TW574429B - Method for producing composite electro-cast metal mold - Google Patents
Method for producing composite electro-cast metal mold Download PDFInfo
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- TW574429B TW574429B TW91108025A TW91108025A TW574429B TW 574429 B TW574429 B TW 574429B TW 91108025 A TW91108025 A TW 91108025A TW 91108025 A TW91108025 A TW 91108025A TW 574429 B TW574429 B TW 574429B
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- electroformed
- metal
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- metal sheet
- mold
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- 239000002184 metal Substances 0.000 title claims abstract description 61
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 61
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000002131 composite material Substances 0.000 title claims abstract description 14
- 239000007769 metal material Substances 0.000 claims abstract description 27
- 239000004033 plastic Substances 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 238000000151 deposition Methods 0.000 claims abstract description 12
- 230000008021 deposition Effects 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 11
- 238000005266 casting Methods 0.000 claims abstract description 7
- 150000002739 metals Chemical class 0.000 claims abstract 2
- 238000005323 electroforming Methods 0.000 claims description 21
- 238000002360 preparation method Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 19
- 239000010703 silicon Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 3
- 238000005304 joining Methods 0.000 claims 2
- 235000012239 silicon dioxide Nutrition 0.000 claims 2
- 239000012811 non-conductive material Substances 0.000 claims 1
- 239000000088 plastic resin Substances 0.000 claims 1
- 239000010453 quartz Substances 0.000 claims 1
- 230000000717 retained effect Effects 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 229910052716 thallium Inorganic materials 0.000 claims 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 claims 1
- 229910000831 Steel Inorganic materials 0.000 abstract description 6
- 239000010959 steel Substances 0.000 abstract description 6
- 238000006243 chemical reaction Methods 0.000 abstract description 3
- 238000001465 metallisation Methods 0.000 abstract description 2
- 230000032798 delamination Effects 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 26
- 230000000694 effects Effects 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- -1 English Substances 0.000 description 1
- 241000283973 Oryctolagus cuniculus Species 0.000 description 1
- 238000000563 Verneuil process Methods 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 210000004709 eyebrow Anatomy 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
574429574429
五、發明說明（i) 【技術領域】 0 本發明係有關一種電鑄金屬模之製造方法，特別是扣 一種複合電鑄金屬模之製造方法，其兼具結合介面受固、 加工快速及高溫下不易變形之優點及功效。 【先前之技術】 黎於目前市面上使用電鑄方式所形成的電鑄金眉片和 模具鋼材模仁結合的方式各有其缺點。 若以真空吸附方式雖然可快速達到需求的電躊片摩 度，但模具製作需相當精密，而且要增加真空設備’模具 維護困難。 若使用火焰熔喷接合或雷射焊接法均會使電鑄金屬片 變形，破壞電鑄金屬片的表面輪廓。 或是，使用機械崁合或螺絲鎖合的方式接合，電鑄金 屬片需要相當厚，相對電鑄時間就相當久。 假設以傳統電鑄方式來形成一足夠厚之電鑄金屬片， 若以3mm(30 00微米）為例，若沉積成長速度為每分鐘〇· 4微 米計算，由於它是單向沉積，所以理論上需要75〇〇分鐘， 換算後即為125小時，相當於5· 2天，非常耗時，且電鑄完 成後因為内應力堆積於厚層材質，容易有變形之虞。 請參閱第一圖，其中，在一電鑄基板91上設有一經設 計與製作出之塑膠模仁92 ,兩側設有絕緣板93，而此原有 電鑄金屬片8〇在電鑄完成後變成相當厚（假設由數 缺點？ ΐ ΐ i 3:to)兔此時内應力累積後^易產生變形之 、.第一圖所不為誇張化之示意圖。V. Description of the Invention (i) [Technical Field] 0 The present invention relates to a method for manufacturing an electroformed metal mold, in particular to a method for manufacturing a composite electroformed metal mold, which has both combination of interface fixing, fast processing and high temperature. The advantages and effects of not being easily deformed. [Previous Technology] The methods of combining the electroformed gold eyebrows and mold steel formed by the electroforming method in the current market have their own disadvantages. If the vacuum adsorption method can be used to quickly achieve the required electric diaphragm friction, the mold manufacturing needs to be quite precise, and it is difficult to increase the vacuum equipment 'mold maintenance. If flame fusion or laser welding is used, the electroformed metal sheet will be deformed and the surface profile of the electroformed metal sheet will be damaged. Or, if it is joined by mechanical coupling or screw locking, the electroformed metal sheet needs to be quite thick, and the electroformed time is relatively long. Assume that a sufficiently thick electroformed metal sheet is formed by the traditional electroforming method. If 3mm (300 micron) is taken as an example, if the deposition growth rate is calculated as 0.4 micron per minute, it is a unidirectional deposition, so the theory It takes 750,000 minutes, which is 125 hours after conversion, which is equivalent to 5.2 days, which is very time-consuming. After the electroforming is completed, the internal stress is accumulated in the thick layer material, which is liable to be deformed. Please refer to the first figure, in which an electroformed substrate 91 is provided with a designed and manufactured plastic mold core 92, and insulating plates 93 are provided on both sides, and the original electroformed metal sheet 80 is completed in electroforming After it becomes quite thick (assuming a number of disadvantages? Ϊ́ ΐ i 3: to) After the internal stress is accumulated at this time, the rabbit is liable to deform. The first picture is not an exaggerated schematic.
Ml 1^1 第4頁 574429 五、發明說明（2) 因此，有必要研發新產品以解決上述缺點。 【目的及功效】 本發明之主要目的，在於提供一種複合電鑄金屬模之 製造方法，其係巧妙的利用具有相當厚度之金屬材，且兩 結合面同時向内（雙向）電鑄沉積，結合後結合介面堅固， 而且十大幅縮短模具之製造時間。 本發明之又一目的，在於提供一種複合電鑄金屬模之 製造方法，具有高溫下不易變形之功效。 【技術内容】 本發明係提供一種複合電鑄金屬模之製造方法，包括 下列步驟： 一、 金屬材準備步驟； 二、 電鑄金屬片及塑膠模仁與電鑄基板之準備步驟； 三、 電源準備步驟； 四、 電鑄沉積層形成步驟；及 五、 離形步驟。 本發明之上述目的與優點，不難從下述所選用實施例 之詳細說明與附圖中，獲得深入瞭解。 茲以下列實施例並配合圖式詳細說明本發明於後： 【圖式簡單說明】 第一圖係傳統方法所產生過厚電鑄金屬模之變形示意 圖 第二圖係本發明方法之流程圖 第三圖係本發明在電、鑄前之裝配示意圖Ml 1 ^ 1 Page 4 574429 V. Description of Invention (2) Therefore, it is necessary to develop new products to solve the above disadvantages. [Objective and Effect] The main purpose of the present invention is to provide a method for manufacturing a composite electroformed metal mold, which is a clever use of a metal material having a considerable thickness, and the two joint surfaces are simultaneously inwardly (two-way) electroformed and deposited. The rear bonding interface is strong, and the manufacturing time of the mold is greatly reduced. Another object of the present invention is to provide a method for manufacturing a composite electroformed metal mold, which has the effect of preventing deformation at high temperatures. [Technical content] The present invention provides a method for manufacturing a composite electroformed metal mold, including the following steps: 1. Preparation of metal materials; 2. Preparation of electroformed metal sheet and plastic mold core and electroformed substrate; 3. Power supply Preparation steps; four, an electroforming deposited layer forming step; and five, a release step. The above objects and advantages of the present invention can be easily understood from the detailed description and accompanying drawings of selected embodiments described below. The following examples and the drawings are used to explain the present invention in detail: [Simplified illustration of the drawings] The first diagram is a schematic diagram of the deformation of an over-thick electroformed metal mold produced by a traditional method. The second diagram is a flowchart of the method of the present invention. The three pictures are the assembly schematic diagrams of the present invention before electric and casting
574429 五、發明說明（3) 第四圖係本發明在電鑄中之局部放大示意圖一 第五圖係本發明在電铸中之局部放大示意圖二 第六圖係本發明在電鑄完之示意圖 第七圖係本發明在離形步驟後之示意圖 第八圖係本發明之另一實施例之局部放大示意圖 【圖號說明】 (本發明部份） 金屬材準備步驟1 電鑄金屬片及塑膠模仁與電鑄基板之準備步驟2 電源準備步驟3 第一結合面2 1 第二結合面3 1 塑膠模仁40 電源6 0、7 0 陽極62、72 電鑄基板91 絕緣板9 3 電鑄沉積層形成步驟4 離形步驟5 電鑄沉積層1 5 金屬材20 絕緣層22 電鑄金屬片30 加工表面32 電鑄基板50 陰極61、71 電鑄材料來源80 (習知部份） 電鑄金屬片90 塑膠模仁92 【實施例之詳細說明】574429 V. Description of the invention (3) The fourth diagram is a partially enlarged schematic diagram of the present invention in electroforming. The fifth diagram is a partially enlarged schematic diagram of the present invention in electroforming. The sixth diagram is a schematic diagram of the present invention after electroforming. The seventh diagram is a schematic diagram of the present invention after the release step. The eighth diagram is a partially enlarged schematic diagram of another embodiment of the present invention. [Illustration of the drawing number] (part of the present invention) Metal material preparation step 1 Electroformed metal sheet and plastic Preparation of mold core and electroformed substrate 2 Power preparation step 3 First joint surface 2 1 Second joint surface 3 1 Plastic mold core 40 Power source 6 0, 7 0 Anode 62, 72 Electroformed substrate 91 Insulating plate 9 3 Electroformed Step 4 of forming layer 5 Deforming step 5 Electroforming deposition layer 1 5 Metal material 20 Insulating layer 22 Electroforming metal sheet 30 Machined surface 32 Electroforming substrate 50 Cathode 61, 71 Electroforming material source 80 (known part) Electroforming Metal sheet 90 Plastic mold core 92 [Detailed description of the embodiment]
574429574429
五、發明說明（4) 請參閲第二圖，本發明係為一種複合電鎊金 造方法之流程圖，包括下列步驟： 之製 一、金屬材準備步驟1、二、電鑄金屬片及塑 與電鎊基板之準備步驟2、三、電源準備步驟3、四、一 沉積層形成步驟4及五、離形步驟5。茲針對各步趨二電鑄 nr。 ’輝詳逑如 一、金屬材準備步驟1:請參閱第三圖，準備一具 預疋厚度且可導電之金属材20(可為銅、鋼、等等） 屬材20具有一微凸之第一結合面21，其餘表面包覆 層22’且該金屬材20之厚度至少超過1姐扭，以方便後續作 二、 電鑄金屬片及塑膠模仁與電鑄基板之準備步驟 2:準備一平均厚度小於500//m之電鑄金屬片30，其旲有 一相對應該第一結合面21之第二結合面31及一加工表面 32 ’該電鑄金屬片3〇之加工表面32上係結合一不導電之塑 膝模仁40及一不導電之電鑄基板50，三者暫時結合為一 體’該電鑄金屬片30之加工表面32上設有形成預定形狀之 結構或特定的外形紋路（例如為一特定之微結構，用以在 後續製程中形成導光模組） 三、 電源準備步驟3:準備二電源60、70，每一電源 均美有一陰極61、71及一陽極62、72。 四、電鑄沉積步驟4:請參閱第三、四及五圖，將該 微凸之第一結合面21與該第二結合面31以一預定之小面積 接觸，進行電鑄，電鑄時，該二電源60、70之陽極62、72V. Description of the invention (4) Please refer to the second figure. The present invention is a flow chart of a method for manufacturing a composite electric pound metal, including the following steps: 1. Preparation of metal materials 1. Preparation of metal materials 1. Preparation steps 2 and 3 of the plastic and electric substrate, power supply preparation steps 3, 4, and a deposition layer forming step 4 and 5 and releasing step 5. For each step, we will electro-form nr. 'The details are as follows: 1. Metal material preparation step 1: Please refer to the third figure to prepare a metal material 20 (can be copper, steel, etc.) with a pre-thickness and conductivity. The metal material 20 has a slightly convex A bonding surface 21, the remaining surface cladding layer 22 'and the thickness of the metal material 20 at least more than one twist, so as to facilitate subsequent preparations 2. Preparation of electroformed metal sheets and plastic mold cores and electroformed substrates Step 2: Preparation 1 The electroformed metal sheet 30 having an average thickness of less than 500 // m has a second joint surface 31 and a processed surface 32 corresponding to the first joint surface 21, and the processed surface 32 of the electroformed metal sheet 30 is bonded. A non-conducting plastic mold core 40 and a non-conducting electroformed substrate 50 are temporarily combined into one. The processing surface 32 of the electroformed metal sheet 30 is provided with a structure forming a predetermined shape or a specific outline ( For example, a specific microstructure is used to form a light guide module in subsequent processes. 3. Power preparation step 3: Prepare two power supplies 60 and 70. Each power supply has a cathode 61, 71 and an anode 62, 72. . 4. Electroforming deposition step 4: Please refer to the third, fourth, and fifth drawings, and contact the slightly convex first bonding surface 21 and the second bonding surface 31 with a predetermined small area to perform electroforming. , The anodes 62, 72 of the two power sources 60, 70
574429 五、發明說明（5) 係接通至一電 屬材2 0和該電 61、71，二者 與該電鑄金屬 五及六圖，隨 力，使該金屬 沉積層1 5而緊 積層15、該電 板5 0依序結合 五、離形 仁40及電鑄基 鑄金屬片3 0保 沉積層1 5而與 電鑄金屬模。 更詳細的 矽、玻璃、石 料0 鍀材料來源80(例如為鎳），且電鑄時使該金 鏵金屬片3〇同時接通該二電源Μ、7〇之陰極 並同時逐漸沉積於該金屬枋2〇之第 姓衣 片30之第二結合面31之間的空間· ^結合面 著雙向沉積之厚度越來越厚及^屬請參閱第 材20和該電鑄金屬片30藉由一叙:間結合 密接合在一起，而使得該金屬材2〇、 電鑄 鱗金屬片30、塑膠模仁40及不莫番、電碡沉 為U 等電之電鑄基 步驟5:請參閱第七圖，將不導電之塑 板50去除（亦包括絕緣層22)，即離形/模 有翻鑄原來的加工表面32，並且蕤士 使電 該金屬材20緊密接合在一起，而形忐 电轉 ~或一複合 氣化 電材 說，該電鑄基板50之材料可選自矽、 英、塑膠、環氧樹酯其中之一之不導 實務上，對於精密模具如液晶顯示器（LCD)之導光_ 組之加工時，此該金屬材之厚度約介於2至3min，且該電 金屬片之厚度係介於250/im至350jCtm。 轉 當然，請參閱第八圖，該第一結合面21可以改成— 凸錐面’且該第二結合面31係為一平面’同樣由小面積 觸再逐漸沉積。 ' # 除上述導光模組外，本發明可應用在相關之產業， ΜΗ 第8頁 574429 五、發明說明（6) 汽機車之車燈模組，其表面上需要有微細之紋路（使專透 之光線霧化擴散），或是應用於雷射全像片等等。 - 本發明之優點及功效可歸納為： [一] 結合介面堅固。由於此電鑄沉積層15之結合力 是材料内部之金屬間結合力，可將金屬材20與電鑄金屬片 30十分堅固的固定在一起，並可提高本發明之複合電鑄金· 屬模之使用壽命。 [二] 加工快速。本發明之主要厚度（假設為2. 5mm，夾 固用）部份係由現有之金屬材20提供，所需電鑄沉積之厚 度很小，假設為〇· 5mm(500微米），若其沉積成長速度為每 分鐘0.4微米計算，由於本發明是由兩相對内表面同時向 内成長，故單邊需成長之長度為250微米，除以0.4微米/ 秒，故可得理論上應為625分鐘（約10.4小時）。比起習知 的全程電鑄沉積至3mm( 2· 5 + 0· 5mm)所需之時間為7500分鐘 (約125小時’等於5.2天），本發明之加工速度比習知技術 的加工速度快大約12倍，大幅縮短模具加工時間。 [三] 高溫下不易變形。由於本發明之結合介面為金屬 與金屬之電鎿沉積結合，結合後在後績之加工作業中，可 耐高溫，且不易變形。 以上僅是藉由較佳實施例詳細說明本發明，對於該實 施例所做的任何簡單修改與變化皆不脫離本發明之精神與 範圍。 由以上詳細說明，可使熟知本項技藝者明瞭本發明的 確可達成前述目的，實已符合專利法之規定，表提出發明574429 V. Description of the invention (5) It is connected to an electric metal material 20 and the electric materials 61 and 71, both of which are in accordance with the figure 5 and 6 of the electroformed metal. With force, the metal deposition layer 15 is compacted. 15. The electric plate 50 is sequentially combined with the five, the inferior core 40 and the electroformed base cast metal sheet 30, and the deposit layer 15 is combined with the electroformed metal mold. More detailed silicon, glass, stone 0 material source 80 (for example, nickel), and the gold metal sheet 30 is simultaneously connected to the cathodes of the two power sources M and 70 during electroforming and gradually deposited on the metal枋 The space between the second bonding surface 31 of the second piece of clothing piece 30, and the thickness of the bonding surface is increasing in both directions. Please refer to the material 20 and the electroformed metal sheet 30 by a Narrative: The joints are tightly bonded together, so that the metal material 20, the electroformed scale metal sheet 30, the plastic mold core 40, and the Momo, electroforming is U, etc. Step 5: Please refer to section Seven pictures, the non-conductive plastic plate 50 is removed (also including the insulating layer 22), that is, the mold / mold has the original processing surface 32, and the metal material 20 is tightly joined together to form the shape. Electro-conversion ~ or a composite gasification electrical material, said that the material of the electroformed substrate 50 can be selected from one of silicon, English, plastic, epoxy resin. For non-conducting practice, for precision molds such as liquid crystal display (LCD). When processing the light guide _ group, the thickness of the metal material is about 2 to 3 min, and the thickness of the electric metal sheet is Between 250 / im and 350jCtm. Of course, referring to the eighth figure, the first joint surface 21 can be changed to-a convex cone surface 'and the second joint surface 31 is a flat surface', which is also gradually deposited by a small area. '# In addition to the above light guide module, the present invention can be applied to related industries, ΜΗ page 8 574429 V. Description of the invention (6) The light module of the automobile and motorcycle requires fine lines on the surface Through the light, atomization and diffusion), or applied to laser holograms and so on. -The advantages and effects of the present invention can be summarized as follows: [1] The combination interface is strong. Since the bonding force of the electroformed deposition layer 15 is the intermetallic bonding force within the material, the metal material 20 and the electroformed metal sheet 30 can be very firmly fixed together, and the composite electroformed metal of the present invention can be improved. Its useful life. [2] Fast processing. The main thickness of the present invention (assuming 2.5 mm, for clamping) is provided by the existing metal material 20, and the thickness of the required electroformed deposition is very small, assuming 0.5 mm (500 microns). The growth rate is calculated at 0.4 micrometers per minute. Since the present invention grows inward from two opposite inner surfaces at the same time, the length to be grown on one side is 250 micrometers, divided by 0.4 micrometers per second, so theoretically 625 minutes can be obtained. (About 10.4 hours). The processing speed of the present invention is faster than the processing speed of the conventional technology, compared with the time required for the conventional full-electrodeposition to 3mm (2.5mm + 0.5mm) is 7500 minutes (about 125 hours' equal to 5.2 days). Approximately 12 times, greatly reducing mold processing time. [三] Not easy to deform under high temperature. Since the bonding interface of the present invention is a combination of metal and metal electrodeposition, it can withstand high temperatures and is not easily deformed in subsequent processing operations after bonding. The above is only a detailed description of the present invention through a preferred embodiment, and any simple modifications and changes made to the embodiment will not depart from the spirit and scope of the present invention. From the above detailed description, those skilled in the art can understand that the present invention can indeed achieve the aforementioned purpose, and it has indeed complied with the provisions of the Patent Law.
574429574429
第ίο頁 574429 圖式簡單說明 【圖式簡單說明】 第一圖係傳統方法所產生過厚電鑄金屬模之變形示意 圖 第二圖係本發明方法之流程圖 第三圖係本發明在電鑄前之裝配示意圖 第四圖係本發明在電鑄中之局部放大示意圖一 第五圖係本發明在電鑄中之局部放大示意圖二 第六圖係本發明在電鑄完之示意圖 第七圖係本發明在離形步驟後之示意圖 第八圖係本發明之另一實施例之局部放大示意圖 【圖號說明】 (本發明部份） 金屬材準備步驟1 第一結合面2 1 第二結合面3 1 塑膠模仁40 電源60、70 陽極62、72 電鑄金屬片及塑膠模仁與電鑄基板之準備步驟2 電源準備步驟3 電鑄沉積層形成步驟4 離形步驟5 電鑄沉積層1 5 金屬材20 絕緣層22 電鑄金屬片30 加工表面32 電鑄基板50 陰極61、71Page 574429 Brief description of the drawings [Simplified description of the drawings] The first diagram is a schematic diagram of the deformation of an over-thick electroformed metal mold produced by the traditional method. The second diagram is a flowchart of the method of the present invention. The previous assembly diagram. The fourth diagram is a partially enlarged schematic diagram of the present invention in electroforming. The fifth diagram is a partially enlarged schematic diagram of the present invention in electroforming. The second and sixth diagrams are schematic diagrams of the present invention after electroforming. The eighth diagram of the present invention after the release step is a partially enlarged schematic diagram of another embodiment of the present invention [Illustration of the drawing number] (part of the present invention) Metal material preparation step 1 First joint surface 2 1 Second joint surface 3 1 Plastic mold core 40 Power supply 60, 70 Anode 62, 72 Preparation of electroformed metal sheet, plastic mold core and electroformed substrate 2 Power supply preparation step 3 Formation of electroformed deposited layer 4 Deformation step 5 Electroformed deposited layer 1 5 Metal material 20 Insulating layer 22 Electroformed metal sheet 30 Machined surface 32 Electroformed substrate 50 Cathode 61, 71
574429 圖式簡單說明 電鑄材料來源80 (習知部份） 電鑄金屬片90 電鑄基板91 塑膠模仁9 2 絕緣板9 3574429 Brief description of the drawing Source of electroformed material 80 (the conventional part) Electroformed metal sheet 90 Electroformed substrate 91 Plastic mold 9 9 Insulating plate 9 3
第12頁Page 12
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| TW91108025A TW574429B (en) | 2002-04-17 | 2002-04-17 | Method for producing composite electro-cast metal mold |
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| TW91108025A TW574429B (en) | 2002-04-17 | 2002-04-17 | Method for producing composite electro-cast metal mold |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI470121B (en) * | 2013-01-08 | 2015-01-21 | Tsai Lin Yang | Electroforming method for enhancement of joint strength |
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2002
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI470121B (en) * | 2013-01-08 | 2015-01-21 | Tsai Lin Yang | Electroforming method for enhancement of joint strength |
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