TWD240928S - 基板處理裝置用溫度測定具之部分 - Google Patents

基板處理裝置用溫度測定具之部分

Info

Publication number
TWD240928S
TWD240928S TW112306501F TW112306501F TWD240928S TW D240928 S TWD240928 S TW D240928S TW 112306501 F TW112306501 F TW 112306501F TW 112306501 F TW112306501 F TW 112306501F TW D240928 S TWD240928 S TW D240928S
Authority
TW
Taiwan
Prior art keywords
design
substrate processing
temperature measuring
processing equipment
measuring tool
Prior art date
Application number
TW112306501F
Other languages
English (en)
Chinese (zh)
Inventor
中田高行
Original Assignee
日商國際電氣股份有限公司 (日本)
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 (日本), 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司 (日本)
Publication of TWD240928S publication Critical patent/TWD240928S/zh

Links

TW112306501F 2023-06-19 2023-12-12 基板處理裝置用溫度測定具之部分 TWD240928S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-012485 2023-01-31
JP2023012485F JP1760962S (fr) 2023-06-19 2023-06-19

Publications (1)

Publication Number Publication Date
TWD240928S true TWD240928S (zh) 2025-10-11

Family

ID=89452079

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112306501F TWD240928S (zh) 2023-06-19 2023-12-12 基板處理裝置用溫度測定具之部分

Country Status (3)

Country Link
US (1) USD1140755S1 (fr)
JP (1) JP1760962S (fr)
TW (1) TWD240928S (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD174922S (zh) 2015-02-25 2016-04-11 日立國際電氣股份有限公司 熱電偶用保護管之部分
TWD182149S (zh) 2016-02-10 2017-04-01 日立國際電氣股份有限公司 基板處理裝置之溫度測定器之部分

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KR100462013B1 (ko) * 1997-08-13 2005-06-02 삼성전자주식회사 독립수신이가능한팩스모뎀및그제어방법
USD520854S1 (en) * 2004-10-28 2006-05-16 International Rv Products Company Extendable awning wand for engaging and deploying a retractable awning on a home or motor home
USD564462S1 (en) * 2005-12-27 2008-03-18 Tokyo Electron Limited RF electrode for a process tube of semiconductor manufacturing apparatus
US7780210B1 (en) * 2006-03-02 2010-08-24 Boyum Paul H Pickup box retrieval implement
USD560126S1 (en) * 2006-06-22 2008-01-22 Watlow Electric Manufacturing Company Dual temperature sensor assembly
USD560518S1 (en) * 2006-06-22 2008-01-29 Watlow Electric Manufacturing Company Uni-probe temperature sensor assembly
CA128723S (en) * 2008-06-11 2010-01-20 Magisso Oy Hook for a sink
USD656373S1 (en) * 2010-10-18 2012-03-27 David Martin Extendable pole
DE202012003186U1 (de) * 2012-03-29 2012-04-30 Türk & Hillinger GmbH Eintauch-Temperatursensor
JP6493722B2 (ja) * 2014-07-03 2019-04-03 清水建設株式会社 ３次元図形生成システム及び３次元図形生成方法
JP1534939S (fr) * 2015-02-25 2015-10-13
JP1577927S (fr) 2016-07-14 2017-06-05
USD822824S1 (en) * 2016-10-26 2018-07-10 Vyaire Medical Capital Llc Sensor port
USD811193S1 (en) * 2017-01-03 2018-02-27 Spectrum Brands, Inc. Handle
USD882437S1 (en) * 2017-10-16 2020-04-28 Caterpillar Inc. Gauge needle
USD871864S1 (en) * 2018-07-13 2020-01-07 Hewlett-Packard Development Company, L. P. Arm extension tool
USD937104S1 (en) * 2019-07-25 2021-11-30 Chunhua Lei Probe for food thermometer
JP1689064S (ja) * 2020-08-31 2021-07-05 温度センサ
JP1692912S (ja) * 2020-09-15 2021-08-16 温度センサ
JP7638792B2 (ja) * 2021-06-02 2025-03-04 東京エレクトロン株式会社 半導体製造装置及び温度制御方法
CN117836914A (zh) * 2021-09-28 2024-04-05 株式会社国际电气 支撑件、基板处理装置以及半导体装置的制造方法
USD1031467S1 (en) * 2022-03-18 2024-06-18 Therm-O-Disc, Incorporated Dual probe sensor
USD1096359S1 (en) * 2023-09-28 2025-10-07 Xingsanxing Cloud Technology Co., Ltd. Handle

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD174922S (zh) 2015-02-25 2016-04-11 日立國際電氣股份有限公司 熱電偶用保護管之部分
TWD182149S (zh) 2016-02-10 2017-04-01 日立國際電氣股份有限公司 基板處理裝置之溫度測定器之部分

Also Published As

Publication number Publication date
USD1140755S1 (en) 2026-08-11
JP1760962S (fr) 2024-01-10

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