TWI233377B - Continuous coating apparatus - Google Patents
Continuous coating apparatus Download PDFInfo
- Publication number
- TWI233377B TWI233377B TW092108367A TW92108367A TWI233377B TW I233377 B TWI233377 B TW I233377B TW 092108367 A TW092108367 A TW 092108367A TW 92108367 A TW92108367 A TW 92108367A TW I233377 B TWI233377 B TW I233377B
- Authority
- TW
- Taiwan
- Prior art keywords
- sealing member
- processing chamber
- wall
- straight
- adjacent
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Gasket Seals (AREA)
- Chemical Vapour Deposition (AREA)
Description
1233377 玖、發明說明 ........ (發明說明應敘明··發明所屬之技術領域、先前技術、內容、實施方式及圖式簡單說明) 發明所屬之技術頜域 本發明涉及一種直通式塗層設備,其多個各別之處理 室須依序配置,使其中一處理室之具有出入口之壁鄰接於 相鄰之處理室之同樣具有一出入口之壁且該二個出入口藉 由一配置在該二壁之間之密封件而向外密封著。
先前技術
此種直通式塗層設備例如是一種濺鍍設備且過去通常 是用來在基板上產生多個層封包。目前該設備具有超過30 個相鄰配置之處理室且總長超過1 0 0米。各處理室之正側 之各壁中之各出入口用來使基板由一處理室被輸送至另一 處理室。爲了使各處理室相對於大氣壓力而被密封,則目 前在各別處理室之各壁之間須分別配置一圍繞該出入口之 密封件,以便在各處理室之各壁連接之後形成一完整之真 空密封式整体設備。 在上述之直通式塗層設備中缺點是:爲了在相鄰之處 理室之各壁之間更換各別之密封件,則需較大之耗費。例 如,若在此種設備之中央區中有一密封件未密封,則所有 連接於前面之處理室須由一側來拆除,以便可到達該有缺 陷之密封件。這在大的設備中會造成數星期之生產停頓, 此種密封件之未密封狀態因此會使經濟上蒙受重大損失。 發明內容 1233377 本發明之目的是提供一種上述形式之直通式塗層設備 ,使配置在各別處理室之間之密封件可儘可能快速且簡易 地被更換。 本發明中上述目的以下述方式達成:各出入口之一是 設置在密封部件中,該密封部件由相同側分別以第一支撐 面支撐在一處理室之壁上且以第二支撐面相對於相鄰處理 室之壁而支撐著,且在該二個支撐面和其支撐所用之壁之 間分別設有一環形之密封件,其緊靠各別之支撐面和壁。 上述之各密封部件可在其所密封之處理室未被隔開之 情況下被拆除,這是因爲其並非配置在各處理室之間而是 配置在處理室內部,因此在解開該固定各密封部件所用之 固定件之後各密封部件可由各別之壁而移動至該處理室之 內部方向中。各密封部件因此可由各別之處理室中移除而 更換各別之密封件。 若密封部件以環形板構成且其中一支撐面由密封部件 之正側所形成以及另一支撐面由密封部件之步級所形成時 ,則此種形式之密封部件特別簡單。 在本發明之另一形式中,若該密封部件在其二個支撐 面之每一面中分別具有0 -環之環形槽作爲密封件,則各密 封件可方便地在處理室外部進行拆解或安裝。各密封件因 此不需安裝在各處理室之壁中。反之,容易操控之各密封 部件可設有密封件。 若該密封部件以其由步級所形成之支撐面緊靠在一承 載面上,則該密封部件可齊平地配置在其所處之處理室之 1233377 若該密封部件由不銹鋼所構成,則整体設備可由成本 低之材料(例如,結構鋼)所製成。因此只須在良好之表面 特性持續地出現之處使用昂貴之材料即可。 本發明可有多種不同之實施形式。本發明以下將依據 圖式來描述。
第1圖顯示一種直通式塗層設備中二個處理室1,2之 二個相鄰之區域,其分別以壁3,4來相連。出入口 5由處 理室1連通至壁4中之出入口 6,使處理室丨,2可藉由出 入口 5,6而互相連接。各出入口 5,6可使未顯示之基板 由其中一處理室1或2輸送至另一處理室2或1。
爲了使二個壁3 ’ 4之間不會形成一種由二個處理室1 或2至大氣之連接,則處理室1中須設有一環形之密封部 件7。由於該步級8,則該密封部件7須具有二個指向同側 之支撐面9,10,其分別具有一槽11,12,槽中存在一以 0 -環構成之密封件1 3,1 4。壁3在密封部件7之區域中具 有一凹口 1 5而形成一承載面1 5。該密封部件7以其支撐 面9而緊靠該壁3之承載面16且同時以其支撐面10而緊 靠該壁4。該密封部件7在該位置中由螺栓1 7所固定,各 螺栓1 7分別經由壁4之鑽孔1 8且栓入壁3之螺紋孔1 9中 。密封件1 4因此位於鑽孔1 8及螺紋孔1 9之外部,使該處 理室2之大氣不會經由鑽孔1 8及各壁3,4之間之區域而 向外形成一種連接。該密封件1 3可防止該處理室1從旁向 外連接至密封環7之外側上,密封件1 4則除了經由鑽孔1 8 1233377 之連接之外可防止一經由出入口 5,6之向外至大氣之連接 〇 第1圖又顯示一活門閥2 0,其在劃線條之位置中藉由 一閉鎖元件21來封閉該出入口 5。該閉鎖元件21以一密 封環22而緊靠該密封部件7之平坦之密封面23。 圖式簡單說明 第1圖本發明中該直通式塗層設備之主要區域之切面 圖。
Claims (1)
- ¢2^3377 . 1合、'申請專利範圍 第92 1 08 3 6 7號「直通式塗層設備」專利案 (9 2年1 2月修正) 1. 一種直通式塗層設備,其具有多個分開之處理室(1,2 ) 各處理室須依序配置使其中一處理室U)之具有出入口(5) 之壁(3)鄰接於相鄰之處理室(2)之同樣具有一出入口(6) 之壁(4)且該二個出入口(5,6)藉由一配置在該二壁(3, 4 )之間之密封件而向外密封著,其特徵爲:該出入口( 5 ) 設在一密封部件(7 )中,該密封部件(7 )由相同側以第一 支撐面(9)而支撐在其中一處理室(1)之壁(3)上且同時以 第二支撐面(10)而支撐在相鄰之處理室(2)之壁(4)上’ 在該二個支撐面(9,10)及支撐其之各壁(3,4)之間分別 設有一緊靠各支撐面(9,1 0 )及各壁(3,4 )之環形密封件 (13, 14)° 缉 2.如申請專利範圍第1項之直通式塗層設備,其中該密封 、·:f 部件(7)以環形板構成且其中一支撐面(1〇)由該密封部件 % ( 7 )之正側所構成且另一支撐面(9 )由該密封部件(7 )之步 i 級(8 )所形成。 修3.如申請專利範圍第1或2項之直通式塗層設備,其中該 正 ¥ 密封部件(7 )在其二個支撐面(9,1 0 )之每一支撐面中分 否 ^ 別具有一環形槽(1 1 ’ 1 2 )’其以〇 -環作爲密封件(1 3,1 4 ) 更 Μ 。 w 4.如申請專利範圍第1或2項之直通式塗層設備,其中該 工裙謂操貝 y ·· "*-**- m (7 )以其由步級(8 )所形成之支撐面(9 )而緊靠在 承載面(1 6 )上,該承載面(1 6 )由凹口( 1 5 )而形成在容納 該密封部件(7 )所用之處理室之壁(3 )中。 5.如申請專利範圍第1項之直通式塗層設備’其中該密封 部件(7)藉由螺栓(17)而固定在壁(3,4)上且與具有該密 封部件(7 )之處理室(1 )相鄰接之該處理室(2 )之壁(4 )中 之這些螺栓(17)由另一處理室(1)之由一密封件(14)(其 緊靠相鄰之處理室)所圍繞之區域內部導引至該密封部件 (7)之螺紋孔(19)中。6.如申請專利範圍第1或5項之直通式塗層設備,其中該 密封部件(7 )與各螺栓(1 7 )(其由相鄰之處理室(2 )向內連 通至該密封部件(7 )中)一起形成該二個相鄰之處理室(1 ,2 )所用之連接件。7. 如申請專利範圍第1項之直通式塗層設備,其中該密封 部件(7 )在其所在之處理室(1 )中是一圍繞該出入口( 5 )所 用之密封面(2 3 )以用於一配置在該處理室(1 )中之活門閥 (2 0 )(其用來使該出入口( 5 )封閉)之閉鎖元件(2 1 )中。 8. 如申請專利範圍第 7項之直通式塗層設備,其中該密封 部件(7 )由不銹鋼構成。 ~2 -
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10247002A DE10247002B3 (de) | 2002-10-09 | 2002-10-09 | Durchlauf-Beschichtungsanlage |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200408460A TW200408460A (en) | 2004-06-01 |
| TWI233377B true TWI233377B (en) | 2005-06-01 |
Family
ID=30775602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092108367A TWI233377B (en) | 2002-10-09 | 2003-04-11 | Continuous coating apparatus |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6949173B2 (zh) |
| EP (1) | EP1407828A3 (zh) |
| JP (1) | JP4141311B2 (zh) |
| KR (1) | KR100725109B1 (zh) |
| CN (1) | CN1286576C (zh) |
| DE (1) | DE10247002B3 (zh) |
| TW (1) | TWI233377B (zh) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19817257A1 (de) * | 1998-04-19 | 1999-12-09 | Grace Gmbh | Granulatzusammensetzung aus Antiblockingmitteln und Additiven für Polymerherstellung |
| DE102006059848A1 (de) * | 2006-12-15 | 2008-06-19 | Von Ardenne Anlagentechnik Gmbh | Konfigurationshilfselement für eine Prozessanlage und Prozessanlage |
| US8270075B2 (en) | 2008-05-08 | 2012-09-18 | Musion Ip Limited | Projection apparatuses and associated methods |
| GB0910117D0 (en) | 2008-07-14 | 2009-07-29 | Holicom Film Ltd | Method and system for filming |
| GB0821996D0 (en) | 2008-12-02 | 2009-01-07 | Musion Ip Ltd | Mobile studio |
| US9563115B2 (en) | 2008-12-24 | 2017-02-07 | Musion Ip Limited | Method of manufacturing foil for producing a pepper's ghost illusion |
| GB0918115D0 (en) | 2009-10-16 | 2009-12-02 | Musion Ip Ltd | A method of manufacturing foil for producing a pepper's ghost illusion |
| US20100283240A1 (en) * | 2009-05-05 | 2010-11-11 | Applied Materials, Inc. | Externally replaceable vacuum chamber to chamber flange seal |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6103055A (en) * | 1986-04-18 | 2000-08-15 | Applied Materials, Inc. | System for processing substrates |
| US5110249A (en) * | 1986-10-23 | 1992-05-05 | Innotec Group, Inc. | Transport system for inline vacuum processing |
| US4795299A (en) * | 1987-04-15 | 1989-01-03 | Genus, Inc. | Dial deposition and processing apparatus |
| DE69108079T2 (de) * | 1990-03-30 | 1995-11-02 | Sony Corp | Sputteranlage. |
| DE4203473A1 (de) * | 1992-02-07 | 1993-08-12 | Leybold Ag | Drehschleuse zum ein- und/oder ausbringen eines substrats aus der einen in eine benachbarte behandlungskammer |
| DE19857201A1 (de) * | 1998-12-11 | 2000-06-15 | Leybold Systems Gmbh | Schleusenventil |
| KR200253342Y1 (ko) * | 2001-07-30 | 2001-12-01 | 심재필 | 버터플라이 밸브 |
-
2002
- 2002-10-09 DE DE10247002A patent/DE10247002B3/de not_active Expired - Fee Related
-
2003
- 2003-04-09 EP EP03008221A patent/EP1407828A3/de not_active Withdrawn
- 2003-04-11 TW TW092108367A patent/TWI233377B/zh not_active IP Right Cessation
- 2003-04-23 KR KR1020030025629A patent/KR100725109B1/ko not_active Expired - Fee Related
- 2003-04-24 JP JP2003120389A patent/JP4141311B2/ja not_active Expired - Fee Related
- 2003-05-09 CN CNB031384560A patent/CN1286576C/zh not_active Expired - Fee Related
- 2003-05-23 US US10/445,101 patent/US6949173B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1488446A (zh) | 2004-04-14 |
| EP1407828A3 (de) | 2007-12-05 |
| DE10247002B3 (de) | 2004-02-26 |
| US20040069624A1 (en) | 2004-04-15 |
| TW200408460A (en) | 2004-06-01 |
| KR100725109B1 (ko) | 2007-06-04 |
| JP4141311B2 (ja) | 2008-08-27 |
| KR20040032731A (ko) | 2004-04-17 |
| EP1407828A2 (de) | 2004-04-14 |
| JP2004131837A (ja) | 2004-04-30 |
| CN1286576C (zh) | 2006-11-29 |
| US6949173B2 (en) | 2005-09-27 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |