TW585342U - Composite material structure with high heat conduction and electromagnetic shielding functions - Google Patents

Composite material structure with high heat conduction and electromagnetic shielding functions

Info

Publication number
TW585342U
TW585342U TW92206575U TW92206575U TW585342U TW 585342 U TW585342 U TW 585342U TW 92206575 U TW92206575 U TW 92206575U TW 92206575 U TW92206575 U TW 92206575U TW 585342 U TW585342 U TW 585342U
Authority
TW
Taiwan
Prior art keywords
composite material
heat conduction
high heat
electromagnetic shielding
material structure
Prior art date
Application number
TW92206575U
Other languages
Chinese (zh)
Inventor
Ching-Lung Yang
Original Assignee
Cateron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cateron Corp filed Critical Cateron Corp
Priority to TW92206575U priority Critical patent/TW585342U/en
Priority to US10/813,164 priority patent/US20040214496A1/en
Publication of TW585342U publication Critical patent/TW585342U/en
Priority to JP2004128828A priority patent/JP2004322649A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3976—Including strand which is stated to have specific attributes [e.g., heat or fire resistance, chemical or solvent resistance, high absorption for aqueous composition, water solubility, heat shrinkability, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3976—Including strand which is stated to have specific attributes [e.g., heat or fire resistance, chemical or solvent resistance, high absorption for aqueous composition, water solubility, heat shrinkability, etc.]
    • Y10T442/3984—Strand is other than glass and is heat or fire resistant

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW92206575U 2003-04-25 2003-04-25 Composite material structure with high heat conduction and electromagnetic shielding functions TW585342U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW92206575U TW585342U (en) 2003-04-25 2003-04-25 Composite material structure with high heat conduction and electromagnetic shielding functions
US10/813,164 US20040214496A1 (en) 2003-04-25 2004-03-31 Material having characteristics of high thermal conductivity and electromagnetic interference resistance
JP2004128828A JP2004322649A (en) 2003-04-25 2004-04-23 Composite material structure provided with high heat conduction and electromagnetic shielding function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92206575U TW585342U (en) 2003-04-25 2003-04-25 Composite material structure with high heat conduction and electromagnetic shielding functions

Publications (1)

Publication Number Publication Date
TW585342U true TW585342U (en) 2004-04-21

Family

ID=33297716

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92206575U TW585342U (en) 2003-04-25 2003-04-25 Composite material structure with high heat conduction and electromagnetic shielding functions

Country Status (3)

Country Link
US (1) US20040214496A1 (en)
JP (1) JP2004322649A (en)
TW (1) TW585342U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103098575A (en) * 2010-09-14 2013-05-08 莱尔德技术股份有限公司 Compliant multilayered thermally-conductive interface assemblies having emi shielding properties

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006098528A1 (en) * 2005-03-15 2006-09-21 Sung Suk Ju Conductive device for electronic equipment
US7969741B2 (en) * 2005-08-30 2011-06-28 Panasonic Corporation Substrate structure
JP4978478B2 (en) * 2008-01-11 2012-07-18 ソニー株式会社 Electromagnetic wave suppressing heat radiation sheet and electronic device
GB201112740D0 (en) 2011-07-25 2011-09-07 Qinetiq Ltd Radiation absorption
JP2013118313A (en) * 2011-12-05 2013-06-13 Dexerials Corp Electromagnetic wave-absorbing thermally conductive sheet, and manufacturing method of electromagnetic wave-absorbing thermally conductive sheet
KR102066482B1 (en) 2013-07-16 2020-01-15 삼성전자주식회사 Fiber reinforced plastic material and electronic device including the same
GB2521835A (en) * 2014-01-02 2015-07-08 Nokia Technologies Oy Electromagnetic shielding
JP1550138S (en) * 2015-07-23 2016-05-23
JP1550139S (en) * 2015-07-23 2016-05-23
US9781819B2 (en) * 2015-07-31 2017-10-03 Laird Technologies, Inc. Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding
CN107567270A (en) * 2017-08-30 2018-01-09 艾威尔电路（深圳）有限公司 Rigid-flex combined board with high-intensity signal shielding
CN108909113B (en) * 2018-08-24 2024-09-24 深圳市飞鸿达科技有限公司 A thermally conductive electromagnetic noise suppression sheet and a preparation method thereof
US10462944B1 (en) * 2018-09-25 2019-10-29 Getac Technology Corporation Wave absorbing heat dissipation structure
CN109243684B (en) * 2018-10-31 2024-03-12 舜仕(深圳)科技有限公司 Shockproof, filtering and anti-electromagnetic interference signal line
CN114267960B (en) * 2021-12-27 2022-11-01 彗晶新材料科技(杭州)有限公司 Composite material with heat conduction and wave absorption and electromagnetic shielding functions and preparation method thereof
CN114901041A (en) * 2022-05-13 2022-08-12 上海茵特格锐科技有限公司 Electromagnetic shielding and heat dissipation structure of motor built-in circuit board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5178704A (en) * 1974-12-28 1976-07-08 Onahama Seiren Kk
EP0126790B1 (en) * 1983-05-27 1986-09-03 Ibm Deutschland Gmbh Composite magnetic disk
US5632942A (en) * 1993-05-24 1997-05-27 Industrial Technoology Research Institute Method for preparing multilayer ceramic/glass substrates with electromagnetic shielding
EP1228861B9 (en) * 1999-08-25 2012-04-25 Bridgestone Corporation Glass with improved impact resistance

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103098575A (en) * 2010-09-14 2013-05-08 莱尔德技术股份有限公司 Compliant multilayered thermally-conductive interface assemblies having emi shielding properties

Also Published As

Publication number Publication date
US20040214496A1 (en) 2004-10-28
JP2004322649A (en) 2004-11-18

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Legal Events

Date Code Title Description
MK4K Expiration of patent term of a granted utility model