TW546803B - Shaped springs and methods of fabricating and using shaped springs - Google Patents

Shaped springs and methods of fabricating and using shaped springs Download PDF

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Publication number
TW546803B
TW546803B TW090108014A TW90108014A TW546803B TW 546803 B TW546803 B TW 546803B TW 090108014 A TW090108014 A TW 090108014A TW 90108014 A TW90108014 A TW 90108014A TW 546803 B TW546803 B TW 546803B
Authority
TW
Taiwan
Prior art keywords
patent application
scope
item
element material
substrate
Prior art date
Application number
TW090108014A
Other languages
English (en)
Chinese (zh)
Inventor
Gaetan L Mathieu
Benjamin N Eldridge
Stuart W Wenzel
Original Assignee
Formfactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/547,561 external-priority patent/US7458816B1/en
Priority claimed from US09/547,560 external-priority patent/US6640432B1/en
Application filed by Formfactor Inc filed Critical Formfactor Inc
Application granted granted Critical
Publication of TW546803B publication Critical patent/TW546803B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Battery Mounting, Suspending (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connecting Device With Holders (AREA)
TW090108014A 2000-04-12 2001-04-03 Shaped springs and methods of fabricating and using shaped springs TW546803B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/547,561 US7458816B1 (en) 2000-04-12 2000-04-12 Shaped spring
US09/547,560 US6640432B1 (en) 2000-04-12 2000-04-12 Method of fabricating shaped springs

Publications (1)

Publication Number Publication Date
TW546803B true TW546803B (en) 2003-08-11

Family

ID=27068579

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090108014A TW546803B (en) 2000-04-12 2001-04-03 Shaped springs and methods of fabricating and using shaped springs

Country Status (7)

Country Link
EP (1) EP1275150A2 (de)
JP (1) JP2003531495A (de)
KR (2) KR100835027B1 (de)
CN (1) CN100339985C (de)
AU (1) AU2001249567A1 (de)
TW (1) TW546803B (de)
WO (1) WO2001080315A2 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449280B (zh) * 2011-01-17 2014-08-11 Hon Hai Prec Ind Co Ltd 測試連接器
TWI503948B (zh) * 2009-07-22 2015-10-11 奧瑞可美國股份有限公司 高頻寬斜堆式晶片封裝

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE311604T1 (de) * 2000-06-20 2005-12-15 Nanonexus Inc Testsystem von integrierten schaltungen
KR100941360B1 (ko) * 2006-07-21 2010-02-11 가부시키가이샤후지쿠라 집적 회로 소켓, 집적 회로 소켓 조립체, 및 집적 회로 소켓의 제조 방법
EP2177646B1 (de) * 2008-10-17 2011-03-23 ATOTECH Deutschland GmbH Spannungsreduzierte Ni-P/Pd-Stapel für Waferoberfläche
US8441808B2 (en) * 2010-09-22 2013-05-14 Palo Alto Research Center Incorporated Interposer with microspring contacts
KR101738421B1 (ko) 2015-11-10 2017-05-23 광주과학기술원 자가변형 플렉서블 필름 및 이의 제조 방법
KR102042052B1 (ko) * 2017-03-23 2019-11-08 광주과학기술원 자가변형 플렉서블 필름 및 이의 제조 방법
KR102114210B1 (ko) * 2018-12-17 2020-05-25 주식회사 코리아 인스트루먼트 프로브 빔 및 프로브 모듈
CN114108041A (zh) * 2021-12-20 2022-03-01 太仓市惠得利弹簧有限公司 一种弹簧表面抗氧化处理工艺

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0546195Y2 (de) * 1985-02-15 1993-12-02
US5216631A (en) * 1990-11-02 1993-06-01 Sliwa Jr John W Microvibratory memory device
JPH06181301A (ja) * 1992-12-14 1994-06-28 Fujitsu Ltd 固体撮像素子
US5810609A (en) * 1995-08-28 1998-09-22 Tessera, Inc. Socket for engaging bump leads on a microelectronic device and methods therefor
JPH09213183A (ja) * 1996-02-05 1997-08-15 Eiko Takahashi 小型サーモスタット
JPH09213813A (ja) * 1996-02-06 1997-08-15 Sony Corp 半導体装置及び半導体装置製造方法
EP1482314B1 (de) * 1996-05-17 2009-11-11 FormFactor, Inc. Mikroelektronisches Federkontaktelement
AU7491598A (en) * 1997-05-15 1998-12-08 Formfactor, Inc. Lithographically defined microelectronic contact structures
AU7959298A (en) * 1997-09-17 1999-04-05 Formfactor, Inc. Method of making a structure with improved material properties by moderate heat treatment of a metal deposit
US6827584B2 (en) * 1999-12-28 2004-12-07 Formfactor, Inc. Interconnect for microelectronic structures with enhanced spring characteristics

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI503948B (zh) * 2009-07-22 2015-10-11 奧瑞可美國股份有限公司 高頻寬斜堆式晶片封裝
TWI449280B (zh) * 2011-01-17 2014-08-11 Hon Hai Prec Ind Co Ltd 測試連接器

Also Published As

Publication number Publication date
KR100801353B1 (ko) 2008-02-05
EP1275150A2 (de) 2003-01-15
KR20070093456A (ko) 2007-09-18
WO2001080315A2 (en) 2001-10-25
KR20020090234A (ko) 2002-11-30
AU2001249567A1 (en) 2001-10-30
KR100835027B1 (ko) 2008-06-03
CN100339985C (zh) 2007-09-26
WO2001080315A3 (en) 2002-03-28
CN1451179A (zh) 2003-10-22
JP2003531495A (ja) 2003-10-21

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees