1250657 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種影像感測模組及其封裝方 法，尤指一種應用於手持式移動裝置之影像感測模組 及其封裝方法。 ' 【先前技術】 ， 影像感測模組（Image Sensor)模組常應用於如數 位相機、手機、個人數位助理（Personal Digital φ Assistant, PDA)等之手持式移動裝置中。而應用於手 持式移動裝置時，往往受限於手持式移動裝置的機構 設計限制而採用客製化的設計來進行。然而採用客製 化的方式來設計，往往無法滿足對於低成本、快速開 發及量產的要求。 傳統的影像感測模組封裝基板包含多種不同的類型，例 如：CLCC (Ceramic Leaded Chip Carrier，陶瓷無引線晶片承 載’如圖 la)、OLCC (Organic Leaded Chip Carrier，有機無引 線晶片承載，如圖 lb)、PLCC (Plastic Leaded Chip Carrier，塑 _ 料無引線晶片承載，如圖lc)、DIP (Dual In-Line Package，雙 列直插式封裝，如圖Id)、QFN (Quad Flat No Lead，四方爲平 無接腳封骏，如圖le)、QFP(QuadFlatPackage，四邊爲平封 裝，如圖If)。 傳統的影像感測模組封裝方式是以陶瓷或有機材 料作成一有空穴的封裝基板（如圖la至If)，再將影 像感測元件黏附在封裝基板上，並以打線的方式將元 件與封裝基板空穴内的金屬墊連結，接著將封裝基板 的空穴以破璃等透光材料視窗覆蓋並以膠黏附住，以 得到一個與外部隔離而又能讓光線進出的結構，其封 裝流程如圖2。 1250657 例如中華民國專利公告第542493號「影像感測器 構造」所揭示者’其中包含一基板、一凸緣層、一影 像感測晶片及一透光層’該影像感測晶片設於該凸緣 層與該基板所形成之凹槽中，該凸緣層之上表面形成 有訊號輸入端，以供複數個導線電性連結該些訊號輸 入端與該影像感測晶片，再經由該凸緣層之側邊電性 連結至該基板，該凸緣層之上表面塗佈有部分之黏著 廣，以黏著該透光層，在封裝製程中，必須先將該凸 緣層固設於該基板上以形成該凹槽。 當封裝基板較大且有較多的打線金屬墊時，傳統 的封裝方式是一相當方便的方式。只要封裝基板的空 穴夠大、打線金屬墊夠多，不同規格的影像感測元件 均可共用。 然而此種方式也伴隨著一些缺點：（a)封裝尺寸較 大、（b)引線較多、（c)因為引線較多，後續組裝製程 時’表面黏者技術（Surf ace Mounting Technology， SMT)良率較低、成本較高、（d)因部分引線須透過外部 迴路做連結因此較易受雜訊干擾、（e)由於封裝尺寸較 大’ SMT焊點較易因熱膨脹係數不匹配而引起老化、 (〇由於封裝尺寸較大，SMT時對於基板的平面度要求 較高，否則將較容易引起SMT空焊。 ^ ” ”，从巧衣工狀黏，囚此， 如何研發一種影像感測模組封裝設計，以得到較低雜 訊、較少線路接腳、較高組裝良率及較低組裝成本; 以及對不同影像感測模組供應商所提供的不同影後咸1250657 IX. Description of the Invention: [Technical Field] The present invention relates to an image sensing module and a packaging method thereof, and more particularly to an image sensing module and a packaging method thereof for a handheld mobile device. [Prior Art] Image Sensor modules are commonly used in handheld mobile devices such as digital cameras, mobile phones, and personal digital assistants (PDAs). When applied to a handheld mobile device, it is often limited to the design constraints of the handheld mobile device and is designed with a customized design. However, designing in a customized manner often fails to meet the requirements for low cost, rapid development and mass production. The conventional image sensing module package substrate comprises a plurality of different types, for example: CLCC (Ceramic Leaded Chip Carrier), OLCC (Organic Leaded Chip Carrier), as shown in the figure. Lb), PLCC (Plastic Leaded Chip Carrier, plastic lead-free wafer carrier, as shown in Figure lc), DIP (Dual In-Line Package, dual in-line package, as shown in Figure Id), QFN (Quad Flat No Lead, The four sides are flat and sealed, as shown in Figure le), QFP (QuadFlatPackage, four sides are flat package, as shown in Figure If). The conventional image sensing module is packaged in a ceramic or organic material to form a cavity with a cavity (as shown in FIG. 1 to If), and then the image sensing component is adhered to the package substrate, and the component is wired. The metal pad in the cavity of the package substrate is connected, and then the cavity of the package substrate is covered with a light-transmissive material window such as a glass and adhered to obtain a structure that is isolated from the outside and allows light to enter and exit. As shown in Figure 2. 1250657 For example, the disclosure of "Image Sensor Construction" of the Republic of China Patent Publication No. 542493 includes a substrate, a flange layer, an image sensing wafer and a light transmissive layer. The image sensing wafer is disposed on the convex a signal input end is formed on the upper surface of the flange layer, and a plurality of wires are electrically connected to the signal input end and the image sensing chip, and then the flange is formed through the flange. The side of the layer is electrically connected to the substrate, and the upper surface of the flange layer is coated with a part of the adhesion to adhere the light transmission layer. In the packaging process, the flange layer must be fixed on the substrate. Upper to form the groove. The conventional packaging method is a relatively convenient method when the package substrate is large and there are many wire metal pads. As long as the holes in the package substrate are large enough and the metal pads are sufficient, different image sensing components can be shared. However, this method is accompanied by some shortcomings: (a) larger package size, (b) more leads, and (c) more leads, subsequent assembly process [Surf ace Mounting Technology (SMT)) Low yield, high cost, (d) some of the leads must be connected through the external circuit and therefore more susceptible to noise interference, (e) due to larger package size 'SMT solder joints are more likely to be caused by mismatch in thermal expansion coefficient Aging, (〇 Due to the large package size, the flatness of the substrate is required in SMT, otherwise it will be easier to cause SMT air soldering. ^ ”, from the clever job, stick to this, how to develop an image sensing Module package design for lower noise, fewer line pins, higher assembly yield and lower assembly cost; and different shadows for different image sensing module suppliers
有鑑於習知影像感測模組封裝上的缺點，因此， 犮精心研究，並 遂提出本發明應 7 1250657 用於影像感測模組之封裝設計，以得到較低雜訊、較 少線路接腳、較高組裝良率及較低組裝成本、以及對 不同影像感測模組供應商所提供的不^影像感測元件 之間提供相容設計之功效，實為一不可多得之發明。 【發明内容】 士本，述ί發明的某些特徵’其他特徵將敍述於 其合併於此段落作為Ζ考 0 : 、 組之主二 用於影像感測模 件及其他表面黏著4=;;=路、被動元 =的較少線路接腳、較高組“率及較 為達上述目的，本發明夕_ 供-種影像感測模組，包含·一tJff施樣態為提 屬墊，分別平行排列於封裝巧;複數個金 元件黏著區，以兩兩平行^於封裝:數個 内；複數個表面黏著元件，分‘：^緣 裳基板四周邊緣上，；形=;:ff ’固定在封 複數個元件黏著區之空$.二，數個金屬墊及該 封裳基板上，並由複像感μ件，黏著在 所包圍；及-透光;旻數個元件黏著區In view of the shortcomings of the conventional image sensing module package, it has been carefully studied and proposed that the invention should be used for the imaging design of the image sensing module to obtain lower noise and less line connection. Foot, higher assembly yield and lower assembly cost, as well as the ability to provide compatible design between the image sensing components provided by different image sensing module suppliers, is a rare invention. SUMMARY OF THE INVENTION Some features of the invention are described in the following paragraphs as reference 0: , the main group of the group for image sensing modules and other surface adhesions 4 =; = road, passive element = less line pin, higher group "rate and more to achieve the above purpose, the present invention _ supply-type image sensing module, including · a tJff application state is a support pad, respectively Parallel arrangement in the package; a plurality of gold component adhesion areas, in two or two parallel packages; several inside; a plurality of surface adhesion components, divided into ': ^ edge on the edge of the substrate,; shape =;: ff 'fixed In the sealing area of several components, the space is $.2, a plurality of metal pads and the cover substrate, and is surrounded by a complex image, and is adhered to it; and - light transmission;
與外部隔離並允許光線進出。U之園牆上，以 根據本發明之構想，封F 製成。 謝發明上==製成。 8 1250657 根據本發明之構想，複數個表面黏著元件以表面 點著技術的方式黏著在封裝基板之複數個元件黏^區 上0 根據本發明之構想，複數個表面黏著元件以黏晶 的方式黏著在封裝基板之複數個元件黏著區上。曰曰 根據本發明之構想，影像感測元件以黏晶的 黏著在封裝基板上。 工 根據本發明之構想，影像感測元件以打線的方 與複數個金屬墊連結。 根據本發明之構想，製成封裝基板之方式是選自 印刷電路板、高溫共燒陶瓷基板、低溫共燒陶美 板所組成之群組。 土 根據本發明之構想，製成圍牆之方式是選自由機 二、雷射加工、尚溫燒結、射出成型方式所組成 (辩*組。 浐蝌本發明之構想，透光層由玻璃或是光學濾光 規尸^緊成。 征一^上述目的，本發明另一較廣義實施樣態為提 ^了種衫巧感測模組之封裝方法，依序包括下列步 二i字、複數個金屬墊、複數個元件黏著區及連結用 夺面&二併製作於封裝基板上之邊緣内；b)將複數個 t面兀件黏著在封裝基板之複數個元件黏著區 圚兮圍^备嵐固定在封裝基板四周邊緣上，以形成包 = ，至屬墊及該複數個元件黏著區之空穴；d) 著在封裝基板上;e)將影像感測元 …透光層固定在封裝 供一 目,”，本發明另-較廣義實施樣態為提 1、種衫像感測模组之封裝方法，依序包括下列步 9 1250657 驟：a)將複數個金屬墊、複數個元件黏著區及連結用 之線路合併製作於封裝基板上之邊緣内；b)將複數個 表面黏著元件黏著在封裝基板之複數個元件黏著區 上；c)將影像感測元件黏著在封裝基板上；d)將影 像感測元件與複數個金屬墊連結；e)將透光層固定在 圍牆上；及f)將上有透光層之圍牆固定在封裝基板 - 四周邊緣上，以形成包圍該複數個金屬墊及該複數個 元件黏著區之空穴。 _ 為達上述目的，本發明另一較廣義實施樣態為提 ^ 供一種影像感測模組之封裝方法，依序包括下列步 驟：a)將複數個金屬墊、複數個元件黏著區及連結用 之線路合併製作於封裝基板上之邊緣内；b)將圍牆固 定在封裝基板四周邊緣上，以形成包圍該複數個金屬 墊及該複數個元件黏著區之空穴；c)將複數個表面黏 著元件黏著在封裝基板之複數個元件黏著區上；d)將 影像感測元件黏著在封裝基板上；e)將影像感測元件 與複數個金屬墊連結；及f)將透光層固定在圍牆上。 【實施方式】 • 體現本發明特徵與優點的一些典型實施例將在後 段的說明中詳細敘述。應理解的是本發明能夠在不同 ~ 的態樣上具有各種的變化，其皆不脫離本發明的範 圍，且其中的說明及圖式在本質上當作說明之用，而 非用以限制本發明。 圖3為依據本發明實施例之影像感測模組1之示 意圖。如圖3所示，影像感測模組1包含封裝基板10、 複數個金屬墊20、複數個元件黏著區30、複數個表面 黏著元件40、圍牆50、影像感測元件60、透光層70。 封裝基板10是由陶瓷或有機材料所製成，並可經 1250657 由印刷電路板、高溫共燒結陶瓷基板、低溫共燒陶瓷 基板之方式將金屬墊2〇及元件黏著區3〇製作於封裝 ，板/Ο上之邊緣内。表面黏著元件4〇可藉由表面黏 著技術（Surface Mounting Technology，SMT)或黏晶 參 ，方式連結到封裝基板1〇上之元件黏著區3〇。影像 感測兀件60可先以黏晶的方式黏著在封裝基板1〇 士，再藉由打線的方式與金屬墊2〇連結。圍牆5〇 由陶巧機材料所製成，並以黏膠固定在封裝基板 邊緣上，形成包圍金屬墊20及元件黏著區3〇 之工穴。其中，圍牆可經由機械加工、雷射加工、高 ，成型之方式製成。透光層70以黏膠固定 ί) If ,之圍牆50上，以將圍牆50内之金屬墊 6〇蓋^主以in30、表面黏著元件40、影像感測元件 Λ卩隔離’制避免水氣、灰塵或微粒子 元之目的。其中，透光層70可為 象=件60可以透過透光層7G接收光訊號。 種實ί例來述之影像感測模組，在此將以三 、 述不同的影像感測模組封裝方式。 之封^|依5本發明第-實施例之影像感測模組1 ΐίί;及=著其首先提供-上有金 20盘元件點封裝基板1〇,其中金屬墊 内。接下來將排^於封裝基板1〇之邊緣 i::圍么 1結到封裝基板10上之元件黏著區 上，形成屬m定ΐ封裝基板10四周邊緣 出成型之方式械加工、雷射加工、高溫燒結、射 二製成。在此，如圖7所示，圍牆亦可以 1250657 壓模的方式製成，並將元件黏著區3〇及表面黏著元件 直接包覆於其内。接著再將影像感測元件6〇以黏 曰曰的方式黏著在封裝基板1 〇上，並藉由打線的方式與 金屬塾20連結。最後，將透明材料之透光層70以黏 膠固定在封裝基板10之圍牆50上。 圖5為依據本發明第二實施例之影像感測模組1 之封裝流程示意圖。如圖5所示，首先提供一上有金 屬墊20及元件黏著區3〇之封裝基板1〇，其中金屬墊 2〇與元件黏著區30分別排列於封裝基板之邊緣 内。接下來將表面黏著元件4〇藉由表面黏著技術（SMT) 或黏晶的方式連結到封裝基板1〇上之元件黏著區 3〇。再將影像#感測元件60以黏晶的方式黏著在封裝基 板上，並藉由打線的方式與金屬塾20連結。另外， 預先，透明材料之透光層7〇以黏膠固定在圍牆5〇 上。最後，將上有透光層7〇之圍牆以黏膠固定在 封，基板10四周邊緣上，形成包圍金屬墊2〇及元件 黏著區巧之空穴。其中，圍牆可經由機械加工、雷射 加工、高溫燒結、射出成型之方式製成。 圖、6為依據本發明第三實施例之影像感測模組i 之封裝流程示意圖。如圖6所示，首先提供一上有金 f墊20及兀件黏著區3〇之封裝基板1〇，其中金屬墊 與το件黏著區30分別排列於封裝基板1〇之邊緣 1。接下來將圍牆50以黏膠固定在封裝基板1〇四周 ，緣上，形成包圍金屬墊20及元件黏著區30之空穴。 二、中，、圍牆可經由機械加工、雷射加工、高溫燒結、 成ί之方式製成。再將表面黏著元件40藉由表面 -者技術（SMT)或黏晶的方式連結到封裝基板1〇 :，區30。接著再將影像感測元么板以黏t 方式黏者在封裝基板1〇上，並藉由打線的方式與金屬 12 1250657 墊20連結。最後，將透明材料之透光層70以黏膠固 定在封裝基板10之圍牆50上。 利用本發明影像感測模組之封裝方式不但可以得 到較低雜訊、較少線路接腳、較高組裝良率及較低組 裝成本，也可以對不同影像感測模組供應商所提供的 不同影像感測元件之間提供相容設計之功效，此為習 ^ 知技藝無法達成。本發明技術具有實用性、新穎性與 進步性，爰依法提出申請。 ^ 縱使本發明已由上述之實施例詳細敘述而可由熟 癱 悉本技藝之人士任施匠思而為諸般修飾，然皆不脫如 _ 附申請專利範圍所欲保護者。 【圖式簡單說明】 第1圖為多種習知影像感測模組封裝基板之示意圖。 第2圖為習知影像感測模組之封裝流程示意圖。 第3圖為依據本發明實施例之影像感測模組之示意 圖。 第4圖為依據本發明第一實施例之影像感測模組之封 裝流程不意圖。 • 第5圖為依據本發明第二實施例之影像感測模組之封 裝流程示意圖。 第6圖為依據本發明第三實施例之影像感測模組之封 . 裝流程示意圖。 第7圖為依據本發明第一實施例之影像感測模組之另 一模組示意圖。 13 1250657 【主要元件符號說明】 1 影像感測模組 10 封裝基板 20 金屬墊 30 元件黏著區 40 表面黏著元件 50 圍牆 60 影像感測元件 70 透光層Is isolated from the outside and allows light to enter and exit. The wall of U is made of F in accordance with the concept of the present invention. Xie invented == made. 8 1250657 According to the concept of the present invention, a plurality of surface adhesive elements are adhered to a plurality of component adhesive regions of the package substrate in a surface-wise manner. According to the concept of the present invention, a plurality of surface adhesive components are adhered in a die-bonding manner. On a plurality of component adhesion areas of the package substrate. According to the concept of the present invention, the image sensing element is adhered to the package substrate by a die bond. According to the concept of the present invention, the image sensing element is connected to a plurality of metal pads by wire bonding. According to the concept of the present invention, the package substrate is formed by a group consisting of a printed circuit board, a high temperature co-fired ceramic substrate, and a low temperature co-fired ceramic plate. According to the concept of the present invention, the method of forming the wall is selected from the group consisting of machine 2, laser processing, sintering at room temperature, and injection molding. (The invention is based on the concept of the invention, the light transmission layer is made of glass or The optical filter gauge is compacted. In view of the above object, another generalized embodiment of the present invention provides a method for packaging a plastic sensing module, which includes the following steps: i, plural The metal pad, the plurality of component adhesion areas and the connection surface and the second surface are formed on the edge of the package substrate; b) the plurality of t-surface elements are adhered to the plurality of component adhesion areas of the package substrate岚 is fixed on the periphery of the package substrate to form a package =, to the pad and the holes of the plurality of component adhesion regions; d) on the package substrate; e) fixing the image sensing element... the light-transmitting layer in the package For one item," the invention is further - in a broader embodiment, a method for packaging a type of shirt-like sensing module, comprising the following steps in step 9 1250657: a) bonding a plurality of metal pads and a plurality of components The area and the connection line are combined and fabricated on the side of the package substrate b) bonding a plurality of surface adhesive components to a plurality of component adhesive regions of the package substrate; c) adhering the image sensing component to the package substrate; d) connecting the image sensing component to the plurality of metal pads; Fixing the light transmissive layer on the fence; and f) fixing the wall with the light transmissive layer on the peripheral edge of the package substrate to form a cavity surrounding the plurality of metal pads and the adhesive regions of the plurality of components. In order to achieve the above object, another generalized embodiment of the present invention provides a method for packaging an image sensing module, which comprises the following steps: a) using a plurality of metal pads, a plurality of component bonding regions, and connecting The circuit is fabricated in the edge of the package substrate; b) the wall is fixed on the periphery of the package substrate to form a cavity surrounding the plurality of metal pads and the adhesive regions of the plurality of components; c) bonding the plurality of surfaces The component is adhered to a plurality of component adhesion regions of the package substrate; d) the image sensing component is adhered to the package substrate; e) the image sensing component is coupled to the plurality of metal pads; and f) the light transmissive layer is fixed [Embodiment] Some typical embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can be varied in various different aspects without departing from the invention. The present invention is intended to be illustrative, and not to limit the invention. Figure 3 is a schematic diagram of an image sensing module 1 in accordance with an embodiment of the present invention. The image sensing module 1 includes a package substrate 10, a plurality of metal pads 20, a plurality of component adhesion regions 30, a plurality of surface adhesive components 40, a wall 50, an image sensing component 60, and a light transmissive layer 70. The package substrate 10 It is made of ceramic or organic material, and can be fabricated into a package by a printed circuit board, a high-temperature co-fired ceramic substrate, and a low-temperature co-fired ceramic substrate through 1250657. Inside the edge. The surface adhesive component 4 can be bonded to the component adhesion region 3 on the package substrate 1 by Surface Mounting Technology (SMT) or a die bond. The image sensing element 60 may be adhered to the package substrate 1 by a die bonding method, and then connected to the metal pad 2 by wire bonding. The wall 5〇 is made of ceramic material and is fixed on the edge of the package substrate with adhesive to form a working hole surrounding the metal pad 20 and the adhesive region of the component. Among them, the wall can be made by machining, laser processing, high and molding. The light transmissive layer 70 is fixed on the wall 50 by adhesive, so that the metal pad 6 in the wall 50 is covered by the in30, the surface adhesive component 40, and the image sensing component are separated to prevent moisture. , the purpose of dust or microparticles. The light transmissive layer 70 can be such that the image member 60 can receive the optical signal through the light transmissive layer 7G. The image sensing module described in the example will be described in three different image sensing module packages. The image sensing module 1 according to the first embodiment of the present invention is provided with a gold-plated 20-dot component package substrate 1 in which a metal pad is placed. Next, the edge i: of the package substrate 1 is bonded to the component adhesion region on the package substrate 10 to form a method for forming a peripheral edge of the package substrate 10, and processing the laser processing. , high temperature sintering, shot two. Here, as shown in Fig. 7, the wall can also be formed by stamping 1250657, and the component adhesive region 3 and the surface adhesive member are directly coated therein. Then, the image sensing element 6 is adhesively adhered to the package substrate 1 and connected to the metal crucible 20 by wire bonding. Finally, the light transmissive layer 70 of the transparent material is fixed to the wall 50 of the package substrate 10 with an adhesive. FIG. 5 is a schematic diagram of a packaging process of the image sensing module 1 according to the second embodiment of the present invention. As shown in FIG. 5, a package substrate 1 having a metal pad 20 and a device adhesion region 3 is first provided, wherein the metal pad 2 and the device adhesion region 30 are respectively arranged in the edge of the package substrate. Next, the surface adhesive component 4 is bonded to the component adhesion region 3 on the package substrate 1 by surface adhesion technology (SMT) or die bonding. The image sensing element 60 is adhered to the package substrate in a die-bonding manner and bonded to the metal crucible 20 by wire bonding. Further, in advance, the light-transmitting layer 7 of the transparent material is fixed to the fence 5 by adhesive. Finally, the wall with the light-transmissive layer 7 is fixed by adhesive on the periphery of the substrate 10 to form a cavity surrounding the metal pad 2 and the adhesive region of the component. Among them, the wall can be made by machining, laser processing, high temperature sintering, and injection molding. FIG. 6 is a schematic diagram of a packaging process of the image sensing module i according to the third embodiment of the present invention. As shown in FIG. 6, first, a package substrate 1A having a gold pad 40 and a bonding region 3 is provided, wherein the metal pad and the bonding region 30 are respectively arranged on the edge 1 of the package substrate 1. Next, the wall 50 is fixed to the periphery of the package substrate 1 by adhesive, and the holes surrounding the metal pad 20 and the component adhesion region 30 are formed. Second, the middle, the wall can be made by mechanical processing, laser processing, high temperature sintering, and ί. The surface mount component 40 is then bonded to the package substrate 1 :, region 30 by surface technology (SMT) or die bonding. Then, the image sensing element board is adhered to the package substrate 1 by adhesive bonding, and is connected to the metal 12 1250657 pad 20 by wire bonding. Finally, the light transmissive layer 70 of transparent material is adhered to the wall 50 of the package substrate 10 with an adhesive. The packaging method of the image sensing module of the invention can not only obtain lower noise, less line pins, higher assembly yield and lower assembly cost, but also can be provided by different image sensing module suppliers. The ability to provide compatible designs between different image sensing components is not possible with conventional techniques. The technology of the present invention has practicality, novelty and progress, and is submitted in accordance with the law. Even though the invention has been described in detail by the above-described embodiments, it can be modified by those skilled in the art, and is not intended to be protected by the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a plurality of conventional image sensing module package substrates. FIG. 2 is a schematic diagram of a package flow of a conventional image sensing module. Figure 3 is a schematic diagram of an image sensing module in accordance with an embodiment of the present invention. Fig. 4 is a schematic view showing the packaging process of the image sensing module according to the first embodiment of the present invention. Fig. 5 is a flow chart showing the packaging process of the image sensing module according to the second embodiment of the present invention. FIG. 6 is a schematic diagram of the assembly process of the image sensing module according to the third embodiment of the present invention. Figure 7 is a block diagram showing another module of the image sensing module according to the first embodiment of the present invention. 13 1250657 [Description of main component symbols] 1 Image sensing module 10 Package substrate 20 Metal pad 30 Component adhesion area 40 Surface adhesion component 50 Fence 60 Image sensing component 70 Light transmission layer
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