TWI254403B - Electrostatic clamper, and electrostatic attracting structures - Google Patents

Electrostatic clamper, and electrostatic attracting structures Download PDF

Info

Publication number
TWI254403B
TWI254403B TW090110405A TW90110405A TWI254403B TW I254403 B TWI254403 B TW I254403B TW 090110405 A TW090110405 A TW 090110405A TW 90110405 A TW90110405 A TW 90110405A TW I254403 B TWI254403 B TW I254403B
Authority
TW
Taiwan
Prior art keywords
electrostatic
electrode
dielectric layer
volume resistivity
electrostatic chuck
Prior art date
Application number
TW090110405A
Other languages
English (en)
Chinese (zh)
Inventor
Hideyoshi Tsuruta
Naohito Yamada
Original Assignee
Ngk Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ngk Insulators Ltd filed Critical Ngk Insulators Ltd
Application granted granted Critical
Publication of TWI254403B publication Critical patent/TWI254403B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07—Flat, e.g. panels
    • B29C48/08—Flat, e.g. panels flexible, e.g. films
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
TW090110405A 2000-05-19 2001-05-01 Electrostatic clamper, and electrostatic attracting structures TWI254403B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000147170 2000-05-19

Publications (1)

Publication Number Publication Date
TWI254403B true TWI254403B (en) 2006-05-01

Family

ID=18653384

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090110405A TWI254403B (en) 2000-05-19 2001-05-01 Electrostatic clamper, and electrostatic attracting structures

Country Status (4)

Country Link
US (2) US20020012219A1 (de)
EP (1) EP1156522B1 (de)
KR (1) KR100450476B1 (de)
TW (1) TWI254403B (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
US20030010292A1 (en) * 2001-07-16 2003-01-16 Applied Materials, Inc. Electrostatic chuck with dielectric coating
US7494894B2 (en) * 2002-08-29 2009-02-24 Micron Technology, Inc. Protection in integrated circuits
FR2850790B1 (fr) * 2003-02-05 2005-04-08 Semco Engineering Sa Semelle de collage electrostatique avec electrode radiofrequence et moyens thermostatiques integres
US7369393B2 (en) 2004-04-15 2008-05-06 Saint-Gobain Ceramics & Plastics, Inc. Electrostatic chucks having barrier layer
KR101064872B1 (ko) * 2004-06-30 2011-09-16 주성엔지니어링(주) 정전척
KR100773723B1 (ko) 2005-09-08 2007-11-06 주식회사 아이피에스 플라즈마 처리장치
US7983017B2 (en) * 2006-12-26 2011-07-19 Saint-Gobain Ceramics & Plastics, Inc. Electrostatic chuck and method of forming
TWI475594B (zh) 2008-05-19 2015-03-01 恩特格林斯公司 靜電夾頭
JP5345583B2 (ja) * 2009-04-07 2013-11-20 日本碍子株式会社 静電チャック
SG10201402319QA (en) 2009-05-15 2014-07-30 Entegris Inc Electrostatic chuck with polymer protrusions
US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
US8593779B2 (en) * 2010-01-05 2013-11-26 Nikon Corporation Hybrid electrostatic chuck
CN105196094B (zh) 2010-05-28 2018-01-26 恩特格林斯公司 高表面电阻率静电吸盘
JP5441020B1 (ja) * 2012-08-29 2014-03-12 Ｔｏｔｏ株式会社 静電チャック
US10403535B2 (en) 2014-08-15 2019-09-03 Applied Materials, Inc. Method and apparatus of processing wafers with compressive or tensile stress at elevated temperatures in a plasma enhanced chemical vapor deposition system
WO2019116600A1 (ja) * 2017-12-14 2019-06-20 硬化クローム工業株式会社 冷却ロール、およびそれを用いた熱可塑性樹脂シートの製造方法
CN111868913B (zh) * 2018-03-23 2023-08-22 住友大阪水泥股份有限公司 静电卡盘装置及静电卡盘装置的制造方法
SG11202112198UA (en) 2019-05-03 2021-12-30 Therm X Of California Inc High temperature aluminum nitride heater with multi-zone capability
US11501993B2 (en) * 2019-07-29 2022-11-15 Applied Materials, Inc. Semiconductor substrate supports with improved high temperature chucking

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2665242B2 (ja) 1988-09-19 1997-10-22 東陶機器株式会社 静電チャック
JPH06737A (ja) 1991-03-29 1994-01-11 Shin Etsu Chem Co Ltd 静電チャック基板
JPH04342155A (ja) * 1991-05-20 1992-11-27 Fujitsu Ltd 半導体製造装置
JP3357991B2 (ja) * 1991-07-15 2002-12-16 株式会社アルバック 静電吸着装置
EP0734055B1 (de) 1991-11-07 2000-07-26 Varian Semiconductor Equipment Associates Inc. Verfahren zur Herstellung einer elektrostatischen Halteplatte
US5800618A (en) 1992-11-12 1998-09-01 Ngk Insulators, Ltd. Plasma-generating electrode device, an electrode-embedded article, and a method of manufacturing thereof
JP3050716B2 (ja) 1993-02-20 2000-06-12 東京エレクトロン株式会社 プラズマ処理装置
JP3040630B2 (ja) 1993-02-16 2000-05-15 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理方法
US5384681A (en) 1993-03-01 1995-01-24 Toto Ltd. Electrostatic chuck
KR100430643B1 (ko) 1994-01-31 2004-05-12 어플라이드 머티어리얼스, 인코포레이티드 두께가 균일한 절연체 막을 갖는 정전기 척
JPH07297265A (ja) 1994-04-26 1995-11-10 Shin Etsu Chem Co Ltd 静電チャック
US5886863A (en) 1995-05-09 1999-03-23 Kyocera Corporation Wafer support member
JP3457477B2 (ja) 1995-09-06 2003-10-20 日本碍子株式会社 静電チャック
JPH09172055A (ja) * 1995-12-19 1997-06-30 Fujitsu Ltd 静電チャック及びウエハの吸着方法
JPH09213781A (ja) * 1996-02-01 1997-08-15 Tokyo Electron Ltd 載置台構造及びそれを用いた処理装置
US6071630A (en) * 1996-03-04 2000-06-06 Shin-Etsu Chemical Co., Ltd. Electrostatic chuck
JP3172671B2 (ja) * 1996-03-19 2001-06-04 信越化学工業株式会社 静電チャック
JP3457495B2 (ja) * 1996-03-29 2003-10-20 日本碍子株式会社 窒化アルミニウム焼結体、金属埋設品、電子機能材料および静電チャック
JP3428836B2 (ja) 1996-11-19 2003-07-22 信越化学工業株式会社 静電チャック
JPH11111828A (ja) 1997-09-30 1999-04-23 Shin Etsu Chem Co Ltd 静電吸着装置
US5880924A (en) * 1997-12-01 1999-03-09 Applied Materials, Inc. Electrostatic chuck capable of rapidly dechucking a substrate
US6104596A (en) 1998-04-21 2000-08-15 Applied Materials, Inc. Apparatus for retaining a subtrate in a semiconductor wafer processing system and a method of fabricating same
JPH11354504A (ja) * 1998-06-08 1999-12-24 Sony Corp ガラス基板処理装置
US6256187B1 (en) 1998-08-03 2001-07-03 Tomoegawa Paper Co., Ltd. Electrostatic chuck device
US6125025A (en) 1998-09-30 2000-09-26 Lam Research Corporation Electrostatic dechucking method and apparatus for dielectric workpieces in vacuum processors
JP3805134B2 (ja) * 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック

Also Published As

Publication number Publication date
US20040070916A1 (en) 2004-04-15
US7042697B2 (en) 2006-05-09
KR20010105236A (ko) 2001-11-28
EP1156522A3 (de) 2002-03-27
US20020012219A1 (en) 2002-01-31
EP1156522B1 (de) 2014-11-19
KR100450476B1 (ko) 2004-10-01
EP1156522A2 (de) 2001-11-21

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