TW572832B - Process for preparation of single powder film on long ruler-like film substrate and apparatus for preparing the same - Google Patents

Description

572832 V. Description of the Invention (1) Technical Field of the Invention The present invention relates to a method for manufacturing a powder single-layer film of a single-layer film, which is uniform in the plane direction on the surface of the adhesive layer of a long-size film substrate. And the powder is continuously and finely manufactured, and a part of the powder is a powder protruding from the surface of the adhesive layer and a powder single-layer film manufacturing device suitable for the manufacturing method. [Technical Background of the Invention] In a method for attaching a powder to a substrate, there are generally (1) an electrostatic spray method in which a powder to which a charge is applied is attached to the substrate by a sprayer, and (2) the substrate is immersed in a substrate In powder coatings in a fluidized state caused by charged gas, the electrostatic flow impregnation method for electrostatically attaching the powder, (3) dispersing the charged powder in a liquid, and applying a voltage to the substrate Electroplating method in which powder adheres to the substrate. In addition, there is a proposal proposed in Japanese Patent Application Laid-Open No. 5-3021 76 (4) An adhesive layer composed of an uncured resin is formed on the surface of the substrate in advance, and it is adhered to the surface of the film-forming medium by external force such as vibration. A method for embedding a powder coating in the adhesive layer. Also, there is proposed in Japanese Patent Application Laid-Open No. 9-3 1 8801 and Japanese Patent Application Laid-Open No. 1 1-95004 (5) After forming an adhesive layer on a substrate, powder is supplied to the adhesive layer, and the powder is applied. After smoothing and making the surface uniform, the method of burying the powder in the adhesive layer by using a press or a pressure roller. However, the method of forming a powder film according to (1) to (3) above is a method of attaching a large amount of powder to a body. From the principle of coating, it cannot be uniformly and finely filled in a planar direction. Powder single layer powder layer. In the coating method of (4), the powder is embedded in a liquid state in an unhardened state. 572832 V. Description of the invention (2) When the adhesive layer made of resin is used, the liquid resin of the adhesive layer may The surface is pushed out so that the powder adheres to it. This phenomenon will eventually repeat until the exudation of the liquid resin ceases to form a plurality of thin films. In addition, with this method, since both the film forming medium and the substrate are shaken or stirred in the container at the same time, it is difficult to apply to a large-area substrate with a large area and high flexibility, such as a long film, and the device itself becomes large. There is a problem of causing pollution to a device for spraying powder. On the other hand, in the coating method of (5), although it is suitable for a film-like substrate, the filling density of the powder in the plane will produce fine parts and rough parts, and there will be powders side by side in the flow direction, or It is prone to strip damage. In addition, in this method, since the pressure applied to the film by a punch or a pressure roller has a subtle error, it is very difficult to embed the powder uniformly and deeply into the adhesive layer system over the entire substrate. In addition, with regard to the aforementioned pressure deviation, in places where a large pressure is applied, the exuded adhesive will adhere to the powder and the powder layer will become a plurality of layers, and the part with the lower pressure will not have a sufficient degree of embedding. There is a problem that a defect easily occurs due to the detachment of the powder when the remaining powder is removed in the next step. The foregoing phenomenon can be clearly observed in the case of processing a large-area substrate, or in the case of using a fine particle powder having an average particle diameter of 15 / m or less. In particular, for powders with an average particle diameter of 15 // m or less, the total surface area becomes larger, which is greatly affected by electrostatic forces or van der Waals forces caused by frictional charging. The fluidity is remarkably lowered, and it becomes difficult to adhere the powder uniformly and densely to the surface of the adhesive layer. In addition, even if there is no problem of fluidity, in the aforementioned fine particle powder -4- Λ 572832 5. In the aspect of the invention (3), the pressure of the pressure roller will be dispersed, and the pressure applied to each powder will be reduced. It is quite difficult to bury other powder systems uniformly and deeply at the gap between the powder and the powder already attached to the adhesive layer. In addition, as a device for burying the powder in the surface layer of the adhesive layer, there is a vibration device in which a container C is provided on the vibration mechanism V as shown in FIG. 10. Container C is a container made of a hard synthetic resin or a hard material such as metal. A bowl-shaped opening cl is formed at the upper part, and a central part of the bottom C2 is provided with a bulge extending upward to reach and The columnar portion c3 having the same height as the opening portion cl. On the other hand, the vibrating mechanism V is provided with a vibrating piece f3 on the machine F via the coil springs f 1 and f2. A vertical axis f4 extending upward is protruded at a central portion above the vibrating piece f3, and a lower center of the vibrating piece f3 A motor f5 is fixed at each part, and a weight f7 is mounted off-axis at an output shaft f6 of the motor f5. The container C is installed in a state where the upper end of the columnar body c3 is fixed to the upper end of the vertical axis f4 in a state of being mounted on the vibrating piece f 3, and is received when the motor f 5 is driven and the weight f 7 is rotated. The state of vibration. The powder and the pressurized medium are put into the container C of the vibration device, and while the container C is vibrated, the adhesive layer is laminated, and the substrate to which the powder is adhered is drilled in the pressurized medium. Thereby, the powder on the adhesive layer is impinged through the pressurized medium subjected to vibration in the container C, and the powder is buried in the surface layer of the adhesive layer to form a powder single-layer film. However, in the aforementioned vibration device, the vibration of the pressurized medium in the container C may be different at the center portion and the edge portion, so that the smaller substrate 'can be formed uniformly and finely in the plane direction. Powder list

I I572832 V. Description of the invention (4) Layer film 'However, for a substrate with a large area and high flexibility like a long-size sheet, the processing in the container C is limited. For example, even if the processing is performed, the substrate width The embedding of the powder in the direction becomes a problem of unevenness. Therefore, the present invention is to provide a powder composed of a plurality of powders embedded in a fine single layer continuously on a surface of an adhesive layer of a long-size sheet-like substrate with a part protruding. A method for manufacturing a powder single-layer film of a bulk single-layer film and a powder single-layer film manufacturing apparatus suitable for the method are aimed at. The "powder monolayer" in the present invention refers to a state in which powders do not overlap in the thickness direction in a plane, are in close contact with each other, and are laid and gathered at almost the same height. In terms of use, in addition to the general coating film used to improve the durability and strength of the surface while providing aesthetics, it can also be used for honing, anti-slip or smoothness improvement, light reflection or prevention of light reflection, electrical Insulating or conductive, flat lenses that concentrate or diffuse light, or transmissive screens. [Explanation of the invention] The method for producing a powder layer film of the present invention is to continuously manufacture a single layer embedded in a fine layer on the surface of an adhesive layer on a long-size sheet-like substrate with a part of it protruding. A method for manufacturing a powder single-layer film of a powder single-layer film composed of a plurality of powders, which is characterized by the step of providing an adhesive layer on at least one side of the substrate, and attaching the powder to the aforementioned adhesive layer. A step and a step of removing and attaching the powder to the layered body obtained in the previous step. In another form of the method for manufacturing a powder single-layer film according to the present invention, it is -6-572832. 5. Description of the invention (5) After the powder attachment step is performed, the adhesive layer and the powder vibrating in a container are used. The step of contacting the body and the medium with each other on the surface of the adhesive layer, and burying the powder in a single layer with a part of the protrusion protruding, is the best. In addition, the powder layer film manufacturing apparatus of the present invention is characterized by including an attachment mechanism for attaching the powder to the adhesive layer laminated on the long-sized sheet substrate, and embedding the powder in the width direction of the substrate. Mechanism, and removal mechanism for removing excess powder; continuously manufactured by burying powder in a single layer on a surface of an adhesive layer on a long-sized sheet-like substrate with a part protruding Powder monolayer film. In addition, the embedding mechanism of the powder layer film manufacturing device of the present invention is characterized by being provided with a container that fills at least the thickness direction of the substrate while maintaining a posture parallel to the width direction of the long-sized sheet-like substrate, and a filling container. The medium in the container is in contact with the substrate and guides the substrate in the medium, and a supporting element supporting the impact force generated by the vibration of the container, and transmits the impact force in the width direction of the substrate from the thickness direction of the substrate through the medium. To impose. According to the method for producing a powder layer film of the present invention, it is possible to produce an adhesive layer 2 suitable for having a long-size sheet-like substrate 1 as shown in FIGS. 1A and B, and the surface of the adhesive layer 2 can be produced. Above, a powder single-layer film formed of a powder single-layer film 4 composed of a plurality of powders 3 embedded in a single layer in a state in which a part of it is protruding. Fig. 1A is a cross-sectional view of a powder single-layer film laminate, and B is a perspective view of the powder single-layer film laminate as viewed from the surface of the powder single-layer film. In addition, the powder single-layer film 4 composed of a plurality of powders 3, as shown in FIG. 1A, can be separated from the sheet-like substrate 1 572832 5. Description of the invention (6), or can be contacted. [Brief description of Tu Wu] Figure 1 is a simple schematic diagram of a powder single-layer film laminate obtained by the method for manufacturing a powder layer film of the present invention. Fig. 2 is a simple schematic diagram illustrating an embodiment of the powder layer film manufacturing apparatus of the present invention. Fig. 3 is a schematic diagram illustrating the powder attachment mechanism of the powder layer film manufacturing apparatus of the present invention, and its replication roller in one embodiment. Fig. 4 is a schematic diagram illustrating a powder attachment mechanism of the powder layer film manufacturing apparatus of the present invention, and a magnetic brush in an embodiment thereof. Fig. 5 is a simple schematic diagram illustrating an embodiment of a powder embedding mechanism of the powder layer film manufacturing apparatus of the present invention. Fig. 6 is a schematic diagram illustrating another embodiment of the powder embedding mechanism of the powder layer film manufacturing apparatus of the present invention. Fig. 7 is a schematic diagram illustrating another embodiment of the powder embedding mechanism of the powder layer film manufacturing apparatus of the present invention. Fig. 8 is a schematic diagram illustrating another embodiment of the powder embedding mechanism of the powder layer film manufacturing apparatus of the present invention. Fig. 9 is a simple schematic diagram of an embodiment of a supporting element suitable for the powder embedding mechanism shown in Fig. 8. Fig. 10 is a simple schematic diagram of a powder embedding mechanism of a conventional powder layer film manufacturing apparatus. FIG. 11 is an electron micrograph magnifying the plane of the powder single-layer film of the first embodiment by a factor of 2000. 572832 t V. Description of the invention (7) Figure 12 is an electron micrograph enlarged at 2000 times the cross section of the powder single-layer film of the first embodiment. FIG. 13 is an electron micrograph magnified 1500 times the plane of the powder single-layer film of the comparative example. FIG. 14 is an electron micrograph magnifying a cross-section of the powder single-layer film of the comparative example 2000 times. [Explanation of Element Symbols] 1 ···· Long-size sheet-like substrate 2.… adhesive layer 3.… powder 4 ··· powder single-layer film 5. ··· separated substrate 10. Peeling mechanism 20 .. Adhesion mechanism 30 .. Embedding mechanism 40 .. Removal mechanism [Best embodiment of the invention] Hereinafter, the method for manufacturing a powder layer film of the present invention and an applicable manufacturing device will be described in steps The sequence is explained in detail. A. Manufacturing method of powder single-layer film 1. Laminating step of adhesive layer As the long-sized sheet-like substrate used in the present invention, a sheet-like article which can be rolled into a roll and has flexibility is used. Its material can be polyethylene terephthalate (PET), polyethylene naphthalene (PEN), triethylfluorenyl cellulose-9-572832 5. Description of the invention (8) (TAC), polycarbonate ( pc), polyacrylate, polyimide (pi), aromatic polyamine, polymaple (ps), polyester 碉 i (pes), cellophane, polyethylene (PE), polypropylene (PP), Various resins made of polyvinyl alcohol (PVA) or paper, paper, coated paper, resin-impregnated paper, or metal flakes such as aluminum and stainless steel can be used alone or in combination. Objects. In addition, as a sheet-like substrate, transparent or opaque objects can be used depending on the application, and thicknesses within a range of 1 // m to 5 mm can be used in consideration of productivity. The sheet-like substrate may be provided with an adhesive layer directly, or another adhesive layer may be provided between the sheet-like substrate and the adhesive layer or on the opposite side of the sheet-like substrate provided with the adhesive layer and used. In the present invention, although an adhesive layer having adhesiveness is provided on the substrate, the so-called adhesiveness here means that the powder described below has adhesiveness that can only be attached at normal temperature, and any of them is on the substrate. Materials with excellent binding power with powder can be used. In addition, the "adhesive layer" in the present invention refers to a layer having adhesiveness at least from the step of attaching the powder to the step of burying the powder, for example, when the powder is applied Prior to the step of attaching, it is sufficient to apply a solvent or the like to temporarily make the article exhibit adhesiveness. Specific examples of the material of the adhesive layer include resin-based adhesives such as polyimide-based, epoxy-based, polyamine-based, silicon dioxide-based, rubber-based, and acrylic resins. The aforementioned resins can be used alone or in combination of two or more. In particular, acrylic adhesives have excellent water resistance, heat resistance, light resistance, etc., and have good adhesion and transparency. In addition, when used in optical applications, it is easy to adjust the refractive index to suit the needs. . Examples of acrylic adhesives include acrylic acid, its esters, and methacrylic -10-

I I572832 V. Description of the invention (9) Individual polymers of propylene monomers such as acids and their esters, acrylamine and acrylonitrile, or copolymers thereof, and at least one of the aforementioned propylene monomers and vinyl acetate , Maleic anhydride, styrene and other aromatic polyethylene monomer copolymers. In particular, vinyl acetate, acrylonitrile, acrylamide, styrene, and formic acid, which are the main monomers such as ethylene acrylate, butene acrylate, and 2-ethyl ethylene acrylate, which are found to be cohesive, are used as cohesive components. Monomers such as methacrylate, isomethacrylate, and methacrylic acid, acrylic acid, itaconic acid, hydroxyethyl methacrylate, and hydroxypropyl group to increase the adhesion surname and have reactivity with the crosslinking agent Methyl propionate, dimethylaminoethyl methacrylate, dimethylaminomethyl methacrylate, acrylamide, hydroxymethacrylamide, epoxypropylmethacrylate, horse Interpolymers composed of monomers having functional groups, such as maleic anhydride, are best when the Tg temperature (glass transition point) is in the range of -55 ~ -15 ° C. The average molecular weight of the propylene-based adhesive is preferably 250,000 or more.

Adhesives with a Tg temperature lower than -55 ° C or adhesives with an average molecular weight of less than 250,000, are too soft, and after a degree of adhesion, the powder will be peeled off due to the impact force described below, and the powder will fall off. The problem that a uniform powder monolayer cannot be formed. In addition, there is also a problem that an adhesive is adhered to the powder after being adhered once, so that the powder adheres to the powder monolayer again. In addition, in an overly soft adhesive layer, the powder rotates on the surface of the adhesive layer through the impact of the medium, and the part of the powder to which the adhesive is attached will appear on the surface of the powder single layer, and the adhesive will Due to the impact of the medium or the capillary phenomenon seeping from the gap of the powder, it is easy to re-attach other powders there and cause double layer unsuitability. On the other hand, adhesives with a Tg temperature higher than -15 ° C have an adhesion of -11-572832 t. 5. Description of the invention (1G) Insufficient properties exist. Even if the powder is in contact with the powder, the powder cannot be copied. Impact powder cannot be fixed to the adhesive layer, and it is not suitable for the problem of powder falling off in steps such as removing excess powder. The adhesive force of the adhesive layer (JIS Z 0237: 1 980) is preferably 100 g / 25 mm or more. When the adhesive strength is lower, the powder does not separate and is not suitable. The adhesive may be added as a hardener. For example, one or two or more metal chelating agents, isocyanates, and epoxy-based crosslinking agents may be used as necessary. In addition, a photocurable adhesive to which a photopolymerizable monomer, an oligomer, a polymer, and a photopolymerization trigger are added may be used as the adhesive. Various additives such as a coupling agent, a surface tension modifier, a coloring pigment, a dye, a tincture, a viscosity increasing agent, an oxidation inhibitor, a rust inhibitor, an antibacterial agent, and an ultraviolet absorber can be added to the adhesive as needed. When an adhesive is provided on the substrate in a method described later, in order to obtain an appropriate film thickness, the adhesive may be diluted with an organic solvent as necessary. Specifically, alcohols such as methanol, ethanol, propanol, and butanol; ketones such as methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; and esters such as ethyl acetate, propyl acetate, and butyl acetate, Carbohydrates such as toluene and xylene, ethers such as methyl cellosolve, ethyl cellosolve, butyl cellosolve, and tetrahydrofuran. The method of applying the aforementioned adhesive to one or both sides of the substrate directly or via other layers to provide an adhesive layer includes the following various coating methods or printing methods. Among the coating methods, there are an airway coating method, a blade coating method, a blade coating method, a reverse coating method, a gravure coating method, a micro gravure coating method, a touch coating method, and a spray coating method. , Gated coating method, dip coating method, mold coating method, etc. Moreover, in the printing method, letterpress printing such as elastic printing can be used.-12- 572832 V. Description of the Invention (n) Brush, gravure printing such as direct gravure printing, offset gravure printing, offset printing such as offset printing, screen printing, etc.状 印刷。 Printing. The thickness of the adhesive layer must be such that the powder is buried in a single layer by a medium. That is, the thickness of the adhesive layer is 0 to the diameter of the embedded powder particles. 01 ~ 2 times is better. The layer thickness is 0. When the thickness is 01 times, the powder is liable to fall off when the powder is adhered to the adhesive layer, and when the layer thickness is twice as thick, the state of the surface protruding may not be obtained due to excessive embedding. The powder monolayer film will ooze out the adhesive between the powders to make other powders adhere, which increases the possibility that the powder monolayer cannot be obtained, which is not applicable. In the present invention, after the adhesive layer is provided by the aforementioned method, a powder adhesion step described later can be performed immediately, and before that, various coating methods or printing methods can be performed to form adhesiveness on the surface of the substrate. A step of sticking a separation-type body to the adhesive layer in the layer state, and a step of peeling the adhesion-shaped layer from the separation-type body to expose the adhesion layer. Adhesion to the separation type substrate is performed by providing an adhesive layer by the aforementioned coating method or printing method and drying the adhesive layer as necessary. The laminated body with the separation type substrate adhered can be temporarily stored. . After that, the separation type substrate is peeled off, and the next powder adhesion step is performed. By using the aforementioned method, it is possible to store the laminated body in a state in which the separation type substrate is adhered to the adhesive layer. Therefore, the production of multiple types of powder single-layer films may be changed by changing the type of powder afterwards. It is easy, and there is an advantage that it is easy to combine its production steps. In other methods of providing an adhesive layer on a substrate, an adhesive layer may be provided on a separate substrate in advance, dried as necessary, and the adhesive surface and -13 · 572832 V. Description of the invention (12) Matrix phase Adhesion, peeling the separation type substrate, and attaching an adhesive layer to the substrate. This laminated body of the substrate / adhesive layer / separated substrate can be stored, which is quite advantageous for a variety of production processes or production steps. In addition, an adhesive layer is provided on the separation type substrate in advance, and a laminated body that is bonded to other separation type substrates to form a separation type substrate / adhesive layer / separation type substrate is formed on the surface of the adhesion layer. , Peeling off one of the separation-type substrates, adhering the adhesive layer provided on the other separation-type substrate to the substrate, and then attaching the adhesion layer to the substrate by peeling the separation-type substrate. If the roll of the laminated substrate of the above-mentioned separated substrate / adhesive layer / separated substrate is prepared and temporarily stored, an adhesive layer can be formed on a variety of substrates, and the permeability of production is very high. In the configuration in which the separation type substrates are provided on both sides of the adhesive layer, it is preferable that the separation forces of the separation type substrates on both sides be different. When the separation forces of the separation-type substrates on both sides are substantially the same, it becomes difficult to peel off the separation-type substrate on either side. When the adhesive layer contains a hardening agent, the laminated body of the substrate / adhesive layer / separated substrate or the laminated body of the separated substrate / adhesive layer / separated substrate is used in a state of The temperature of 20 ~ 3 (TC, 3 ~ 14) makes it mature, so that the adhesive and the hardener fully react, and then the hardening of the adhesive layer is stable, and then it is better to move to the next step. As a separation type substrate, The surface in contact with the adhesive layer is a peelable object, and is not particularly limited to a general film or sheet. For example, polyethylene terephthalate, polyvinyl chloride, polypropylene, polyethylene, Fiber-14- 572832 V. Description of the invention (13) Resin films such as acetic acid acetate, synthetic paper, paper, woven fabrics impregnated with resin, or metal flakes such as aluminum, or laminated objects of the foregoing materials. 2. Powder adhesion step Next, in the method for producing a powder single-layer film of the present invention, powder is adhered to an adhesive layer formed on a substrate as described above. This can prevent the carrier particles and the medium from adhering to the adhesive layer described later, and also has the advantage of increasing the filling rate of the powder and reducing the defects of powder falling off. As the powder in the present invention, either an inorganic substance or an organic substance can be applied. In the powder used in the present invention, specific examples of the inorganic substance include metals such as aluminum, zinc, copper, gold, silver, nickel, tungsten, iron, hafnium, and titanium, and alloys, oxides, and nitrides thereof. , Silicide, carbon black, diamond, graphite, silicon dioxide, glass, brass, bronze, copper montmorillonite, silica sand, silicon carbide, boron carbide, silicon nitride, clay, talc, mica, calcium carbonate, etc. . The powder made of organic substances is made of various resins. Specifically, there are acrylic resin, polystyrene resin, styrene-propylene copolymer tree, urethane resin, silicone resin, phenol resin, and epoxy resin. Resin, polyethylene resin, polypropylene resin, Teflon, polyvinyl chloride resin, urea resin, melamine resin, etc. The aforementioned powder is embedded in the aforementioned adhesive layer at a high filling density and uniform depth at the surface of the adhesive layer provided on the substrate. The powder is spherical and its particle diameter distribution is narrow. Better. The specific particle diameter is 0. 8 ~ 1. A range of 0 is preferred, and 0. 9 ~ 1. 0 is better. The true arc of the spherical particles is preferably 80% or more, and more preferably 90% or more. In addition, the particle diameter of the aforementioned powder is defined by the following general formula (1) -15-572832 V. Description of the invention (). The number-average particle diameter and volume-average particle diameter are obtained by taking an image of the powder with an optical microscope or a transmission electron microscope and photographing it, and obtaining the image by analyzing the image. Particle diameter distribution == number average particle diameter / volume average particle diameter (1) number average particle diameter: the diameter of 100 powders randomly extracted is added to the average 値 after measurement. Volume average particle diameter: Treat the powder as a sphere, calculate the total volume from the diameter of 100 powders randomly extracted, and accumulate from the smaller volume of powder, when the cumulative volume becomes 50% of the total volume diameter. In addition, the true arc is defined by the following general formula (2). Specifically, an image can be obtained by using a light microscope or a transmission electron microscope and photography to obtain an image, and the image can be obtained by analyzing the image. A, B 値 are calculated. True arc (%) = (4tt A / B2) x100 (2) A: Projected area of powder B: Circumference length of powder The particle diameter (volume average particle diameter) of the powder of the present invention, with 1 ~ 50 / zm is preferable, and 3 to 30 / zm is more preferable. Compared to the powder with a small particle diameter, it is very difficult to embed the adhesive layer in a single layer. From the viewpoint of weight and volume, the powder with a small particle diameter is an adhesive layer. Embedding is liable to cause unevenness, and the possibility of detachment in the step of removing excess powder and the like described later will increase. In addition, when the present invention is applied to an optical film having a light diffusing function, acrylic resin, styrene resin, styrene-propylene copolymer resin-16-572832 V. Description of the invention (15), silicone resin, and other optical transparency A powder made of a higher material is preferred, and the particle diameter (volume average particle diameter) is preferably 2 to 15 // m, and the molecular diameter distribution and true arc are also preferred to a higher object . A specific method for attaching the powder to the adhesive layer may be a method of simply contacting the adhesive with the powder placed in the container, passing the powder through the powder, and shaking the powder. For example, it is more efficient to use a fluid gas where the particle diameter of the powder is small. In addition, there is a method for spraying the powder onto the adhesive layer through an air sprayer. This is because it is easy to mix with air, so it is very suitable for uniformly attaching the powder to the adhesive layer. In addition, in this step of attaching the powder to the adhesive layer, the powder may be adhered to the surface of the adhesive layer through the adhesive force of the adhesive layer or the electrostatic attractive force, even if multiple layers are attached. It doesn't matter. 3. Powder embedding step In the method for manufacturing a powder single-layer film of the present invention, in the aforementioned powder attaching step, the powder is brought into contact with the surface of the adhesive layer on the substrate and adhered to form a powder single Layer film, in addition, the degree of embedding of the powder in the adhesive layer is further controlled to produce a more uniform powder single-layer film. After the aforementioned powder attachment step, a substrate having an adhesive layer is prepared. On the adhesive layer, the step of vibrating the powder in the container in contact with the medium, and burying the powder in a single layer with a part of the adhesive layer protruding to obtain a laminated body is preferred. The medium of the present invention refers to an object in which the impact force generated by the vibration of the medium hits the powder and embeds the powder in the adhesive layer. In particular, other powders can be pushed into the adhesive layer and initially adhere to the adhesive layer. Between powder and powder -17- 572832 V. Description of the invention (16) It is very important to have the ability to increase the filling density of powder single layer film and make it uniform. The media has a diameter of 0.  1 ~ 3.  The granules of Omm are preferably spherical. In order to embed the powder into the adhesive layer with a high filling density and uniform depth, the particle diameter is not required, but The higher the arc and the true arc, the better. In media less than 0.1 mm in diameter, there is the ability to adhere to the adhesive layer with the powder, or the ability to embed the powder in the adhesive layer is insufficient, or because the particles are too small Causes inconvenience. On the other hand, the diameter is 3. Although a medium having a thickness of 0 mm or more has a large impact force, on the contrary, it is difficult to embed the powder into the adhesive layer uniformly at a high filling density, which is not suitable. Specific examples of the medium may be a medium composed of iron, carbon steel, alloy steel, copper and copper alloy, aluminum and aluminum alloy, other kinds of metal, alloy, or aluminum white, silicon dioxide, titanium dioxide, The medium composed of ceramics such as chromium oxide and silicon carbide can be glass, quartz, hard plastic, hard rubber, etc. In the case of hard plastic or hard rubber, a medium containing particles of the aforementioned various metals or alloys, ceramics, glass, etc. can also be used in its composition. The medium used in the present invention must select the most suitable medium for the thickness and adhesion of the adhesive layer, the diameter and specific gravity of the particles, and the depth of embedding of the powder. When the particle diameter of the medium is large, its impact force is also large, but because there is less opportunity to transmit force to the adhesive layer, it lacks uniformity and it tends to fall off the powder easily. Conversely, when the particle diameter is small, the uniformity is improved but the impact force is reduced, so the embedded force is -18-572832. V. Description of the invention (17) becomes weak. In addition, the degree of embedding of the powder is related to the proportion and close contact of the medium. If the weak material is used, the impact force will increase, while the material with a lower specific gravity will have a smaller impact force and reduce the powder embedding capacity. . Therefore, it is generally preferable to use a medium having a small particle diameter and a large specific gravity. In the present invention, it is preferable that the powder and the medium are placed in a container, and the powder and the medium are shaken in the container, and the two are sufficiently mixed to form a state in which the powder is adhered to the surface of the medium. At this time, although the state of powder attachment on the surface of the medium may be a single layer or a plurality of layers, it is not suitable for a combination in which the two will separate after vibration. Therefore, it is necessary to confirm the specific gravity and surface adhesion of the two in advance. As long as the container containing the powder and the medium is an object capable of withstanding the weight and vibration of the two, the material and size of the container are not considered. However, the shape of the container must be considered by bringing the adhesive layer on the substrate into contact with the powder vibrating in the container and the medium. In particular, when the container itself is vibrated, its force is transmitted to the powder and the medium, and the powder is finally buried in the adhesive layer, at least for the width direction of the adhesive layer of the film-like substrate, It is necessary to have a uniform impact force from the powder and the medium, so the distance between the wall surface and the adhesion surface of the vibration container that holds the powder and the medium is preferably at least in the width direction of the film-like substrate. In addition, instead of vibrating the container, a vibrating device such as a vibrating reed is placed in the container, so that the powder and the medium can be vibrated. At this time, in order to apply a uniform force to the film-like substrate, it is started from its installation position or adhered. The distance from the face must be better. In the case of vibrating powder and medium, consideration must be given to the container side so that the powder and medium are not scattered. -19- 572832 V. Description of the invention (18) In order to vibrate a container containing powder and medium, or a vibration device such as a vibrating plate provided in the container, a vibration motor, an air vibrator, an electromagnetic vibration device, Conventional vibration devices such as mechanical vibration devices using cams. The aforementioned various vibration devices can be widely used in devices such as feeders, hoppers, transmission belts, sieves, parts feeders, parts aligners, vibration platforms, cylinder honing, etc. In the present invention, it is necessary to consider the inclusion of a thin film. The structure of the device such as the size of the substrate, the size of the container, and the weight of the container must be selected from the appropriate items. In addition, for any device, in order to embed the powder at a high filling rate and uniform depth, the vibration mode, vibration force, and amplitude must be adjusted through the installation position of the vibration device and the selection of the spring. In terms of vibration frequency, 200 to 4000 cpm is preferable, and 1,000 to 3 000 cpm is more preferable. When the vibration frequency is lower than 2000 cpm, the force of the medium to bury the powder in the adhesive layer will be weakened, making the processing time longer, which is not applicable. When the vibration frequency exceeds 4000 cpm, the impact force will be too large and the powder will easily fall off from the adhesive layer. Or, on the contrary, the vibration generated by the container or the vibration device will be absorbed by the medium and the powder will not be easy. The problem of reaching the adhesive layer does not apply. In the case of the above-mentioned model selection and condition determination, in order to be able to stably embed the powder into the adhesive layer for a long time while moving the long-sized film-like substrate provided with the adhesive layer, attention must be paid to the powder. And the medium does not fly out of the container, or to avoid separation in the container, the phenomenon of bias to one side. It is preferable that the powder and the medium are such that the portion in contact with the adhesive layer can flow slowly instead of being replaced. 4 · Residual powder removal step-20-572832 V. Description of the invention (19) After the powder is buried in the adhesive layer using the aforementioned medium, there will be residual electrostatic forces or van der Waals effect on the adhesive layer. Residual powder adhered to it by force such as force between particles must be removed. The method is to dry-clean with a blade, wipe with a brush or bristles, wipe with a cloth, etc., blow off with an air stream (ultrasonic air stream), and attract. However, in the case of using a powder with a small particle diameter or a high adhesion between the powders, the remaining powder cannot be completely removed only by using the aforementioned dry cleaning mechanism, so it is necessary to use water or add 淸Wet rinse the aqueous solution of lotion, and then fully dry. In the wet rinsing, the jet water jet that strongly ejects water from the nozzle is quite effective. However, there is an incomplete problem in removing fine particles with a particle diameter of 15 // m or less only through the fluid pressure. After ion-exchanged water added with a detergent such as a surfactant is internally washed with ultrasonic waves, it is preferably washed thoroughly with deionized water. After the wet washing is performed, it is necessary to remove water finally. Examples include a method of rolling out water between rubber rollers, absorbing and wiping the water with a water-absorbing roller or cloth, or drying the water by air. Depending on the type of substrate and powder, when it is not possible to completely remove moisture by the aforementioned method, it is necessary to apply cold air or hot air for a sufficient time, or dry it with an infrared heater. Furthermore, in the method for manufacturing a powder single-layer film of the present invention, it is better to provide another resin layer on the powder single-layer film for the purpose of eliminating the cross-fold property of the adhesive layer and improving the surface strength. . For the application of optical film, through this method, it is possible to adjust the light transmittance and the Hertzian in the optical characteristics, prevent blocking, and improve the reliability of the optical characteristics. -21- 572832 V. Description of the invention (20) There is no particular limitation on the material of the resin layer provided on the powder single-layer film. When setting the resin layer by coating or printing method, you must choose not to It will erode the adhesive layer embedded with powder, disturb and destroy the arrangement of the powder collected in the powder single-layer film, and will not cause scars. If a paint or ink dissolved in an organic solvent is used as the resin material, care must be taken that the solvent does not cause swelling and dissolution of the adhesive layer embedded in the powder, and it must be a small amount. When a propylene-based adhesive is used as the material of the adhesive layer, its solubility in ketones, esters, and aromatic carbon solvents is so high that it cannot be used as an adhesive on a powder single-layer film. The solvent of the layer is preferably used, preferably water, alcohol, or an aliphatic carbohydrate solvent. On the contrary, as the resin usable here, it must be a substance that can be dissolved or diluted in the aforementioned solvent. Among the alcohol solvents, specific examples include methanol, ethanol, n-propanol, isopropanol, n-butanol, and isobutanol. Examples of resins that can be dissolved in these solvents include polyisobutylene acrylate, dimethacrylate, Acrylic resins such as butene methacrylate copolymers, cellulose resins such as cellulose acetate propionate and cellulose acetate butyrate, butyraldehyde, and shellac used in alcohol coatings. In aliphatic carbohydrate-based solvents, the chemical composition of n-hexane, iso-hexane, cyclohexane, n-heptane, octane, decane, hexadecane, and tridecane is distinguished by distillation. Industrial petroleum includes petroleum ether, light oil, rubber volatile oil, soybean volatile oil, mineral oil and so on. Examples of resins that can be dissolved in the aforementioned aliphatic carbohydrate-based solvents include rosin-based resins, petroleum resins, rubber-based resins, and olefin resins. In the case of water-based coatings, they can be selected from various water-soluble resins or latexes. In addition, solvent-free • 22-. 0. 0572832 V. Description of the invention (21) The ultraviolet curing resin is used directly or after being diluted with the aforementioned alcohol solvent. Among the ultraviolet resins, there are resins in which an optical radical polymerization initiator is added to a material containing acrylic monomers or semipolymers, and resins in which an oxygen resin or a cyclobutane compound is mixed with an optical cationic polymerization initiator. According to the main structure, urethane acrylate, polyester acrylate, epoxy acrylate, silicone acrylate, etc. can be classified. In addition, it is inevitable that the resin used in the present invention can be firmly adhered to the adhesive layer and powder on the surface of the coated substrate. When using various solvents to set the resin on the powder single-layer film, various coating and printing methods described previously when setting the adhesive layer can be used, but it must be selected so as not to damage the powder single-layer film as much as possible. method. In addition, the surface of the single layer of powder is a large surface with a part of each powder protruding and having unevenness. Therefore, when coating and printing on the top surface of the powder, the purpose of preventing rebound and entrainment of air, Additives such as a surfactant may be used as necessary. In addition, for the purpose of adding functions or improving coating adaptability, various dyes or pigments may be added to the resin layer paint and ink. In addition, the resin layer provided on the powder single-layer film is usually laminated on the adhesive layer and powder on the lower layer, and there is also a field layer laminated on the adhesive layer and not laminated on the powder. In the present invention, it is applicable to any occasion. In the method for manufacturing a powder single-layer film of the present invention, in addition to the above-mentioned configuration, an adhesive layer, a coloring layer, or the like may be provided between the long-sized film-like substrate and the adhesive layer or on the reverse side of the film-like substrate. Conductive layer, static layer, antistatic layer, etc. In addition, a plurality of layers of different resins can be laminated on the powder single-layer film. In the case where the present invention is applicable to an optical film, more must be -23-572832 V. Description of the invention (22) The resin layer provided on the powder single-layer film must be considered based on the substrate, the adhesive layer, and the powder. Its refractive index can finely adjust the light transmission function, reflection function, and light diffusion function. Further, in the manufacturing method of the present invention, all the steps described above can be performed continuously to produce a powder single-layer thin film laminate, or it can be performed partially continuously. However, as described above, after the adhesive layer is provided, it cannot be rolled up and stored directly. Therefore, once it is adhered to the separation type substrate, it must be rolled up and stored, or the powder must be adhered to the adhesive layer. It is better to roll it up for storage, or to make the powder and medium vibrating in the container contact the adhesive layer to form a single-layer powder film and roll it up for storage. The powder is adhered to the adhesive layer, the powder and the medium are in contact with the adhesive layer, and the object in which the powder is buried in the adhesive layer is no longer adhesive and can be directly rolled up for storage. In this case, it is not necessary to continuously perform the subsequent steps. In this state, the powder will not only adhere to the adhesive layer in a single layer, but the possibility of powder adhesion on the reverse side is quite high, so When rolled up directly, indentations occur on the substrate and the adhesive layer. Therefore, it is preferable to perform the step of removing the remaining powder continuously after the foregoing steps. If the step of removing the remaining powder is discontinuous, it can be rolled up by using a soft paper or film sandwiched between it, or rolled up with a strip of paper or film at both ends and rolled up. In addition, the pressure-sensitive adhesive layer is not subjected to the pressure of the aforementioned indentation. In the manufacturing method of the present invention, the powder single-layer film may be provided on both sides of the substrate simultaneously or sequentially. When only one side is provided, the reverse side may be coated, printed, adhered, and other processes thereafter. Processing as powder sheet-24-572832 V. Description of the invention (23) Laminated film can also be used. b. Powder Monolayer Film Manufacturing Apparatus FIG. 2 is a cross-sectional view illustrating an embodiment of the powder layer film manufacturing apparatus of the present invention. As shown in FIG. 2, the powder layer film manufacturing apparatus of the present invention is a roll-out mechanism 6 that rolls out a long-sized film-like substrate provided with an adhesive layer from the left side of the drawing, and The peeling mechanism 10 for separating the separation type substrate on the adhesive layer, attaching the powder to the powder attaching mechanism 20 on the adhesive layer, and burying the powder in the adhesive embedding mechanism 30 ′ The powder removing mechanism 40 for removing excess powder is constituted by a rolling mechanism 70 for rolling up a long-sized film-like substrate provided with an adhesive layer. In the powder single-layer film manufacturing device of the present invention, before the powder adhesion mechanism, a formation mechanism for forming an adhesive layer on a long-size film-like substrate may be provided. In order to stabilize various characteristics after the adhesive layer is formed, Due to the problem of powder mixing in the adhesive layer due to the adjacent formation of the adhesive layer forming step and the powder attaching step, the size of the entire device when the adhesive layer forming mechanism is continuously installed, etc. As the adhesive layer, a long-size film substrate provided with a separation type substrate is preferably used. Hereinafter, the constituent mechanism and operation example of the powder layer film manufacturing apparatus of the present invention will be described in detail. Regarding the unwinding mechanism and the unwinding mechanism, conventionally known objects can be used, and a description thereof will be omitted. 1 . Peeling mechanism The long-size film substrate 1 used in the powder layer film manufacturing apparatus of the present invention is preferably provided with an adhesive layer on at least one side thereof, and more preferably a separation type substrate provided above it. In this case, the powder attachment mechanism 20 -25- 572832 5. Before the description of the invention (24), there must be a peeling mechanism of the peeling and separating type substrate. Generally, the adhesive layer used has a thickness of several tens of m, and because it is adhered to other layers through the adhesive layer, it is not necessary to be too concerned about the peeling of the separation type substrate. However, the thickness of the adhesive layer of the powder single-layer film is only a few // m. Furthermore, because the powder adheres to the surface, it is necessary to maintain the uniformity of the surface of the adhesive layer and peel the separation type substrate. If the adhesive surface is disordered, the powder adheres unevenly, and a uniform and fine powder monolayer film cannot be formed in the plane direction. Therefore, in the peeling mechanism 10 of the present invention, as shown in FIG. 2, it is preferable to provide a heating roller Π. The heating roller Π is arranged in pairs with the opposite roller 12, and the long-term film-like substrate is heated between the heating roller 11 and the roller 12 to increase the flexibility of the adhesive layer. It can peel off the separation type substrate smoothly. Further, in the peeling mechanism 10 of the present invention, it is preferable that the roller 14 is rolled up with the separation substrate through the roller 12 and the roller 13 to separate the separation substrate 5 from the substrate 1 at a constant speed and a certain angle. By this method, the separation of the separation type substrate 5 is stabilized, and the uniformity of the surface of the adhesive layer is maintained. 2. Powder Adhering Mechanism As the powder adhering mechanism of the present invention, there can be mentioned only contacting the adhesive layer with the upper surface of the powder put in the container, passing the adhesive layer through the powder, and adhering the powder to the surface. The adhesive layer is attached by shaking, the powder is sprayed on the adhesive layer through an air sprayer, and the like. In particular, a mechanism for fluidizing the powder in the width direction of the substrate is preferable. Specifically, as shown in FIG. 2, the agitator 21, the vibration device, and the fluidized gas stream are parallel to the substrate width direction. 572832 V. Description of the invention (25) etc. It is preferable that the powder 23 in the container 22 is uniformly flowed in the width direction of the substrate, and the substrate 1 provided with the adhesive layer is passed through the fluidized powder mechanism. Thereby, the filling rate of the powder to the adhesive layer is increased, and the defect of powder falling off can be reduced. In addition, as the powder attachment mechanism, a container containing the powder may be vibrated and adhered. The shape of the agitator is not particularly limited to a feather shape, as long as the shape can uniformly fluidize the powder in the width direction of the substrate, other shapes such as a spiral shape may be used, and a plurality of stirring blades may be used. In addition, the powder adheres to the adhesive layer as long as it passes through the adhesive force or electrostatic attractive force of the adhesive layer, and the powder only needs to adhere to the surface of the adhesive layer, and it does not matter if multiple layers are attached. . As the powder attachment mechanism of the present invention, a powder attachment device as shown in Figs. 3 and 4 can be used. Figure 3 shows an example of a powder single-layer film device in which powder adhered to the surface of a transfer roller is contacted and transferred to an adhesive layer on a substrate. In FIG. 3, 51 is a container into which the powder 3 is placed. The container 51 is provided with a transfer roller 52, a roller-shaped supply element 53 that supplies a predetermined amount of the powder 3 to the surface of the transfer roller 51, and The powder 3 is stirred to improve the fluidity of the powder 3 and make the powder 3 easily adhere to the mixer 54 on the surface of the transfer roller 52. By rotating the transfer roller 52 in the direction of the arrow, the powder 3 on the surface of the transfer roller 52 will be adjusted by the thickness-limiting element 55 such as a thickener paddle, and the amount of powder attached will be adjusted. A powder adhesion layer 56 made up of a plurality of powders 3 is formed on the surface of the transfer roller 52. The base body 1 composed of a film-shaped base body provided with an adhesive layer 2 is composed of -27-572832. 5. Description of the invention (26) The adhesive layer 2 and the replication roller are formed while being carried in the direction of the arrow in the figure. The powder adhesion layer 56 on the surface 52 is in contact. A part of the powder adhesion layer 56 in contact with the adhesive layer 2 is copied on the surface of the adhesive layer 2 to form a powder single-layer film on the surface of the adhesive layer 2. The surface of the transfer roller 52 has weak adhesiveness, and its adhesive force is set to be weaker than that of the adhesive layer 2 provided on the substrate. With this setting, a part of the powder 3 which is in contact with the powder adhesion layer 56 of the adhesive layer 2 is transferred to the surface of the adhesive layer 2. When the adhesive force of the transfer roller 52 is the same as that of the adhesive layer 2 or the adhesive force of the transfer roller 52 is strong, the powder 3 cannot be transferred to the adhesive layer 2. Examples of the roller material of the transfer roller 52 having weak adhesion include rubber, urethane rubber, and silicone rubber, and the surface is coated with the aforementioned adhesive. The adhesiveness can be adjusted by the type of adhesive to be applied, the blending, and the hardness of the roller. The back surface of the substrate 1 is provided with support elements 57 and square rollers 57a, 57b, 57c. The aforementioned rollers maintain the contact between the adhesive layer 2 on the substrate 1 and the powder adhesion layer 56 attached to the surface of the transfer roller 52. To set. On the other hand, the conveying speed of the substrate 1 and the linear speed of the transfer roller 52 are slightly larger than the former, and the powder 3 is supplied to the adhesive layer 2 'in a large amount. Also, as the transfer roller 52, an electrostatic roller can be used which adheres the powder 3 to the surface by an electrostatic force. Here, the electrostatic force that causes the powder 3 to adhere to the surface of the transfer roller 52 is generated by the frictional electricity generated by the transfer roller 52 and the powder 3. It is also effective to apply a voltage to the transfer roller 52 from outside to charge the transfer roller 52. As the transfer roller 52 used here, -28- 572832 V. Description of the invention (27) is a metal roller such as aluminum or an elastic roller such as urethane rubber. In the case of an elastic roller, in order to apply an external voltage, a conductive substance must be used inside or on the surface of the roller to optimize the resistance. In addition, considering the type of charging of the powder used, it is necessary to adjust the roller material and the applied voltage. In addition, the surface of the roller may be a smooth surface, or a concave-convex surface may be provided for the powder to easily adhere. Fig. 4 is an example of a powder single-layer film device in which a powder adhered to a magnetic brush is brought into contact with and adhered to an adhesive layer on a substrate. The so-called magnetic brush refers to the surface of a magnetic roller on which a S- and N-pole magnet is arranged inside a roller made of stainless steel, etc., and the magnetic particles are used to carry the magnetic particles of iron powder or ferrite bearing particles. Brush-like attachment. The diameter of the particles carrying the particles is 40 ~ 200 // m. The powder will adhere to the surface of the particles by electrostatic or magnetic force. In FIG. 4, in the container 61 containing the powder 3, a magnetic brush 66 is formed on the surface of the magnetic roller 63 containing the magnet 62. By rotating the magnetic roller 63 in the direction of the arrow, the magnetic brush 66 will The adhesive layer 2 on the long-size film-like substrate 1 moving in the direction of the arrow is in contact with each other. The magnetic brush 66 is that the powder 3 is attached to the surface of each load-bearing particle by electrostatic force or magnetic force. The load-bearing particles to which the powder 3 is attached are connected to each other by magnetic force to form a spike shape. The powder 3 in the magnetic brush 66 that is in contact with the adhesive layer 2 is adhered to the surface of the adhesive layer 2 because the adhesive force of the adhesive layer 2 is greater than the electrostatic force or magnetic force of the carrier particles. After the powder 3 of the magnetic brush 66 after being in contact with the adhesive layer 2 is attached, the magnetic brush 66 1 after the magnetic roller 63 rotates, and the frictional electrification generated by the particles and powder carried in the container 61 is caused by the magnetic 29- 572832 V. Description of the invention (28) Force brush 66 'will replenish powder 3. Since the substrate is long and thin, the container 61 is preferably set such that the magnetic brush 66 is in contact with the entire width of the adhesive layer on the substrate. The container 61 is preferably provided with a stirring element 64. By stirring the powder 3 in the container, the magnetic brush 66 causes the powder 3 to be easily charged. In FIG. 4, although the shape of the stirring element 64 is a feather shape, it is not particularly limited to this shape, and other shapes such as a spiral shape may be used. The number of the stirring elements 64 may be plural. In the magnetic brush 66, it is preferable that the bristle height limiting element 65 restricts the bristle height of the magnetic brush 66 and that the powder 3 can be filled in the adhesive layer 3 at a high density. The magnet 62 contained in the magnetic roller 63 is not rotated in Fig. 4, and the magnet can also be rotated, and the direction of rotation is not particularly limited. The magnetic roller 63 is rotated in the direction of the arrow so that the rotation can be reversed. Specific examples of the carrier particles include magnetic materials, and may be iron particles, ferrite particles, or magnet particles. The mixed crystals of MeO-Fe203 used as ferrite particles in the present invention. In this case, Me means Mn, Zn, Ni, Ba, Co, Cu, Li, Mg, Cr, Ca, V, etc. 'Any one or two or more may be used. When a mixed crystal of MeO-FesO4 is used as the magnetic iron particles, the Me system in this case is the same as in the case of the ferrite particles. The surfaces of iron particles, ferrite particles, and magnet particles may be coated with a resin such as a silicone resin, an acrylic resin, or a fluorinated resin. The base 1 provided with the adhesive layer 2 is provided with a support member 67 for smooth movement. 30-572832 V. Description of the invention (29). The supporting member 67 has a function of supporting the base body 1 provided with the adhesive layer 2 so that the magnetic brush 66 can easily come into contact with the adhesive layer 2. The supporting member 67 is preferably a rotatable roller as shown in Fig. 4. Even if it is a partially rotating roller, as long as it can support the base body 1, its shape is not particularly required. The supporting element 67 is preferably provided at a position 67b holding the base 1 provided with the adhesive layer 2 opposite to the magnetic roller 66, so as to be able to glue high-density powder into the adhesive layer 2, There may be only two locations 67a and 67b, and the number and position of the substrate 1 are not limited as long as the substrate 1 can be supported. The method of contacting and attaching the powder to the adhesive layer on the substrate must be differentiated according to the nature of the powder used, that is, electrical, magnetic, or specific gravity. Among powders that are easily rubbed with electricity, the powder is attached to the surface of a charging roller or a magnetic brush by electrostatic force, and it is better to shake the magnetic brush on the powder with weak magnetism. For powders such as metals that do not have magnetic properties and high conductivity, it is preferable to use a weakly adhesive roller. · &lt; In addition, in terms of contact and adhesion of the powder, the powder may be pulled on the surface of the adhesive roller on the adhesion roller or the magnetic brush and the surface of the adhesive layer on the substrate. In order to effectively adhere, it is necessary to make the adhesive adhere. The adhesion between the adhesive and the powder is weaker than the adhesion between the roller or the magnetic brush and the powder. The combination of the material and the powder such as the roller is optimized. In the method using a magnetic brush, not only the powder receiving particles may also adhere to the adhesive surface, it is necessary to add a component to enhance the adhesion between the magnetic roller and the receiving particles. Although not shown in Figs. 3 and 4, a device for supplying powder may be installed in a container for storing powder. In addition, in Figures 3 and 4, this -31-572832 V. Description of the Invention (30) The upper part of the container is depicted in an exposed position. In order to prevent foreign matter from mixing in and to prevent powder from scattering, the lid is added as good. In addition, with the magnetic brush method, since the powder transferred to the adhesive surface will contact the subsequent carrier particles, the carrier particles will play the function of burying the powder in the adhesive layer, and it can be expected to form a uniform powder. Monolayer film. In addition, in the present invention, in order to form a uniform powder single-layer film, the processing time of the aforementioned powder attachment step may be lengthened, or it may be implemented multiple times. 3. Powder embedding mechanism The powder embedding mechanism in the powder single-layer film manufacturing device of the present invention is provided with a mechanism for vibrating the medium in order to form a uniform and fine powder single-layer film in the planar direction. Better. Thereby, the powder adhered to the adhesive layer can be buried in the adhesive layer using the impact force through the medium. The following is a detailed description of the implementation form applicable to the powder embedding mechanism used in the present invention. (1) First Embodiment Fig. 5 is a cross-sectional view illustrating a first embodiment of a powder embedding mechanism of a powder layer film manufacturing apparatus of the present invention. As shown in FIG. 5, in the first embodiment, the film substrate surface of the long-sized film-like substrate 1 provided with the adhesive layer is brought into contact with the roller 71, and the powder of the roller 71 in the container 72 is moved. The mixture 73 of the body and the medium is immersed to a depth of about 1/3 of the diameter of the roller 71. The roller 71 is provided on a frame different from the container 72 without transmitting vibration directly. A vibration motor is integrally mounted directly below the container 72 and is fixed to the floor 76 by a spring 75. For the adhesive layer of the film-like substrate 1 provided with an adhesive layer, the roller 71 series-32- 572832 V. Description of the invention (31) Opposite the opposite side, and the container 72 is vibrated by the vibration motor 74 to pass the vibration In the mixture 73 of powder and medium, the powder is buried in the adhesive layer. The roller 71 is preferably immersed in a mixture of powder and medium 73 to a depth where the powder does not adhere to the film-like substrate surface opposite to the adhesive layer, and the depth is 1/3 of the diameter of the roller 71 It is better to impregnate to a certain depth. At this depth, it is possible to prevent the powder from adhering to the surface of the film-like substrate opposite to the adhesive layer. (2) Second embodiment Fig. 6 is a cross-sectional view illustrating a second embodiment of the powder embedding mechanism of the powder layer film manufacturing apparatus of the present invention. As shown in FIG. 6, in the second embodiment, the container 82 is provided with two rollers 81 mounted on another frame different from the container 82, and the roller 81 is provided with an adhesive layer. Film-shaped substrate 1. Although the principle of this method is the same as that of the first embodiment, the distance of the film-like substrate 1 provided with an adhesive layer immersed in the mixture 83 of powder and medium is longer than that of the first embodiment. As a result, As for the landing, the opportunity for embedding the powder is increased, and there is an advantage that the conveying speed of the film-like substrate 1 provided with the adhesive layer can be increased. In addition, the film-like substrate 1 provided with the adhesive layer comes into contact with the powder while reaching the roller 81 in the container 82. At this stage, the powder adheres to the adhesive layer, and therefore has adhesiveness on both sides. In the case of a layered film-like substrate, the powder can be buried in both sides. (3) Third Embodiment Fig. 7 is a sectional view showing a third embodiment of the powder embedding mechanism of the powder layer film manufacturing apparatus of the present invention. As shown in Fig. 7, in Section 3 -33- 572832 V. Description of Invention (32) In the implementation mode, the container 91 is fixed, and an electromagnetic vibration device 92 that passes through the bottom of the container 91 is used, and the vibrating piece 93 is adopted. A structure that vibrates up and down. The film-like substrate 1 provided with the adhesive layer passes through the gap 94 opened to the right and left of the container 91, and then passes through the container 91 to receive the powder-medium mixture 95 therein. Here, the medium will not overflow from the gap 94 to the outside, and the gap interval must be set to be narrower than the diameter of the medium. In addition, although the vibration method of this figure uses an electromagnetic vibration device and a vibrating piece, this method is not necessary, and a vibration container method may be adopted as in the first embodiment and the second embodiment. In the first embodiment and the second embodiment, the powder or medium held between the film-like substrate 1 and the roller 2 provided with the adhesive layer may be caused by the particle diameter of the medium or the tension of the film-like substrate. The problem of damaging the film-like substrate. In order to solve this problem, grooved rollers or mesh-shaped rollers are used, so that the powder and medium entering between the film-shaped substrate and the rollers can escape into the grooves or pass through the mesh. In addition, only the two ends of the film-shaped substrate are supported by rollers, transmission belts, guides, etc., or roller processing is applied on both ends of the film-shaped substrate, or the chain-chain processing is applied by a dedicated roller with protrusions. A film-like substrate is also an effective method. Moreover, in any of the embodiments so far, the film-like substrate 1 provided with the adhesive layer is immersed in the powder and the medium. At this time, the adhesive layer is applied to the adhesive layer due to the depth of the immersion. The pressure will be different, so you must adjust the appropriate depth beforehand. Although it is also related to the density of the medium, generally when the film-like substrate is placed in an excessively deep place, that is, for placing -34-572832 V. Description of the invention (33) The adhesive layer of the film-like substrate under high pressure When vibration from a medium is applied, the possibility of powder falling off is increased, which is not suitable. In addition, only when the end of the adhesive layer is lightly contacted with the powder in the vibration and the surface of the medium, it is possible to fully reach the case where the powder is buried in the adhesive layer. (4) The fourth implementation Form The fourth embodiment of the powder embedding mechanism of the powder layer film manufacturing apparatus of the present invention is a container that vibrates at least in the thickness direction of the substrate while maintaining a parallel posture with the width direction of the long-length film-like substrate. And the medium filled in the container will continue to contact the substrate. A support element is provided to guide the substrate in the aforementioned medium and support the impact force generated by the vibration of the container, and the impact force will be in the width direction of the substrate. It is applied in the thickness direction of the substrate via the aforementioned medium. Fig. 8 is a sectional view of the fourth embodiment. As shown in FIG. 8, the fourth embodiment is a container 101 which is arranged parallel to the width direction of the long-size film-like substrate, and is in contact with the substrate 1 and is supported on the opposite end of the container 101 from the substrate 101. Element 102 is formed. The container 101 can be vibrated in the thickness direction of the substrate, and the supporting member 102 is fixed without being affected by the vibration of the container 101. The container 101 is filled with 103, and in this embodiment, a guide member 104 for guiding the base 1 into the support member 102 is provided. The container in the fourth embodiment has a mechanism that vibrates at least in the thickness direction of the substrate while maintaining a posture parallel to the width direction of the long film-like substrate. As a result, the medium filled in the container can be vibrated, which can -35- 572832 V. Description of the invention (34) The powder attached to the adhesive layer on the substrate can be hit by the thickness direction of the substrate. The vibration direction of the container may be up and down or back and forth for the device as long as it is the thickness direction of the substrate. The vibration of the container may be circular or elliptical. The container in the fourth embodiment is preferably the same in cross-sectional shape in the width direction of the substrate. Through this shape, the medium in the width direction of the substrate can be uniformly vibrated, and the powder on the adhesive layer can be embedded. The support element of the fourth embodiment is provided in contact with the surface on which the adhesive layer is not provided at the end opposite to the container. In addition, the support element has a surface extending parallel to the long-size substrate, and along the plane, the substrate will be guided in the medium filled in the container to form and vibrate the medium and the powder on the adhesive layer. Contact configuration. In addition, the contact surface between the support element and the substrate is an object that supports the impact force when the medium strikes the powder on the adhesive layer through the vibration of the container. As such a support element, the cross-sectional shape of the support element corresponding to the width direction of the substrate is the same, and at least the lower part of the cross-section is an arc-shaped element. Specifically, as shown in FIG. 9, the cross-sectional shape is a circle. , Oval, drop-shaped, bullet-shaped components are preferred. As long as it has the aforementioned cross-sectional shape, the arc-shaped area will become a contact surface with which the substrate is contacted, and along this contact surface, a long-sized substrate can be smoothly introduced into the container. In the case where the supporting element is a cylindrical roller, the roller can be rotated in accordance with the progress of the substrate, but in the case of other shapes, the roller travels along the plane parallel to the substrate to make it travel. Therefore, the material of the supporting element is preferably an object with less friction to the substrate. -36- 572832 5. Description of the invention (35) In this support element, as shown in FIG. 8, a guide element 104 provided with a substrate 1 guided to approach the contact surface in contact with the substrate is good. Through the guide element 104, the gap between the support element 102 and the base body 1 is reduced, and the medium 103 can be prevented from entering the gap. When the medium enters the gap between the supporting element and the substrate, when the medium in the container hits the powder on the substrate, the entered medium will be pushed into the substrate, and there is a danger that the substrate will be deformed or broken. In addition, when the cross-sectional shape of the support element is a circle, an ellipse, a drop shape, and the like, the width of the upper end is small, as shown in FIG. 8, the distance from the guide element 104 is reduced to be smaller than the support. The narrower maximum element width prevents the entry of media. Furthermore, in the fourth embodiment, a mechanism for preventing the medium from entering between the support element and the substrate is described, and a removal mechanism for continuously removing the medium entering between the support element and the substrate can be further provided. The method for removing the medium by the removing mechanism may be suction, blowing, digging, wiping, etc., and it is better to remove the medium before the substrate contacts the supporting member. 4. Residual powder removing mechanism The remaining powder removing mechanism of the present invention is that after the powder is buried in the adhesive layer, the remaining powder is adhered by an interparticle force such as electrostatic force or van der Was force. Removed bodies. As the remaining powder removing mechanism of the present invention, as shown in FIG. 2, it is an effective way to remove water by spraying water strongly from the water nozzle 41. In addition, for the surface where the powder is not embedded, it can be placed in the water tank 42. In the water, the pressing roller 44 presses the sponge sheet 43 toward the substrate -37-572832. V. Description of the Invention (36) 1. Wipe off the remaining powder. In addition, when the particle diameter of the powder is 15 μm or less, there is a concern that it is not enough to remove it only by fluid pressure. Ultrasonic waves are immersed in ionized water to which a cleaning aid such as a surfactant is added. After rinsing, rinse thoroughly with deionized water. After the aforementioned water washing, water must be removed at the end. Therefore, in the removal mechanism of the present invention, it is preferable to use a mechanism provided with an air nozzle 46 for dehydration to remove water, or a mechanism for absorbing water using a water-absorbing roller 47 or the like. In addition, due to the difference between the types of long-thick film-like substrates and powders, there are occasions when it is impossible to completely remove water only by the aforementioned mechanism, and heating with an infrared heater and then fully blowing it with cold or hot air to dry good. 5. Operation of powder single-layer film manufacturing apparatus The operation of the powder single-layer film manufacturing apparatus of the present invention will be described with reference to the structure shown in FIG. 2. The long-size film-like substrate 1 processed in the powder single-layer film manufacturing apparatus is an object in which an adhesive layer was originally formed on one area of the substrate, and a separation type substrate 5 was set on the surface of the adhesive layer and then rolled up. . First, the rolled-up long-size film-like substrate 1 is unrolled by a unwinding mechanism 6 and supplied to a peeling mechanism 10 via a passive roller. In the peeling mechanism 10, the substrate 1 is guided between the heating roller 11 and the opposite roller 12, and the adhesive layer is heated by the heating roller 11 to improve the flexibility of the adhesive layer. When the substrate 1 is heated between the roller 11 and the roller 12, the separating substrate 5 on the adhesive layer will be peeled off, and the roller 13 will be rolled by the roller 13 through the roller 13 plus -38- 572832 5. Description of the invention (37) . At this time, the angle and speed of the separation-type substrate 5 are kept constant. On the other hand, the substrate 1 after the separation-type substrate 5 is peeled is guided to the attachment mechanism 20. In the attachment mechanism 20, the agitator 21 in the container 22 will uniformly fluidize the powder 23 in the width direction of the substrate 1, so that the powder 23 can be uniformly attached to the guided one in the width direction of the substrate 1. On the adhesive layer of the substrate 1. Subsequently, the powder-attached substrate 1 is guided to the embedding mechanism 30. In the embedding mechanism 30, one side to which the powder is adhered will be guided to the ground base 1 opposite to one of the guide elements 34, and the opposite side will be guided in contact with the support element 32, and the base 1 will be guided. When it is conveyed along the support element 32, the base body 1 is generally guided by the other guide element 34 with its powder attachment surface facing relatively. In the container 31, the medium 33 is inserted to a depth of one-third of the diameter of the support member 32. As a result, the surface on which the powder on the substrate 1 is attached will come into contact with approximately the lower half of the support member 32, and the substrate 1 will be in contact with the medium 33. In this state, the container 31 vibrates in the thickness direction of the base body 1 and moves the base body 1 under the device. At this time, the support member 32 and the guide member 34 will be passively rotated along with the movement of the base body 1. In this way, the vibration medium 33 of the container 31 will be vibrated, and the powder on the substrate 1 will be hit through the medium 33. Then, a uniform impact force will be continuously applied in the width direction of the substrate 1, and the powder will be embedded at a uniform depth. The buried adhesive layer is uniformly and finely formed in the planar direction to form a powder single-layer film in which a part thereof protrudes from the surface of the adhesive layer. Next, the substrate 1 will be guided to the removing mechanism 40, and both sides of the substrate 1 will be washed through the jet water flow from the water spray nozzle -39- 572832 5. Invention Description (38) 41, and then the substrate 1 will be guided to the storage in In the water of the water tank 42, the surface of the base 1 where the powder is not embedded is pressed by the pressing roller 44 to press the sponge 43 to wipe away the remaining powder. After that, the substrate 1 is taken out from the water, and both sides of the substrate 1 are washed by the jet water jet of the water spray nozzle 45, and then the water adhering to the substrate 1 is blown away by the jet air flow from the air nozzle 46 for dehydration, and more through the water-absorbing roller 47 Soak up moisture. Next, the substrate 1 is heated by the infrared heater 48, and is sufficiently dried to produce a long-size film-like powder single-layer film with excess powder adhered thereto. After that, this long single-layer powdery thin film is rolled up by a winding mechanism to form a state ready for the next step. EXAMPLES Next, the effects of the present invention will be described in more detail through examples and comparative examples based on the present invention. a. Preparation of propylene polymer First, the preparation of the propylene polymer, which is the main component of the propylene-based adhesive used in the adhesive layer of each of Examples and Comparative Examples, will be described. Put in a flask equipped with a thermometer, a stirrer, a reflux cooling tube, and a nitrogen introduction tube, 94 weight units of n-butyl acrylate, 3 weight units of acrylate, 1 weight unit of 2-hydroxy acrylate, and 0.3 weight unit of Benzene peroxide, 40 weight units of ethyl acetate, and 60 weight units of toluene. Nitrogen was introduced through a nitrogen introduction tube. After the flask was filled with nitrogen, it was heated to 65 ° C for 10 hours to obtain a polymerization reaction with an average molecular weight of about 1 million. A propylene polymer solution with a Tg temperature of about -50 ° C. Next, this propylene polymer solution -40-572832 V. Explanation of the invention (39) Methyl isobutyl ketone was added at a solid ratio of 20% by weight to prepare a propylene polymer. b. Production of powder single-layer film Next, production of the powder single-layer film of Examples 1 to 4 and Comparative Example 1 provided with the adhesive layer using the aforementioned propylene polymer will be described. (Example 1) As a substrate, a cellulose acetate with a thickness of 80 // m (trade name: Fuji TACK UVD80, manufactured by Fuji Photo FILM) was used. On one side of the transparent film, the aforementioned propylene polymer 100 weight units add 0.35 weight units of isocyanate (trade name: L-45, manufactured by Sogo Chemical Co., Ltd.), 0.15 weight units of epoxy hardener (trade name: E-5XM, manufactured by Soka Chemical Co., Ltd.) Agent with a dry thickness of 3 // m and applied with a reverse applicator and dried at 10 ° C for 2 minutes. Then, a PET film (trade name: 3801, Lint) was peeled off on the coated surface. (Manufactured by Kesha Co., Ltd.) After thinning, it is rolled up and placed in a constant temperature bath at 40 ° C for one week to harden the adhesive layer to make an adhesive sheet. Secondly, as a powder, a volume average particle diameter of 4.5 // m is used. , Polymethylsiloxane balls with a particle diameter distribution of 0.94, a refractive index of 1.43, and a true arc of 96% (trade name: Teswell 1 45, manufactured by GE Toshiba SL ICON). The powder attachment mechanism of the powder single-layer film manufacturing device shown in Fig. 3 In the container, the transfer roller of the aforementioned powder attachment mechanism is a silicone rubber roller, and its surface is previously coated with a weakly adhesive silicone adhesive. After the powder is placed in the container, the transfer roller is rotated. A powder adhesion layer is formed on the surface. Then, '41 -572832 'will be peeled off from the aforementioned adhesive sheet. 5. Description of the invention (40) The PET film is peeled off, and the transparent substrate film having an adhesive layer on the surface is as shown in FIG. As shown, a powder single-layer film is formed on the surface of the adhesive layer being transported. In addition, there is no contamination caused by the powder around the device for manufacturing the powder single-layer film. Next, ion exchange water is added with The above-mentioned laminated body was immersed in an aqueous solution of a 0.1% surface active agent (trade name: Liponex NC-95, manufactured by LION), and the remaining powder was washed and removed by giving ultrasound. After being thoroughly washed with ion-exchanged water, the surface moisture was removed through an air knife. After that, it was placed in a thermostatic layer at 40 ° C for 3 weeks to fully dry, and after cooling at room temperature, the powder in Example 1 of the invention was manufactured. Body sheet Laminated film. &lt; Example 2 &gt; The powder single-layer film manufacturing apparatus provided with a transfer roller having weak adhesion on the surface in Example 1 was replaced with a urethane rubber having a conductive substance on its surface. A powder single-layer thin-film thin film manufacturing device of Example 2 was obtained in the same manner as in Example 1 except that the powder single-layer thin-film manufacturing device configured to apply a voltage to the transfer roller was constructed. In this powder single-layer film manufacturing apparatus, powder is adhered to the surface of a transfer roller by electrostatic force. In addition, there is no contamination caused by the powder around the powder monolayer film manufacturing equipment. <Example Instead of the powder attachment mechanism using the powder single-layer film manufacturing apparatus of FIG. 3 in Example 1, the powder attachment mechanism of the powder single-layer film manufacturing apparatus of FIG. 4 was used. Except for the above, the powder single-layer thin film laminate of Example 3 was obtained in the same manner as in Example 1. The carrier particle system uses ferrite particles with an average particle diameter of -42-572832. V. Description of the Invention (41) 90 // m. In addition, there is no contamination caused by powder around the device for manufacturing the powder single-layer film. &lt; Example 4 &gt; In place of the powder attachment mechanism of the powder single-layer film production apparatus of FIG. 3, the powder attachment mechanism of the powder single-layer film production apparatus of FIG. 8 was used. Except for the above, the powder single-layer thin-film laminate of Example 4 was obtained in the same manner as in Example 1. In the powder single-layer film manufacturing apparatus of FIG. 8, the interval X between the island-printed elements 104 is 15 cm, the diameter of the roller-shaped support element 102 is 20 cm, the depth y of the support element in the medium 103 is 7 cm, and the width of the container 101 z is 30 cm, and the container 101 puts a spherical oxide pin having a diameter of 0.5 mni as a medium and the aforementioned powder, and the container 101 is vibrated with an elliptical movement of 3 mm in the vertical direction and 1 mm in the horizontal direction in FIG. 8 at 1800 cpm. A long transparent substrate film with an adhesive layer on the surface is transported from left to right in FIG. 8 at a speed of lm / min. In the mixture of vibrating powder and medium, by passing the film having the powder layer described above, the powder is hit by the impact of the oxidized wrong ball to obtain a powder sheet in which the powder is buried in the adhesive layer. Laminated film. &lt; Comparative Example 1 &gt; For the transparent substrate film provided with an adhesive layer after peeling the peeling PET film of Example 1, the polymethylsiloxane ball of Example 1 was used to coat the gun with an electrostatic powder ( Trade name: GX-108, manufactured by Chichibu Onoda Co., Ltd.) The adhesive layer of the film is blown without applying a voltage to make the powder adhere to the surface of the adhesive layer. 0 -43- 572832 V. Description of the invention (42) Next, a YBA type baking coater (manufactured by YOSHIMITSU Seiki Co., Ltd.) was used to planarize (smooth) the surface where the thickness of the powder adhesion layer was 12.5 // m or less. After that, using a pressure roller (trade name: Lamipacker PD3204, manufactured by Fujipla Inc.), the powder-attached film was inserted into the pressure roller at a speed of 1.5 cm seconds to bury the charge into the adhesive layer. After performing the same steps of removing the remaining powder as in Example 1, drying was performed to obtain a powder single-layer thin film laminate of Comparative Example 1. c. Observation of powder layer The planes and cross sections of the powder single-layer films of Examples 1 to 4 and Comparative Example 1 obtained by the aforementioned methods were observed with an electron microscope. Figures 11 and 12 are electron micrographs of planes and sections of Example 1 taken at 20,000 times. Judging from the plan photograph in Figure Π, the phenomenon that the powder was uniformly and densely packed was confirmed. In addition, from the photograph of the cross section in FIG. 12, it has been confirmed that the powder is embedded in a part having a protrusion from the surface of the adhesive layer and is embedded at a uniform depth. On the other hand, FIG. 13 is an electron micrograph photographing the plane of the powder layer of Comparative Example 1 at 1500 times, and FIG. 14 is photographing a cross section of the powder layer of Comparative Example 1 at 2000 times. Electron micrograph. Comparing Fig. 13 with Fig. 14, the powder layer of Comparative Example 1 in which the powder is buried by the pressure roller, the filling density of the powder may vary, and there are powders embedded in multiple layers. Partially, or the place where the filling density of the powder is low, the uneven embedment depth of the powder has been confirmed. Judging from the method for manufacturing the powder single-layer film of the present invention, even if it is -44-572832 41 V. Description of the invention () When using a powder of fine particles, it can be adhered to a long-sized film-like substrate On the level, a uniform powder monolayer film is formed with high productivity. Furthermore, from the powder single-layer film manufacturing apparatus of the present invention, there is no contamination due to scattering of powder, etc., and a high-density powder single-layer film can be formed on the adhesive layer of the substrate. Even for long-size film-like substrates, it is possible to continuously produce powder single-layer films that are uniform and dense in the planar direction, and a part of the powder protrudes from the surface of the adhesive layer. -45-

Claims (1)

572832 f _Notices-I. Patent No. 90 1 1 87 5 3 "Patent method and device for manufacturing single-layer powder film on long-size lamellar substrate" (May 1992 Modification of 23 mortars) Scope of six patent applications: 1. A method for manufacturing a powder single-layer film on a long-sized sheet-like substrate, which is on a single-layered part of the surface of the adhesive layer of the long-sized sheet-like substrate. It is formed by embedding a powder single-layer film formed of a plurality of powders, and is characterized by comprising: a step of providing an adhesive layer on at least one side of the substrate; a step of attaching the powder to the aforementioned adhesive layer; and A step of removing the residual powder adhered to the laminated body obtained in the previous step. 2 · The method for manufacturing a powder single-layer film on a long-size sheet-like substrate according to item 1 of the scope of the patent application, which, after the aforementioned powder attachment step, comprises a powder which vibrates the aforementioned adhesive layer and vibrates in a container, and The step of burying the powder on the surface of the adhesive layer in a partially protruding single layer state when the medium is in contact with each other. 3. The method for producing a powder single-layer film on a long-size sheet-like substrate according to the scope of the patent application, after the step of laminating the adhesive layer, the method includes attaching a release-type substrate to the adhesive layer. The above step is a step of peeling the release-type substrate from the adhesive layer and exposing the adhesive layer. 4. For example, the powder on the long-size sheet-like substrate of the scope of the patent application No. 1 572832 6. The method of manufacturing the single-layer film of the scope of the patent application, in the aforementioned adhesive lamination step, it is set in advance through the separation type The adhesive layer on the substrate is attached to the substrate, and then the separation-type substrate is peeled off. The adhesive layer is copied on the substrate, and an adhesive layer is provided on the substrate. 5 · The method for manufacturing a powder single-layer film on a long-size sheet-like substrate according to item 4 of the scope of patent application, in the step of attaching the powder to the adhesive layer of the substrate having the aforementioned adhesive layer, With fluidized powder contact adhesive layer. 6 · The method for manufacturing a powder single-layer film on a long-size sheet-like substrate according to item 1 of the patent application scope, which is further a powder single-layer film having a laminated body obtained by disposing the resin in the step of removing the remaining powder. On the steps. 7 · The method for manufacturing a powder single-layer film on a long-size sheet-like substrate as described in item 1 of the scope of the patent application, wherein the adhesive layer contains an acrylic adhesive and has the powder only embedded through the aforementioned medium. Film thickness of single layer. 8 · The method for manufacturing a powder single-layer film on a long-size sheet-like substrate according to item 1 of the scope of the patent application, wherein the medium is a granular material having a diameter of 0.1 to 3.0 mm, and is generated by vibrating the medium. The impact force strikes the powder, and the powder is buried in the adhesive layer. 9. The method for manufacturing a powder single-layer film on a long-size sheet-like substrate according to item 1 of the scope of patent application, which comprises performing the wet cleaning by adding an aqueous solution of water and a builder after the step of removing the remaining powder, Fastener 572832 6. The scope of patent application is provided with the step of drying the laminated body. i 〇 • As in the method for manufacturing a powder single-layer film on a long-size sheet-like substrate according to item 4 of the patent application scope, wherein the aforementioned powder attachment step is through and adhered to the powder on the surface of the replication roller, or attached to magnetic force The powder on the brush is contact-replicated, and the powder is attached to the adhesive layer of the aforementioned substrate. 1 1. The method for manufacturing a powder single-layer film on a long-size sheet-like substrate according to the scope of patent application No. 10, wherein the surface of the replication roller is slightly adhesive, and the powder is adhered by the adhesive force . 1 2. The method for manufacturing a powder single-layer film on a long-size sheet-like substrate according to item 10 of the scope of the patent application, wherein the replication roller makes the powder adhere to the electrostatic force generated by applying a voltage and / or friction. surface. 1 3. According to the method for manufacturing a powder single-layer film on a long-size sheet-like substrate in the range of 10 of the application for a patent, wherein the magnetic brush is attached to an object constituted by a magnetic roller bearing particle formed on the surface of the magnetic roller, The powder is adhered to the surface of the carrier particle by electrostatic force and / or magnetic force. 14. A device for manufacturing a powder layer film on a long-size sheet substrate, comprising: an attachment mechanism for attaching powder to an adhesive layer laminated on the long-size sheet substrate; and embedding in a body width direction Mechanism; and removal mechanism for removing excess powder; 572832 Sixth, the scope of the patent application is through the surface of the adhesive layer on the long thin sheet substrate 5 by embedding the powder in a partially protruding single layer state Continuously produce powder monolayer film. 15. If the device for manufacturing a powder single-layer film on a long-size sheet-like substrate according to item 14 of the patent application scope, before the aforementioned attachment mechanism, 5 is equipped with a peeling mechanism for peeling off the separable substrate. 16 The powder single-layer film manufacturing device for a long-size sheet-like substrate according to item 15 of the patent, wherein the peeling mechanism is provided with a heating roller for heating the adhesive layer. 17. If the device for manufacturing a powder single-layer film on a long-size sheet-like substrate of item 15 in the scope of patent application, the peeling mechanism peels the separated plastic substrate at a certain speed and a certain angle. 18 The single-layer thin-film manufacturing device for long-size sheet-like substrates in the scope of the patent No. 14 item, wherein the attachment mechanism is provided with a mechanism for fluidizing the powder in the width direction of the substrate. The device for producing a powder single-layer film on a long-size sheet-like substrate according to the item, wherein the attachment mechanism is provided with a container for loading the powder, a transfer roller for adhering the powder, and supplying a predetermined amount of powder to the transfer device. The structure of the printing roller, and the support member for transferring the powder adhered to the transfer roller to a substrate provided with an adhesive layer. 20 Such as the long-sized sheet-like substrate of the scope of application for patent No. 14 Powder single-layer film manufacturing device, The attachment mechanism in the system is provided with a container for powder, a 4-magnetic brush for attaching the powder, and a quantity of powder 572832. 6. The structure of the patent application is supplied to the magnetic brush, and the magnetic brush is attached. The powder is contact-transferred to a support member for a substrate provided with an adhesive layer. 21, such as a powder single-layer film manufacturing device on a long-size sheet-like substrate in the scope of patent application No. 20, wherein the magnetic brush system is The requirement for bearing particles formed on the surface of a magnetic roller containing a magnet; the structure for supplying a certain amount of powder to a magnetic brush is to attach the powder to the surface of the bearing particles by rotating the magnetic roller. The structure for supplying a powder to a magnetic brush in a powder single-layer continuous manufacturing apparatus for a long-size sheet-like substrate according to item 19 or 20, is provided with a supply element and a layer thickness limiting element. 23. For example, a single-layer continuous manufacturing device for powder on a long-size sheet-like substrate in the scope of the patent application No. 19 or 20 9 wherein the supporting element is a rolled sheet 0 24. In the case of the long-size sheet in the scope of patent application No. 14 The embedment mechanism of the powder single-layer thin film manufacturing device on the substrate is provided with a mechanism for vibrating the medium. 25. The device for manufacturing a powder single-layer film on a long-sized sheet-like substrate such as the item No. 14 of the scope of application for a patent, wherein the removal mechanism is a dry cleaning mechanism. 26. For a device for manufacturing a powder single-layer film on a long-sized sheet-like substrate in the scope of application for item No. 14, the removal mechanism is provided with a water washing and drying mechanism. 5- 572832 VI. Application for patent scope 27. For a single-layer thin-film manufacturing device for a long-size sheet-like substrate, such as in item 14 of the scope of patent application, which includes a state in which an adhesive layer is provided on at least one side, The rolled long sheet-like substrate is continuously rolled out, and is supplied to the above-mentioned attachment mechanism or the unwinding mechanism of the peeling mechanism, and after the powder single-layer film is formed, the long sheet substrate is described above. Rolled-up coiling mechanism 0 28. For a powder single-layer film manufacturing device on a long-size sheet-like substrate in the scope of patent application No. 14, the embedding mechanism is provided with a mechanism for maintaining and long-size sheet-like substrates. In a state of parallel posture in the width direction> A container that vibrates at least according to the thickness direction of the substrate, a medium filled in the container, contacts the substrate and guides the substrate in the described medium, and is provided with a support for the container. Vibration Institute The supporting element of the generated impact force applies the impact force in the width direction of the substrate from the thickness direction of the substrate through the aforementioned medium. 29. For example, a powder single-layer film manufacturing device on a long-sized sheet-like substrate in the scope of the patent application No. 28, The cross-sectional shape of the container in the width direction of the substrate is the same. 30. For example, a powder single-layer film manufacturing device on a long-size sheet-like substrate in the scope of the patent application No. 28, which is provided with a substrate guide introduced into the aforementioned support. Guiding element near the element 〇31. For example, the powder single-layer film manufacturing device on the long-size sheet-like substrate of the 28th aspect of the application for a patent, which is provided with a gap between the support element and the substrate Medium 6-removal mechanism to remove