TWI220103B - Fastener of heat sink table - Google Patents

Abstract

The present invention is a fastener of heat sink table, which includes: a frame having at least two side panels, in which each opposite side of the two panels has a protrusion; at least a crossing portion crossed on the frame; and, an elastic top-against structure configured at the crossing portion, and the elastic top-against structure can be retractable in the direction vertical to the plane with the frame located thereon; wherein, when the fastener is fastened with the edge of a chip by the protrusion to fix the heat sink table on the chip, the elastic top-against structure can be against the heat sink table with the elasticity, and further closely combine the heat sink table with the chip.

Description

I22〇i〇3 V. Description of the invention α) The technical field to which the invention belongs This case is a kind of fastener for a heat sink ', especially a fastener for a heat sink of an integrated circuit chip. Prior technology Since 1959, when Jack Kilby of Texas Instruments invented integrated circuits, semiconductor process technology has progressed thousands of miles. In 1965, Mr. Moore, who served at Express Semiconductor Corporation, boldly proposed the "Moore's Law" that affected the semiconductor industry and made semiconductor technology advance by leaps and bounds as he had speculated. Therefore, in the past 10 years, Cheng Technology has progressed from the minimum line width of 0.7mm in 1989, the number of transistors around ικκ & to the line width of 13 in 2000 and the number of transistors of 5M; After two = one century, it has reached 0.1mm line width and the number of transistors is 10M in nanometer (nm) era.退 八 1 系 # Ξ: ^ The relative miniaturization of electronic products is accompanied by the impact on components and ::. Because in the original crystal: the area does not increase much or even less. The sunday knife edge 1 needs to accommodate more electric bodies in the day, day, and month, so that it is known that in such a limited space the end of the day and the generation of the sun and the sun. The increase in volume and other issues has greatly challenged engineers in the field of Yanzhiguan. Can ...: The more the functions become more complete, the more heat dissipation problems will occur in various chipsets for each chip and the month f;; the more chips there are, the more obstacles must be considered during operation. 1220103 V. Description of the invention (2) The solution to the problem T is to design the heat sink through the omnipotent: 1. First, various heat sinks to avoid temperature rise. The so-called heat-dissipating equipment = 'Generally through fans (fans), aluminum (αι) with high thermal conductivity, copper weight, and solid, by closely adhering the south thermal conductivity metal material to the hair body surface layer, the heat generating body Heat is transferred to the gold: tail and end table! ; ϊίBlowing, through the convection method, to maintain the heating body running under a certain Industrial Fox X, is the design concept of the basic cooling module. This work =: with the water tank system in the car, the cooling system of the home air conditioner, and the computer to overclock, you must replace the idea of an oversized fan, consistent. However, the difference in material application is that the heat radiation in the computer is generally designed to maintain the appropriateness of convection and conduction in a small space. In order to make the heat sink made of a metal material with high thermal conductivity closely adhere to the heat sink, a heat sink is usually used with the heat sink and the crystal one. A side view of a conventional fastener of a heat sink is shown in the figure: (:); # 中 '扣 Men are composed of the frame 10, the side plate " There are a plurality of holes U, and the inner side of the side plate 11 also has a convex piece 丨 4. 2 As shown in the first figure (b), the fastener 丨 is fixed by a plurality of heat radiating fins 120 included in the clip 12 and the heat sink 15 to the correct position, and then the protrusion on the side plate 11 is used The bottom surface of the side heat sink 15 that holds the wafer 16 can be attached to the surface of the wafer 16 to achieve the purpose of excluding the thermal energy generated by the wafer 16. However, this type of fastener has many disadvantages.

Page 6 1220103 V. Description of the invention (3) The salvation is as follows: (1) The overall disassembly is not easy ί: = Figure = shows that the heat sink 2 is used because the fastener 2 is used. After being fixed to the chip 1 and the heat sink at 2 °, the two parts of the fastener 2 are offset by 90 ° such as /, ^ A,, 1U, and the convex parts on the inside of the side plate 22 (not shown in the figure). (Shown) Hold the edge of the chip 21 in turn, _ τ on the helmet, and ttw of the mouth. And the tomb made into a yttrium structure as shown in the second figure (b). At the time of disassembly, the fastener 2 is attached to the heat sink 20 and the chip 21 only. Strength), U this morning, it ’s not easy to remove the buckle by hand. The 仵 2 is hurriedly disassembled. Generally, it is based on π, n9Q > 4 π. After the holes 2 3, they are disassembled with the square # Γ ΛΑ 72, 1 gas pushed outward (that is, the direction opposite to that during assembly), and the disassembly procedure is more troublesome. (2) Poor material selection 'A few of the fasteners in the conventional technology are part of the handle | The τ knife 4 is made of metal material', which is prone to electrical conduction when buckled with the chip. (3) Insufficient compressive stress. Due to the fastener 2 in the second figure (b), the heat sink 20 and the chip 21 are fixed together by their own material stress and convex force. The manufacturing process of the fastener 2 is inaccurate. It is easy to cause insufficient stress when applying pressure, which affects the degree of bonding of the wafer 21 of the loose seat 201. ^ ^ (4) Uneven pressure distribution. Due to the fastener 2 in the second figure (b), the heat sink 20 and the chip 21 are fixed together by the material stress and the strength of the convex component. The fastener 2 itself is worn through. 〗 The error in the process is likely to cause half of the stress distribution of taxis and sweets when pressure is applied. Wide p τ Θ, especially early

Page 7 1220103 V. Description of the Invention (4) ^. The shape of the edge of the edge of the side is the most likely to affect the bonding of the heat sink 20 and the chip ^ (5) The manufacturing cost is relatively high. The fastener of the operation is for the loose # seat and the chip + the same thick sound clip = later. Production, in other words, the heat sink and the same: The design must be changed. It is a waste of manufacturing and hinders the research and development of the manufacturer. In order to improve the problems of (3) and ((uneven distribution), the conventional technology appears; Insufficient and pressure (") card will be used to improve the technology of the second kind of buckle V, the other two f ^ by designing the clip 24 in the frame 25 two opposite ^ kg display = Fuguo heat sink on the chip The pressure release at the time is relatively average. At both ends of the clip 24, a longer piece 241 is made at each end. Moreover, the tolerance value of the stress that can be absorbed by the body (T〇leranc = buckle, increase the heat sink and the The degree of fit when the chips are bonded is large, and the fasteners (.) Are still practical for users to feel = there is room for improvement on the level of uniform pressure distribution in the second and second pictures, and the stress may be completely resolved As mentioned above, the fasteners of the conventional technology are expected to obtain a pioneering design of the heat sink. 〃The reason for all the problems is that the inventor, in view of the lack of know-how inventing the idea, continued to carry out meticulous experiments and research, and devoted himself to improving God, and finally invented the case "The heat sink seat fastener 7 perseverance. The following is a brief description of this case: 1220103 V. Description of the invention (5) Summary of the invention-the design of the main body of t!-A kind of fastener of the heat sink, which uses = same production ΓΓ! The heat sink needs to be designed + the situation of cost waste caused by j fasteners. According to the idea of this case, a board with a plate, each-the two side pairs = with and-the-frame, 'crossing the frame-the- —The center of the frame edge is adjacent to: and an elastic abutment structure, which is arranged at the span dr perpendicular to the plane where the frame is located. The elastic abutment structure includes:-the abutment body 'has two abutment tops; 卩And a bullet, ί; in: ΓΓ page body 'and will produce-elastic force, so that the abutment body can be expanded and contracted within a length range between 5 abutment; among them, each "the convex part buckle The edge of a chip is used to fix the heat sink. It is necessary that the top end bears against the loose seat, and: = the heat sink is closely attached to the chip., And then shaped. According to the above-mentioned concept, the frame and the bridging unit are integrated into a plastic housing. Wherein, the frame and the bridging part are made of materials according to the above-mentioned concept, wherein at least one of the two side plates has a hole at the joint. Plate /, the frame 1220103

According to this case, a frame has a center with a convex frame edge on one side and a flat convex member provided on the cross frame to buckle a crystal of the elastic abutment knot and let the heat sink be constructed according to the above-mentioned model. The phase has at least two pieces; at least _ the center of the edge of the frame and the edge of the upper piece in the direction of the face, can be tightly conceived through the wafer, in which the center of the side plate and the bridging portion is stretchable to fix A close-fitting fastener for a heat sink of the frame, the side of the female body ^ one side plate facing each other is connected to one of the frame; and an elastic abutment structure, the abutment structure can be perpendicular to the frame ; Where 'when the fastener is on the chip through the heat sink, an elastic force abuts the heat sink, and the bridge and the crossover are integrated into one. According to the above concept,' the frame and the The bridging part is made of plastic. According to the above-mentioned concept, in the two side plates, at least one side plate has a hole at the connection point with the frame. According to the above concept, the elastic abutment structure includes: an abutment body having two abutment tops; and a spring, which is sleeved on the abutment body, and the elastic force is generated so that the abutment body can be in the two The length between the abutting ends is expanded and contracted to achieve the purpose of making the heat sink and the chip closely fit. According to a further idea of the present case, a fastener for a heat sink is provided, which includes: a frame having at least two side plates, each of the two side plates having a convex piece on one side opposite to each other; at least one bridging portion that bridges over the On the frame; and an elastic abutment structure, which is disposed on the bridging portion, and the elastic abutment structure can be

1220103

In the direction perpendicular to a plane where the frame is located, the fastener is used to fasten the edge of a chip by the protrusion, two; ^ 'when on the chip', the elastic abutment structure can be seated on the heat sink through 'Further, the heat sink and the chip are closely attached to the type. According to the above-mentioned concept, wherein the frame and the; connection; are integrated into one, according to the above-mentioned concept, it is plastic. Wherein, the frame and the bridging part are made of at least one side plate and the frame. According to the above-mentioned concept, a connection portion of the middle frame of the two side plates has a hole. According to the above-mentioned concept, the bridging portion bridges the center of one frame edge and the center of a second edge of the frame. According to the above idea, the elasticity abuts the center of the top. M. The mouth structure is placed on the bridge, as described above, "" wherein the elastic abutment structure includes: _ ί 钿; and a spring, which is sleeved on the abutment body and generates the elastic force to make the abutment. The body can be expanded and contracted within the two-degree and two-degree dry enclosures to achieve the purpose of making the heat sink and the chip closely fit together. This case can be further explained with the following drawings and detailed description: < Implementation

1220103 V. Description of the invention (8) Please refer to the third figure (a), which is a structural diagram of a preferred embodiment of the fastener of the heat sink described in the present application. The fastener 3 is composed of a frame 30 and a bridge 3 丨And a resilient abutment structure 32; the frame 30 has two side plates 33, each side plate 33 has a convex piece 33 on one side opposite to each other, and the bridging portion 31 is bridged over the frame 30 The center of the first frame side 301 and the center of the second frame side 302 of the 'other' elastic abutment structure 32 are composed of an abutment body 32o and a spring 321 sleeved on the abutment body 3 20, The elastic abutment structure 32 is disposed at the center of the bridging portion 31 in a manner perpendicular to the plane where the frame 30 is located.

The two ends of the middle abutment body 3 20 each have an abutment top 322 for elastically abutting the structure 32. When installed in the ring 303, the abutment body 32 can perform a telescopic movement within a length range between the two abutment ends 322 according to the elastic force of the spring 321. Using the above principle, when the heat sink 34 is fixed on the chip 35 by using the fastener 3 as shown in the third figure (a), the installation method is to first mount the fastener 3 on the heat sink 34 (The bridging portion 31 can be used to be clamped between the plurality of heat dissipation fins 341 of the loose seat 34), and then the combination of the fastener 3 and the heat sink 34 is inclined to one side, and the frame 30 side The convex part 33〇

After the edge of the chip 35, the other side of the combination of the fastener 3 and the heat sink 34 is pressed down, so that the convex piece 33 on the other side of the frame 30 is also buckled against the edge of the chip to achieve the fixed heat sink 34. For the purpose of the wafer 35, the completed diagram is shown in the second diagram (b). ° The special fastener design in this case has the following advantages compared with the conventional technology

Page 12 1220103 V. Description of the invention (9) Π) Disassembly is easy, as shown in the second figure (a), the method of deduction is as follows: --- shaped screw ^ screwdriver $ disassembly can be passed as follows: Bu push The method of removing the fastener 3 outside the hole / weight 30 is 4: 2 and then the direction is important. Because the case is elastic, it is important to rely on the material stress of the frame 3; Instead of being thinner, as shown in the third figure (a), wood 30 can be widely inquired at the time of production, so the frame structure; 0:;: == two daggers) is small and small enough for use The person can use two fingers to force; the action of pressing 330 to push outward can be used to complete the convex tool. 7 仟 ^, the heat release seat 34 is separated without the need to make (2) the material safe as shown in the second figure (3). Fastening 9 ιτ / ν々 All other parts can be divided by plastic; 32-^ It disturbs the material department to work in one piece, (= on / sheet 35, it is impossible to conduct electricity. (3) the pressure is sufficient ~ because this case uses an elastic structure as the source of pressure stress, The tolerance tolerance (Tolerance) that the fastener can absorb will be relatively large, because the I-Fixed heat sink and the wafer will be better, no matter whether it is moved or shaken, don't worry about displacement, separation or falling. (4) The average stress ^ As shown in the third figure (a) of the fastener structure 3, the elastic abutment structure 32 is installed in the center of the frame 3, so the stress will be comprehensive when the pressure is applied The ground is evenly distributed around the wafer 35, and there is no single point or single page 1220103 in the conventional technology. V. Description of the invention (ίο) 2 The pressure is applied to ensure the close contact of the heat sink 34 and the wafer 35. The pressure of Zongyu 321 is a linear way that conforms to Hooke's law. The increase of force is relatively gentle and less vulnerable. (5) The cost is low, because the wooden frame uses an elastic structure as the pressure stress to face it: the thickness of the heat sink can have a large degree of adaptability, and in comparison, there is no heat sink Thickness-once changed, it will take 30 to produce fasteners that are not in size, which has a significant effect on saving production costs. In summary, the small changes in the structure of the fastener used to fix the heat sink described in this case. It solves the long-term problem of the fasteners of the heat sink. It has practicality, novelty, and progress. The wood is made by a person who is familiar with the technology and uses it as a craftsman. Those who want to protect the scope of the patent. Degree; the source is connected at the pressure point, so the technology to reset the company's components is only modified with the nature of the past,

Page 14 1220103 Brief description of the drawings Brief description of the drawings The first diagram (a): a side view of a conventional fastener of a heat sink; the first diagram (b): the fastener fixes the heat sink of the first diagram (a) The second diagram (a) ~ (b): the schematic diagram of the fastener fixing the heat sink in the first diagram (a); the second diagram (c): the side view of the fastener of another conventional heat sink; Three figures (a): a structural diagram of a preferred embodiment of the fastener of the heat sink in this case; and

The third figure (b): the side view of the fastener holding the heat sink in the third figure (a). Description of Symbols 2 ~ 3 Fasteners 10, 25, 30 Frame 11, 22, 33 Side plate

12, 24 clips 1 3 holes 14, 241, 33 0 convex parts 120 heat sink fins 15, 20, 34 heat sink 1 6, 2 1, 3 5 chip 3 1 jumper

Page 15 1220103 Brief description of the drawing 32 Elastic abutment structure 3 0 1 First frame edge 3 0 2 Second frame edge 304 Hole 320 Abutment body 321 Spring 3 2 2 Abutment 341 Heat dissipation fin

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Claims (1)

6. Scope of patent application1. A frame of a heat sink with a convex and a bridging fastener on one side, including: having at least one piece; a plate, each of the two side plates facing each other and crossing one of the frames. And a top structure, which is disposed on the bridging plane, 'the elastic abutment knot = body with two abutting top steam' is sleeved on the abutting body, and the fastener at the top of the two abutting can be passed through the convex piece; When the wafer is fastened, the heat sink and the fastener described in item 1 of the crystal range are formed by the spring. The fasteners described in item 1 of the scope are made of plastic. The fastener described in the first item of the scope, wherein the frame has a fastener at the connection portion, including: having at least two side plates, each piece; at least one bridging portion, spanning the center of the frame edge of the frame, an elasticity Abutting on the frame where the frame is located makes the abutment shrink. Among them, it is determined that the heat sink seat is located on the heat sink seat. 2 · If the patent application joint unit is integrated 3 · If the patent application joint unit is made of material 4 · If a patent is applied for at least the side plate and 5 ·-a kind of heat sink and a frame, the side has a center of a convex and a frame side and a center of a first part, and is perpendicular to the structure including:; and the body 'and the length of a spring The edge of a wafer is stretched within the range, and the abutting tip and the abutting sheet are tightly attached with a solid force. Wherein the frame and the span, the frame and the span, and the two side plates, holes. The two side plates are opposite each other—the center of the first frame edge and Page 17 122U103 6. Application for patent application 丨 One of the frame's one edge of the elastic abutment structure can hang in it, when the buckle heat sink on the crystal elastic force against the loose 6 · If the patent application connection system is integrated 7 · If the patent application is connected The material of the part 8. If the patent is applied for at least one side plate and 9. The structure for the patent application includes: the center of the part, which is stretched in the direction of the elastic face; the edge of the sheet to fix the structure can pass through one of the The wafer is closely attached. , Wherein the frame and the span ′ wherein the frame and the span ′ have holes in the two side plates. Where the elasticity is against the knot The center; and the top structure 'is disposed on a flat piece that crosses directly to the frame when the projection is fastened to a chip, the elasticity abuts the top knot, and the seat' further allows the heat sink seat to be described in item 5 The fastener is formed. The fasteners described in item 5 of the scope are plastic. The fastener described in the item 5 of the scope has a fastener t body as described in the item 5 of the scope, which has two abutting ends; and ~-is set on the abutting body, i will produce The elastic force can make the soldiers and soldiers expand and contract within a length range between the two top ends, so as to achieve the purpose of making the heat sink and the wafer closely fit. 10 · A fastener for a heat sink, comprising: a busy operation having at least one side plate, each of the two side plates having a convex piece on one side opposite to each other; at least one bridging portion, straddling the frame; and an elasticity The abutment structure is disposed on the bridging portion, and the elastic abutment structure can expand and contract in a direction perpendicular to a plane on which the frame is located; A220103 6. In the scope of patent application f, when the fastener fastens the edge of a wafer by the convex member, the month. When the heat seat is on the wafer, the elastic abutment structure can abut the heat sink by two elastic forces, so that the heat sink and the wafer are closely attached. η • The fastener according to item 10 of the scope of patent application, wherein the frame and the bridge are integrally formed. / 、 ^ Wherein the frame and the two side plates 12 · The material for making the bridge part of the fastener as described in item 10 of the scope of patent application is plastic. 13. According to the fastener described in item 10 of the scope of application, at least one side plate has a hole at the connection point with the frame. 14. The fastener according to item 10 of the scope of patent application, wherein the bridging portion is bridged between the center of a first frame edge and the center of a second frame edge of the frame. 15. The fastener according to item 10 of the scope of patent application, wherein the elastic abutment structure is disposed at the center of the bridge portion. 16. The fastener according to item 10 of the scope of patent application, wherein the elastic abutment structure includes: an abutment body with two abutment tops; and a spring, which is sleeved on the abutment body and will The elastic force is generated so that the abutment body can be extended and contracted within a length range between the two abutment top ends, so as to achieve the purpose of making the heat sink and the chip closely fit. Page 19