TW587004B - Injection molding image sensor packaging method - Google Patents

Abstract

The inventive injection molding image sensor packaging method comprises the steps of: providing plural mutually arranged metal sheets, each metal sheet having a first plate, a second plate and a third plate for forming a C-shape; encapsulating each metal sheet by a first time of injection molding for forming a first molded body, so that the first plate of the metal sheet is exposed out of the upper surface of the first molded body, the second plate is exposed out of the lower surface of the first molded body, and the third plate is exposed out of the side of the first molded body; forming a second molded body on the first molded body by a second time of injection molding, and forming a recessed slot with the first molded body; providing an image sensor chip and arranging the same in the recessed slot formed by the first molded body and second molded body; providing plural wires for electrically connecting the image sensor chip to the first plate of the metal sheet; and providing a light penetrating layer located on top of the second molded body for encapsulating the image sensor chip.

Description

587004 V. Description of the invention (1) Technical field The present invention relates to an image sensor packaging method for an injection molding, and particularly refers to a person who uses an injection molding method to package an image sensor. A hurry ahead "^ =. Press, the general sensor can be used to sense a signal. The signal may be a light or a sound signal. The sensor in this case is used to receive a light signal and an image signal. After receiving the optical signal, the image sensor can be used to convert the optical 2 signal into an electrical signal, which is transmitted to the circuit board through the substrate. Please refer to FIG. 1, a cross-sectional view of a conventional image sensor package structure, where f: a substrate 10, the upper and lower surfaces 11 and 13 of the substrate 10 respectively form a flood signal input terminal 18 and a signal output terminal 24; The layer 12 is disposed on the substrate 2 and forms a groove 16 with the substrate 10; an image sensing wafer 14 is placed in the groove 16 formed by the second plate 10 and the flange layer 12, and a plurality of layers are formed thereon The know pad 2 0 a plurality of wires 1 5 are electrically connected to the solder pad 2 of the image sensing chip 14 and the signal input terminal 18 of the substrate 10, and a light-transmitting layer 22 is coated with a layer of adhesive 23 first, and then placed on it. On the flange layer 丨 2, the image sensor chip 丨 4 is covered to complete the packaging of the light sensor. The above-mentioned image sensor packaging method has the following disadvantages: ^ It must be manufactured in a single piece, and in mass production, the purpose of reducing production costs cannot be achieved. 2 During the packaging process, each package must provide a substrate 10, and then rebond = two flange layers 12, if so, it will cause inconvenience in manufacturing and material cost, and the glue will easily cause overflow. This phenomenon affects line operations.

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Internal invention of the invention The main object of the present invention is to provide a method for packaging a sensor, which achieves a large image by injection molding to achieve the purpose of effectively reducing production costs. Another object of the present invention is to provide a birding method for injection molding ', which forms a packaging structure by injection molding; and the case where the glue cannot be wired when the glue overflows. Another object of the present invention is to provide an injection detector packaging method, which uses a metal sheet instead of a substrate and a circuit on the substrate to sense ′, which can effectively reduce material and manufacturing costs. (1) To achieve the above-mentioned object, the main feature of the present invention is to include the following steps: providing a plurality of metal sheets arranged one on another, each of which has a first plate, a second plate, and a third plate to form A letter-shaped shape; each metal sheet is covered by the first injection molding to form a first molded body, and the first plate of the metal sheet is exposed from the upper surface of the first molded body; Two plates are exposed from the lower surface of the first molded body, and a third plate is exposed from the side of the first molded body; a second injection molding method is used to form a second molded body on the first molded body, and is in contact with the first molded body. The first molded body forms a groove; an image sensing chip is provided, and it is arranged in the groove formed by the first molded body and the second molded body; a plurality of wires are provided to electrically connect the

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The first plate of the metal sheet; and-providing a light-transmitting layer ... the upper end of the adult body 'is used to cover the image sensing chip. If so, the efficacy and purpose of the present invention can be achieved. This case can be understood more deeply by the following drawings and descriptions. Please refer to FIG. 2 for the application method, which is the first plan of the image sensor package of the present invention, which includes the following steps: First, provide a plurality of numbers. Each metal piece 30 is provided with a J40, a second plate 42 and a third plate "to form a shape, and the metal pieces 30 are arranged around to form a frame structure with four sides. Please refer to Fig. 3 This is the second intent of the image sensor package side of the injection-molded image sensor of the present invention. In the first injection molding method, # each industrial metal material is used to cover each metal sheet 30 to form a first mold. Body 4; in order for the first plate 40 of the metal sheet 30 to be exposed from the upper surface of the first molded body 46, the two plates 42 to be exposed from the lower surface of the first molded body 46, and the third plate 44 from the first molded body 46 side Please refer to FIG. 4, which is a third schematic diagram of the injection molding image sensor package according to the present invention. In the second injection molding method, industrial plastic is used as a material to form a first molded body 46. The second formed body 48 forms a groove 50 with the first formed body 46, and a plurality of metals The first plate a of 30 is located in the groove 50. Referring to FIG. 5, a fourth schematic diagram of the method for sealing and forming an image sensor according to the present invention is provided, and an image sensing chip 52 is provided on which a plurality of Each

587004 V. Description of the invention (4) Welding cymbal 54 'is provided in the groove 50 formed by the first molded body 46 and the second molded body 48, and is fixed on the first molded body 46. A plurality of wires 56 are provided, which are used to electrically connect the pads 54 of the image sensing chip 52 to the first plate 40 of the metal sheet 30 so that the signals of the image sensing chip 52 can be transmitted to the plurality of metal sheets 30. . A light-transmitting layer 58 'is provided on the upper end of the second molded body 48 for covering the image-sensing chip 5 2 so that the image-sensing chip 52 can receive light signals through the light-transmitting layer 58. With the combination of the above structures, the injection-molded image sensor packaging method of the present invention has the following advantages: 1. It is produced by injection molding, which can effectively reduce production costs during mass production. 2. The package is formed by injection molding, which can avoid the overflow of adhesive. 3. Substituting the metal sheet 30 for the substrate and the wiring on the substrate can effectively reduce material and manufacturing costs. The specific embodiments proposed in the detailed description of the preferred embodiments are only for easy explanation of the technical content of the present invention, and are not intended to limit the present invention to the embodiments in a narrow sense. The various changes made are within the scope of the present invention.

Page 8 587004 Brief description of the drawing Figure 1 is the conventional image sensor package structure Figure 2 The injection molded image sensor of the present invention: Figure 3 The injection molded image sensor of the present invention is the first $ Schematic diagram 4 The second schematic diagram of the injection molded image sensor seal of the present invention Fig. 5 The third schematic diagram of the injection molded image sensor soil of the present invention The fourth schematic diagram of the present invention No. 4 metal sheet 30 first plate 40 The second plate 4? Chu a first molded body 46 a second molded body 48 concave; 50 44 groove 54 a plurality of wires 56 light transmitting layer 58 $ '则 晶 52

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Claims (1)

587004 The method includes the following steps: 1. An injection molding method for packaging an image sensor: providing a plurality of phase first plates, a second plate, and a third metal plate arranged in parallel with each other in a shape of first injection molding. The metal sheet is formed into a first molded body with an exposed surface on the upper surface thereof. The second molded body is shot out, and the second molded body is shot out twice, and each of the metal pieces is provided with a c shape; A metal sheet is covered, and the shaped first plate is exposed by the first molded body plate from the lower surface of the first molded body, and the third side is exposed; a molding method is provided in which the first plate is located in the groove. Set in the formation of the first molded body of the provided sheet; " an image sensing wafer 'on which the first molded body and the second molded plurality of wires are electrically connected to the shadow plate; and a first molded body is formed with a The second groove, and the metal sheets are provided with a plurality of solder pads, and the grooves formed by the system are like the solder pads of the sensing chip to the gold, and the light-transmitting layer is located on the second The upper end of the molded body Coated wafer live sense. 2 · The method for packaging an image sensor by injection molding as described in item 1 of the declared patent scope, wherein the first molding body and the second molding system are made of industrial plastic materials. 3. The injection-molded image sensor packaging method as described in item 丨 of the patent application range, wherein the transparent layer is a transparent glass. Page 10