOYSA-N p-cumyl phenol Natural products CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 1
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- 150000004965 peroxy acids Chemical class 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- KRIOVPPHQSLHCZ-UHFFFAOYSA-N propiophenone Chemical compound CCC(=O)C1=CC=CC=C1 KRIOVPPHQSLHCZ-UHFFFAOYSA-N 0.000 description 1
- ODLMAHJVESYWTB-UHFFFAOYSA-N propylbenzene Chemical compound CCCC1=CC=CC=C1 ODLMAHJVESYWTB-UHFFFAOYSA-N 0.000 description 1
- 239000003223 protective agent Substances 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/06—Unsaturated polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D167/00—Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
- C09D167/06—Unsaturated polyesters having carbon-to-carbon unsaturation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
- C09J167/06—Unsaturated polyesters having carbon-to-carbon unsaturation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Paints Or Removers (AREA)
- Epoxy Resins (AREA)
Abstract
Description
經濟部智慧財產局員工消費合作社印製 530079 A7 B7 五、發明說明(1 ) 發明所屬之技術領域 本發明爲關於活化能線硬化性樹脂組成物,且特別爲 關於以保護銅、銀電極等各種電極爲目的之活化能線硬化 性之組成物。 先行技術 一般,電子零件等之各種電極對於外氣(濕氣)之保 護劑(保護塗層)已知有熱硬化系、紫外線硬化系及室溫 硬化系之樹脂組成物。例如,熱硬化系之樹脂組成物爲如 特公平1 - 1 9 8 3 4號公報所揭示之環氧樹脂系樹脂組 成物,又,紫外線硬化系之樹脂組成物爲如特開昭 6 0 - 1 0 3 3 4 3號公報所揭示之丙烯酸系樹脂組成物 〇 然而,此些樹脂組成物中,熱硬化系之樹脂組成物於 硬化處理時需要長時間的加熱,故作業性差,且擔心對於 其他材料造成不良影響。 紫外線硬化系之樹脂組成物雖具有硬化速度快,可於 低溫硬化之優點,但因爲硬化收縮大,故硬化物對於基材 的密合性差,於硬化物殘留歪斜並發生裂縫,具有耐水性 差之缺點。 室溫硬化系之樹脂組成物並不需要硬化設備,具有廉 價之優點,但於硬化需要長時間,更且必須確保硬化之場 所,具有作業性差之缺點。 相對地,可克服上述各種缺點之樹脂組成物,於紫外 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) — — — — — — — — — — i^wi --------^-------- (請先閱讀背面之注意事項再填寫本頁) 530079 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明(2 ) 線硬化系之樹脂組成物中亦已提案特別使用低硬化收縮爲 其特徵之光陽離子觸媒之樹脂組成物(參照特公平 2 — 30326號、特開平5 — 186755號公報)。 但是,此類樹脂組成物若於金屬電極上使用,則發生因爲 光陽離子觸媒所造成之金屬電極易產生腐蝕的新問題。 另一方面,在平面面板模型等所代表般之進行外部電 極精細圖型化的今日,其電極爲於玻璃基板上,以光學平 板印刷法於狹齒距中以圖型化之煅燒銀漿料予以作成。因 此,將此類於狹齒距中圖型化之金屬電極,即使欲以如上 述之先前的樹脂組成物予以保護,亦無法取得充分的保護 性能。 又,爲了令電子機器輕薄短小化,最近亦在P E T薄 膜上將銀漿料予以濾網印刷,並且形成電極(薄膜液晶、 觸摸面板),但此時之保護膜除了所謂的保護機能以外, 亦要求薄膜素材的低彎曲、尺寸安定性、密合性等重要之 特性。 發明所欲解決之課題 因此,本發明之目的爲解決如前述之先前技術的問題 點,並且提供保持紫外線硬化系樹脂組成物所具有之優點 ,且耐水性,對於基材之密合性優良,可承受遷移所造成 之電極間短路的活化能線硬化性樹脂組成物。 此處,將可承受遷移所造成之電極間短路之性能,於 以下單稱爲「耐遷移性」。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 、--------.丨丨•-裝--- (請先閱讀背面之注意事項再填寫本頁) i>_ 530079 A7 B7 五、發明說明(5 ) (請先閱讀背面之注意事項再填寫本頁) 式中,X爲表示氫原子或甲基、Y爲表示 —C(CH3)2 —、S〇2 —、CH2 —或直接鍵,R1 及 R 2爲表示碳數1〜1 2個之直鏈狀、環狀或分支狀之烷基 ,m爲表示0〜4之整數,η爲表示〇〜5之整數。 尙,於本發明之活化能線硬化性樹脂組成物之第一態 樣中,在對於組成物特性不會造成不良影響之範圍內,可 配合(A 〃)分子內具有二個以上乙烯性不飽和雙鍵之活 化能線硬化性樹脂,和/或不具有羥基和芳香族環之活化 能線硬化性樹脂等之上述(A /)成分以外之其他活化能 線硬化性化合物。 此類活化能線硬化性樹脂(A 〃 ),若爲經由活化能 線照射而令乙烯性不飽和雙鍵爲進行自由基聚合之化合物 即可,並無特別限定,但以(甲基)丙烯酸酯系化合物爲 特佳。又,亦可具有丙烯醯基(甲基丙烯醯基)以外之官 能基。更且,若爲單官能且於樹脂骨架中具有芳香環和環 狀環,則有利於密合性、斥水性方面。 經濟部智慧財產局員工消費合作社印製 另一方面,於本發明之活化能線硬化性樹脂組成物之 第二態樣中,活化能線硬化性樹脂(A )爲以分子內具有 一個乙烯性不飽和雙鍵之活化能線硬化性樹脂(A 〃)做 爲必須之構成成分,且其爲與環氧樹脂共同含有爲特徵。 此活化能線硬化性樹脂(A 〃)爲將參與反應之官肯g 基數目限定於1分子中1個,使得光自由基聚合時之硬化 收縮的影響壓至最小限度,有助於防止密合性的降低。但 ,僅以上述活化能線硬化性樹脂(A 〃 ),則耐遷移性和 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 530079 A7 B7 五、發明說明() 對於基材之密合性爲依所用用途而不夠充分,故必須倂用 環氧樹脂(C)。此處,環氧樹脂(C)爲不參與硬化, 故可有效減低硬化收縮(改善密合性)。又,環氧樹脂( C )亦有效提高耐遷移性,雖然其理由未明。 前述活化能線硬化性樹脂(A 〃 ),若爲經由活化倉g 線照射而令乙烯性不飽和雙鍵爲進行自由基聚合之化合物 即可,並無特別限定,但以(甲基)丙烯酸酯系化合物爲 特佳。又,亦可具有丙烯醯基(甲基丙烯醯基)以外之官 能基。更且,若於樹脂骨架中具有芳香環和環狀環,則有 利於斥水性方面。 此類活化能線硬化性樹脂(A 〃)之具體例可列舉4 —(甲基)丙烯醯氧基三環〔5 . 2 · 1 . 〇2.6〕癸烷 、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸環己酯、 (甲基)丙烯酸苄酯、(甲基)丙烯酸苯酯、(甲基)丙 烯酸苯氧基二甘醇酯、(甲基)丙烯酸苯氧基聚乙二醇酯 、苯酚E〇改質(甲基)丙烯酸酯、對枯基苯酚E 0改質 (甲基)丙烯酸酯、壬基苯酚E 0改質(甲基)丙烯酸酯 、壬基基酚P0改質(甲基)丙烯酸酯、丙烯酸2 -羥基 一 3 -苯氧基丙酯、(甲基)丙烯酸異冰片酯、(甲基) 丙烯酸二環戊烯酯、(甲基)丙烯酸二環戊烯氧乙酯、( 甲基)丙烯酸二環戊酯等之單官能(甲基)丙烯酸酯類等 0 此些單官能(甲基)丙烯酸酯類亦可將縮水甘油基予 以(甲基)丙烯酸酯化。具體而言,可列舉鄰-聯苯基縮 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -----------·裝--- (請先閱讀背面之注意事項再填寫本頁) 訂· 經濟部智慧財產局員工消費合作社印製 530079 A7 B7 五、發明說明(9 ) ,(C )環氧樹脂爲必須成分,於第一態樣中亦以加入環 氧樹脂,可再達成提高特性。如前述般,因爲環氧樹脂( C )爲不參與光硬化反應,故可有效減低硬化收縮(改善 密合性)。 環氧樹脂(c )爲公知慣用的各種環氧樹脂’其可歹U 舉例如雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型 環氧樹脂、溴化苯酚A型環氧樹脂、氫化雙酚A型環氧樹 脂、雙酚型環氧樹脂、聯二甲苯酚型環氧樹脂、脂環式環 氧樹脂、苯酚酚醛淸漆型環氧樹脂、甲苯酚酚醛淸漆型環 氧樹脂、溴化苯酚酚醛淸漆型環氧樹脂、雙酚A之酚醛淸 漆型環氧樹脂等之縮水甘油醚化合物、對酞酸二縮水甘油 酯、六氫酞酸二縮水甘油酯、二聚酸二縮水甘油酯等之縮 水甘油酯化合物、異氰脲酸三縮水甘油酯、N,N ’ N / ,N > —四縮水甘油基間二甲苯二胺、N,N,N,, N / -四縮水甘油基雙胺甲基環己烷、N,N,一二縮水 甘油基苯胺等之縮水甘油胺化合物等之公知慣用的環氧化 合物。此些環氧樹脂可單獨或組合使用二種以上。 經濟部智慧財產局員工消費合作社印製 -----------_-裝--- (請先閱讀背面之注意事項再填寫本頁) 本發明之活化能線硬化性樹脂組成物爲於此些環氧樹 脂中,特別以使用軟化點爲4 0 °C以上,室溫下爲半固型 或固型狀態之環氧樹脂爲佳。藉此,可提高樹脂組成物之 表面硬化性(指觸乾燥性)、耐水性。更且,經由選擇具 有斥水性骨架之環氧樹脂,則可提高樹脂組成物的斥水性 ,並且有效防止遷移。 本發明者等人,由含有環氧樹脂之各種斥水性樹脂中 .................. a H,2 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 530079 A7 B7 10 五、發明說明() ,選定如上述於室溫下爲半固型或固型狀態之環氧樹脂, 做爲參與耐遷移性之樹脂,並且再重覆檢討,結果得知此 些環氧樹脂中,亦以烯丙基經由過醋酸予以環氧化之具有 下述構造者,即,於分子中具有下述一般式(3 )所示之 部分構造之環氧化合物,或具有下述式(4 )或(5 )所 示任一構造之脂環式環氧化合物,爲比表氯醇之衍生物具 有更優良的耐遷移性。與表氯醇衍生物相比較,具有下述 構造之環氧化合物因爲不純物離子濃度低,故電特性優良 (請先閱讀背面之注意事項再填寫本頁) 裝530079 A7 B7 printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the Invention (1) The technical field to which the invention pertains The present invention relates to activated energy ray-curable resin compositions, and in particular, to the protection of various electrodes such as copper and silver electrodes The electrode is a composition having a hardenable activation energy line. Prior art In general, various types of electrodes such as electronic components are known as protective agents (protective coatings) for external air (moisture) from thermosetting, ultraviolet curing, and room temperature curing resin compositions. For example, the thermosetting resin composition is an epoxy resin resin composition disclosed in Japanese Patent Publication No. 1-1 9 8 3 4 and the ultraviolet curing resin composition is Japanese Unexamined Patent Publication No. 6 0- The acrylic resin composition disclosed in Japanese Patent Publication No. 1 0 3 3 4. However, among these resin compositions, the thermosetting resin composition requires long-term heating during the hardening treatment, so the workability is poor, and there are concerns about Other materials cause adverse effects. Although the UV-curing resin composition has the advantages of fast curing speed and low-temperature curing, the curing shrinkage is large, so the adhesion of the cured material to the substrate is poor, the cured product remains skewed and cracks occur, and it has poor water resistance. Disadvantages. The room temperature curing resin composition does not require hardening equipment and has the advantage of being inexpensive. However, it takes a long time to harden, and it is necessary to ensure a hardening site, which has the disadvantage of poor workability. In contrast, the resin composition that can overcome the above-mentioned various shortcomings applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) at the UV paper scale — — — — — — — — — — — i ^ wi --- ----- ^ -------- (Please read the precautions on the back before filling out this page) 530079 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (2) Wire hardening department Among resin compositions, a resin composition having a photocationic catalyst characterized by low hardening shrinkage has also been proposed (refer to Japanese Patent Publication No. 2-30326 and Japanese Patent Application Publication No. 5-186755). However, if such a resin composition is used on a metal electrode, a new problem that a metal electrode is easily corroded due to a photocation catalyst occurs. On the other hand, today's fine patterning of external electrodes, as represented by flat panel models, is based on the use of optical lithography to pattern the calcined silver paste on a glass substrate in a narrow pitch. Make it. Therefore, even if the metal electrode patterned in the narrow pitch is to be protected by the previous resin composition as described above, sufficient protection performance cannot be obtained. In addition, in order to reduce the thickness and thickness of electronic equipment, silver paste has been recently screen-printed on PET films to form electrodes (thin-film liquid crystals and touch panels). However, in addition to the so-called protection function, the protective film also has Important characteristics such as low bending, dimensional stability, and adhesion of film materials are required. Problems to be Solved by the Invention Therefore, the object of the present invention is to solve the problems of the prior art as described above, and to provide the advantages of maintaining the ultraviolet curing resin composition, water resistance, and excellent adhesion to the substrate, Active energy ray-curable resin composition capable of withstanding short circuit between electrodes caused by migration. Here, the performance that can withstand the short circuit between electrodes caused by migration is hereinafter referred to as "migration resistance". This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm), --------. 丨 丨 • -Packing --- (Please read the precautions on the back before filling this page) i > _ 530079 A7 B7 V. Description of the invention (5) (Please read the precautions on the back before filling out this page) In the formula, X is hydrogen atom or methyl group, Y is -C (CH3) 2-, S 〇2 —, CH2 — or a direct bond, R1 and R2 are linear, cyclic or branched alkyl groups having 1 to 12 carbon atoms, m is an integer of 0 to 4, and η is an integer of 0. An integer of ~ 5.尙 In the first aspect of the active energy ray-curable resin composition of the present invention, within a range that does not adversely affect the characteristics of the composition, (A 〃) can be compounded with two or more ethylenic compounds in the molecule. An activation energy ray-curable resin having a saturated double bond and / or an activation energy ray-curable compound other than the aforementioned (A /) component, such as an activation energy ray-curable resin having no hydroxyl group and an aromatic ring. This type of activation energy ray-curable resin (A 〃) is not particularly limited as long as it is a compound that makes the ethylenically unsaturated double bond undergo radical polymerization through irradiation with activation energy rays, but (meth) acrylic acid Esters are particularly preferred. Moreover, it may have a functional group other than acrylfluorenyl (methacrylfluorenyl). Furthermore, if it is monofunctional and has an aromatic ring and a cyclic ring in the resin skeleton, it is advantageous in terms of adhesion and water repellency. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs On the other hand, in the second aspect of the active energy ray-curable resin composition of the present invention, the active energy ray-curable resin (A) has an ethylenic property in the molecule. Unsaturated double-bond active energy ray hardening resin (A 必须) is an essential constituent, and it is characterized by being contained together with epoxy resin. This active energy ray hardening resin (A 〃) is to limit the number of official ken g groups involved in the reaction to one in one molecule, so that the effect of hardening shrinkage during photoradical polymerization is minimized, which helps prevent dense Decreased synergy. However, only with the above-mentioned activation energy ray hardening resin (A 〃), the migration resistance and the paper size apply the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 530079 A7 B7 V. Description of the invention () For Since the adhesiveness of the substrate is insufficient depending on the intended use, epoxy resin (C) must be used. Here, since epoxy resin (C) does not participate in hardening, it can effectively reduce hardening shrinkage (improve adhesion). The epoxy resin (C) is also effective in improving migration resistance, although the reason is unknown. The activation energy ray-curable resin (A 〃) is not particularly limited as long as it is a compound in which an ethylenically unsaturated double bond is radically polymerized by irradiation with g-rays through an activation chamber, but (meth) acrylic acid Esters are particularly preferred. Moreover, it may have a functional group other than acrylfluorenyl (methacrylfluorenyl). Furthermore, if an aromatic ring and a cyclic ring are contained in the resin skeleton, it is advantageous in terms of water repellency. Specific examples of such an active energy ray-curable resin (A 〃) include 4- (meth) acrylic fluorenyloxy tricyclo [5.2.1.1.〇2.6] decane, (meth) acrylic phenoxy Ethyl ester, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, phenyl (meth) acrylate, phenoxydiethylene glycol (meth) acrylate, phenoxy poly (meth) acrylate Glycol ester, phenol E0 modified (meth) acrylate, p-cumylphenol E 0 modified (meth) acrylate, nonylphenol E 0 modified (meth) acrylate, nonylphenol P0 modified (meth) acrylate, 2-hydroxy-3 -phenoxypropyl acrylate, isobornyl (meth) acrylate, dicyclopentene acrylate (meth) acrylate, and dicyclo (meth) acrylate Monofunctional (meth) acrylates such as pentenoxyethyl ester, dicyclopentyl (meth) acrylate, etc. 0 These monofunctional (meth) acrylates can also be glycidyl (meth) Acrylate. Specifically, we can enumerate the size of ortho-biphenyl shrink paper. Applicable to China National Standard (CNS) A4 (210 X 297 mm) ----------- · Packing --- (please first Read the notes on the back and fill in this page) Order · Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 530079 A7 B7 V. Invention Description (9), (C) Epoxy resin is an essential component, and it is also in the first aspect. With the addition of epoxy resin, improved properties can be achieved. As described above, since the epoxy resin (C) does not participate in the photo-hardening reaction, it can effectively reduce hardening shrinkage (improve adhesion). Epoxy resins (c) are well-known and commonly used epoxy resins, and examples thereof include bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, bisphenol S-type epoxy resin, and brominated phenol A type. Epoxy resin, hydrogenated bisphenol A epoxy resin, bisphenol epoxy resin, bixylenol epoxy resin, alicyclic epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin Glycidyl ether compounds such as epoxy resin, brominated phenol novolak lacquer type epoxy resin, bisphenol A novolac lacquer type epoxy resin, diglycidyl terephthalate, diglycidyl hexahydrophthalate , Glycidyl compounds such as diglycidyl dimer, triglycidyl isocyanurate, N, N'N /, N > -tetraglycidyl-m-xylylenediamine, N, N, N , N / -tetraglycidyl bisamine methylcyclohexane, N, N, glycidylamine compounds such as diglycidyl aniline and the like are known and commonly used epoxy compounds. These epoxy resins can be used alone or in combination of two or more. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -----------_- pack --- (Please read the precautions on the back before filling out this page) The active energy line hardening resin composition of the present invention Among these epoxy resins, it is particularly preferable to use an epoxy resin having a softening point of 40 ° C or more and a semi-solid or solid state at room temperature. Thereby, the surface hardenability (touch-drying property) and water resistance of a resin composition can be improved. Furthermore, by selecting an epoxy resin having a water-repellent skeleton, the water-repellency of the resin composition can be improved and migration can be effectively prevented. The inventors and others, from various water-repellent resins containing epoxy resin .. a H, 2 This paper size applies Chinese National Standard (CNS) A4 Specifications (210 X 297 mm) 530079 A7 B7 10 5. Description of the invention (), select the epoxy resin that is semi-solid or solid at room temperature as described above, as the resin that participates in migration resistance, and then Repeated review, it was found that among these epoxy resins, those having an allyl group epoxidized by peracetic acid have the following structure, that is, the molecule has a partial structure shown by the following general formula (3) An epoxy compound or an alicyclic epoxy compound having any one of the following formulae (4) or (5) has better migration resistance than derivatives of epichlorohydrin. Compared with epichlorohydrin derivatives, epoxy compounds with the following structure have excellent electrical characteristics because of the low ion concentration of impurities (please read the precautions on the back before filling this page).
tr-· · ~ · · ·⑷ ~ · · · (5) 經濟部智慧財產局員工消費合作社印製 式中,X爲表示環氧基和/或乙烯基,p爲表示1〜 1 0 0之整數。但,於分子中含有至少1個環氧基。 特別地,耐遷移性之點,以分子中具有下述一般式( 3 )所示部分構造之環氧化合物中,下述式(a )及(b )所示之官能基數目之比(a)/(b)爲平均1 ·〇〜 4 · 0爲佳。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 530079 A7 經濟部智慧財產局員工消費合作社印製 B7____ 14五、發明說明() A— 189、A— 1100、A— 1120 及 A — 1160、東芝 Silicone (株)製之 TSL — 8310 、TSL — 8311、TSL - 8320、 TSL - 8395、TSL-8325、 TSL-8331、TSL - 8340、 TSL-8345. TSL-8380. TSL-8350、 TSL — 8355、 TSL — 8370、及 TLS — 8375 等。 於如上說明之本發明之活化能線硬化性樹脂組成物中 ,可於如前述之成分以外適當配合添加劑。例如,由減低 硬化收縮率、減低熱膨脹率、提高尺寸安定性、提高彈性 率、調整粘度、提高熱傳導率、提高強度、提高靭性等之 觀點而言,則可配合有機或無機之充塡劑。此類充塡劑可 使用聚合物、陶瓷、金屬、金屬氧化物、金屬鹽等,關於 形狀可爲粒子狀、纖維狀等,並無特別限定。尙,於配合 上述聚合物時,可不爲充塡劑型式而爲以聚合物摻混物、 聚合物合金型式,於活化能線硬化性樹脂組成物中溶解、 半溶解或微分散亦可。 又,本發明之活化能線硬化性樹脂組成物亦可配合有 機或無機之顏料、染料等著色劑做爲添加劑,並供於塗料 、油墨等之用途。 更且,本發明之活化能線硬化性樹脂組成物可適當配 合柔軟性賦與劑、可塑劑、難燃化劑、保存安定劑、抗氧 化劑、紫外線吸收劑、觸變賦與劑、分散安定劑、流動性 4^- (請先閱讀背面之注意事項再填寫本頁) 裝 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 530079 A7 B7 可使用適當之有機溶劑等之 度。 以下,示出實施例及比較例具體說明本發明,但本發 明並非限定於下述實施例。 用之活化能量線硬化性樹脂(A - 1 )〜(A - 3 )爲具 有下述之化學構造。 五、發明說明(15 ) 賦與劑等做爲其他的添加劑 本發明之活化能線硬化 之方法,於基材上塗佈,並 線’令具有乙嫌性不飽和鍵 硬化。 活化能線之照射光線以 壓水銀燈、超高壓水銀燈、 其他,激光光線、電子射線 量線。 尙,本發明之樹脂組成 任一型態。以液狀使用時, 性樹脂組成物可依據公知慣用 對所形成之塗佈層照射活化能 之化合物進行光自由基聚合而 低壓水銀燈、中壓水銀燈、高 氣燈或金屬鹵素燈等爲適當。 等亦可利用做爲曝光用活化能 物可使用液狀、糊狀及薄膜狀 爲了調整樹脂組成物之粘度, 公知的粘度調整劑予以調整粘 尙,以下之實施例及比較例所 先 閱 讀 背 之 注 事 項 填 本 頁tr- · · ~ · · · ⑷ ~ · · · (5) In the printed format of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, X is epoxy and / or vinyl, and p is 1 to 1 0 0 Integer. However, at least one epoxy group is contained in the molecule. In particular, the point of migration resistance is the ratio of the number of functional groups represented by the following formulae (a) and (b) in an epoxy compound having a partial structure represented by the following general formula (3) in the molecule (a ) / (b) is preferably on average 1 · 0 to 4 · 0. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 530079 A7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs B7____ 14 V. Description of the invention () A—189, A—1100, A—1120 And A — 1160, TSL — 8310 made by Toshiba Silicone Co., Ltd. — TSL — 8311, TSL — 8320, TSL — 8395, TSL — 8325, TSL — 8331, TSL — 8340, TSL — 8345, TSL — 8380, TSL — 8350, TSL — 8355, TSL — 8370, and TLS — 8375. In the activated-energy-ray-curable resin composition of the present invention described above, additives may be appropriately blended in addition to the aforementioned components. For example, organic or inorganic fillers can be blended from the viewpoints of reducing hardening shrinkage, reducing thermal expansion, improving dimensional stability, increasing elasticity, adjusting viscosity, improving thermal conductivity, increasing strength, and improving toughness. Polymers, ceramics, metals, metal oxides, metal salts, and the like can be used as such fillers. The shape may be particulate, fibrous, or the like, and is not particularly limited. That is, when blending the above polymers, it may be a polymer blend type or a polymer alloy type instead of a filling agent type, or it may be dissolved, semi-dissolved, or microdispersed in an active energy ray-curable resin composition. In addition, the active energy ray-curable resin composition of the present invention may be blended with colorants such as organic or inorganic pigments and dyes as additives, and used for coatings, inks, and the like. Furthermore, the active energy ray-curable resin composition of the present invention can be appropriately blended with a softener, a plasticizer, a flame retardant, a storage stabilizer, an antioxidant, an ultraviolet absorber, a thixotropic agent, and a dispersion stabilizer. Agent, fluidity 4 ^-(Please read the precautions on the back before filling this page) The size of this paper is applicable to China National Standard (CNS) A4 (210 X 297 mm) 530079 A7 B7 Appropriate organic solvents can be used, etc. Degree. Hereinafter, the present invention will be described in detail with examples and comparative examples, but the present invention is not limited to the following examples. The activated energy ray-curable resins (A-1) to (A-3) have the following chemical structures. V. Description of the invention (15) Additives as other additives The method of hardening the activation energy line of the present invention is coated on the substrate, and the wire is used to harden the ethylenically unsaturated bond. The light rays of the activation energy rays are pressure mercury lamps, ultra-high pressure mercury lamps, others, laser rays, and electron beams. Alas, the resin composition of the present invention is of any type. When used in a liquid state, the resin composition may be subjected to photoradical polymerization by irradiating the formed coating layer with activation energy, and low-pressure mercury lamps, medium-pressure mercury lamps, high-pressure lamps, or metal halide lamps are suitable. It can also be used as an active energy material for exposure. Liquid, paste, and film can be used. In order to adjust the viscosity of the resin composition, a known viscosity adjuster can be used to adjust the viscosity. The following examples and comparative examples are read first. Notes for this page
本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 530079 A7 __B7 五、發明說明(16 ) 〇This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) 530079 A7 __B7 V. Description of the invention (16)
OH 實施例1〜1 7 將表1及表2所示之各成分以指定比例,以攪拌裝置 混合,調製各種成分組成之活化能線硬化性樹脂組成物。 比較例1〜6 將表3所示之各成分以指定比例,以攪拌裝置混合, 調製各種成分組成之活化能線硬化性樹脂組成物。 -----------裝--- (請先閱讀背面之注意事項再填寫本頁) 訂· 經濟部智慧財產局員工消費合作社印製 Φ 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公f ) 530079 A7 ___ B7五、發明說明(21 ) 開始至短路爲止之時間。 經濟部智慧財產局員工消費合作社印製 (3 )密合性試驗(對玻璃基板): 於上述耐遷移性試驗(2 )中,以目視確認溫度8 5 °C、相對濕度8 5 %、D C 1 〇 〇 V下1 5 0 0小時後之 玻璃及銀電極與漿料之密合性。評價爲如下。 ◎:即使1 5 0 0小時以上,亦未察見浮起及剝離。 〇:1 5 0 0小時後於電極上察見若干浮起。 △:於1 5 0 0小時以內由玻璃上剝離。 X :硬化後立即剝離。 (4 )密合性試驗(對P E T薄膜) 對於1 Ο Ο // m厚之Ρ Ε Τ薄膜將各樹脂組成物,使 用塗佈器塗佈成膜厚3 5 // m,硬化後,將切出2 c m x 5 c m之薄膜做爲試驗片。將其投入溫度4 0 °C,相對濕 度9 5 %之恆溫恆濕槽中,評價剝離狀態。 ◎:即使1 0 0 0小時以上,亦未發生浮起及剝離。 〇:至1 0 0 0小時爲止並未發生浮起及剝離。 △:於1 0 0 0小時剝離。 X :硬化後立即發生剝離或於試驗片製作時發生剝離 (5 )彎曲 測定前述密合性試驗(4 )所製作之試驗片的彎曲量 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -----------裝— (請先閱讀背面之注意事項再填寫本頁) 訂 530079 A7 B7 99 五、發明說明() 0 ◎:彎曲量爲1mm以下,幾乎不彎曲。 〇:彎曲量爲2mm以下。 (請先閱讀背面之注意事項再填寫本頁) X:彎曲量爲2mm以上。 (6 )恢復性: 將各樹脂組成物於玻璃基板上適量塗佈且硬化之樣品 ,於甲基乙基酮中浸漬,並且測定可美麗剝離爲止之時間 。前述各試驗之結果分別示於表1〜表3。 如表1及表2所示之結果所闡明般,若根據本發明, 經由於光自由基聚合性之樹脂組成物中使用具有羥基和芳 香族環之單官能丙烯酸酯,則對於精細齒距之銀電極亦顯 示充分的電極保護效果,並且可實現對於玻璃和薄膜基材 等之密合性、及減低基材之彎曲。 經濟部智慧財產局員工消費合作社印製 又,得知①經由添加環氧樹脂則可取得更高之防止遷 移效果、②經由添加環氧樹脂、飽和聚酯樹脂、矽烷偶合 劑則可更加提高對於被粘體之密合性、③經由添加環氧樹 脂、飽和聚酯樹脂則可實現更加減低彎曲、④經由添加飽 和聚酯樹脂則可提高恢復性。 實施例1 8〜2 4、比較例7、8 將表4所示之各成分以指定比例,以攪拌裝置混合, 調整各種成分組成之活化能線硬化性樹脂組成物。 對於如此處理調製之各樹脂組成物,以前述評價方法 —---- 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公 530079 A7 ___B7 五、發明說明(23 ) 同樣之方法評價吸水率、耐遷移性、密合性(對玻璃基板 )。尙,各樹脂組成物爲使用紫外線照射裝置(Oak製作 所(株)金屬鹵素燈),以照射量2 0 0 0 m J / c m 2進 行硬化。 試驗結果合倂示於表4。 ---------:II _ -裝 i — (請先閱讀背面之注意事項再填寫本頁) · 經濟部智慧財產局員工消費合作社印製 本紙張又度適用中國國家標準(CNS)A4規格(210 X 297公釐) 530079 A7 _____B7 五、發明說明(25 ) 如表4所不之結果所闡明般,若根據本發明,於光自 由基聚合性之樹脂組成物中添加環氧樹脂做爲斥水性粘合 劑,對於精細齒距之銀電極亦可取得充分的電極保護效果 〇 又,得知①環氧樹脂中亦可經由使用離子殘渣少之構 造者,取得更高之防止遷移效果、②將交聯成分做爲官會g 基數1之自由基聚合成分,則可防止密合性降低、③經由 添加飽和聚酯樹脂,則可更加提高對於被粘體之密合性。 發明之效果 如以上所說明般,若根據本發明,則可維持紫外線硬 化系之樹脂組成物所具有之優點並解決其缺點,提供斥水 性和對於基材之密合性、耐遷移性亦優良之活化能線硬化 性樹脂組成物。 因此,本發明之活化能線硬化性樹脂組成物,比先前 之熱硬化系和室溫硬化系之樹脂組成物之作業性良好’極 爲有用於做爲對於各種被粘體之密合性、各種電極之防止 遷移效果優良之活化能線硬化型之粘合劑及塗層劑。 (請先閱讀背面之注意事項再填寫本頁) 裝 訂· 經濟部智慧財產局員工消費合作社印製 〇〇 Tv 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 第89127271號專利争諝案- 申請曰期 只Q 年 月 1Q R 案 號 «Q197971 類 別 C〇^L^3/d〇; ^Ί/〇^ 以上各欄由本局填註) 中文說明書修正頁民_私每1么月:¾作修正補充, A4 C4 530079 專利説明書 中 文 發明 名稱 英 文 姓 名 國 籍 活化能線硬化性樹脂組成物OH Examples 1 to 7 Each component shown in Tables 1 and 2 was mixed in a predetermined ratio with a stirring device to prepare an active energy ray-curable resin composition having various component compositions. Comparative Examples 1 to 6 Each component shown in Table 3 was mixed with a stirring device at a specified ratio to prepare an active energy ray-curable resin composition having various component compositions. ----------- Installation --- (Please read the notes on the back before filling out this page) Order Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Φ This paper size applies to Chinese national standards (CNS ) A4 specification (210 X 297 male f) 530079 A7 ___ B7 V. Description of invention (21) The time from the start to the short circuit. Printed (3) Adhesion test (for glass substrate) by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs: In the above migration resistance test (2), visually confirm the temperature of 85 ° C, relative humidity of 85%, DC Adhesion of glass and silver electrodes to paste after 1 500 hours at 1000 V. The evaluation was as follows. :: Even after 1500 hours or more, no floating or peeling was observed. 〇: After 15 hours, some floating was observed on the electrode. Δ: Peeled from the glass within 15 hours. X: Peel immediately after hardening. (4) Adhesion test (for PET film) For a resin film with a thickness of 1 〇 // // m thick, each resin composition is coated with a coater to a film thickness of 3 5 // m. After curing, A 2 cm x 5 cm film was cut out as a test piece. This was put in a constant temperature and humidity bath at a temperature of 40 ° C and a relative humidity of 95%, and the peeling state was evaluated. :: Floating and peeling did not occur even after 1000 hours or more. 〇: Floating and peeling did not occur until 1000 hours. Δ: Peeled at 1000 hours. X: Peeling occurs immediately after hardening or peeling occurs during test piece production (5) Bending measurement The amount of bending of the test piece produced by the aforementioned adhesion test (4) This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ----------- install— (Please read the precautions on the back before filling in this page) Order 530079 A7 B7 99 V. Description of the invention () 0 ◎: Bending amount is less than 1mm , Hardly bent. ○: The amount of bending is 2 mm or less. (Please read the precautions on the back before filling in this page) X: The bending amount is 2mm or more. (6) Restorability: A sample of each resin composition coated and hardened on a glass substrate in an appropriate amount was immersed in methyl ethyl ketone, and the time until beautiful peeling was measured. The results of the foregoing tests are shown in Tables 1 to 3, respectively. As clarified by the results shown in Tables 1 and 2, if a monofunctional acrylate having a hydroxyl group and an aromatic ring is used in the resin composition due to photo radical polymerization according to the present invention, the fine tooth pitch The silver electrode also exhibits sufficient electrode protection effects, and can achieve adhesion to glass, film substrates, and the like, and reduce bending of the substrate. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs and learned that ① higher migration prevention effects can be achieved by adding epoxy resin, ② more effective by adding epoxy resin, saturated polyester resin, and silane coupling agent Adhesion of the adherend, ③ By adding epoxy resin and saturated polyester resin, bending can be further reduced, and ④ By adding saturated polyester resin, recovery can be improved. Example 1 8 to 2 4. Comparative Examples 7 and 8 Each component shown in Table 4 was mixed with a stirring device at a specified ratio, and the activation energy ray-curable resin composition of each component composition was adjusted. For each resin composition processed and prepared in this way, the aforementioned evaluation method is adopted —---- This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 public 530079 A7 ___B7) V. Description of the invention (23) Evaluation by the same method Water absorption, migration resistance, and adhesion (to a glass substrate). Alas, each resin composition is an ultraviolet irradiation device (Oak Manufacturing Co., Ltd. metal halide lamp), and the irradiation amount is 20000 m J / cm 2 Hardening. The combined test results are shown in Table 4. ---------: II _ -install i — (Please read the precautions on the back before filling this page) · Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs The printed paper is also applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 530079 A7 _____B7 V. Description of the invention (25) As explained in the results shown in Table 4, if according to the present invention, in the light Adding an epoxy resin to the radically polymerizable resin composition as a water-repellent adhesive can also achieve sufficient electrode protection effects for silver electrodes with fine pitches. It is also known that ① it can also be used in epoxy resins. Structure with less ionic residue To achieve a higher migration prevention effect, ② use the cross-linking component as a radical polymerization component with a base group of 1 to prevent a decrease in adhesion, and ③ by adding a saturated polyester resin, it can further improve the resistance to adhesion. The effect of the invention is as described above. According to the present invention, the advantages of the UV-curable resin composition can be maintained and its disadvantages can be solved, and water repellency and adhesion to the substrate can be provided. 2. Active energy ray-curable resin composition that is also excellent in migration resistance. Therefore, the active energy ray-curable resin composition of the present invention has better workability than the conventional heat-curable and room-temperature-curable resin compositions. It is used as an active energy hardening type adhesive and coating agent with excellent adhesion to various adherends and various electrodes to prevent migration. (Please read the precautions on the back before filling this page) · Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 〇〇Tv This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) Patent No. 89127271 Case-Application date is only Q year 1Q R Case No. «Q197971 Category C〇 ^ L ^ 3 / d〇; ^ Ί / 〇 ^ The above columns are filled by this Office) The Chinese manual amendment page for the people _ 私 every 1 month : ¾ As a supplement, A4 C4 530079 Patent Specification Chinese Invention Name English Name Nationality Activation Energy Ray Hardening Resin Composition
RESIN COMPOSITION CURABLE WITH ACTINIC ENERGY RAY (1)柿沼惠子 0 有馬聖夫 (1)日本國埼玉縣熊谷市新堀一一五二一四九 裝 一 發明 一1^ 人 住、居所 (2)日本國埼玉縣川越市脇田本町二五一二一 丫(:一二〇四 訂 姓 名 (名稱) 國 籍 (1)太陽墨水製造股份有限公司 太陽ο牛製造株式会社 線 申請人 住、居所 (事務所) 代表人 姓 名 (1)日本 (1)日本國東京都練馬區羽沢二丁目七番一號 (1)川原光雄 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 530079RESIN COMPOSITION CURABLE WITH ACTINIC ENERGY RAY (1) Keinuma Keiko 0 Arima Seifu (1) Shinjo, Kumagaya City, Saitama Prefecture, Japan 1152 2149, 1 Invention 1 ^ People's Residence, Residence (2) Saitama Prefecture, Japan Kawagoe City, 2521, Wakada Honmachi (: 1240 Name (Name) Nationality (1) Taiyo Ink Manufacturing Co., Ltd. Taiyoo Cow Manufacturing Co., Ltd. Line Applicant Residence, Residence (Office) Name of Representative (1) Japan (1) No. 7-chome, Hajimeji-chome, Nerima-ku, Tokyo, Japan (1) Mitsuo Kawahara This paper is sized for the Chinese National Standard (CNS) A4 (210X297 mm) 530079
A7 Q\ \l S __B7 1 . 五、發明説明(3 ) 用以解決課題之手段 (請先閱讀背面之注意事項再填寫本頁) 爲了達成前述目的,根據本發明,則爲提供含有(A )活化能線硬化性樹脂及(B )光自由基聚合引發劑之活 化能線硬化性樹脂組成物,於第一態樣中,上述(A )成 分之5 0重量%以上爲(A >)分子內具有一個自由基聚 合性之乙烯性不飽和雙鍵、與一個以上羥基及芳香族環之 活化能線硬化性樹脂組成物爲其特徵,於第二態樣中,上 述(A )成分爲(A 〃)於分子內具有一個乙烯性不飽和 雙鍵之活化能線硬化性樹脂,且含有(C )環氧樹脂爲其 特徵。 於前述第二態樣中,必須含有環氧樹脂(C ),但較 佳令第一態樣亦含有環氧樹脂(C )。環氧樹脂(C )以 軟化點爲4 0 °C以上,於室溫下爲半固型或固型狀態者爲 佳。 於更佳之態樣中,本發明之活化能線硬化性樹脂組成 物爲含有(D )飽和聚酯樹脂、(E )乙烯基三畊衍生物 及(F )矽烷偶合劑所組成群中選出至少一種。 經濟部智慧財產局員工消費合作社印製 含有如前述成分之本發明之活化能線硬化性樹脂組成 物,爲此先前之熱硬化系和室溫硬化系之樹脂組成物之作 業性良好,且斥水性,對於各種被粘體之密合性、各種電 極之防止遷移效果優良。 發明之實施塑熊 本發明之活化能線硬化性樹脂組成物於第一態樣中, 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -6 - 530079 A7 B7 五、發明説明(4 ) (請先閱讀背面之注意事項再填寫本頁) 活化能線硬化性樹脂(A )爲以分子內具有一個自由基聚 合性之乙烯性不飽和雙鍵、與一個以上羥基及芳香族環之 活化能線硬化性樹脂(A /)做爲必須之構成成分,且( A )成分含有5 0重量%以上爲其特徵。 此活化能線硬化性樹脂(A >)爲將參與光硬化反應 之官能基(乙烯性不飽和雙鍵)數目限定於1分子中1個 ,使得光自由基聚合時之硬化收縮的影響壓至最小限度, 有助於防止密合性的降低。另外,羥基之存在爲大有助於 與基材之密合性,且芳香族環之存在爲有助於耐水性。 上述之活化能線硬化性樹脂(A /)可使用工業上可 輕易取得之單官能環氧(甲基)丙烯酸酯類,可根據一般 的製法而將單官能環氧樹脂之縮水甘油基予以(甲基)丙 烯酸酯化。具體例可列舉苯基縮水甘油醚、鄰-聯苯基縮 水甘油醚、萘基縮水甘油醚等之(甲基)丙烯酸酯化物。 特別,新穎之活化能線硬化性樹脂之下述一般式(1 )或(2 )所示之(甲基)丙烯酸酯化合物,具體而言鄰 -聯苯基縮水甘油醚、萘基縮水甘油醚等之(甲基)丙烯 酸酯化物爲於斥水性方面優良。 經濟部智慧財產局員工消費合作社印製A7 Q \ \ l S __B7 1. V. Description of the invention (3) Means to solve the problem (please read the notes on the back before filling this page) In order to achieve the aforementioned purpose, according to the present invention, it is provided to contain (A ) The activation energy ray-curable resin composition of the activation energy ray-curable resin and (B) the photoradical polymerization initiator, in a first aspect, 50% by weight or more of the (A) component is (A > It is characterized by having a radically polymerizable ethylenically unsaturated double bond, one or more hydroxyl groups and an activation energy ray-curable resin composition of an aromatic ring. In the second aspect, the (A) component It is (A 〃) an activation energy ray hardening resin having an ethylenically unsaturated double bond in the molecule, and it is characterized by containing (C) epoxy resin. In the aforementioned second aspect, epoxy resin (C) must be contained, but it is preferable that the first aspect also contains epoxy resin (C). The epoxy resin (C) preferably has a softening point of 40 ° C or higher and is semi-solid or solid at room temperature. In a more preferred aspect, the active energy ray-curable resin composition of the present invention is selected from the group consisting of (D) saturated polyester resin, (E) vinyl tri-cultivated derivative, and (F) silane coupling agent. One. The consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed the active energy ray-curable resin composition of the present invention containing the aforementioned ingredients. For this reason, the previous heat-curable and room-temperature-curable resin compositions have good workability and water repellency. Good adhesion to various adherends and excellent migration prevention effect for various electrodes. Implementation of the invention Plastic bear The active energy ray-curable resin composition of the present invention is in the first aspect. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mm) -6-530079 A7 B7 V. Description of the invention (4) (Please read the precautions on the back before filling in this page) The activation energy ray hardening resin (A) is an ethylenically unsaturated double bond with a free radical polymerizability in the molecule, and more than one hydroxyl group and aromatic The activation energy ray-curable resin (A /) of the ring is an essential constituent, and it is characteristic that the component (A) contains 50% by weight or more. The activation energy ray hardening resin (A >) is to limit the number of functional groups (ethylenically unsaturated double bonds) participating in the photohardening reaction to one in one molecule, so that the effect of hardening shrinkage during photoradical polymerization is reduced. To a minimum, it helps prevent a decrease in adhesion. In addition, the presence of a hydroxyl group greatly contributes to adhesion to a substrate, and the presence of an aromatic ring contributes to water resistance. The above-mentioned activation energy ray-curable resin (A /) may be a monofunctional epoxy (meth) acrylate which is easily available in industry, and the glycidyl group of the monofunctional epoxy resin may be given according to a general manufacturing method ( (Meth) acrylated. Specific examples include (meth) acrylates such as phenyl glycidyl ether, o-biphenyl glycidyl ether, and naphthyl glycidyl ether. Particularly, the (meth) acrylate compound represented by the following general formula (1) or (2) of the novel activation energy ray-curable resin, specifically, o-biphenyl glycidyl ether, naphthyl glycidyl ether The (meth) acrylate is excellent in water repellency. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs
本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 530079 A7 以 Β7 i ^ 五、發明説明(7 ) 水甘油醚、萘基縮水甘油醚、苯基縮水甘油醚等之(甲基 )丙烯酸酯化物。 (請先閱讀背面之注意事項再填寫本頁) 尙,在對於組成物之硬化收縮不會造成不良影響之範 圍內,即在(A )成分全體未滿2 0重量%之範圍內,則 可配合分子內具有二個以上乙烯性不飽和雙鍵之活化能線 硬化性樹脂。 光自由基聚合引發劑(B )若爲可經由活化能線令前 述活化能線硬化性樹脂(A )進行自由基聚合之化合物即 可,並無特別限定。光自由基聚合引發劑(B )之具體例 可列舉2 ,4 —二甲基噻吨酮、2,4 一二乙基噻吨酮、 經濟部智慧財產局員工消費合作社印製 2 -氯基噻吨酮、2,4 -二異丙基噻吨酮等之噻吨酮類 ;2 —甲基蒽S昆、2 —乙基蒽醌、2 -第二丁基葱醌、1 一氯基蒽醌等之蒽醌類;4,4 / 一雙二乙胺基二苯酮等 之二苯酮類;1 一經基-環己基—苯基酮、2 -經基一 2 一甲基一 1—苯基丙烷一 1—酮等之α -羥基酮類;2, 4,6 -三甲基苯甲醯二苯膦氧化物等之(雙)醯基膦氧 化物類;雙(2,4 —環戊二烯一 1 一基)雙(2,6 — 二氟一 3 -(1Η -吡咯一 1—基)苯基)鈦等之鈦素體 類;2 —苄基一 2 -二甲胺基—1— (4 —嗎啉苯基)丁 酮—1 ,2 —甲基-1—〔4 —(甲硫基)苯基〕—2 — 嗎啉丙烷—1 一酮等胺基乙醯苯類;苄基、4 ’ 4 > 一二 甲氧苄基、梓腦-醌等之α -雙酮類等。 又,上述光自由基聚合引發劑(Β )亦可依據所使用 之光源等,倂用數種,其可列舉例如2 -甲基- 1 -〔 4 本纸張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) -10- 530079 A7 B7This paper size applies to China National Standard (CNS) A4 (210X297 mm) 530079 A7 to B7 i ^ V. Description of the invention (7) Water glyceryl ether, naphthyl glycidyl ether, phenyl glycidyl ether (methyl) ) Acrylate. (Please read the precautions on the back before filling in this page) 尙 As long as it does not adversely affect the hardening and shrinkage of the composition, that is, within the range of less than 20% by weight of the entire (A) component, it may be Active energy ray hardening resin with two or more ethylenically unsaturated double bonds in the molecule. The photoradical polymerization initiator (B) is not particularly limited as long as it is a compound capable of radically polymerizing the aforementioned activation energy ray-curable resin (A) via an activation energy ray. Specific examples of the photo-radical polymerization initiator (B) include 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chloro group printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs Thioxanthones such as thioxanthone, 2,4-diisopropylthioxanthone, etc .; 2-methylanthracene Squin, 2-ethylanthraquinone, 2-second butyl onionquinone, 1-chloro group Anthraquinones such as anthraquinones; 4,4 / benzophenones such as bisdiethylaminobenzophenone; 1 trimethyl-cyclohexyl-phenyl ketone, 2-trimethyl-1, 2-methyl-1 Α-Hydroxyketones such as phenylpropane-l-one; (Bis) phosphoranyl oxides such as 2,4,6-trimethylbenzidine diphenylphosphine oxide; bis (2,4 —Cyclopentadiene-1, 1-yl) bis (2,6—difluoro-3— (1 吡 -pyrrole-1—yl) phenyl) titanium, etc .; 2—Benzyl—2—dimethyl Amino-1— (4-morpholinylphenyl) butanone-1, 2-methyl-1— [4- (methylthio) phenyl] -2—morpholinpropane-1 monoketone and other aminoethyl groups Benzenes; benzyl, 4'4 > α-diketones such as dimethoxybenzyl, catalin-quinone and the like. In addition, the aforementioned photo-radical polymerization initiator (B) may be used in several types depending on the light source used, for example, 2-methyl-1-[4 This paper size is applicable to Chinese National Standards (CNS) Α4 specification (210X297 mm) -10- 530079 A7 B7
五、發明説明(8 一(甲硫基)苯基〕一 2 -嗎啉丙院一 1 一酮等之胺基乙 醯苯類與噻吨酮類或胺基乙醯苯之組合;1 -羥基-環己 基一苯基酮等之^ 一羥基酮類與2,4,6 一三甲基苯甲 之組合等。更 中,加入三乙 甲基丙烯酸、 醯二苯膦氧化物等之(雙)醯基膦氧化物類 且可於此些公知慣用之光自由基聚合引發劑 醇胺等之三級胺、二甲胺基苯甲酸異戊酯、 二甲胺基乙酯等之光引發助劑。 於如前述之光自由基聚合引發劑(B )中,亦以2 -羥基一 2 -甲基一 1 一苯基丙烷一 1—酮、1—羥基—環 己基苯基酮、1 一(4 —異丙基苯基)—2 -羥基—2 — 甲基丙烷—1—酮、2 —甲基—1—〔4 一(甲硫基)苯 基〕一 2 -嗎啉丙基—1—酮、2 —苄基一 2 -二甲胺基 一 1 一(4 一嗎啉苯基)丁酮一 1—等之苯基酮系化合物 、雙(2 ,4 ,6 -三甲基苯甲醯基)苯膦氧化物等之( (請先閲讀背面之注意事項再填寫本頁) •裝· 訂 經濟部智慧財產局員工消費合作社印製 雙)醯基膦氧化物類和鈦素體化合物爲佳。 此些光自由基聚合引發劑(B )之配合 述活化能線硬化性樹脂(A ) 1 0 0重量份 份以上、2 0重量份以下爲適當,較佳爲〇 份。光自由基聚合引發劑(B )之配合量未 份,則無法以活化能線充分進行光硬化,另 超過2 0重量份大量配合,則因其硬化爲呈 不經濟的,並且反而恐於組成物之光硬化後 物之特性降低。 於本發明之活化能線硬化性樹脂組成物 量,相對於前 以0 . 5重量 • 5〜5重量 滿0 · 5重量 一方面,即使 飽和狀態故爲 殘存且令硬化 之第二態樣中 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -11 - 530079 A7 B7 五、發明説明(11)V. Description of the invention (8- (methylthio) phenyl]-2 -morpholine-propanone- 1 Acetones such as ketones and thioxanthone or aminoacetophenone; 1- Hydroxy-cyclohexyl-phenyl ketone, etc., a combination of ^ one hydroxy ketones and 2,4,6 trimethyl benzoate, etc. In addition, triethyl methacrylic acid, fluorene diphenyl phosphine oxide, etc. ( Di) fluorenylphosphine oxides and photoinitiation of tertiary amines such as alcohol amines, dimethylaminoisobenzoate, dimethylaminoethyl etc., which are known and commonly used photoradical polymerization initiators In the photoradical polymerization initiator (B) as mentioned above, 2-hydroxy-1, 2-methyl-1, 1-phenylpropane, 1-one, 1-hydroxy-cyclohexylphenyl ketone, 1 Mono (4-isopropylphenyl) -2-hydroxy-2—methylpropane-1-one, 2-methyl-1- [4-mono (methylthio) phenyl] -2-morpholinyl —1-ketone, 2-benzyl-2-dimethylamino—1- (4-morpholinophenyl) butanone—1- and other phenyl ketone compounds, bis (2,4,6-trimethyl) Benzyl amidino) phenylphosphine oxide, etc. (Please read the precautions on the back before filling out this page) • Binding and printing of double-printed fluorenyl phosphine oxides and titanium compounds by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. These photo-radical polymerization initiation The blending of the agent (B) is preferably 100 parts by weight or more and 20 parts by weight or less of the active energy ray-curable resin (A), and preferably 0 parts. The compounding amount of the photoradical polymerization initiator (B) If it is not in the amount, the light hardening cannot be sufficiently performed with the activation energy line, and if it is compounded in a large amount exceeding 20 parts by weight, it is uneconomical because it is hardened, and on the contrary, the properties of the composition after light hardening may be reduced. The amount of the active energy ray hardening resin composition of the invention is 0.5 weight • 5 to 5 weight and 0 5 weight relative to the former. On the one hand, even in the saturated state, it remains and hardens in the second aspect of the paper. Applicable to China National Standard (CNS) A4 specification (210X 297 mm) -11-530079 A7 B7 V. Description of invention (11)
〇一 (a) CH—CH2 \ / 〇〇 一 (a) CH—CH2 \ / 〇
0— (b) CH-CH; 經濟部智慧財產局員工消費合作社印製 此類環氧樹脂可列舉Diacel化學工業(株)製之 Ceroxide 3150、Ceroxide 2085 等。 具有上述一般式(3 )所示官能基之聚醚型環氧樹脂 ,可令具有活性氫之化合物與4 -乙烯基環己烯1 -氧化 物、或視需要具有一個其他環氧基之化合物’於觸媒存在 下反應所得之聚醚化合物之乙烯基,以過醋酸等之過酸類 和過氧化氫類等之氧化劑予以部分或完全地環氧化則可取 得。此時,亦可導入少量的乙醯基等。具有活性氫之化合 物爲醇類,可列舉例如直鏈狀或分支鏈狀之脂族醇,較佳 爲三羥曱基丙烷等之多元醇、和苯酚類、羧酸類、胺類、 硫醇類。於此些具有活性氫之化合物中,並不限於僅導入 1個前述一般式(3)所示之官能基,且可導入數個。但 ,於導入數個之情形中,若前述官能基之重覆部分數目過 多,則變成熔點高之化合物,故合計數以1 0 0個以下爲 佳。此外,亦可使用特公平7 - 2 5 8 6 4號記載之其他 聚醚型環氧樹脂。關於此類聚醚型環氧樹脂因已於上述公 報中詳細說明,故其詳細參照上述公報。 此些環氧樹脂(C )之配合量,相對於前述活化能線 硬化性樹脂(A ) 1 〇 〇重量份,以5重量份以上,6 0 重量份以下爲適當,較佳爲5〜4 0重量份。環氧樹脂( (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -14- 530079 A7 1¾ iL 2Τ _ B7_:_- 五、發明説明(12) C )之配合量未滿5重量份,則難取得前述效果,另一方 面,超過6 0重量份大量配合亦因所期待之效果呈現飽和 (請先閱讀背面之注意事項再填寫本頁) 狀態,故爲不經濟的,又,反而恐妨礙組成物的光硬化性 〇 本發明之活化能線硬化性樹脂組成物爲於上述各成分 中,再加上配合飽和聚酯樹脂(D )爲佳。此飽和聚酯樹 月旨(D ),若爲其有可提高與被粘體之密合性效果者即可 ,並無特別限定。飽和聚酯樹脂(D )之具體例可列舉東 洋紡Viron系列(東洋紡績(株)製)之Viron 2 0 0、 220、240、245、270、280、290、 296、300、500、530、550、560、 600、630、650、BX1001、GK110、 130、140、150、180、19 0、250、 330、590、640、680、780、810、 8 8 0、8 9 0 等。 更且,此類飽和聚酯薄膜除了提高密合性之效果以外 ,亦具有令硬化物由基材剝離之行爲容易進行之恢復性優 良之特性。 經濟部智慧財產局員工消費合作社印製 飽和聚酯樹脂(D )之配合量,相對於前述活化能線 硬化性樹脂(A ) 1 0 0重量份,以5重量份以上,5 0 重量份以下爲適當,較佳爲5〜3 0重量份。飽和聚酯樹 月旨(D )之配合量未滿5重量份,則難取得前述效果’另 一方面,即使大量配合超過5 0重量份’亦因所期待之效 果呈現飽和狀態,故爲不經濟的’又,反而恐妨礙組成物 本紙張尺度適用中國國家標準(CMS ) A4規格(2丨〇X 297公釐) -15- 530079 A7 _ B7 分丨 五、發明説明(13) 的光硬化性,令硬化物之特性降低。 (請先閱讀背面之注意事項再填寫本頁) 本發明之活化能線硬化性樹脂組成物爲於上述成分中 ,再加上配合乙烯基三畊衍生物(E )爲佳。使用此乙烯 基三哄衍生物(E )之目的爲用以有效防止金屬電極之遷 移。 乙烯基三啡衍生物(E )之具體例可列舉2,4 一二 胺基—6 —乙烯基一 S —三啡、2,4 —二胺基一 6 —甲 基丙烯醯氧基- S -三啡及其異氰脲酸加成物。此些乙烯 基三畊化合物或其衍生物(E )爲單獨或以二種以上之混 合物型式供使用。 此些乙烯基三畊衍生物(E )之配合量,相對於前述 活化能線硬化性樹脂(A ) 1 〇 〇重量份,以〇 . 5〜 20重量份爲適當,較佳爲〇·5〜5重量份。乙烯基三 畊衍生物(E )之配合量未滿〇 . 5重量份,則難充分提 高耐遷移效果,另一方面,即使大量配合超過2 0重量份 ,亦因所期待之效果呈現飽和狀態,故爲不經濟的,又, 反而恐於組成物之光硬化後殘存,令硬化物之特性降低。 經濟部智慧財產苟員工消費合作社印製 本發明之活化能線硬化性樹脂組成物可視所需,含有 矽烷偶合劑(F )。加入矽烷偶合劑(F )之目的爲提高 與基材,特別與玻璃之密合性。矽烷偶合劑(F )若爲可 提高與基材之密合性即可,並無特別限定。 矽烷偶合劑(F )之具體例可列舉日本Unica (株)製 之 A-143、A-150、A- 151、A-171、 A — 172、A — 174、A— 186、A— 187、 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -16- 530079 A7 B7 五、發明説明(17)0— (b) CH-CH; Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economics. Examples of such epoxy resins include Ceroxide 3150 and Ceroxide 2085 manufactured by Diacel Chemical Industry Co., Ltd. The polyether type epoxy resin having the functional group represented by the above general formula (3) can make a compound having active hydrogen and 4-vinylcyclohexene 1-oxide, or a compound having one other epoxy group as necessary 'The vinyl group of the polyether compound obtained by the reaction in the presence of a catalyst can be obtained by partial or complete epoxidation with peracids such as peracetic acid and hydrogen peroxide. In this case, a small amount of ethenyl or the like may be introduced. The compounds having active hydrogen are alcohols, and examples thereof include linear or branched aliphatic alcohols, preferably polyhydric alcohols such as trihydroxymethylpropane, and phenols, carboxylic acids, amines, and thiols. . Among these compounds having active hydrogen, it is not limited to the introduction of only one functional group represented by the aforementioned general formula (3), and several may be introduced. However, in the case where several are introduced, if the number of the overlapping portions of the aforementioned functional group is too large, it will become a compound with a high melting point, so the total count is preferably 100 or less. In addition, other polyether-type epoxy resins described in Japanese Patent No. 7-2 5 8 6 4 may be used. Since such a polyether-type epoxy resin has been described in detail in the aforementioned bulletin, it is referred to the aforementioned bulletin in detail. The compounding amount of these epoxy resins (C) is preferably 5 parts by weight or more and 60 parts by weight or less with respect to 1,000 parts by weight of the activation energy ray-curable resin (A), and preferably 5 to 4 parts. 0 parts by weight. Epoxy resin ((Please read the precautions on the back before filling in this page) The paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) -14- 530079 A7 1¾ iL 2T _ B7 _: _- V. Invention Note (12) C) If the blending amount is less than 5 parts by weight, it is difficult to achieve the aforementioned effect. On the other hand, a large amount of more than 60 parts by weight is also saturated due to the expected effect (please read the precautions on the back before filling in This page) state is not economical, and it may interfere with the photo-curability of the composition. The activation energy ray-curable resin composition of the present invention is added to the above components, and a saturated polyester resin ( D) is better. The purpose of this saturated polyester tree (D) is not particularly limited as long as it has an effect of improving the adhesion with the adherend. Specific examples of the saturated polyester resin (D) include Viron 2 0 0, 220, 240, 245, 270, 280, 290, 296, 300, 500, 530, and 550 of the Toyobo Viron series (manufactured by Toyobo Co., Ltd.). , 560, 600, 630, 650, BX1001, GK110, 130, 140, 150, 180, 190, 250, 330, 590, 640, 680, 780, 810, 8 8 0, 8 9 0, etc. Furthermore, in addition to the effect of improving the adhesiveness of such saturated polyester films, they also have excellent recovery properties that allow the cured product to be easily peeled from the substrate. The blending amount of the saturated polyester resin (D) printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is more than 5 parts by weight and less than 50 parts by weight relative to the aforementioned active energy ray-curable resin (A) 100 parts by weight As appropriate, it is preferably 5 to 30 parts by weight. It is difficult to achieve the aforementioned effect if the blending amount of saturated polyester tree (D) is less than 5 parts by weight. On the other hand, even if it is blended in a large amount exceeding 50 parts by weight, it is saturated because of the expected effect, so it is not necessary. It is economical, and it may prevent the composition of the paper from being applied to the Chinese National Standard (CMS) A4 specification (2 丨 〇X 297mm) -15- 530079 A7 _ B7 points 丨 Fifth, the light hardening of the invention (13) Properties, reducing the properties of the hardened material. (Please read the precautions on the back before filling out this page) The active energy ray-curable resin composition of the present invention is in the above-mentioned components, and it is better to add a vinyl Sanka derivative (E). The purpose of using this vinyl trioxane derivative (E) is to effectively prevent migration of metal electrodes. Specific examples of the vinyltriphine derivative (E) include 2,4-diamino-6-vinyl-S-triphine, 2,4-diamino-6-methacryloxy-S -Trimorph and its isocyanurate adduct. These vinyl-based three-farming compounds or their derivatives (E) are provided for use alone or in a mixture of two or more kinds. The blending amount of these vinyl three-cultivated derivatives (E) is preferably 0.5 to 20 parts by weight, and more preferably 0.5 to 50 parts by weight of the activation energy ray-curable resin (A). ~ 5 parts by weight. It is difficult to sufficiently improve the migration resistance effect when the compounding amount of the vinyl trident derivative (E) is less than 0.5 parts by weight. On the other hand, even if the compounding amount exceeds 20 parts by weight, the expected effect is saturated. Therefore, it is not economical, and, on the contrary, it is feared that the composition will remain after light hardening, which will reduce the characteristics of the hardened material. Printed by the Intellectual Property of the Ministry of Economic Affairs and the Consumers' Cooperative, the activated energy ray-curable resin composition of the present invention may contain a silane coupling agent (F) as required. The purpose of adding the silane coupling agent (F) is to improve the adhesion with the substrate, especially with glass. The silane coupling agent (F) is not particularly limited as long as it can improve the adhesion to the substrate. Specific examples of the silane coupling agent (F) include A-143, A-150, A-151, A-171, A-172, A-174, A-186, A-187, manufactured by Unica Co., Ltd., Japan. This paper size applies to Chinese National Standard (CNS) A4 specification (210X297mm) -16- 530079 A7 B7 V. Description of invention (17)
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7 B ^1¾修a 0 五、發明説明(18) 表2 組成(重量份)及特性 實施例 10 11 12 13 14 15 16 17 A A-l 100 100 100 100 100 100 100 100 A-2 — A-3 — k" ΡΕΑ*υ — L-4*2) — — — — — — 一 — A" TMPTA*3) 一 — — — — 一 — — B IRUGACURE 184*4) 3 3 3 3 3 3 3 3 C YX-4000*5) EOCN 1020*6) — — 15 — — 15 70 — Ceroxide 3150*7) — — — 15 — — — — D Viron 200*8) 10 — — — 10 10 — 65 F A-174*9) — 1 — 1 1 1 — — 吸水率(%) 0.30 0.32 0.28 0.26 0.30 0.2 0.36 0.38 耐遷移性(hr) 1000 1000 1200 1500 1000 1200 800 800 密合性 玻璃 〇 ◎ 〇 ◎ ◎ ◎ Δ Δ PET ◎ 〇 ◎ ◎ ◎ ◎ Δ Δ 彎曲 ◎ 〇 ◎ ◎ ◎ ◎ 〇 〇 恢復性(分) 5 15 5 10 5 5 10 5 備*1)丙烯酸苯氧基乙酯 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 考*2)2-苯基苯酚氧基矽烷加成物單丙烯酸酯(新中村化學(株)製) *3)三丙烯酸三羥甲基丙烷酯 *4)Coba Specialty Chemicals(株)製光自由基聚合弓丨發劑:1-經基-環己基-苯基酮 *5)油化Shell Epoxy(株)製聯苯酚型固型環氧樹月旨 *6)日本化藥㈱)製鄰-甲苯酚酚醛淸漆之聚縮水甘油醚 *7)Diacd化學工業(株)製2,2-(羥甲基)小丁醇之1,2-環氧-4(2』f院基)環己酮加成 物 *8凍洋紡織株)製飽和聚酯棚旨 *9)日本Umca(株)製矽烷偶合劑:r -甲基丙烯氧丙基三甲氧基矽烷__ 本紙張尺度適用中國國家標準(CNS ) A4規格(2】0X297公釐) -21 - 530079 A7 B7 丨f· 五、發明説明(I9) 表3 組成(重量份)及特性 比較例 1 2 3 4 5 6 A A-l — — — 40 — A-2 — — — 40 — — A-3 — — — — — 40 Ar/ PEA*1) — 10 — 60 — — L-4*2) — — 100 — — 60 A7/ tmpta*3) 100 — — — 60 — B IRUGACURE 184*4) 3 3 3 3 3 3 C YX-4000*5) — — — — — — EOCN 1020*6) — — — — — — Ceroxide 3150+7) — — — — — — D Viron 200*8) — — — — — — F A-174*9) — — — — — — 吸水率(%) 0.21 0.32 0.26 0.27 0.26 0.28 耐遷移性(hr) — 800 500 800 — 600 密合性 玻璃 X Δ Δ Δ X Δ PET X X X X X X 彎曲 X 〇 X 〇 X X 恢復性(分) — 15 15 15 — 15 備*1)丙烯酸苯氧基乙酯 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 考*2)2-苯基苯酚氧基矽烷力喊物單丙烯酸酯(新中村化學(株)製) *3)三丙烯酸三羥曱基丙烷酯 *4)Coba Specialty Chemicals(株)製光自由基聚合引發劑:1-羥基-環己基-苯基酮 *5)油化Shell Epoxy(株)製聯苯酚型固型環氧樹脂 *6)日本化藥(株)製鄰-甲苯酚酚醛淸漆之聚縮水甘油醚 *7)Diacel化學工業(株)製2,2-(羥甲基)小丁醇之1,2-環氧-4(2馮院基)環己酮加成 物 *8谏洋紡績(株)製飽和聚酯樹月旨 *9)曰本Umca(株)製矽烷偶合劑:r -甲基丙烯氧丙基三甲氧基矽烷_ 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -22- 530079 A7 ㈣农 B7 五、發明説明(2〇) (請先閱讀背面之注意事項再填寫本頁) 對於如此調製之各樹脂組成物,評價吸水率、耐遷移 性、密合性、彎曲、及修復性。評價方法爲如下。尙,各 樹脂組成物爲使用紫外線照射裝置(Oak製作所(株)金屬 鹵素燈),以照射量2 〇 〇 〇 m J / c m 2予以硬化。 (1 )吸水率:7 B ^ 1¾ 修 a 0 V. Description of the invention (18) Table 2 Composition (parts by weight) and characteristics Example 10 11 12 13 14 15 16 17 A Al 100 100 100 100 100 100 100 100 A-2 — A-3 — K " ΡΕΑ * υ — L-4 * 2) — — — — — — One — A " TMPTA * 3) One — — — — One — — B IRUGACURE 184 * 4) 3 3 3 3 3 3 3 3 C YX-4000 * 5) EOCN 1020 * 6) — — 15 — — 15 70 — Ceroxide 3150 * 7) — — — 15 — — — — D Viron 200 * 8) 10 — — — 10 10 — 65 F A-174 * 9) — 1 — 1 1 1 — — Water absorption (%) 0.30 0.32 0.28 0.26 0.30 0.2 0.36 0.38 Migration resistance (hr) 1000 1000 1200 1500 1000 1200 800 800 Adhesive glass 〇 ◎ ○ ◎ ◎ Δ Δ Δ PET ◎ ○ ◎ ◎ ◎ Δ Δ Bend ◎ ○ ◎ ◎ ◎ ◎ 〇 Recoverability (minutes) 5 15 5 10 5 5 10 5 Note * 1) Phenoxyethyl acrylate (please read the precautions on the back first) Fill out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs * 2) 2-Phenylphenoloxysilane Adduct Monopropene Acid ester (manufactured by Shin Nakamura Chemical Co., Ltd.) * 3) trimethylolpropane triacrylate * 4) photoradical polymerization bow manufactured by Coba Specialty Chemicals Co., Ltd. hair extension agent: 1-yl-cyclohexyl-benzene Ketone * 5) Bisphenol-type solid epoxy resin made by Oleochemical Shell Epoxy Co., Ltd. * 6) Nippon Kayaku ㈱) Polyglycidyl ether of o-cresol novolak lacquer * 7) Diacd Chemical Industry Saturated polyester shed made from 2,2- (hydroxymethyl) -butanol-1,2-epoxy-4 (2′f-based) cyclohexanone adduct * 8 frozen ocean textile company) Purpose * 9) Silane coupling agent made by Umca Co., Ltd. of Japan: r-methacryloxypropyltrimethoxysilane __ This paper size applies to China National Standard (CNS) A4 specification (2) 0X297 mm -21- 530079 A7 B7 丨 f. 5. Description of the invention (I9) Table 3 Composition (parts by weight) and characteristics Comparative Example 1 2 3 4 5 6 A Al — — — 40 — A-2 — — — 40 — — A-3 — — — — — 40 Ar / PEA * 1) — 10 — 60 — — L-4 * 2) — — 100 — — 60 A7 / tmpta * 3) 100 — — — 60 — B IRUGACURE 184 * 4) 3 3 3 3 3 3 C YX-4000 * 5) — — — — — — EOCN 1020 * 6) — — — — — Ceroxide 3150 + 7) — — — — — — D Viron 200 * 8) — — — — — — F A-174 * 9) — — — — — — Water absorption (%) 0.21 0.32 0.26 0.27 0.26 0.28 Resistance Mobility (hr) — 800 500 800 — 600 Adhesive glass X Δ Δ Δ X Δ PET XXXXXX Bend X 〇X 〇XX Recovery (minutes) — 15 15 15 — 15 Preparation * 1) Phenoxyethyl acrylate (Please read the precautions on the back before filling out this page) Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs * 2) 2-Phenylphenoloxysilane-based monoacrylate (made by Shin Nakamura Chemical Co., Ltd.) * 3) Trishydroxypropylpropane triacrylate * 4) Photo radical polymerization initiator manufactured by Coba Specialty Chemicals Co., Ltd .: 1-hydroxy-cyclohexyl-phenyl ketone * 5) Oily Shell Epoxy Co., Ltd. Phenol-type solid epoxy resin * 6) Polyglycidyl ether of o-cresol novolak lacquer manufactured by Nippon Kayaku Co., Ltd. * 7) 2,2- (hydroxymethyl) butyl diamine manufactured by Diacel Chemical Industry Co., Ltd. Alcohol 1,2-epoxy-4 (2 Feng Yuanji) cyclohexanone adducts * 8 Saturated polyester tree made by Hanyobo Co., Ltd. * 9) Silane coupling agent made by Ubenca Umca: r -A Acryloxypropyltrimethoxysilane_ This paper size is in accordance with Chinese National Standard (CNS) A4 (210X 297 mm) -22- 530079 A7 Tenon B7 5. Description of the invention (2〇) (Please read the note on the back first Please fill in this page again for each item) For each resin composition prepared in this way, the water absorption, migration resistance, adhesion, bending, and repairability were evaluated. The evaluation method is as follows. In other words, each resin composition was cured using an ultraviolet irradiation device (Oak Manufacturing Co., Ltd. metal halide lamp) at an irradiation amount of 2000 m J / cm 2. (1) Water absorption:
將各樹脂組成物試料,分別流入直徑1 5 0 m m、深 度2 m m之圓形鐵弗龍製容器後,硬化,作成測定用九狀 物。測定此測定用九狀物之重量(a )後,於2 0 t之離 子交換水中浸漬2 4小時,測定浸漬後之重量(b )。此 時之吸水率爲以丨((b ) -( a ) ) / ( a )丨X 1 0 0所求出之値(% )。 (2)耐遷移性試驗: 於做爲試驗用基板之Corming 1737玻璃板(厚度 0 _ 7 m m )上,以市售之煅燒型銀漿料作成梳型電極( L/S=l〇〇/l〇〇//m)供使用。 經濟部智慧財產局員工消費合作社印製 此試驗用基板之梳型電極上,將各樹脂組成物以厚度 2 m m塗佈後,於溫度8 5 °C、相對濕度8 5 %之恆溫恆 濕槽內放置1 5 0 0小時。此時之梳型電極的外加電壓爲 D C 1 〇 〇 V,並且隨時測定恆溫恆濕槽內之絕緣電阻値 〇 耐遷移性之評價爲將前述測定中之絕緣電阻値顯示 1 · 0 X 1 0 5 Ω以下數値之時刻視爲短路,並且評價試驗 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -23- 530079 A7 % B7五、發明説明(24) 經濟部智慧財產^7員工消費合作社印製 寸嗽 比較例 〇〇 〇 1 T-< I 1 0*3 1 1 1 1 I 0.27 〇 1 1 CO 1 1 1 1 1 1 0.29 B f=: X 實施例 〇 1 1 CO 1 1 1 1 1 "H CM 0.29 1500以上 ◎ CO 05 § 1 1 1 1 1 VO f-H 1 0.29 | 1500以上1 ◎ CN 03 § 1 CO 1 1 1 I r-< 1 0.27 1500以上 〇 1 8 1 cn 1 1 1 1 1-H 1 0.30 1200 〇 〇 1 1 cn 1 1 1 1 1 1 0.28 1200 〇 ON § ' 1 cn 1 1 1 1 1 1 0.27 1000 〇 〇〇 § | 1 cn 1 I 1 I 1 1 0.30 1000 〇 I組成(重量份)及特性 PEA*0 eoa*2) TMPTA·3) IRUGACURE 184*4) |SP150,5) YX-4000·6) |EOCN 1020^ | Ceroxide 315(Γ Viron 200,9) a > A-174·1〗) 吸水率(%) 耐遷移性(hr) 密合性(玻璃) < u Q PQ Pin iwsissr 篛sin^糴账w燧舷餵® 菡枨fr-»a!(#)攤^柃[11(卜*¾¾祕酹到画副s擀®fi)ispqipqsrvlse*ISAlM»-srIJ®-wli-I"g鹬一&<0账«« 皿来 if(«)sl^io☆so^s^oofI— ow 舻 _gsMg 碱擀氍发1E(U1 0 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) —» 裝·Each resin composition sample was poured into a circular Teflon container having a diameter of 150 mm and a depth of 2 mm, and was then hardened to prepare a nine-piece for measurement. After measuring the weight (a) of the nine materials for measurement, it was immersed in ion-exchanged water at 20 t for 24 hours, and the weight (b) after immersion was measured. The water absorption rate at this time is the 値 (%) obtained from ((b)-(a)) / (a) X 1 0 0. (2) Migration resistance test: On a Corming 1737 glass plate (thickness 0_7 mm) as a test substrate, a comb-type electrode was prepared from a commercially available calcined silver paste (L / S = 100 / 100 // m) for use. The consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed the comb-shaped electrode of the test substrate, coated each resin composition with a thickness of 2 mm, and a constant temperature and humidity bath at a temperature of 85 ° C and a relative humidity of 85%. Leave for 15 hours. At this time, the applied voltage of the comb-shaped electrode was DC 100 V, and the insulation resistance in the constant temperature and humidity tank was measured at any time. The evaluation of the migration resistance was shown as the insulation resistance in the foregoing measurement. 1 · 0 X 1 0 A moment below 5 Ω is considered a short circuit, and the evaluation test is based on the Chinese national standard (CNS) A4 specification (210X297 mm) -23- 530079 A7% B7 V. Description of the invention (24) Intellectual property of the Ministry of Economic Affairs ^ 7 Comparative example printed by employee consumer cooperatives 〇〇〇1 T- < I 1 0 * 3 1 1 1 1 I 0.27 〇1 1 CO 1 1 1 1 1 1 0.29 B f =: X Example 〇1 1 CO 1 1 1 1 1 " H CM 0.29 1500 or more ◎ CO 05 § 1 1 1 1 1 VO fH 1 0.29 | 1500 or more 1 ◎ CN 03 § 1 CO 1 1 1 I r- < 1 0.27 1500 or more. 1 8 1 cn 1 1 1 1 1-H 1 0.30 1200 〇〇1 1 cn 1 1 1 1 1 1 0.28 1200 〇ON § '1 cn 1 1 1 1 1 1 0.27 1000 〇〇〇§ | 1 cn 1 I 1 I 1 1 0.30 1000 〇I Composition (parts by weight) and characteristics PEA * 0 eoa * 2) TMPTA · 3) IRUGACURE 184 * 4) | SP150,5) YX-4000 · 6) | EOCN 1020 ^ | Ceroxide 315 ( Γ Viron 200,9) a > A-174 · 1〗) Water absorption (%) Migration resistance (hr) Adhesiveness (glass) < u Q PQ Pin iwsissr 篛 sin ^ 籴 account w 燧 side feed® 菡 枨fr- »a! (#) booth ^ 柃 [11 (卜 * ¾¾ 秘 酹 到 画 副 s 擀 ®fi) ispqipqsrvlse * ISAlM» -srIJ®-wli-I " g 鹬 一 & < 0 account ««来 来 if («) sl ^ io ☆ so ^ s ^ oofI— ow 舻 _gsMg Alkaline roll 氍 发 1E (U1 0 This paper size applies to China National Standard (CNS) A4 specifications (210X297 mm) (please read the back first) (Please fill out this page again) — »Install ·
、1T 身 -27-1T body -27-
Claims (1)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36427799A JP4497610B2 (en) | 1999-12-22 | 1999-12-22 | Photocurable resin composition |
| JP2000054077A JP4713704B2 (en) | 2000-02-29 | 2000-02-29 | Active energy ray-curable resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW530079B true TW530079B (en) | 2003-05-01 |
Family
ID=26581557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW089127271A TW530079B (en) | 1999-12-22 | 2000-12-19 | Resin composition curable with actinic energy ray |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR100696412B1 (en) |
| CN (1) | CN1196748C (en) |
| TW (1) | TW530079B (en) |
| WO (1) | WO2001046288A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6225921B2 (en) * | 2013-01-15 | 2017-11-08 | 日産化学工業株式会社 | Resin composition for forming cured film |
| US10844255B2 (en) * | 2016-08-30 | 2020-11-24 | Nissan Chemical Corporation | Photosensitive adhesive composition |
| CN109321145B (en) * | 2017-07-31 | 2022-01-04 | 东洋油墨Sc控股株式会社 | Active energy ray-polymerizable adhesive for optical use and optical laminate |
| DE102018121067A1 (en) | 2018-08-29 | 2020-03-05 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Curable two-component compound |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6049024A (en) * | 1983-08-29 | 1985-03-18 | Shikoku Chem Corp | Curing of epoxy resin |
| JPS6084323A (en) * | 1983-10-13 | 1985-05-13 | Shikoku Chem Corp | Curing of epoxy resin |
| JPH05186755A (en) * | 1992-01-08 | 1993-07-27 | Yokohama Rubber Co Ltd:The | Photocurable adhesive composition |
| JP3190251B2 (en) | 1995-06-06 | 2001-07-23 | 太陽インキ製造株式会社 | Photocurable and thermosetting resin composition for alkali-developed flexible printed wiring boards |
| US5707780A (en) * | 1995-06-07 | 1998-01-13 | E. I. Du Pont De Nemours And Company | Photohardenable epoxy composition |
-
2000
- 2000-12-13 WO PCT/JP2000/008812 patent/WO2001046288A1/en not_active Ceased
- 2000-12-13 CN CNB008176795A patent/CN1196748C/en not_active Expired - Fee Related
- 2000-12-13 KR KR1020027008125A patent/KR100696412B1/en not_active Expired - Fee Related
- 2000-12-19 TW TW089127271A patent/TW530079B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1196748C (en) | 2005-04-13 |
| KR100696412B1 (en) | 2007-03-20 |
| WO2001046288A1 (en) | 2001-06-28 |
| KR20020064958A (en) | 2002-08-10 |
| CN1413225A (en) | 2003-04-23 |
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