544825544825
發明領域： 本發明係有關於一種超微小銲锡球的製造方法與裝 置，且特別是有關於-種球格陣列構裝用超微小鲜錫球的 製造方法及其裝置。 相關技術說明： 隨著積體電路（IC)元件不斷朝向低價位、大晶片尺 寸、高I/O數、高線路密度、高運作速率及高功能化發 展，使其對構裝的要求遠超過傳統電子構裝的能力，一些 更為先進的構裝技術因應而生，其中球格陣列構裝（ban grid array，BGA)為一相當成功的例子，由於其構裝尺寸 小，與過去十年最盛行的四方平面構裝（^以(1 flat package，QFP)相較，可節省電路板空間大約49%，就電器 性忐而s，將一個169 I/O數BGA與一個160I/Q數qFP相 比，BGA構裝可減少31%訊號電容及46%交互電感，由此縮 短訊號延遲時間大約46%，更重要的是，由於其面陣排列 (area array)設計，使其接點間距（pUch)大幅放寬（相同 1/〇數情況），再加上錫球具有自行對位（361卜311叩1^1^) 的特性，因此BGA製程良品率（yieid)大約為QFp的十倍以 上，相對的促成其成本優勢，尤其當QFp構裝的腳數高於 300，其接點間距將小於〇. 3mm，產品不良率將劇增至完全 無法與同I/O數的BGA構裝相競爭。 _球格陣列構裝的製程方法是將焊錫球先植入塑膠或陶 瓷基板，進行迴焊（re flow)使焊錫球熔融後固定在基板上 的焊錫墊（pad)，再將此植球後的構裝放在印刷電路^上，FIELD OF THE INVENTION The present invention relates to a method and device for manufacturing ultra-fine solder balls, and more particularly, to a method and device for manufacturing ultra-fine fresh tin balls for ball grid array construction. Relevant technical description: As integrated circuit (IC) components continue to develop toward lower prices, larger chip sizes, high I / O counts, high line density, high operating speeds, and high functionalization, they have far-reaching requirements for construction. Beyond the capabilities of traditional electronic assembly, some more advanced assembly techniques have emerged. The ban grid array (BGA) is a very successful example. Because of its small assembly size, it is similar to the past ten. Compared with (1 flat package, QFP), the most popular square flat structure in the year, it can save about 49% of the circuit board space. In terms of electrical properties, a 169 I / O number BGA and a 160I / Q Compared with qFP, the BGA structure can reduce 31% signal capacitance and 46% interaction inductance, thereby shortening the signal delay time by about 46%, and more importantly, because of its area array design, its contacts The pitch (pUch) is greatly relaxed (the same 1/0 number case), and the solder ball has the characteristic of self-alignment (361, 311, 1 ^ 1 ^), so the yield rate (yieid) of the BGA process is about ten times the QFp. More than double the cost advantage, especially when the number of pins of the QFp structure is higher than 300, the contact pitch will be less than 0.3mm, and the product failure rate will increase sharply to be completely unable to compete with the BGA structure with the same I / O number. _ The method of ball grid array structure is to implant solder balls first Reflow the plastic or ceramic substrate, and then fix the solder pad on the substrate after melting the solder ball, and then place this ball-embedded structure on the printed circuit.
五、發明說明（2) ，，行一次迴焊’完成組裝步驟。基本上， =過去習用的針格陣列構裝(pi…：歹構裝 改為焊錫球，因此焊錫球的品質 的 寸：ί ;”报重要的影響’必須生產的焊錫球= 高、設傷：製;量產速度快、良品率 小化而越ΐϋϊί這些要求隨著焊錫球尺寸曰漸微 廢商mm車，裝用焊錫球的製造方法报多，各 方法包；方法也不盡相同，這些習用的bGa錫球製造各 1 ·液滴重力錫球成型法： 2離液滴’經由自由落體成為球：力辉錫液成 ，球。此法所形成的錫球尺寸帛令部液中凝固 到所要球徑’且無法精確控制球徑：；廣；須：過筛選得 型法得到微小錫球，雖然可以製用一般粉末噴霧成 球尺寸不一，須經過篩選，^吉仫極小的錫球，但錫 採用。 錫球真圓度不佳，很少廠商 3·剪切錫線熔融成形法： 的線材，以剪斷或切斷方式大旦制錫鑄錠擠型成一定直徑 這些相同直徑與長度的錫桎加=2:一定長度錫柱，再將 冷卻液中凝固成錫球；亦可將^:成為熔融銲錫液滴，投入 加熱炼融下層冷卻凝固的_由刀的錫柱直接投入一上層 錫球。 -’同時在液中形成液滴及 五、發明說明（3) 4.沖剪錫板熔融成型法：先將銲 度的錫板，再以沖剪方式大量製 輥軋成一疋厚 類似於剪切錫線熔融成型法將這些錫餅加：3:為，後 液滴，再經冷卻液凝固成錫球，或將沖剪的ς上為銲錫 加熱熔融下層冷卻凝固的同—液體—士々汗杈入上層 切錫線溶融成型法或沖剪錫板炼融成型：乍。剪 用，但其製程較為繁瑣，而且合因 j有坪夕廠商採 使製成的錫球成份偏離要求，：外製程㊁偏析而 質。 录面嚴重減，影響最後錫球品 5. 喷墨液滴成型法：利用噴墨印 脈衝電流產生向下力量，使熔融二、’控制磁場及 滴，再凝固成錫球。此法生產設備禧^成不連續銲錫液 採用的廠商亦不多。 又 ’、’生產速度較慢， 6. 振盪液滴喷射法：將熔融銲錫以一古 錫液’同時利用壓電晶體震盈產生脈衝機體喷射出 分裂成不連續液滴，再凝固成錫球财衝機械力使錫液喷流 7. 振盪液滴擠出法：利 融銲錫由底板多數小洞擠出，# + 體振盪控制板將熔 避免前後擠出的液滴碰H =連續液滴，另外為了 相互排斥分離。最後凝再：力:靜電荷機構使液滴 液滴擠出法均有許多廠商J:农：：液滴噴射法及振盡 尺寸分佈範圍不夠隼中， 、方法所得到的錫球 於錫液在喷嘴或擠出口的表面張力，； = 此外，由 两浪刀了忐造成重覆多次振 五、發明說明（4) 盪擠出現象，而# 然而，卜而使液滴尺寸加倍。 錫球方法均存^ ^头之各種製造球袼陣列構妒（β(ίΑ ) 均-產品。另外、經過師選步驟才可獲得符A要长二：控 为外，當BGA播驴兩西I 何σ要衣的球徑 〇广)日寺，銲錫球的： ' 超微小銲錫球（球徑小於 二=元件之縮小二構二t 亦將更加困難。並且而=:ί;;小鲜锡球的尺寸筛選 程中銲錫球的剝落。 的問碭，容易造成構裝過 有t於此，為了解決上述問題，太乂 ’、種超微小銲錫球的製造方法及盆^明主要目的在於 格陣列構裝用。 及其裝置，可適用於球 發明概述： 置，的在於一種超微小鲜錫球的製造方法μ ^ϊϊ的尺寸微小、均句且真圓度佳 製造方法，此方法的步驟主要種超微小鮮錫球的 首先，將溶融銲錫置於一具有一 著，使上述熔融銲錫經由上述開口、、主二一伊反w至内。接 顆粒狀熔融銲錫。最後，利#辟# 一杈穴中，形成一 置中，用二： 上述收集裝置具有-冷卻裝 吏上述顆粒狀熔融銲錫凝固成銲錫球。5. Description of the invention (2), one reflow is performed once to complete the assembly steps. Basically, = Pitch grid array structure used in the past (pi…: The structure is changed to solder balls, so the quality of the solder balls is inch: ί; "Report important influences" Solder balls that must be produced = High, damage : The production speed is fast, and the yield rate is reduced. These requirements are increasing. As the solder ball size is gradually reduced, the number of methods for manufacturing solder balls is different, and the methods are not the same. Each of these conventional bGa solder balls is made. 1. Droplet gravity solder ball forming method: 2 separate droplets into balls through free fall: Lihui tin liquid, balls. The size of the solder balls formed by this method is in the liquid. Solidified to the desired ball diameter 'and the ball diameter cannot be accurately controlled :; wide; required: tiny tin balls can be obtained by screening method, although it can be made by spraying with ordinary powder to form balls of different sizes, which must be screened, which is extremely small Tin balls, but tin is used. Tin balls have poor roundness, few manufacturers3. Shear tin wire melt forming method: Wires are cut or cut into large diameter denier tin ingots and extruded into a certain diameter. These tin tins of the same diameter and length plus 2: tin pillars of a certain length, then The cooling liquid solidifies into tin balls; ^: can also be turned into molten solder droplets and put into the lower layer of heating to melt and solidify _ from the knife's tin column directly into an upper layer of tin balls.-'At the same time, droplets are formed in the liquid and V. Description of the invention (3) 4. Punch and shear tin plate melt forming method: firstly solder the tin plate with a large amount of rolls, and then roll and roll it into a stack with a thickness similar to the shear tin wire melt forming method. Add: 3: After the liquid droplets are solidified into tin balls by the cooling liquid, or the same layer of punching and shearing is melted with solder, the lower layer is cooled and solidified, and the same-liquid-shihan sweat branch is melted into the upper layer to melt the tin Or punching and shearing of tin plates: cutting. It is used for cutting, but its manufacturing process is tedious, and it is due to the fact that the solder balls produced by the manufacturer have deviated from the requirements. 5. Inkjet droplet forming method: use the inkjet printing pulse current to generate downward force, so that the melting second, 'control the magnetic field and droplets, and then solidify into solder balls. This method production equipment Juecheng There are not many manufacturers of discontinuous soldering fluids. The speed is slower. 6. Oscillating droplet ejection method: The molten solder is spattered into a discrete liquid droplet by using a piezoelectric crystal shock to generate a burst of molten tin, and then solidified into a solder ball. Tin liquid jet 7. Oscillating liquid droplet extrusion method: The molten solder is extruded from most small holes in the bottom plate, and the # + body oscillation control board will melt to avoid the liquid droplets extruded from the front and back to hit H = continuous liquid droplets, and in order to repel each other. Separation. Finally: Re: Force: The electrostatic charge mechanism makes the droplets and droplets extrusion method have many manufacturers J: Nong :: The droplet ejection method and the exhaustion size distribution range are not enough, the solder balls obtained by the method are Surface tension of the molten tin at the nozzle or extrusion port; = In addition, repeated vibrations caused by two waves of knives. 5. Description of the invention (4) Squeeze out the phenomenon, and # However, double the droplet size There are various methods for manufacturing ball arrays in the solder ball method. 妒 (β (ίΑ)) homo-products. In addition, after the teacher's selection process, the symbol A must be two long: control outside. When the BGA broadcasts the donkeys, the two wests, and the diameter of the ball, the diameter of the dress is wide.) The temple of the solder ball: 'Super tiny solder ball ( Ball diameters smaller than two = reduction of components, two structures and two t will also be more difficult. And =: ί ;; the peeling of solder balls during the screening process of the size of small fresh solder balls. It is easy to cause the structure to have too much t Here, in order to solve the above-mentioned problems, the manufacturing method of the ultra-small solder ball and the basin are mainly used for the lattice array construction. The device and the device can be applied to the ball. Manufacturing method of ultra-fine fresh tin balls μ ^ ϊϊ is a small-sized, uniform sentence manufacturing method with good roundness. The steps of this method mainly include ultra-fine fresh tin balls. First, the molten solder is placed on a substrate. The molten solder is passed through the opening, and the main two-in-one is inwardly connected. The granular molten solder is connected. Finally, a # 1 # hole is formed in a branch, and two are used: The above-mentioned collection device has-cooling The above-mentioned granular molten solder is solidified into solder balls.
〇39l-7795TW(n);Felicia.ptd $ 7頁 544825 五、發明說明（5) 如前所述，上沭锃如〆 錫球所構成。上述反由半徑為ο·1〜ο·3髮米（關）之 入一俘-w γ遍 Μ至内部溫度係為100〜30 0 °c，並通 入保遂性氣體，其壓力伤幻 91 7 ? ， _ 之開口更包括一流量押制卩…、、〜g cm 。且上述反應至 上述模1 %胃 工制閥，用以控制上述熔融銲錫流入 3〇〇°c。此外，上述模ΐ為1〜2kg/cm2，溫度係為100〜 ㈣之圓柱狀。 之形狀係為直徑0.1〜2爱米 本發明亦提供一種銲錫球之製造裝置， 銲錫製造成適用於球格陣 9 、 j ^陴列構裝之鲜錫球接點，包括·· 汉應至’具有一開口與一加執 裝置係用以將上述固_纟曰^ t置，/、中上述加熱 θ ^ ^ ^ U恶知錫熔化成熔融鲜錫。一 具有-模穴，*上述模穴旋轉至上述開口： J轉盤’ 熔融銲錫經由上述開口填入上述模穴内，：：：【’上述 融銲錫。-第-氣體輪出裝置，用以吹落旋炫 上述顆粒狀_錫。一收集裝置1以方之 顆粒狀f融銲錫，並且具有-冷卻裝Ϊ,使^述落$下之 粒狀炼融銲錫凝固成銲錫球。 之顆 為使本發明之上述目的、特徵和優點 下文特舉一較祛告仏y丨 ^ ^ Λ .. 又顯易幢， 下：佳Λ〜例，並配合所附圖式，作詳細說明如〇39l-7795TW (n); Felicia.ptd $ 7 544825 V. Description of the invention (5) As mentioned above, the upper part is made of tin balls. The above reaction is from a radius of ο · 1 ~ ο · 3 hair meters (off) into a trap -w γ times M to the internal temperature is 100 ~ 30 0 ° c, and a ductile gas is passed in, and the pressure is traumatic. The opening of 91 7?, _ Further includes a flow control 押 ..., ~ g cm. And the above reaction to the mold 1% gas-operated valve is used to control the molten solder inflow to 300 ° C. In addition, the mold ΐ is a cylindrical shape having a temperature of 1 to 2 kg / cm2 and a temperature of 100 to ㈣. The shape is 0.1 ~ 2 in diameter. The present invention also provides a solder ball manufacturing device. The solder is manufactured into a fresh solder ball contact suitable for the ball grid array 9, j ^ array configuration, including ... 'It has an opening and a clamping device, which are used to set the above-mentioned solid 纟 ^ t, /, the above-mentioned heating θ ^ ^ ^ U evil tin is melted into molten fresh tin. One has-mold cavity, * the above mold cavity is rotated to the above opening: J turntable 'molten solder is filled into the above mold cavity through the above opening :: [' the above-mentioned molten solder. -No.-Gas wheel-out device for blowing off the above-mentioned granular _tin. A collecting device 1 melts the solder in the form of particles f and has a cooling device, so that the granular smelting solder that falls below is solidified into solder balls. In order to make the above-mentioned objects, features and advantages of the present invention more specific, the following will be described below: y 丨 ^ ^ Λ .. It is easy to build, and the following: good Λ ~ example, and in conjunction with the accompanying drawings, will be described in detail Such as
544825 圖式簡單說明 ，1圖係顯示根據本發明之銲錫球製造方法流程圖。 第2圖係顯示根據本發明一較佳實施例之二Θ。 裝置之示意圖。 、义鲆錫球 第3圖係顯示根據本發明一較佳實 裝置之模穴轉盤與收集纟置之示意]之^4锡球 符號說明： S100、S200、S300 1 0〜上蓋； 2 1 0〜開口； 4 0〜壓板； 5 1 0〜填料模穴； 7 〇〜針閥； 1 2 0〜冷卻裝置； A〜熔融銲錫； S40 0〜步驟； 2 0〜反應室； 3 0〜下模頭； 5 〇〜分料轉盤； 60〜轉子； 11 0〜加熱裝置； 130〜收集裝置； B〜顆粒狀熔融銲錫； p、s、τ〜氮氣； R〜液氮。 c〜銲錫球； Q〜第一氣體輸出裝置； 實施例： 請同時參考第丨圖之製造方法流程 之製造裝置示意圖。 口，、第2圖、第3圖 # L先：i步驟sio°中’將以適當酸液清洗之-銲錫 ==甚锡’置於一反應室20内部。關閉一針間70，再 在封上盍10。並且，於上述反應室20内部保持一定的一 保護性氣體壓力P，其氣體係為惰性氣體，例如夺··氣氣。 開-加熱裝置11 0，例如一加熱線圈加熱，使上述反應室544825 The diagram is briefly explained. Fig. 1 is a flowchart showing a method for manufacturing a solder ball according to the present invention. FIG. 2 shows the second Θ according to a preferred embodiment of the present invention. Schematic of the device. 3, the figure 3 of the solder ball shows the schematic diagram of the mold cavity turntable and the collection device according to a preferred embodiment of the present invention.] ^ 4 solder ball symbol description: S100, S200, S300 1 0 ~ upper cover; 2 1 0 ~ Opening; 40 ~ Pressing plate; 5 1 0 ~ Filling cavity; 7 ~~ Needle valve; 12 ~~ Cooling device; A ~ Molten solder; S40 ~~ Step; 2 ~~ Reaction chamber; 3 ~~ Lower die Head; 50 ° ~ distribution turntable; 60 ~ rotor; 110 ~ heating device; 130 ~ collection device; B ~ granular molten solder; p, s, τ ~ nitrogen; R ~ liquid nitrogen. c ~ solder ball; Q ~ first gas output device; Example: Please also refer to the schematic diagram of the manufacturing device of the manufacturing method flow in FIG. 丨. Fig. 2 and Fig. 3 # LFirst: In step sio °, ′ -solder == tin, which is cleaned with an appropriate acid solution, is placed inside a reaction chamber 20. Close one stitch 70 and seal 盍 10. In addition, a certain protective gas pressure P is maintained inside the reaction chamber 20, and the gas system thereof is an inert gas, such as a gas. On-heating device 110, such as a heating coil, heats the above reaction chamber
0391-7795TWF(n);Felicia.ptd 第9頁 544825 圖式簡單說明 2〇内部升溫，待上述塊狀銲錫κ完 銲錫A。 王这化成為均質的熔融 接著，在步驟S200中，請參考第 達使一轉子60旋轉並同時帶動一分料轉^般5 j，，打開馬 室20與一下模頭30'的間隙適當。再二泣旦定上述反應 上述熔融銲錫Λ流經開口210，到達i、+、^二！控制閥70使 中分枓鏟般Μ μ目古 γ ㈤達上述分料轉盤50處，其 甲刀枓轉盤50上具有一模穴510。當 处 了◦下方時，上述反應室20内=== 體壓力Ρ的上述熔融銲錫Α便能流出 Υ礼 穴5〇。 山且氓，雨整個上述填料模 接著，在步驟S3G〇中，t已填滿上述溶 料杈穴50繼續旋轉離開了上述開口21〇下方的同時，^ 述填料模穴50與±述開口21〇内的溶融鮮錫A相連，而 侍到一定體積的獨立熔融銲錫。而當填滿熔融銲錫a的上 ，填料模穴50旋轉至一第一氣體輸出裝置Q出口的正下方 f，亡述第一氣體輸出裝置Q輸出一惰性氣體s，例如：氮 氣，氣體S流速約為1〜2ro/s，氣氛壓力例如為〇· 2〜 l.O^g/cm2且其溫度約為1〇〇〜3〇(rc，上述熔融銲錫便會 被吹了下來成為獨立之一顆粒狀熔融銲錫B。 接著’在步驟S400中，如第3圖所示，上述顆粒狀熔 融銲錫B由於受到上述第一氣體輸出裝置Q之壓力、模壁摩 擦力、離心力、重力及氣氛阻力等多重作用，故使液滴運 動路徑為近拋物線型。於下方設置一收集裝置丨3 〇 ,使上 述顆粒狀溶融銲錫β能落入其中。上述收集裝置丨3 〇具有一0391-7795TWF (n); Felicia.ptd Page 9 544825 Brief description of the diagram 20 Internal heating, wait for the above-mentioned bulk solder κ to complete solder A. Wang Huahua became homogeneous melting. Next, in step S200, referring to Dada, a rotor 60 is rotated while simultaneously driving a material transfer 5j, and the gap between the chamber 20 and the lower die 30 'is opened appropriately. Once again, the above reaction is determined. The molten solder Λ flows through the opening 210 and reaches i, +, and ^! The control valve 70 enables the middle shovel-like shovel to reach the above-mentioned material-distributing turntable 50, and the knife-turning turntable 50 has a die cavity 510. When it is positioned below, the molten solder A in the reaction chamber 20 === body pressure P can flow out of the Lili cavity 50. The whole stuffing mold is rainy. Then, in step S3G0, t has filled the molten material branch hole 50 and continues to rotate away from the above opening 21. At the same time, the stuffing mold cavity 50 and the opening 21 The molten fresh tin A within 〇 is connected, and a certain volume of independent molten solder is served. When the molten solder a is filled, the filler cavity 50 is rotated to f below the outlet of the first gas output device Q, and the first gas output device Q outputs an inert gas s, such as nitrogen, gas S flow rate. It is about 1 ~ 2ro / s, the atmospheric pressure is, for example, 0.2 ~ 10 g / cm2, and its temperature is about 100 ~ 30 (rc, the above-mentioned molten solder will be blown down to become an independent one. Molten solder B. Next, in step S400, as shown in FIG. 3, the granular molten solder B is subjected to multiple effects such as pressure from the first gas output device Q, mold wall friction, centrifugal force, gravity, and atmospheric resistance. Therefore, the movement path of the droplet is near parabolic. A collection device 丨 3 〇 is provided below, so that the granular molten solder β can fall into it. The collection device 丨 3 〇 has a
0391-7795TWF(n);Felicia.ptd0391-7795TWF (n); Felicia.ptd
544825 圖式簡單說明 冷卻裝置120，例如係以液態氮R流入上述收集器13〇的总 壁周圍，再氣化成氮氣3揮發帶走大量潛熱，使得上述I 粒狀炼融鮮錫B隨著落下的過程中其溫度及形狀會連續改 變。上述顆粒狀熔融銲錫B的溫度從約高於只〜 由上述冷卻裝置1 20輸出一液態氮（R)蒸發成氮氣（s)所= 走的大量潛熱，使顆粒狀熔融銲錫B受到幅射冷卻效應而 逐漸降溫。形狀則由剛開始離上述開填料模穴51〇的^柱 形，，漸漸受到顆粒狀熔融銲錫B自身表面張力的影響而呈 球形，且溫度越接近凝固點的表面張力越大，因此吾藉由 一此材料特性，便能順利使一顆顆的焊錫液滴變成^ ^度 極佳的銲錫球c。顆粒狀熔融銲錫]8通過急冷區過程中，ς 度持續下降，當顆粒狀熔融銲錫Β來到冷卻裝置丨2〇下方/皿 時，銲錫球C已完全凝固完畢，成為真圓度極佳的固態銲 錫球銲錫球C雖然已經轉變為固態，但若在其速度“降為 零之前受到太大的衝擊力，將使銲錫球c變形而影變&了真 圓度。因此，在收集裝置130下方設置一第二氣體^出裝 置，用以輸出一向上喷之保護性氣體τ，例如··氮氣，藉 由氣流與上述銲錫球C運動方向相反的方式來降低錫球^ 落下速度，用以減緩上述銲錫球(;所受的衝擊，維持上述 銲錫球C得真圓度，便完成上述銲錫球c的收集。 如前所-述，根據本發明之製造銲錫球裝置，如第2圖 與第3圖所不，#有一反應室2〇，上述反應室2〇具有一開 口210與一加熱裝置110。一旋轉盤5〇，設置於上述開口之 下方’具有一模穴510。再者，—第一氣體輸出裝置〇，設 第11頁 0391-7795TWF(n);Felicia.ptd 544825 圖式簡單·1¾明 2於上述開口210旁。另外，一收集裝置120，具有一冷卻 ^置12/與一第二氣體輸出裝置τ，其中上述第二氣體輸出 設置於上述收集裝置12〇之下方。並且，反應室⑼、 鋼蓋10、、下模頭30及轉子60等零件之材質例如為304不銹 u 用以配合其在高溫下使用，如此便高溫強度佳、耐腐 溫f不易與銲錫材料互溶。並且，分料轉盤5 1 0則需要高 生佳、與溶融銲錫接觸角大且不易被熔融銲錫潤溼的 材料戶f構成，：鈦合金、钽合金等。 j合上述，本發明具有下列優點： 模穴空間2據本發明所製造之銲錫球，其體積大小取決於 寸均Ϊ1大小’其粒徑分佈範圍極窄，因此銲錫球之尺 其真圓度極佳，適 然其並非用以限定 在不脫離本發明之 —、根據本發明所製 用於球格陣列構裝。 之知錫球 本發明雖以齡4每从 本發明的範圍，任何露如上，、 精神和範圍内，者、、白項技藝者，在不脫離本發明之 保護範圍當視後二二=的更動與潤飾，因此本發明之 甲❺專利範圍所界定者為準544825 The diagram briefly illustrates the cooling device 120, for example, the liquid nitrogen R flows into the surrounding wall of the collector 130, and then vaporizes into nitrogen 3 and volatilizes away a large amount of latent heat, so that the above-mentioned I granular smelted fresh tin B falls with it During the process, its temperature and shape will change continuously. The temperature of the granular molten solder B is higher than only ~ The cooling device 120 outputs a large amount of latent heat from the evaporation of liquid nitrogen (R) to nitrogen (s), which causes the granular molten solder B to be cooled by radiation. Effect and gradually cool down. The shape is from the shape of a column that is 51 ° away from the above-mentioned open mold cavity, and gradually becomes spherical due to the surface tension of the granular molten solder B. The closer the temperature is to the freezing point, the greater the surface tension. With this material property, the individual solder droplets can be smoothly turned into solder balls c with an excellent degree. Granular molten solder] 8 During the process of passing through the quenching zone, the degree of continuity decreases. When the granular molten solder B comes to the cooling device below 20 °, the solder ball C has completely solidified and becomes extremely round. Although the solid solder ball C has been transformed into a solid state, if it receives too much impact force before its speed "falls to zero", the solder ball c will be deformed and its roundness will be affected. Therefore, in the collection device, A second gas outlet device is provided below 130 to output an upwardly sprayed protective gas τ, such as nitrogen, to reduce the speed of the solder ball ^ by using a gas flow opposite to the movement direction of the solder ball C described above. In order to reduce the impact of the solder ball (; the impact received, maintain the true roundness of the solder ball C, the collection of the solder ball c is completed. As mentioned above, according to the present invention, a solder ball manufacturing device, as shown in FIG. 2 As shown in Fig. 3, # has a reaction chamber 20, which has an opening 210 and a heating device 110. A rotating disk 50 is provided below the opening and has a cavity 510. ， —The first gas output device 〇, suppose on page 11 0391-7795TWF (n); Felicia.ptd 544825 The diagram is simple · 1¾ Ming2 next to the opening 210. In addition, a collection device 120 has a cooling device 12 / and a second gas output Device τ, in which the above-mentioned second gas output is disposed below the above-mentioned collection device 12o. In addition, the materials of parts such as the reaction chamber 盖, the steel cover 10, the lower die 30 and the rotor 60 are, for example, 304 stainless steel. It is used at high temperature, so it has good high temperature strength, corrosion resistance f is not easy to dissolve with the solder material. Moreover, the dividing turntable 5 1 0 needs high quality, good contact angle with the molten solder, and is not easily wetted by molten solder. It consists of: titanium alloy, tantalum alloy, etc. In combination with the above, the present invention has the following advantages: Cavity space 2 The solder ball produced according to the present invention has a volume size that depends on the size of the inch size and its particle size distribution range. Extremely narrow, so the roundness of the solder ball ruler is very good, but it is not intended to be limited to the invention without using the ball grid array structure made in accordance with the present invention. From the age of 4 Anyone who shows the above, within the spirit and scope, and those who are white items, will not deviate from the protection scope of the present invention as the modification and retouching of the second two =. Therefore, the scope of the formazan patent scope of the present invention is quasi-