TW554086B - Method for producing plated molded product - Google Patents

Method for producing plated molded product Download PDF

Info

Publication number: TW554086B
Authority: TW; Taiwan
Prior art keywords: plating; molded product; layer; chromium; bath
Prior art date: 2001-02-16

Application number

TW091102193A

Other languages

English (en)

Chinese (zh)

Inventor

Ichiro Hayashi

Kazuhiro Myokai

Original Assignee

Taiyo Mfg Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2001-02-16

Filing date

2002-02-07

Publication date

2003-09-21

2001-02-16 Priority claimed from JP2001041029A external-priority patent/JP3685999B2/ja

2001-06-25 Priority claimed from JP2001192023A external-priority patent/JP3722724B2/ja

2001-10-19 Priority claimed from JP2001322754A external-priority patent/JP3710408B2/ja

2002-02-07 Application filed by Taiyo Mfg Co Ltd filed Critical Taiyo Mfg Co Ltd

2003-09-21 Application granted granted Critical

2003-09-21 Publication of TW554086B publication Critical patent/TW554086B/zh

Links

238000004519 manufacturing process Methods 0.000 title claims abstract description 19
238000007747 plating Methods 0.000 claims abstract description 146
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 69
VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 43
229910052804 chromium Inorganic materials 0.000 claims abstract description 42
239000011651 chromium Substances 0.000 claims abstract description 42
229910052802 copper Inorganic materials 0.000 claims abstract description 38
239000010949 copper Substances 0.000 claims abstract description 38
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 36
229910052759 nickel Inorganic materials 0.000 claims abstract description 35
238000007772 electroless plating Methods 0.000 claims abstract description 18
238000009713 electroplating Methods 0.000 claims abstract description 17
238000001746 injection moulding Methods 0.000 claims abstract description 17
229910052751 metal Inorganic materials 0.000 claims abstract description 15
239000002184 metal Substances 0.000 claims abstract description 15
238000000465 moulding Methods 0.000 claims abstract description 13
229910000599 Cr alloy Inorganic materials 0.000 claims abstract description 10
239000000788 chromium alloy Substances 0.000 claims abstract description 10
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 42
238000000034 method Methods 0.000 claims description 36
239000000203 mixture Substances 0.000 claims description 31
238000005406 washing Methods 0.000 claims description 27
KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 claims description 20
AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 claims description 20
239000012535 impurity Substances 0.000 claims description 19
239000003054 catalyst Substances 0.000 claims description 17
238000005530 etching Methods 0.000 claims description 16
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
229910001868 water Inorganic materials 0.000 claims description 16
239000002253 acid Substances 0.000 claims description 11
229910000365 copper sulfate Inorganic materials 0.000 claims description 10
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 10
239000003929 acidic solution Substances 0.000 claims description 9
229920001971 elastomer Polymers 0.000 claims description 6
239000000806 elastomer Substances 0.000 claims description 6
238000007664 blowing Methods 0.000 claims description 3
239000000463 material Substances 0.000 claims description 2
229920001169 thermoplastic Polymers 0.000 claims description 2
239000004416 thermosoftening plastic Substances 0.000 claims description 2
BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 claims 1
229920000877 Melamine resin Polymers 0.000 claims 1
235000004347 Perilla Nutrition 0.000 claims 1
244000124853 Perilla frutescens Species 0.000 claims 1
150000007857 hydrazones Chemical class 0.000 claims 1
JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims 1
229910052702 rhenium Inorganic materials 0.000 claims 1
WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 claims 1
238000009941 weaving Methods 0.000 claims 1
239000011347 resin Substances 0.000 abstract description 14
229920005989 resin Polymers 0.000 abstract description 14
239000010410 layer Substances 0.000 description 72
239000000243 solution Substances 0.000 description 18
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 16
238000002347 injection Methods 0.000 description 14
239000007924 injection Substances 0.000 description 14
WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 12
238000001914 filtration Methods 0.000 description 10
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 9
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
239000011248 coating agent Substances 0.000 description 9
239000011247 coating layer Substances 0.000 description 9
238000000576 coating method Methods 0.000 description 9
238000012360 testing method Methods 0.000 description 9
229910052763 palladium Inorganic materials 0.000 description 8
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
239000007788 liquid Substances 0.000 description 7
229910052709 silver Inorganic materials 0.000 description 7
239000004332 silver Substances 0.000 description 7
QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 6
229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 6
239000001257 hydrogen Substances 0.000 description 6
229910052739 hydrogen Inorganic materials 0.000 description 6
JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 5
230000002950 deficient Effects 0.000 description 5
239000000126 substance Substances 0.000 description 5
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 4
239000007864 aqueous solution Substances 0.000 description 4
238000005253 cladding Methods 0.000 description 4
230000007797 corrosion Effects 0.000 description 4
238000005260 corrosion Methods 0.000 description 4
150000002431 hydrogen Chemical class 0.000 description 4
KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 3
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
229910021529 ammonia Inorganic materials 0.000 description 3
238000006243 chemical reaction Methods 0.000 description 3
238000007796 conventional method Methods 0.000 description 3
230000005611 electricity Effects 0.000 description 3
239000007789 gas Substances 0.000 description 3
238000012545 processing Methods 0.000 description 3
238000006722 reduction reaction Methods 0.000 description 3
239000011734 sodium Substances 0.000 description 3
229910052708 sodium Inorganic materials 0.000 description 3
229910001379 sodium hypophosphite Inorganic materials 0.000 description 3
DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
239000004433 Thermoplastic polyurethane Substances 0.000 description 2
239000000956 alloy Substances 0.000 description 2
229910045601 alloy Inorganic materials 0.000 description 2
PHFQLYPOURZARY-UHFFFAOYSA-N chromium trinitrate Chemical compound [Cr+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O PHFQLYPOURZARY-UHFFFAOYSA-N 0.000 description 2
230000000052 comparative effect Effects 0.000 description 2
230000007423 decrease Effects 0.000 description 2
230000007547 defect Effects 0.000 description 2
238000004090 dissolution Methods 0.000 description 2
230000000694 effects Effects 0.000 description 2
229910052737 gold Inorganic materials 0.000 description 2
239000010931 gold Substances 0.000 description 2
239000012528 membrane Substances 0.000 description 2
230000007935 neutral effect Effects 0.000 description 2
239000002245 particle Substances 0.000 description 2
LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 2
238000007788 roughening Methods 0.000 description 2
230000035939 shock Effects 0.000 description 2
238000002791 soaking Methods 0.000 description 2
235000011006 sodium potassium tartrate Nutrition 0.000 description 2
238000004381 surface treatment Methods 0.000 description 2
229920002803 thermoplastic polyurethane Polymers 0.000 description 2
230000000007 visual effect Effects 0.000 description 2
UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
240000007594 Oryza sativa Species 0.000 description 1
235000007164 Oryza sativa Nutrition 0.000 description 1
229910000831 Steel Inorganic materials 0.000 description 1
230000001133 acceleration Effects 0.000 description 1
XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
230000002411 adverse Effects 0.000 description 1
150000001413 amino acids Chemical class 0.000 description 1
230000033228 biological regulation Effects 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
238000005422 blasting Methods 0.000 description 1
KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
239000004327 boric acid Substances 0.000 description 1
229910052799 carbon Inorganic materials 0.000 description 1
230000001413 cellular effect Effects 0.000 description 1
238000001311 chemical methods and process Methods 0.000 description 1
239000003795 chemical substances by application Substances 0.000 description 1
-1 chromium hydrogen hydrogen Chemical class 0.000 description 1
WYYQVWLEPYFFLP-UHFFFAOYSA-K chromium(3+);triacetate Chemical compound [Cr+3].CC([O-])=O.CC([O-])=O.CC([O-])=O WYYQVWLEPYFFLP-UHFFFAOYSA-K 0.000 description 1
GRWVQDDAKZFPFI-UHFFFAOYSA-H chromium(III) sulfate Chemical compound [Cr+3].[Cr+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GRWVQDDAKZFPFI-UHFFFAOYSA-H 0.000 description 1
238000004891 communication Methods 0.000 description 1
238000007739 conversion coating Methods 0.000 description 1
238000001816 cooling Methods 0.000 description 1
YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
239000013078 crystal Substances 0.000 description 1
230000003412 degenerative effect Effects 0.000 description 1
238000011161 development Methods 0.000 description 1
KPVWDKBJLIDKEP-UHFFFAOYSA-L dihydroxy(dioxo)chromium;sulfuric acid Chemical group OS(O)(=O)=O.O[Cr](O)(=O)=O KPVWDKBJLIDKEP-UHFFFAOYSA-L 0.000 description 1
238000007598 dipping method Methods 0.000 description 1
238000002845 discoloration Methods 0.000 description 1
239000003814 drug Substances 0.000 description 1
229940079593 drug Drugs 0.000 description 1
238000001035 drying Methods 0.000 description 1
239000000428 dust Substances 0.000 description 1
238000005868 electrolysis reaction Methods 0.000 description 1
238000001962 electrophoresis Methods 0.000 description 1
238000010828 elution Methods 0.000 description 1
238000005538 encapsulation Methods 0.000 description 1
238000011156 evaluation Methods 0.000 description 1
239000004744 fabric Substances 0.000 description 1
238000011010 flushing procedure Methods 0.000 description 1
238000005242 forging Methods 0.000 description 1
229960002449 glycine Drugs 0.000 description 1
235000013905 glycine and its sodium salt Nutrition 0.000 description 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
239000012771 household material Substances 0.000 description 1
IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
229910000041 hydrogen chloride Inorganic materials 0.000 description 1
150000004679 hydroxides Chemical class 0.000 description 1
238000009434 installation Methods 0.000 description 1
150000002500 ions Chemical class 0.000 description 1
238000002386 leaching Methods 0.000 description 1
239000004973 liquid crystal related substance Substances 0.000 description 1
239000006210 lotion Substances 0.000 description 1
LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
229920005668 polycarbonate resin Polymers 0.000 description 1
235000009566 rice Nutrition 0.000 description 1
150000003839 salts Chemical class 0.000 description 1
229920002379 silicone rubber Polymers 0.000 description 1
239000004945 silicone rubber Substances 0.000 description 1
239000002689 soil Substances 0.000 description 1
239000010959 steel Substances 0.000 description 1
230000003746 surface roughness Effects 0.000 description 1
238000010998 test method Methods 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/04—Electroplating: Baths therefor from solutions of chromium
- C25D3/06—Electroplating: Baths therefor from solutions of chromium from solutions of trivalent chromium
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electrochemistry (AREA)
General Chemical & Material Sciences (AREA)
Mechanical Engineering (AREA)
Electroplating Methods And Accessories (AREA)
Chemically Coating (AREA)

TW091102193A 2001-02-16 2002-02-07 Method for producing plated molded product TW554086B (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2001041029A JP3685999B2 (ja)	2001-02-16	2001-02-16	メッキ成形品の製造方法
JP2001192023A JP3722724B2 (ja)	2001-06-25	2001-06-25	メッキ成形品の製造方法
JP2001322754A JP3710408B2 (ja)	2001-10-19	2001-10-19	メッキ成形品の製造方法

Publications (1)

Publication Number	Publication Date
TW554086B true TW554086B (en)	2003-09-21

Family

ID=27346013

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW091102193A TW554086B (en)	2001-02-16	2002-02-07	Method for producing plated molded product

Country Status (5)

Country	Link
EP (1)	EP1360347A2 (de)
CN (1)	CN100360716C (de)
MY (2)	MY142899A (de)
TW (1)	TW554086B (de)
WO (1)	WO2002064862A2 (de)

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JP2004256876A (ja) *	2003-02-26	2004-09-16	Taiyo Manufacturing Co Ltd	メッキ成形品の製造方法
JP2004327306A (ja) *	2003-04-25	2004-11-18	Sunarrow Ltd	モバイル機器用の多色樹脂成形部品
CN100431080C (zh) *	2005-04-29	2008-11-05	乐金电子（昆山）电脑有限公司	按钮组件
EP1876268B1 (de) *	2006-06-13	2013-05-15	Wolf-Dieter Franz	Cr-VI-freie Schwarzverchromung
KR101136180B1 (ko) *	2006-06-14	2012-04-17	엘지전자 주식회사	정전기 방지 부품 및 그 제작방법
CN101210334B (zh) *	2006-12-29	2010-04-21	佛山市顺德区汉达精密电子科技有限公司	塑料表面处理工艺
CN101246989A (zh) *	2007-02-15	2008-08-20	上海安费诺永亿通讯电子有限公司	一种天线的制造方法以及天线结构
US8763173B2 (en) *	2008-09-26	2014-07-01	Kohler Co.	Stainless steel plumbing fixtures with resistant coatings
US20120156443A1 (en) *	2010-12-15	2012-06-21	David Reeder	Methods of multi-shot injection molding and metal-plated surface coated polymeric articles made therefrom
US9062386B2 (en)	2011-03-01	2015-06-23	Srg Global, Inc.	Methods of multi-shot injection molding and metal-plated polymeric articles made therefrom
FR2985741B1 (fr)	2012-01-12	2015-05-29	Albea Services	Produit plastique metallise or ou argent exempt d'element or et argent et procede pour sa fabrication.
CN104073846B (zh) *	2014-06-25	2016-05-18	陕西华夏粉末冶金有限责任公司	一种树脂电镀、气氛还原的铜镍合金薄板零件制备方法
CN104626448A (zh) *	2015-01-15	2015-05-20	温兵	一种壳体的制造工艺
DE102015109506B4 (de) *	2015-06-15	2018-12-20	Dr. Schneider Kunststoffwerke Gmbh	Verfahren zur selektiven Metallisierung von Kunststoffteilen und Bauteil
CN108683762B (zh) *	2018-05-22	2021-07-06	Oppo广东移动通信有限公司	装饰圈、功能组件、电子装置及装饰圈的加工方法

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2002
- 2002-02-07 TW TW091102193A patent/TW554086B/zh not_active IP Right Cessation
- 2002-02-14 WO PCT/JP2002/001274 patent/WO2002064862A2/en not_active Ceased
- 2002-02-14 MY MYPI20020502A patent/MY142899A/en unknown
- 2002-02-14 EP EP02700586A patent/EP1360347A2/de not_active Withdrawn
- 2002-02-14 CN CNB028068580A patent/CN100360716C/zh not_active Expired - Fee Related
- 2002-02-14 MY MYPI20080007A patent/MY148983A/en unknown

Also Published As

Publication number	Publication date
EP1360347A2 (de)	2003-11-12
WO2002064862A3 (en)	2003-08-28
MY148983A (en)	2013-06-28
CN100360716C (zh)	2008-01-09
MY142899A (en)	2011-01-31
WO2002064862A2 (en)	2002-08-22
CN1527892A (zh)	2004-09-08

Legal Events

Date	Code	Title	Description
2004-01-29	GD4A	Issue of patent certificate for granted invention patent
2014-06-21	MM4A	Annulment or lapse of patent due to non-payment of fees

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