TWD202064S - 固態硬碟儲存裝置 - Google Patents

固態硬碟儲存裝置 Download PDF

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Publication number
TWD202064S
TWD202064S TW108303223F TW108303223F TWD202064S TW D202064 S TWD202064 S TW D202064S TW 108303223 F TW108303223 F TW 108303223F TW 108303223 F TW108303223 F TW 108303223F TW D202064 S TWD202064 S TW D202064S
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TW
Taiwan
Prior art keywords
storage device
design
ssd storage
item
ssd
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TW108303223F
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English (en)
Inventor
全桂辰
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南韓商三星電子股份有限公司
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Application filed by 南韓商三星電子股份有限公司 filed Critical 南韓商三星電子股份有限公司
Publication of TWD202064S publication Critical patent/TWD202064S/zh

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Abstract

【物品用途】;本設計物品是一種固態硬碟（Solid State Drive，簡稱SSD）儲存裝置，其經由使用半導體來儲存資料於其內。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。

Description

固態硬碟儲存裝置
本設計物品是一種固態硬碟（Solid State Drive，簡稱SSD）儲存裝置，其經由使用半導體來儲存資料於其內。
圖式所揭露之虛線部分，為本案不主張設計之部分。
TW108303223F 2018-11-30 2019-05-30 固態硬碟儲存裝置 TWD202064S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR30-2018-0056410 2018-11-30
KR20180056410 2018-11-30

Publications (1)

Publication Number Publication Date
TWD202064S true TWD202064S (zh) 2020-01-11

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ID=72380542

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108303223F TWD202064S (zh) 2018-11-30 2019-05-30 固態硬碟儲存裝置

Country Status (2)

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US (1) USD896229S1 (zh)
TW (1) TWD202064S (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD951937S1 (en) * 2018-12-06 2022-05-17 Samsung Electronics Co., Ltd. Solid state drive storage device
JP1652895S (zh) 2019-01-17 2020-02-17
JP1661340S (zh) * 2019-05-22 2020-06-08
EP3923687B1 (en) 2020-06-09 2024-04-03 Samsung Electronics Co., Ltd. Memory device and electronic device including the same
TWD213297S (zh) * 2020-07-09 2021-08-11 南韓商三星電子股份有限公司 固態硬碟儲存裝置
USD988318S1 (en) * 2020-09-10 2023-06-06 Samsung Electronics Co., Ltd. Solid state drive memory device
USD1072812S1 (en) * 2021-08-27 2025-04-29 Samsung Electronics Co., Ltd. Solid state drive memory device
USD1072828S1 (en) * 2021-08-27 2025-04-29 Samsung Electronics Co., Ltd. Solid state drive memory device
USD1075779S1 (en) * 2021-08-27 2025-05-20 Samsung Electronics Co., Ltd. Solid state drive memory device
USD1072829S1 (en) * 2022-01-10 2025-04-29 Samsung Electronics Co., Ltd. Solid state drive memory device
TWD230983S (zh) * 2023-09-11 2024-04-21 四零四科技股份有限公司 新北市新莊區新北大道四段三號十三樓 (中華民國) 通訊介面轉換器之部分
TWD231132S (zh) * 2023-09-11 2024-05-01 四零四科技股份有限公司 新北市新莊區新北大道四段三號十三樓 (中華民國) 通訊介面轉換器之部分
JP1794589S (ja) * 2024-07-09 2025-03-28 ソリッドステートドライブ記憶装置
JP1794588S (ja) * 2024-07-09 2025-03-28 ソリッドステートドライブ記憶装置

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US20080101036A1 (en) * 2006-10-26 2008-05-01 Chiung Yi Chen Heat-dissipating assembly structure
USD657756S1 (en) * 2011-10-17 2012-04-17 Corsair Memory, Inc. Low profile heat spreader for a computer memory module
USD698792S1 (en) * 2012-01-05 2014-02-04 Kingston Digital, Inc. Memory module
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USD689829S1 (en) * 2013-01-02 2013-09-17 Comptake Technology Inc. Heat dissipating module of memory
USD714789S1 (en) * 2013-02-04 2014-10-07 Comptake Technology Inc. Housing of solid state drive
TWM467916U (zh) * 2013-06-17 2013-12-11 哲亮科技有限公司 多重散熱組件結構
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USD793400S1 (en) * 2016-05-09 2017-08-01 Kingston Digital, Inc. Heat sink for memory module
USD862402S1 (en) * 2017-12-18 2019-10-08 Kingston Digital, Inc. Memory heat dissipation sink
USD842304S1 (en) * 2017-12-21 2019-03-05 Corsair Memory, Inc. Memory module

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USD896229S1 (en) 2020-09-15

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