TW593159B - Method for producing flake-like silver powder - Google Patents

Method for producing flake-like silver powder Download PDF

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Publication number
TW593159B
TW593159B TW092120301A TW92120301A TW593159B TW 593159 B TW593159 B TW 593159B TW 092120301 A TW092120301 A TW 092120301A TW 92120301 A TW92120301 A TW 92120301A TW 593159 B TW593159 B TW 593159B
Authority
TW
Taiwan
Prior art keywords
face
substrate
silver powder
silver
flake
Prior art date
Application number
TW092120301A
Other languages
Chinese (zh)
Inventor
Jenn-Shing Wang
Original Assignee
Far East College
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Far East College filed Critical Far East College
Priority to TW092120301A priority Critical patent/TW593159B/en
Application granted granted Critical
Publication of TW593159B publication Critical patent/TW593159B/en
Priority to US10/885,687 priority patent/US20050016328A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B22F1/068—Flake-like particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0005—Separation of the coating from the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/01—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes on temporary substrates, e.g. substrates subsequently removed by etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1657—Electroless forming, i.e. substrate removed or destroyed at the end of the process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/18—After-treatment
    • C23C4/185—Separation of the coating from the substrate
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)

Abstract

A method for producing a flake-like silver powder, which uses the characteristics that plated film has a uniform thickness, comprises selecting a substrate easily being removed and broken; plating a silver layer on the substrate; pulverizing the test piece and removing the substrate, or removing the substrate and then pulverizing for leaving a flake-like silver powder behind and obtaining a powder having a uniform thickness. During an ordinary stacking process, in addition to point contacts, a large proportion of the flakes has face-to-face layer-wise stacking. Comparing to point-to-point contact, a face-to-face contact has a larger transportation channel. Thus, a stacking with face-to-face contact has a largely reduced thermal resistance and electrical resistance due to easier passage of heat and electrons towards the face-to-face contact, which leads to thermal and electrical conductions at a specific direction.

Description

593159 五、發明說明（1) 【發明所屬之技術領域】 本發明係有關於— 以得到厚度相當均一的 ^ ^古‘作方法，主要係可 之優越的熱傳和導電特性。_亚 利於使用其特定方向 【先前技術】 銀粉因其具有優良導埶 於電子封裝、電極接點 寺性，而廣泛應用在 形式傳導熱和電時接二二積= 片由於後者球形粉體之堆積是二性 向性堆疊，片狀之間除點接=有= 疋面逐層堆疊…面接觸較點接觸有更大流 大：ΐ低：和電t較易由此面接觸通過，使熱阻和電阻 中華I ra衰ΐ特疋方向具有優越的熱傳和導電特性，如 發明公告第432085號「導熱性漿狀組成物」 ^使用的縱向長度為1()微米到50微米而厚度為i微米到5 U米的片狀銀粉體。 針，上述銀粉的製作問題，可見國内外之專利公報或 相關的貝料，例如中華民國專利發明公告第1 46827號「新 銀粉製法」、第490339號「超微細銀鈀合金粉末的製備方 法」丨第2333 1 5號「製備可控制表面積之銀粉的方法」論 及化學溶液中還原析出銀粉方法，第26 1 554號「藉氣溶膠 分解作用製造銀粉末之方法」採用熱分解含銀化合物的不 飽和溶液’而類似概念亦見於第458829號「金屬粉末之製 法」，其主要特徵係為利用熱分解之細粒微滴金屬鹽之溶593159 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to the method of obtaining a relatively uniform thickness ^ ^ ancient method, which is mainly superior heat transfer and electrical conductivity characteristics. _Yali uses its specific direction. [Previous technology] Silver powder is widely used in the form of conductive heat and electricity when it is connected to two-two products because of its excellent conductivity in electronic packaging and electrode contact characteristics. Stacking is an anisotropic stacking, except for the point connection between the sheets = Yes = 疋 The surface is stacked layer by layer ... The surface contact has a larger flow than the point contact: ΐ Low: It is easier to pass through the surface contact with electricity t to make the heat The resistance and resistance of the Chinese I ra ray have excellent heat transfer and electrical conductivity characteristics, such as Invention Bulletin No. 432085 "thermally conductive paste-like composition" ^ The longitudinal length used is 1 () to 50 microns and the thickness is Flake silver powder from i microns to 5 U meters. Needle, the above-mentioned silver powder production problems can be seen in domestic and foreign patent bulletins or related shell materials, such as the Republic of China Patent Invention Publication No. 1 46827 "New Silver Powder Manufacturing Method", No. 490339 "Preparation Method of Ultra-Fine Silver Palladium Alloy Powder"丨 No. 2333 1 "Method for preparing silver powder with controllable surface area" deals with the method of reducing and precipitating silver powder in chemical solution, No. 26 1 554 "Method for manufacturing silver powder by aerosol decomposition" uses thermal decomposition of silver-containing compounds Unsaturated solution 'and a similar concept is also found in "Method for the Preparation of Metal Powders" No. 458829, whose main feature is the dissolution of finely divided metal droplets using thermal decomposition.

第4頁Page 4

Claims (1)

593159593159 l · 一種片狀銀粉的製作方法，其步驟如下·· a、選擇可被移除的材料當基板； b、在基板鍍上一層銀金屬層； c、移除基板’獲得厚度均一之片狀銀粉。 2 ·如申請專利範圍第1項所述之片狀銀粉的製 ’其中’在b步驟後係另施以下列步驟： 去 bl、粉碎含有銀金屬層之基板。 3 ·如申請專利範圍第1項所述之片狀銀粉的製作方、 ’其中’在c步驟後，係另施以下列步驟： 去 c2、粉碎已移除基板之銀金屬層。 4·如申請專利範圍第1項所述之片狀銀粉的製作方、 ，其中該銀金屬層材質為銀金屬。 去l · A method for making flake silver powder, the steps are as follows: a. Select the material that can be removed as the substrate; b. Plate a silver metal layer on the substrate; c. Remove the substrate 'to obtain a sheet with uniform thickness Silver powder. 2 · Preparation of flake silver powder as described in item 1 of the scope of the patent application ′ wherein ′ is followed by the following steps after step b: Go to bl and pulverize the substrate containing the silver metal layer. 3 · According to the manufacturer of the flake silver powder described in item 1 of the scope of patent application, 'wherein' after step c, the following additional steps are performed: c2, crushing the silver metal layer of the removed substrate. 4. The manufacturer of the flaky silver powder as described in item 1 of the scope of the patent application, wherein the silver metal layer is made of silver metal. go with
TW092120301A 2003-07-25 2003-07-25 Method for producing flake-like silver powder TW593159B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW092120301A TW593159B (en) 2003-07-25 2003-07-25 Method for producing flake-like silver powder
US10/885,687 US20050016328A1 (en) 2003-07-25 2004-07-08 Method of manufacturing silver flake

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092120301A TW593159B (en) 2003-07-25 2003-07-25 Method for producing flake-like silver powder

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TW593159B true TW593159B (en) 2004-06-21

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102974839A (en) * 2012-12-04 2013-03-20 中山大学 Method for preparing nanometer flake silver powder through chemical deposition

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1889676A1 (en) * 2006-08-02 2008-02-20 Università Degli Studi Di Milano - Bicocca Nanostructured metallic silver pre-activated as an antibacterial agent
CN103451692A (en) * 2012-05-31 2013-12-18 际华三五二二装具饰品有限公司 Silver electroplating solution
CN108462019A (en) * 2018-05-04 2018-08-28 北京梦之墨科技有限公司 A kind of conducting connecting part and its manufacturing method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3003975A (en) * 1958-11-26 1961-10-10 Myron A Coler Conductive plastic composition and method of making the same
US3340006A (en) * 1963-05-01 1967-09-05 Corning Glass Works Method of producing thin flakes of metal oxide
US3709439A (en) * 1970-12-02 1973-01-09 Int Nickel Co Production of reflective metal flake pigments
JP4704566B2 (en) * 1998-10-23 2011-06-15 アベリー・デニソン・コーポレイション Method for producing metal flakes
US20040149959A1 (en) * 2003-01-31 2004-08-05 Mikhael Michael G. Conductive flakes manufactured by combined sputtering and vapor deposition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102974839A (en) * 2012-12-04 2013-03-20 中山大学 Method for preparing nanometer flake silver powder through chemical deposition

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