TW559571B - Apparatus and method for processing a workpiece - Google Patents

Abstract

A system for processing a workpiece includes a base having a bowl or recess for holding a liquid. A process reactor or head holds a workpiece between an upper rotor and a lower rotor. A head lifter lowers the head holding the workpiece into contact with the liquid. The head spins the workpiece during or after contact with the liquid. The upper and lower rotors have side openings for loading and unloading a workpiece into the head. The rotors are axially moveable to align the side openings.

Description

559571 A7

The invention relates to surface preparation of workpieces such as semiconductor wafers, flat panel display optical media, and thin film heads, or other substrates made of microelectronic circuits, materials, coatings, or micromechanical components. , Washing, washing and drying. These or similar articles are collectively on this wafer ’’ or “workpiece, ...

The semiconductor manufacturing industry is constantly seeking to improve processes used to make microelectronic circuits and components, such as integrated circuits from wafers. Many purposes of these improved processes are to reduce the time required to process a wafer to form the required integrated circuits; to increase the output of available integrated circuits per wafer by, for example, reducing wafer contamination during processing; Reduce the number of Z steps required to produce the required integrated circuit; and reduce manufacturing costs. 7 During wafer processing, it usually requires that one or more sides of the wafer be exposed to any fluid in the form of a liquid, vapor or gas. This fluid is used to, for example, etch the wafer surface, clean the wafer surface, dry the wafer surface, passivate the wafer surface, deposit a thin film on the wafer surface, and so on. Controlling how the processing fluid is applied to the wafer surface is often important to the success of the processing operation. Various machinery and methods have been used to complete these manufacturing processes. However, existing machinery has several disadvantages. These disadvantages include the considerable consumption of process chemicals and water. The chemical consumption of this process increases manufacturing costs, which will ultimately increase the cost of end products such as, for example, computers, mobile phones, and virtually all types of consumables, industrial, chemical, commercial, and military electronics. In addition, many process chemicals are toxic and require special handling and storage. 4- The silver scale of this paper is applicable to the China National Standard (CNS) A4 specification (210 X 297 mm). 5. Description of the invention (2) and configuration method . These costs are costly and difficult, but they are necessary for health, safety and environmental reasons. Therefore, reducing the consumption of process chemicals has many advantages. Reducing water consumption is equally beneficial. In many areas, water is becoming scarce. As the population grows, there is greater competition for water. Disposing of sewage in an environmentally friendly manner also often becomes more difficult or costly. Therefore, it is equally important to reduce process water consumption. Generally speaking, the microelectronic circuits used in practically all electronic products * are made of flat disks or wafers made of semiconductor materials such as silicon. The side or surface of the wafer with microelectronic circuits is called the device side. The other side is often referred to as the back or bottom side of the wafer. In a wafer fab or manufacturing facility, Xiao Shu machinery or robots and methods are used to move, process, and store wafers m to maintain wafers in a m㈣ environment. Applying these technologies, the wafers are transferred to each process machine in a side-by-side direction. This applies well for most process steps. However, for some process steps' it will be necessary to accommodate the wafer in the device side down direction. For example, if the device side processes a liquid, it makes the device side down to help remove the liquid through gravity, and the characteristics are not conducive to the device side up processing. When putting the wafer by :! When the side is turned upside down to the downward direction of a device, conceptually; for 巧 单 事事 # it presents a substantial engineering challenge. Originally, wafers were typically selected only by their edges, and no other part of the wafer was accessible (to reduce contamination). In addition, the wafer must of course be securely grasped or held before it is turned over. The turning or reversing step must be done in a small amount of space because the clean room area of the manufacturing equipment is small and expensive. In addition, the flipping step of this paper-like paper ® ^ (^ 71 ^ (210X297 ^) must be completed quickly to avoid slow manufacturing operations and have movement or transfer of the workpiece. • In the manufacturing step of the σ midnight process, all The chemicals used in the process must be evenly applied / on the wafer to avoid having too much or too little etching, thin film removal, etc. Existing machinery usually cannot adequately and uniformly process chemicals. Will result in less output. In addition, many existing machinery trials use a large number of process chemicals to compensate for deviations in the application of process chemicals. Inadequate use of process chemicals in Japan will cause the above-mentioned disadvantages. Therefore, for improvement The required output, less process chemicals and water, more diversity, and improved machinery and methods that provide better results in manufacturing operations are needed. L Ail singularity < Machinery and methods to overcome the above shortcomings The method is now invented. In one design, the machine includes a workpiece having a processing chamber. The processing fluid is distributed through the surface of the workpiece in the processing chamber using centrifugal force. The machine has a head end, and the head end has a first rotor and a second rotor, the second rotor is engaged with the first rotor to hold a king piece in between. The second rotor preferably has- Open = ~ area 'is used to expose the bottom surface of the guard. The guard exposes the bottom surface to contact with the liquid through a fixed or mobile ㈣ or liquid applicator, or through contact with a liquid pool. With this design, the chemical Consumption will be dramatically reduced. The distribution of process chemicals on the guard is controlled by the rotor, which causes a more uniform and efficient processing. Multiple steps can be completed in the machine at the same time, which will reduce the potential damage to the workpiece due to contamination. 5. Description of the invention (4) and speeding up the manufacturing steps. In a second and separate content order, the first and second rotors each have a one-in and one-out opening. The first and second rotors can be moved relative to each other to w , Partially align the opening for loading and unloading a workpiece. The first and second rotors can move relative to each other at the same time, so that the opening of the guarding of the workpiece does not need to be aligned. Preferably, the opening The device includes at least one actuator for moving at least one of the rotors in a direction parallel to the rotation of the rotor. This design allows workpieces to be loaded into and unloaded from human machinery faster and easier. A-in-third content towel, the head The end is connected to a swinging arm on the head lifter for vertically moving the head toward and away from a base, the base has a liquid source for applying liquid to the bottom surface of the workpiece. The liquid source may be The sister element containing the liquid 'optionally includes a source of sonic energy, such as a huge sonic transmitter. This design provides a variety of machines capable of performing more types of processing steps' which includes turning the workpiece to implement the device side down Li Ergong. In a fourth and separate content, in the method of workpiece processing, the workpiece is horizontally moved to the-process head end. The head end and the guard are reversed and lowered toward a liquid source, the liquid The source provides liquid to the bottom surface of the workpiece. The liquid system is applied to the bottom surface of the workpiece by directly contacting the liquid pool or through the liquid outlet, by spraying or dipping. The workpiece rotates during or after the liquid is applied to the bottom surface of the workpiece. -The same or different liquid or a gas or vapor is selectively introduced into the top surface of the workpiece. This method provides a variety of process steps with less process chemicals and water consumption. It also eliminates the need to move workpieces, thereby reducing manufacturing time and space requirements. 559571

In the fifth inner case, the machine includes a workpiece casing, and the casing has a powerful working fluid distributed through the surface of the workpiece in the processing chamber by centrifugal force. -The holding end holds the guard and makes the bottom of the workpiece open or open. -The base has a clamshell that holds the liquid. -A sonic energy source, such as a giant speed transmitter, connected to the head and the head moving to bring the workpiece configuration into contact with the body. The sonic energy is moved by the sonic energy through the liquid to the workpiece ', thereby improving the machining of the workpiece. When the process head comes into contact with the liquid, it selectively rotates the workpiece. In these two inner valleys, the use of 9-speed energy will speed up processing and provide more efficient processing. Sonic energy and the use of reactors, such as those described in International Patent Application No. WO99 / 46064 used today, in these reactors, Because it is usually a closed structure; a rotating rotor; a fluid volume along the workpiece and / or lacking continuity, it is generally counter-intuitive. However, it has now been found that sonic energy can be practically used in these types of reactors, thereby providing improved processing. Therefore, it is an object of the present invention to provide an improved method and apparatus for processing a workpiece. The present invention exists in both steps and subcombinations of said characteristics. The features described and illustrated in relation to one embodiment can of course be used in other embodiments. Brief description of the drawings In the drawings, the same component number is used to indicate the same component. Figure 1 is a cutaway perspective view of a reactor or machine for workpiece processing. Fig. 2 is a sectional view of the reactor shown in Fig. 1. FIG. 3 is an enlarged detailed view of a certain element of the reactor of FIG. 1. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 6) i. Description of the invention (Figure 4 is the bottom perspective view of the lower processing room shown in Figure 2. Figures 5 and 6 are shown in Figure 3. A further enlarged detailed view showing the characteristics. Fig. 7 is an enlarged perspective view of the upper rotor shown in the reactors of Figs. 1 and 2. Fig. 8 is an enlarged perspective view of the lower rotor shown in the reactors of Figs. 1 and 2. Fig. 9 The cross section of the workpiece processing system is shown at a position above the head end. Fig. 10 is a cross-sectional view of the system at a position below the head end as shown in Fig. 9. Fig. 11 is a partial perspective view of the head end of the process of Fig. 9 Fig. 9.11 is an enlarged cross-sectional view of the process head end, which has a process head end position above and below the head end or an outer rotor in an extended position for loading and unloading a workpiece. Fig. 13-Its A cross-sectional view of a process head with the head end above and in the retracted position below or below the external rotor. Figure 14 is a cross-sectional view of the transformation. Figure 15 is a device with half of the system shown in Figures 丨 -8 or 9-14 A schematic plan view of a circular array. Figure 16 is a linear array of a device with the system shown in Figure 丨 -8 or 9_14 Figure 17 is a perspective view of a process system using sonic energy. Figure 18 is a perspective view of the lower side of the base shown in Figure 17. Figure 19 is an enlarged sectional view of the nozzle shown in Figure 18. Figure 20 is a cross-sectional view taken along the line 20-20 of FIG. Π. Refer to Figure 1-8 for details of the present invention. 'Reaction 100 is a microelectronic workpiece for use in a processing room', such as having an upper side. 12. Silicon wafer 55 on the lower side 14 and the outer circumference 16. -9-559571 A7

For some systems, the upper side 12 is the front side, which may be otherwise referred to as the device side, and the lower side U is the rear side, which may be otherwise referred to as the placement side. However, for other applications, the workpiece 55 is reversed. The reactor 1GG has a chamber member or rotor 112 including an upper or lower chamber wall 12 (), and a chamber member or rotor 112 including a lower chamber wall 14 (lower). These wall surfaces 12 and 14 can be moved apart, and by means of a loading and unloading mechanism (not shown), which can, for example, be in the form of a robot with a manipulation mechanism to allow the workpiece 55 to be loaded into the reactor 100 for processing. The wall surfaces 120 and 140 are configured to move simultaneously to form a chamber 160 along the wafer 55 in the processing position. The reactor 100 is rotatable along an axis A. The head end 200 includes an upper rotor 110, and the upper rotor includes up to a wall 120. A motor 220 is provided for rotating the upper rotor 110. The upper rotor 110 drives the lower rotor so that when it is engaged in the closed position, the upper rotor, the lower rotor, and the workpiece all rotate simultaneously. The motor 22 drives the sleeve 222 through a rotating element bearing 224, and the sleeve is axially supported in the head end 200. The large end 200 is lifted upward to open or separate the wall surfaces 12 and 14 and lowered to join the wall surfaces 120 and 140 or make them close to each other. The upper chamber wall surface 120 has an inlet 122 for processing a fluid, which may be a liquid, a vapor, or a gas. The lower chamber wall surface 140 also has an inlet 142 for such fluids. The fluids provided through inlets 122 and 142 may be the same fluid or different fluids. The head end 200 includes an upper nozzle 210 that extends axially through the sleeve 222 'so as not to interfere with the rotation of the sleeve 222. The upper nozzle 210 directs the processing fluid downwardly through the inlet 122 of the upper chamber wall surface 20 in the upper rotor. The upper chamber wall surface 120 includes an array of identical outlets 124, which are preferably spaced from each other at a fixed angular space along the vertical axis A. In the design shown, -10- this paper size is selected from the Chinese National Standard (CNS) A4 specification (210X297 public love) 559571 A7 B7

Use thirty-six such exits. The exit 124 is spaced outward from the vertical axis A by just slightly smaller than the workpiece radius. The exit 124 may also be spaced inwardly by a smaller radial distance, such as a distance of about 1-5 mm, by the periphery 16 of the workpiece 55 supported in the processing position. When the upper and lower rotors are polymerized at the same time, the wall surfaces 120 and 140 form the micro-environment chamber 160. The chamber 160 includes an upper processing chamber section 126 which is defined by a first or upper substantially planar surface of one of the upper chamber wall surface 120 and the wafer 55. The chamber 16 also includes a lower processing chamber or section 146, which is bounded by a lower chamber wall surface 14o and a second or bottom approximately planar surface of one of the supporting wafers opposite the first side. The upper and lower processing chambers 126 and 146 are connected to each other or communicate with the fluid through the annular region 13 and beyond the periphery 16 of the wafer 55. When joined together, the upper and lower rotors forming the chamber 160 are sealed along the lower rotor 112 by an annular, compressible seal (e.g., O-ring) 132. The seal 132 allows processing fluid to enter the lower inlet 142 to maintain sufficient pressure to flow to the outlet 124. As shown in FIG. 3, the lower nozzle 260 is provided at the inlet 142 of the lower chamber wall surface 14 and includes two or more ports 262. These direct two or more process fluid streams upward through inlet 142. The guide port 262 causes it to generate a directional flow to approximately converge the directional flow to the lower surface of the wafer 55. The reactor 100 also preferably includes a flushing nozzle 280 located on one side of the lower nozzle 260 for directing a flushing gas stream, such as nitrogen, through the lower nozzle 260. The reactor 100 may have a base 300, which supports the lower nozzle 26o and the flushing nozzle 280, and defines a coaxial annular flow system 32o. The circulation system 32 has several (for example, four) discharge pipes 322 (one of which is shown) (> each discharge pipe system is pneumatically driven through a poppet valve 340 for opening and closing the discharge pipe 322. These discharges -11-

559571 A7 B7 V. Description of the invention (9 The discharge pipe 322 provides a separation path to conduct different types of processing liquid to an appropriate system (not shown) for storage, configuration or circulation. The upper rotor 2 10 The annular edge 3 6 0, by The chamber wall surface 120 is located above the circulation system 3 2 0 and extends downward. The direction of each outlet 124 directs the processing fluid away from this outlet 124 so that the inner surface 362 along the annular edge 360 passes through the fluid channel 364. The inner surface 362 is Extend outward and downward as shown: This will cause the processing fluid to reach the inner surface 362 and use centrifugal force to flow outward and downward toward the circulation system as the rotor rotates. Thus, the processing fluid is easily swept through the circulation system 320 toward the discharge pipe 322. In the annular region 204 communicating with the circulation system 320, the upper rotor 11 has a ribbed surface 215 facing and closely spaced from the smooth lower surface of the head end 200. When the upper rotor 110 rotates, the ribbed surface 215 is easy to generate air in the annular area 204 and scroll. This helps to sweep the processing fluid through the circulation system 32 to the discharge pipe 322. The upper chamber wall surface 120 has a partition 128, It protrudes downward to prevent the wafer 55 from being lifted from the processing position and to prevent contact with the upper chamber wall surface 120. The lower chamber wall surface MO has a spacer 148 that protrudes upward to space the wafer 55 above the lower chamber wall surface 140. The pillar 15 projects upward beyond the periphery 16 of the wafer 55 to prevent the wafer 55 from deviating from the center of the vertical axis A. Referring to FIG. 8, the lower rotor 112 may include a lifting mechanism 400 for lifting processing. The wafer 55 supported in the position is raised to a raised position. When the head end 200 is lifted 0 above the base 300, the lifting mechanism lifts the wafer 55 to the raised position to open or separate the upper and lower chambers. Walls 120 and 14. The wafer 55 is lifted to a raised position, which will allow it to be loaded and unloaded by a mechanism (not shown), such as mechanical-12-

559571 A7 B7 V. Description of the invention (10) Arm to unload. The lifting mechanism 400 includes an array of lifting rods 42. Each lifter lever 42 can be pivotally mounted on the lower chamber wall surface 14 via a pivot pin 422, which extends to a socket 424 in the lower chamber wall surface 140. When the rotor moves at the same time and when the upper and lower chamber wall surfaces 12o and 140 are closed, each of the rotary rods 42o is configured to be joined via the upper chamber wall surface 12o. Each swivel lever 420 then turns into an inactive or lowered position. When not engaged through the upper chamber wall surface 120, each of the lifting rods 420 is deflected or elastically loaded with an elastic member 440 (for example, a 0-ring) acting on the hook 425 to turn into the movable or upper position. When the lift lever 420 is pivoted from the lower position to the upper position, the pins 422 on each of the lifting capabilities 420 extend below the wafer 55 supported in the processing position, and lift the wafer to the raised position. Referring temporarily to FIG. 4, when in the closed position, the upper and lower rotors are connected to each other by a locking mechanism 500. As shown in FIGS. 2, 3 and 4, the locking mechanism includes a locking ring 520 retained on the lower rotor 112 and adapted to engage a notch 542 configured in the complementary shape of the upper chamber wall surface 120. The latching ring 520 is made of an elastic spring material (such as polyvinylidene fluoride) with an array of inward-stage portions 530. The latching ring 520 allows the latching ring 520 to be in an undeformed state, wherein the latching ring 520 has a first diameter 'and changes to A deformed state in which the lock ring 52 has a relatively small diameter. This deformation occurs when the stage portion 530 is subjected to a radially inwardly directed force. When this force is removed, the lock ring 52 returns to its undeformed state. The locking mechanism 500 further includes an array of locking cams 545 each associated with a respective stage portion 530. Each latching cam 540 is adapted to apply a radial force to the respective stage portion 530. As shown in FIG. 2, the locking mechanism 500 further includes a uniform moving ring 560. When the standard of this paper is applicable to the standard of China Standards (CNS) A4 (210X297), '559571 A7 _____B7 V. Description of the invention ( 11) The mechanism is adapted to actuate the lock cam 540 when the movement% 560 rises or falls within a predetermined limited action range. The actuation ring 560 is adapted to actuate the latching cam 540 when raised, and release the latching cam when descended. A pneumatic lifter 58 (such as one such device) is suitable for raising and lowering the actuating ring 56. When the actuation ring 56 rises, the upper and lower chamber wall surfaces 120 and 140 are released from each other, so that the head end 200 can be lifted by the base 300 for opening the upper and lower chamber wall surfaces 12 and 14 or lowered to The base 300 is used to close the upper and lower chamber wall surfaces 120 and 140. As shown in FIG. 3, when the actuating ring 560 is lifted, the latch 562 on the actuating ring 56 is pulled out upward and enters the through hole 564 in the positioning ring 570. The positioning ring 570 is coupled to the lower chamber wall surface 140 and rotates therewith. When the actuating ring 56 is lowered, the latch 562 is withdrawn from the through hole 564 and the positioning ring 57 is cleared. When protruding into the respective through holes 564, the pins 562 are aligned with the wafer 55 already supported in the processing position, making it easy to unload the wafer 55 using the above-mentioned mechanical system. In use, when the rotors are spaced apart from each other, a workpiece is arranged on the rotor supported by the rod 42. The rotors then converge. This moves the workpiece down to the processing position 'during which the workpiece is spaced from the upper and lower chamber wall surfaces 12 and 14 by a small gap of, for example, only 〇 · 1 ·, 0.5_0.9 · or 0.7 mm. Preferably, the processing chamber 160 is formed on a flat workpiece, such as a semiconductor wafer or a microelectronic workpiece 55, and closely conforms to the flat surface of the workpiece. In general, the gap between the workpiece and the upper and lower wall surfaces is about 0.75 mm. The motor rotates the rotor and the workpiece. Liquid or gas is introduced through the inlets 122 and 142. Liquid flows outward through the workpiece using centrifugal force. This coats the workpiece with a relatively thin liquid layer. The tight separation of the walls and the workpiece helps to provide a controlled and uniform flow. Gas, if used, can flush or restrict liquid vapor, or at the same time This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) 559571 A7 _________B7 5. Description of invention (12) Provide chemical treatment of workpieces The rotational motion drives the fluid outward through the workpiece, and then flows out of the chamber 160 through the outlet 124. The valve 340 controls the fluid released from the base 300. Many benefits arise directly from the reduced fluid flow area in the reactor chamber. In general, because very little fluid is wasted, the use of process fluids will be more efficient. Furthermore, using the reduced fluid flow area of the reactor chamber, it is usually easy to control the physical parameters of the fluid flow, such as temperature, flow volume, and so on. This will produce more consistent results and make them repeatable. Multiple single workpiece continuous processes can also be accomplished using two or more processing fluids continuously provided through a single inlet through the reactor chamber. The ability to provide different fluids to the upper and lower surfaces of the workpiece allows special machining operations. For example, a processing fluid such as HF liquid may be supplied to the fluid inlet below the reaction chamber for processing the lower wafer surface, and an inert fluid such as nitrogen may be supplied to the upper fluid inlet. Thus, the HF liquid is allowed to react with the lower surface of the wafer, while the upper surface of the wafer effectively isolates the HF reaction. The reactor 100 can perform a wide range of functions. For example, the reactor 100 can perform a process that requires the processing fluid to fully contact the first side of the workpiece and only the peripheral edge portion of the second side of the workpiece. The processing fluid entering the inlet 142 of the lower chamber wall surface 140 can act on the lower side 14 of the wafer 55. Before reaching the outlet 124, the fluid can act on the periphery 16 of the supporting wafer 55 and the outer edge of the substrate 12. After reaching one, the two sides except the upper side 12 = 'The processing fluid entering the upper chamber wall plate opening 122 can act on the upper side of the wafer.' ^ Paper size: Chinese National Standard (CNS) A4 specification (210X 297 male) (Centimeter)

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k -15- 559571 A7 B7 As an example, the reactor 100 can be used to control the pressure of the processing fluid entering the inlets 12 and 142 to complete the processing fluid allowed to contact the first side of the workpiece, the peripheral edge of the workpiece, and the opposite side of the workpiece. Manufacturing process in a circumferential area. This fluid flow / contact can also be considered as a way to exclude the processing fluid applied to the opposite side from the peripheral edge of its side. In this embodiment of the process, a thin film material is etched from the first side, the peripheral edge of the workpiece, and the peripheral area of the opposite side of the workpiece. Figure 9_Π is shown in the transformation system, which has a reactor open on the bottom for applying fluid to the lower surface of the workpiece using other techniques. This allows machining of the workpiece device side to side. The reactor may have an open lower rotor to allow fluid from an external source of the reactor to be applied to the bottom or device side of the workpiece. If the workpiece is loaded with the device side up, fluid can be applied to the rear side of the workpiece through the opening in the lower rotor. A system with a rotor that exposes the bottom of a workpiece to an externally applied fluid preferably includes a reactor head having a ring-shaped lower rotor. The head end is tied to the head end up position for loading and unloading, and the head end down position is used for processing. The head end can be moved towards or away from the base. By opening the lower rotor, the base applies fluid to the lower surface of the workpiece. Figure 9 shows one of the many possible designs of the reactor system 700 for processing from the workpiece device side down to one side, or for externally applying fluid to the workpiece. Bottom surface. As shown in FIG. 9, the system 700 includes a process head end 714 connected to a support arm 711 of a lifter or lifter assembly 702. The lifter assembly 702 includes a lifter housing 700 that surrounds a lift motor 70. The motor rotates a lead screw 708 to lift the lower armature 71. The support arm 711 is connected to the electric -16- Standards for Financial Seizures (CNS) A4 Specification (297 mm)

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559571 A7 B7 V. Description of the invention (14) '-~~-Pivot m. The arm arm motor or actuator 712 in the armature 710 is turned or dragged. The private end 7 14 'is moved from the head up position shown in FIG. 9 to the head end down position shown in FIG. 1 (). Referring again to FIG. 9, the bottom 716 is provided below the process head end 714. The bottom includes a fluid source for providing fluid to the bottom surface of the workpiece 55. The base 716 can be connected to the riser assembly 7G2 or supported on the floor. The riser assembly is optimally supported on the floor. The base 716 is aligned vertically below the process head 714. The lifter assembly 702 moves the process head 714 toward and away from the base 716. FIG. 9 shows that the private head end 714 is lifted away from the base 716, and the process head end 7 丨 4 is placed in the head end upward position for loading or unloading the workpiece 55. FIG. 10 shows the process head 714 in the down position and engages the process head 714 with the base "for applying fluid to the bottom surface of the workpiece 55. The design shown in Figs. 9 and 10 has a base 716 fixed to the elevation The process head 714 can be moved in the vertical direction v toward and away from the base 716. The process head 714 can also be pivoted along the horizontal path H. Although these process heads 714 preferably move relatively, the lifter The assembly 702, and the base 716 can also be used for various dagger motions. For example, one or more of the head ends 714 can be pivoted along a vertical axis, such as the E-axis shown in FIG. Fixed or moved in a vertical, lateral, or longitudinal direction, or pivoted or rotated along a vertical axis. In this way, the base 716 or base can be moved or fixed relative to its supporting structure, such as the lifter assembly 702. Similarly, the process head The end 714 can be provided with other forms of movement. In addition, the process head end 7 i 4 can be supported by the above or other methods, in addition to being supported by the support arm 7 丨 丨 on one side. The process head end 714 can also be supported or connected to the ground to the base 716 Instead of connecting to Height device assembly 702. In addition, Figure 9-17-This paper size is applicable to the Chinese National Standard (CMS) A4 specification (210 X 297 mm) V. Description of the invention (15) Shows the position above the head end and provides the head end The support arm motor 712, which moves between the upper and lower positions of the head, can omit all the functions of loading and unloading, including direct loading and unloading in the lower position of the head. In this way, although Figures 9 and 1G show the better design, This is just one of the many designs contemplated by the present invention. Now returning to Figure U · 14 'except for the following, the process head or rotor 714 is the same as the design and operation of the reactor shown in Figure ㈣. The end 714 performs the processing of the position below the head end shown in FIG. 1 (). The name "above,", "below,", "up,", "down", and the position described with respect to gravity are the same. The name is used here to describe a system 70 with a process head end 7U at the position below the head end (^ The head end position of Fig. 10 corresponds to the reversed Figs. 13 and 14. Referring initially to Figs. 11 and 12, the process head end 714 Includes a lower or outer rotor 730 located at or below the head end housing 73 The upper or inner rotor inside 4. The upper rotor 732 is connected to the head-end rotation motor 738 through a shaft 741. As in Fig. 8, the fluid can be supplied by the upper nozzle 744 through the supply line extending through the pipe 74. Provided to the upper surface of the workpiece 55. The motor 738 is supported on the head end housing 734 by the motor plate 746 shown in FIG. Still referring to Figures 11 and 12, the lower or outer rotor 730 has a ring or ring structure. A central opening or region 73 in the lower rotor 730 allows liquid to be supplied from the base 716 to the bottom surface of the workpiece 55. As shown in FIG. 12, the lower rotor ring 748 is connected to the top surface of the lower rotor 730. The lower rotor 730 is connected to or rotates with the upper rotor via a lower rotor ring. An air box 750 is connected to the top plate 752 of the lower rotor ring 748 and the upper rotor 732. Referring to FIG. 12, the lower rotor extension actuator 760 is connected to the motor -18-559571 A7 B7 V. Description of the invention (16) Plate 746. The shaft or arm of each actuator 760 extends through the opening in the motor plate 746 and the head end housing 734, and is pushed onto the lower rotor ring 748. Preferably, three pneumatic actuators 760 are provided to be evenly spaced from the motor plate 746. As shown in Figures 丨 and 12, the actuator 760 moves the lower rotor 730 from an extended or external position for loading and unloading. The loopback bomb 742 shown in FIG. 13 continuously drives the lower rotor 730 to engage the upper rotor 732 by applying a force. The return spring moves the lower rotor to a retracted or machining position, as shown in Figures 13 and 4. Referring back to Fig. 11, a load / unload opening or window 762 extends through the preferably cylindrical side wall surface of the lower rotor 730. A loading / unloading or loading / unloading slot provides material to the preferably cylindrical side wall surface of the upper rotor 732. When the upper rotor 732 is driven by the rotation motor 738, it rotates along the ¥ axis of FIG. The upper rotor 732 is also preferably fixed to the position of the head end housing 734. The lower rotor 73 ° rotates with the upper rotor 732 and can also move axially in a direction parallel to the ν axis between the positions shown in Figs. Η and 12 on the one hand and the positions shown in Figs. 13 and 14 on the other hand. When the lower rotor 730 is located in the extended position, as shown in FIGS. 丨 and 12, the window and the lower rotor are extended out, or the groove 764 in the upper rotor 732 is opened or exposed. The vertical size and height between the groove 764, the workpiece 55 and the upper rotor 732, as indicated by f ', are sufficient allowable end manipulators or other machinery equipment or tools to move through the opening 762 to lift the wafer away from the upper rotor 732. The width W of the window 762 is larger than the diameter or characteristic size of the workpiece 55 on the surface, so that the robot can pull the workpiece out of the process end 714 through the window 762. The upper rotor 732 has a latch or a bracket 766 for supporting the workpiece along its circumference, and the rest of the rotor 732 is spaced. Similarly, the bolt or bracket 768 on the lower rotor 730 extends toward the workpiece 55 for holding and the lower rotor 73 ° ring structure-19- 559571 A7 ---------- B7__ 5. Description of the invention (17 ) Spaced workpiece 55. When the lower rotor 730 is located in the extended position, as shown in FIG. Η, the workpiece stays on the latch 766 of the upper rotor 732 using gravity. When the lower rotor 73 ° is located at the retracted position, as shown in FIG. 35, the workpiece 55 is fixed, held, or clamped between the pins 766 and 768, and is spaced from other structures of the rotor. The upturn 732 also has a guide pin 769, which is located on a surface larger than the diameter of the workpiece. The guide pin 769 keeps the workpiece large in the middle of the upper rotor. The guide pins extend beyond the height of the upper rotor 732 — 1_5, 2_4, and are typically approximately 2.5 mm. The work support pin 766 has a nominal height of approximately 0.7-0.8 mm. Similarly, the support pin 768 on the lower rotor extends from the lower rotor by more than about 0.7 mm. As far as the workpiece has a thickness of about 0.7-0.8 mm, when the rotors are brought together, there is a nominal vertical gap of about 0.25 mm between the support pin and the workpiece. The guide pin 769 functions as a hard stopper and sets a gap between the rotors. When the lower rotor 730 is located in the retracted position shown in Fig. 13, the window 762 is moved inside the head end housing 734, and the groove 764 in the upper rotor 732 is covered or closed by the solid curved side wall surface of the lower rotor 730. As shown in FIG. 12, the outlet 772 extends from the side wall surface of the downward rotation 730 by an annular channel 77 1 extending continuously along the lower rotor. Similarly, the outlet 770 extends through the outer rotor 732. Referring to FIG. 13, when the lower rotor 73 is in the retracted position, the outlet 770 is connected into the annular passage 771, thereby providing an exit path by a space or chamber 775 formed between the upper surface of the workpiece 55 and the lower surface of the upper rotor 732. When the lower rotor is moved into the process position shown in Fig. 13, the radial seal 774 seals the upper and lower rotors. Referring back to FIG. 9, the base 716 provides liquid to the lower surface of the workpiece 55 through the open center region 731 of the lower rotor 73 °. Therefore, the base 716 can pack -20-

559571 A7 B7

V. Description of the invention (18) Includes various devices for this purpose, such as a contact or dip material part, a core nozzle spray system, a system, and a fixed interval nozzle array, or a movable spray spray Nozzles, such as on one or more translation or pivot arms; mouth. In addition, a 'liquid outlet' for easy liquid contact with the workpiece can be used to spray the nozzle. 9 and 10 show that the system 700 has a surface contact or dip spider or 780 in a base 716. The edge blade 782 may be used to catch and guide the flow of liquid along the chamfer 7 during processing or otherwise be divided. If used, the gas or liquid inlet 786 extends into the piece 780 next to the edge leaf 782. The liquid inlet 792 and the outlet or discharge pipe 788 provide liquid entry or exit flow 78. Multiple inlet states connected to different liquid sources are available. The loader JL member 55 is lowered (in the direction of gravity) and stays on the latch dove. Deactivating the actuator 760 allows the spring 742 to withdraw the lower rotor 73 <) from the extended position shown in Fig. N to the retracted position shown in Fig. 13. The work 55 is fixed between the latches 766 and 768. A large number of edge seal rings 774 as shown in FIG. 15 seal up and down. In use, a single workpiece 55 is loaded into the process head end 714. Referring to Figures 9, n and 12 ', in a preferred embodiment, the process head end 714 is in a position above the head end' and raised or lifted upward and away from the base 716. The lower rotor 73G is located at this extended position. The workpiece 55 moves horizontally through the window in the lower rotor 73 and through the groove 764 in the upper rotor 732. Preferably, the workpiece 55 is loaded by a robot. The height η of the groove 764 is sufficient to allow the workpiece and the robot-side operating mechanism ′ to be cleared or installed between the pins 766 and 768. The robot-side operating mechanism or hand can be installed through the side grooves or openings 762 and 764 and enter the room 775 for

559571 A7 _ B7 V. Description of the invention (~~) ~-To prevent or reduce leakage during the process. When the lower rotor 73 is in the retracted position, the window 762 and the groove 764 are no longer aligned. The direct access door 775 was closed. The motor 712 moves the process head end 714 from the position above the head end shown in FIG. 9 to the position below the head end shown in FIG. 10. The riser assembly 702 moves the process head 714 to engage the base 716. Process liquid is supplied into the bowl member 780 through the liquid inlet 792, thereby forming a liquid solution. When the process head 714 engages the bottom 716, the bottom surface of the workpiece 55 contacts the solution. The workpiece 55 may be completely immersed in the solution. Alternatively, only the bottom surface or bottom surface and the edges of the workpiece may come into contact with the solution. The workpiece-to-solution contact range can be adjusted by changing the liquid level in the carrier 780, or changing the relative vertical position between the process head end 714 and the bottom 716. Preferably, the liquid level of the bowl member 78 is set through the height of the weir 794 on the side of the bowl member. When contacted with the solution, the workpiece 55 may be fixed. Alternatively, the rotary motor 738 can better rotate the workpiece at a low RPM, which facilitates easy liquid movement across the surface of the workpiece. Other process gases, gases or liquids can be supplied to the top surface of the workpiece through the upper nozzle 7. The bowl 78 may be replaced with other liquid applicators, such as fixed or mobile spray nozzles or liquid outlets. After the processing of the liquid solution is completed, the solution in the bowl 78 is discharged or removed through the discharge outlet 788. The workpiece may then be selectively rotated at high speed, directing the process fluid to the top surface of the workpiece with or without nozzle 744. The head can be lifted slightly before turning. A gas, such as nitrogen or air, can be introduced into the base 716 through a gas inlet to help remove or flush the liquid from the bottom. After processing is completed, the lifter assembly 702 lifts the process head 714 off the base 716 by actuating the lifter motor 706. The support arm motor 712 will make the process head end-22- this paper size applies to 81 81 standards (CNS) A4 specifications (210X297 public love) ---- 5. Description of the invention (714 returned to the position above the head end. Extending the cause Actuator 76 moves the lower rotor 73 and returns to the extended position. The workpiece is then removed by the process head end 714. "Washing the machine from the bottom to the bottom is better for various process steps, especially when it comes to processing semiconductor wafers. The design of the workpiece in Figure 9_14 is better controlled because the workpiece is held by the same component, which controls the edge area and has only two interfaces between the motor shaft 74i and the workpiece 55. One interface is located between the fixed plate and the motor shaft 741. The second interface is located between the top plate and the upper rotor 732. In the system 600 of FIG. 15, a robot arm 61 is rotated along the axis 615 to load and unload the machine. 007 and the path 600 between the reactor 100 and / or 700, the system for carrying out the transport operation, or six or more robotic arms 625 are conveyed along the linear path 63 for a loading / unloading machine 6 Required transport between us and reactor 100 and / or 700 The present invention has illustrated related wafers. However, it will understand that the present invention has a wide range of application capabilities. Using examples, the present invention can be applied to the processing of discs and head-ends, flat panel displays, microelectronics Hoods, and other devices need effective and controlled liquid processing. In a transform design, as shown in Figures 17-20, the processing system 810 using sonic energy has a process head 812 and a base 814. The head end 812 has an upper rotor 838 It engages the lower rotor 836 to hold the workpiece 55 in between. The bellows 840 connecting the upper and lower rotors helps to keep process chemicals from flowing out of the components inside the head end 812. When the head end is in the loading / unloading position, the workpiece can pass through The side opening 842 is loaded and unloaded. The nozzle 846 on the inlet and outlet head end introduces the process fluid to the top surface of the workpiece. -23- This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) 559571 A7 __B7 V. Description of the invention (21 ) The base 814 includes a base plate 816. A sonic transmitter 82, such as a giant sonic transmitter, is connected to a portion of the base plate 816. The sonic transmitter 820 is at right angles, and preferably In the middle of the rotation axis of the head end 812. As shown in FIG. 20, the sonic transmitter is installed in the central opening in the bottom plate 816 and forms the central bottom section of the bowl or liquid loading container 817. The spray nozzle 822 extends through the bottom plate 8 16 As shown in FIG. 18, preferably, a series of spray nozzles 822 are provided on the opposite side of the sonic transmitter 820, close to the center of the process head end 812. The spray nozzles are oriented at an angle to spray liquid toward the workpiece 55. The overflow nozzle or inlet 830 extends through the bottom plate 816 and into the bowl 817 at the same time. The overflow nozzle 830 is used to fill the bowl member 817 with liquid so that the liquid may contact or dip the bottom of the processing workpiece 55 or the device side. An overflow nozzle 830 may be provided through the opening of the sonic transmitter 820. Alternatively, the overflow nozzle 830 may be located on one side of the conveyor 820, next to the spray nozzle 822. The discharge pipe outlet 824 extends from the bowl member 817 to one or more discharge valves 826. The sonic transmitter 820 is sealed to the bottom plate 816 by an O-ring 828. Referring to FIG. 19, each of the spray nozzles 822 preferably has a fluid pipe 832 extending through the nozzle body 834. A directional opening 835 at the upper end of the fluid tube 832 directs the spray fluid toward the lower surface of the workpiece on the process head end 812 that engages the base 814. When the spider 817 is on the liquid-containing base 814 and the workpiece is in the liquid, the conveyor 820 is activated. The sonic energy from the conveyor 820 is transmitted through the liquid to the workpiece in contact with the liquid 8 2 2. Sonic energy assists and enhances processing. For example, in the washing step, after the liquid in the bowl 817 has been removed, or it is discharged to a low enough level to expose the spray nozzle 822, the spray nozzle 822 -24- This paper size applies the Chinese national standard (CNS ) A4 size (210X 297mm)

Claims (1)

559571 A8 B8 Guang. C8 ------------- —_D8 VI. Patent Application Fan Yuan I K A machine for processing workpieces, including: one end, one first A rotor and a first rotor surrounding the first rotor in the head-end housing, wherein the second rotor has an open center area and a second sub-engager engages the second rotor to hold a workpiece therebetween; and the second The rotor can be moved from a first position during which the first rotor is 'moved to-a second position' during which the second rotor is spaced from the first rotor. 2. The machine according to item 1 of the scope of patent application, wherein the second rotor and the first rotor each have a chamber access opening, and when the second rotor is in the first position, the access openings deviate from each other, and when the When the second rotor is in the second position, the access openings are at least partially aligned with each other. For example, the machine of claim 1 in the patent claim further includes at least a uniform actuator in the head end for moving the second rotor from the first position to the second position. 4. The machine according to item 1 of the scope of patent application, further comprising a support arm connected to the head end and a head end lifter for raising and lowering the head end. 5. The machine according to item 4 of the patent claim, further comprising a pivot motor for pivoting the head end of the support arm from a head end up position to a head end down position. 6. The machine according to item 4 of the scope of patent application, further comprising a base with a bearing plate, wherein the head end lifter is positioned relative to the head end and the base, for lowering at least part of the head end second rotor into the Offer. • 26- This paper ruler Qi Cai® g house materials (CNS) A4 size (210X297 mm) k Order ★ The machine in item 6 of the "Monthly" Patent Range further includes a sonic energy source associated with the undercarriage. For example, the machine of claim i of the patent scope further includes an entrance in at least one of the first and the first rotor. 9. The machine according to item 6 of the patent, wherein the base is connected to the head-end k-liter. 10. As stated in the patent scope, the machine further includes a locking device for locking the first rotor to the second rotor. η. The machine according to the scope of the patent application, further comprising a rotating motor in a head end connected to at least one of the first rotor and the second rotor. The patentee claims that the machine of item 1 of the patent scope further includes a bellows connected to the first rotor and the second rotor. U · —A reactor for processing a workpiece, comprising: a reactor head end shell; a first rotor rotatably installed in the reactor head end shell; a second rotor that can follow the first rotor Rotating; a rotor moving device for moving the second rotor from a first position in which the first and second rotors are immediately adjacent to each other to a second position in which the first and second rotors are spaced from each other; and a liquid applying device It is separated from the head of the reactor and is used to apply liquid to the downward facing surface of the workpiece supported by the first and second rotors. 14 · A system for processing workpieces, including a head end lifter;-the head end 'is connected to the head end lifter, and the head end is positioned upwards-27-This paper standard is applicable to China National Standard (CNS ) Α4 size (210 X 297 mm) 559571 15 Move to a head-down position; a first rotor located in the head-end of at least one workpiece holder; job-bowl for containing liquid, the material can be borrowed μ μ plus a first position above the material Moving to the y-piece bracket is at least partly located in one of the first position of a reactor for processing a workpiece, including: a first rotor with a generally circular side wall, and an opening in the first A side wall; Chi 113: a second rotor that can be engaged with the first rotor, and has a first side wall that is generally open, and a second access opening is located in the second side wall; and an actuator connected to the At least one of the first and second rotors is used to move the first rotor from the first and third positions where the first and second openings of the Humph are tilted toward each other, to the first and second positions. The two access openings are at least partially opposed to one of the second positions to allow the workpiece to move therethrough. 16. The reactor according to item 15 of the patent application scope, further comprising a rotor housing, the housing comprising at least one rotor actuator connected to the first rotor, for moving the first rotor into the first and second positions. . 17. —A machine for processing workpieces, including: a head end lifter; a head end bracket on the head end lifter; a process head end attached to the head end bracket; the process head knows the actuator ' Connected to the process head for pivoting the process head around a generally horizontal axis; a base that is vertically aligned below the process head; -28- This paper size applies to China National Standard (CNS) A4 (210X 297 mm) Binding ^ 59571 A liquid applicator in a base is used for loading a liquid solution; a first rotor is located on the process head end and has a first rotor access opening; a second rotor is located on the process head end and has a The second rotor access opening is movable to engage with and rotate with the first rotor, and at least partially aligned with the first rotor access opening and the second rotor access opening. 18. The machine of claim 17 in the scope of patent application, wherein the liquid applicator comprises at least one spray nozzle. 19. The machine according to claim 7 of the patent application, wherein the liquid applicator includes a bowl for holding a liquid solution. 20. The machine according to item 17 of the application, wherein the liquid applicator includes a swing arm having at least one spray nozzle. 21 · The machine according to item 18 of the scope of the patent application, wherein the spray nozzle is positioned to spray the fluid vertically upward. 22. The machine according to claim 21, wherein the spray nozzle is located on the second rotor rotating shaft. 23. The machine of claim 17 in the scope of patent application, wherein the liquid applicator comprises a liquid outlet of a liquid supply line. 24 · —A method for processing a workpiece, including the following steps: horizontally moving the workpiece into a process head end; reversing the manufacturing head end; lowering the process head end toward a liquid solution so that at least one of the workpieces The surface is in contact with liquid; -29- This paper size is applicable to China National Standard (CNS) A4 specification (210X 297 public directors) " '----------- Patent application scope ::: piece manufacturing process and head end Leaving upward from the liquid solution is used to rotate the workpiece by the liquid. 25. If applying for a patent, the "Feng Yifeng" method, wherein the step of moving the workpiece :) Package 3: Move the second rotation 2 relative to the first rotor on the process head end to align the second and first rotors. Open σ, and then move the workpiece horizontally through the opening. 26. A device for processing a workpiece, comprising: an upper plate and a lower ring, which can be separately joined to an upper surface and a lower surface or a workpiece, the upper plate is formed An upper processing chamber is located on the upper surface of the workpiece; an upper inlet through the upper plate is used to provide fluid to the upper surface of the workpiece, at least-the fluid outlet is located in the upper processing chamber and is generated by the rotation of the workpiece The centrifugal force 'removes fluid from the processing chamber. 27. For the device in the scope of patent application No. 26, wherein the upper plate and the lower ring are supported on the process head, and the lower ring is parallel to the rotation axis of the lower ring 28. If the device of scope 27 of the patent application is applied, the upper plate is fixed at the position relative to the head end of the process. 29. The device of scope 26 of the patent application, wherein the upper plate has a curve shape The upper plate side wall, with the plate in and out openings passing therethrough, and wherein the lower ring has a curved lower ring side wall, and the ring in and out openings passing therethrough, and during which the upper plate and the lower ring are movable to align the plate in and out openings With ring in and out -30- This paper size is applicable to China National Standard (CNS) Α4 (210X297 mm) Opening. 30. Positioning of item 26 in the scope of patent application. Wherein, the lower ring surrounds the upper plate 31. If the center area of the 26th area of the patent application is located below the lower surface of the workpiece, the lower soil has an opening. For the device of the 27th area of the patent application, further includes a The head lifter connected to the head end of the process, and the bottom 1 & 4 has a liquid applicator for applying liquid to the lower surface of the work piece, and the process head end can be moved through the head to lift. Device toward and away from the base. 33. The alpha heart device according to item 26 of the patent application scope, further comprising an application device for applying a liquid to the lower surface of the workpiece. 34. The device of claim 26, wherein the upper processing chamber is formed by a gap region between the upper surface of the workpiece and the upper plate to tightly restrict the processing fluid from being introduced into the upper processing chamber along the upper surface of the workpiece. 35. If the device of claim 32 is applied, the step further includes a reverse device for reversing the process head. 36 · —A system for processing a workpiece, comprising: a bowl member for loading a liquid; "Suoyue b Ϊ source" is connected to the spider member for introducing sonic energy into the liquid in the bowl member; a Process head end; a process head end lifter is positioned to move at least part of the process head end into and out of the liquid in the bowl, and the process head end includes an upper rotor and a lower rotor, and the upper rotor and the lower rotor The rotor can be engaged along a workpiece. • 31-This paper size applies to China National Standard (CNS) A4 (210X 297mm) 559571 37. The system of claim 36, further comprising a filling port and a discharging port in the bowl. 38. The system of claim 36 of the scope of patent application for oxygen further includes an inlet for the upper rotor. 39. The system of claim 36, wherein the lower rotor includes an annular ring member. < 40. The system according to item 39 of the patent application scope, wherein the lower rotor is movable into a position approximately surrounding the sound velocity energy source. 41. The system of claim 36, wherein the sonic energy source includes a sonic transmitter. 42. The system of claim 41, wherein the transmitter is fixed in position within the pod. 43. The system of claim 42 in which the conveyor is aligned with the lower rotor. 44. The system of claim 36, further comprising a liquid supply source connected to one or more of the spiders. 45. The system according to item 44 of the patent application scope, wherein the process liquid supply source includes a liquid selected from the group consisting of water, HF, and ozone water, and combinations thereof. 46. The system of claim 36, further comprising a motor connected at least indirectly to the upper rotor. 47. The system of claim 41, further comprising a liquid outlet nozzle located below the conveyor opening. 4 8 · If the system of the scope of application for patent No. 41, further includes an extension passed. 32. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 559571 A8 B8 Order t 6. Scope of Patent Application 56. The method of claim 50, wherein the workpiece has a top surface and a bottom surface and the bottom surface of the workpiece is in contact with the solution, and further includes providing a fluid to the top surface of the workpiece. step. 57. The method of claim 50, wherein the fluid is provided in a central area of the workpiece. 5 8 · —A system for processing workpieces, including: an upper rotor; a lower rotor that can be engaged with the upper rotor to hold the workpiece therebetween; a sonic transmitter located at least among the upper and lower rotors One of at least one fluid inlet located in at least one of the upper rotor and the lower rotor; and ^ at least one fluid outlet located in at least one of the upper rotor and the lower rotor-medium 59. If the scope of patent application is 58 The system further includes a water tank for loading liquid 'and an actuator for lowering the lower rotor into the water tank. 60. The system of claim 59, wherein the sonic transmitter has a -center through hole 'and further includes a nozzle outlet in a water tank, which is aligned with the center through hole. 61. If the system according to item 58 of the scope of patent application, the step further includes a rotary motor connected to the upper rotor. 62. The system according to item 58 of the scope of patent application ^ ^ It also further includes a device for connecting and releasing the upper rotor and the lower rotor. • 34-559571 A8 B8 C8 D8, patent application scope 63. If the system of patent application item 59, further includes a first process fluid source connected to the water tank, and one second outlet connected to the upper rotor Process fluid source. 64. The system of claim 59, further comprising a rotating device for rotating the lower rotor with respect to the water tank. -35- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)