TWI291994B - Copper alloy conductor and the manufacturing method - Google Patents
Copper alloy conductor and the manufacturing method Download PDFInfo
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- TWI291994B TWI291994B TW92124073A TW92124073A TWI291994B TW I291994 B TWI291994 B TW I291994B TW 92124073 A TW92124073 A TW 92124073A TW 92124073 A TW92124073 A TW 92124073A TW I291994 B TWI291994 B TW I291994B
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- copper alloy
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- 239000004020 conductor Substances 0.000 title claims description 43
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 40
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 229910052718 tin Inorganic materials 0.000 claims description 38
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 37
- 238000001816 cooling Methods 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 238000007711 solidification Methods 0.000 claims description 10
- 230000008023 solidification Effects 0.000 claims description 10
- 238000005266 casting Methods 0.000 claims description 7
- 239000012535 impurity Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 239000012768 molten material Substances 0.000 claims 1
- SKRWFPLZQAAQSU-UHFFFAOYSA-N stibanylidynetin;hydrate Chemical compound O.[Sn].[Sb] SKRWFPLZQAAQSU-UHFFFAOYSA-N 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 16
- 229910052760 oxygen Inorganic materials 0.000 description 16
- 239000001301 oxygen Substances 0.000 description 16
- 238000012545 processing Methods 0.000 description 16
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 11
- 229910001887 tin oxide Inorganic materials 0.000 description 11
- 238000005096 rolling process Methods 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 238000004611 spectroscopical analysis Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 238000005097 cold rolling Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005098 hot rolling Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 108010004103 Chylomicrons Proteins 0.000 description 1
- 108010068370 Glutens Proteins 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- DLCRXTYMOCAMIQ-UHFFFAOYSA-N [O].[Sn].[Bi] Chemical compound [O].[Sn].[Bi] DLCRXTYMOCAMIQ-UHFFFAOYSA-N 0.000 description 1
- 238000001479 atomic absorption spectroscopy Methods 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 235000021312 gluten Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000002798 spectrophotometry method Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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- Conductive Materials (AREA)
Description
1291994 五、發明說明（1) 【發明所屬之技術領域】 本發明是有關於一種強 及其製造 【先前技 作為 公開之特 線。勤煉 銅，且含 雜質。 另外 號公報中 線時的斷 但是 的導體。 當在 煉銅的氧 強度提高 增大錫濃 作為導體 【發明内 因此 和高導電 本發 的氧化錫 方法。 術】 習知的銅合金導體 公昭46-32333號公 銅通常是一種含有 有 Ag、N i、Sb、As ’還有一種曰本專 所記載的，藉由在 線之技術。 ’由上述的習知技 度和導電率良好的銅合金導體 韌煉銅等中 含量大，而 的貢獻力降 度。然而， 的電氣特性容】 ’本發明的 率的銅合金 明藉由限定 和錫單質的 添加錫 使所含 低。所 當增大 下降之 主要目 導體及 錫濃度 比例， 的相關技術，在日本專利早期 報中記載有一種所謂的韌煉銅 不少於25 0ppm ( 〇· 〇25% )氧的 、Fe 、 Sn 、 Pb 、 Bi 、 Si 、 S 等 利早期公開之特開昭57 — 1 562 銅中添加特定的元素以抑制拉 術難以得到強度和導電率並存 日^ ’能夠提高強度。但是在韌 的錫變成氧化錫的情況下，對 以為了得到需要的強度，必須 錫/農度日守’存在導電率下降且 問題。 的是提供一種兼具良好的強度 其製造方法。 ’並特別規定存在於銅合金中 從而達成上述目的。1291994 V. INSTRUCTION DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a strong and manufacturing process [previously disclosed as a special feature. Diligent copper with impurities. In the other bulletin, the conductor in the middle of the line is broken. When the oxygen intensity in the copper is increased, the tin concentration is increased as a conductor. [Invented therefore, and the high conductivity of the present tin oxide method. The conventional copper alloy conductor Gong Zhao 46-32333 is usually a kind of technology containing Ag, N i, Sb, As ’ and a kind of transcript, which is based on the online technology. The contribution of the copper alloy conductor toughness copper or the like which is excellent in the above-mentioned conventional techniques and conductivity is large, and the contribution is lowered. However, the electrical characteristics of the copper alloy of the present invention are low by the addition of tin and the addition of tin to the elemental tin. In the related art of increasing the ratio of the main target conductor and the tin concentration, the so-called toughened copper is not less than 25 ppm (〇·〇25%) of oxygen, Fe, and Sn. , Pb, Bi, Si, S, etc. Early published special opening Kai 57 - 1 562 Adding specific elements to the copper to suppress the difficulty in obtaining the strength and electrical conductivity of the drawing is able to increase the strength. However, in the case where the tough tin becomes tin oxide, it is necessary to have a problem that the conductivity is lowered in order to obtain the required strength. It is a method of manufacturing that provides both good strength and strength. It is specifically stated that it exists in copper alloys to achieve the above objectives.
12134pif.ptd 第5頁 1291994 ----—— 五、發明說明（2) 重量:的錫本發Λ銅合金導體的特徵在於：含有〇.〇5〜0·80 錫以錫單質二;Λ部/由不可避免的雜質和銅構成，該 量/錫單質isn0中的ς、狀態存在，且氧化錫中的錫成分重 所呀的於、（0中的Sn/Sn)的重量不超過0. 3。另外，這裏 二、氧化錫中的錫成分重量（Sn〇中的如） 人 體以⑽硝酸進行溶解時，作為不溶物留下 (SnO)所含有的錫（Sn)。 下的殘潼中 和錫過！：規定錫濃度及氧化錫中的錫成分 的導體使用。 機裔用配線和汽車用配線 易懂為$ = :2 ί ΐ他㈣、特徵和優點能更明顯 說明如下。、 貫細例，並配合所附圖式，作詳細 【實施方式】 下面對本發明進行更為詳細的說明。 产。ίΪί度小於〇. 〇5重量％時’難以得到足夠的拉伸強 :，更佳L:之導體中，較佳的拉伸強度為55〇ν/_2以 更佳為600Ν/_2以上，特佳為7〇〇/_2以上。 導電i之二ΐ錫濃度大於°.08重量%時，難以得到所定的 二 7巾，較佳的導電率為⑽以上 :上，特佳為8〇%以上。該導電率以在⑼t時對 =銅標準所規定的標準軟鋼的 之… (°/〇I ACS)來表示。 m 12134pif.ptd $ 6頁 1291994 五、發明說明（3) 在形成本發明之銅合金導體的化學成分中，也可含有 不可避免的雜質。不可避免的雜質包括Ag、Ni、Sb、As、 Fe、Pb、Bi、P、Si、Zn、S、Se、Te 等。 而且，使氧化錫中的錫成分和錫單質的重量比在0.3 以下。當該比率超過0. 3 k ’為了得到足夠的拉伸強度就 要增大錫濃度，容易導致導電率的下降。Sn〇中的Sn和以 的合計錫重量藉由發光分光分析（Emission12134pif.ptd Page 5 1291994 ----—— V. INSTRUCTIONS (2) Weight: The tin-bronze copper-copper conductor is characterized by: 〇.〇5~0·80 tin to tin elemental two; Part / consists of unavoidable impurities and copper, the amount / tin element isn0 in the ς, state exists, and the tin content in the tin oxide is heavy, the weight of (Sn / Sn in 0) does not exceed 0. 3. In addition, the weight of the tin component in tin oxide (for example, in Sn) is dissolved in (10) nitric acid, and tin (Sn) contained in (SnO) is left as an insoluble matter. Under the wreckage and tin over! : Use of conductors that specify tin concentration and tin content in tin oxide. Wiring wiring and automotive wiring are easy to understand as $ = : 2 ί ΐ (4), features and advantages can be more obvious as follows. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in more detail. Production. Ϊ 度 度 〇 〇 〇 〇 〇 〇 〇 〇 〇 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' Good for 7〇〇/_2 or above. When the concentration of the bismuth tin oxide of the conductive material i is more than 0.028% by weight, it is difficult to obtain a predetermined amount of two or less, and the preferred conductivity is (10) or more: particularly preferably 8 〇% or more. This conductivity is expressed as (°/〇I ACS) of the standard mild steel specified by the copper standard at (9) t. m 12134pif.ptd $6 1291994 V. DESCRIPTION OF THE INVENTION (3) In the chemical composition of the copper alloy conductor of the present invention, unavoidable impurities may be contained. Inevitable impurities include Ag, Ni, Sb, As, Fe, Pb, Bi, P, Si, Zn, S, Se, Te, and the like. Further, the weight ratio of the tin component in the tin oxide to the tin element is made 0.3 or less. When the ratio exceeds 0.3 k', in order to obtain sufficient tensile strength, the tin concentration is increased, which tends to cause a decrease in electrical conductivity. The Sn weight in Sn〇 and the total tin weight by luminescence spectroscopic analysis (Emission
Spectro-photometric Analysis)進行測定。Sn 單質的重 量是通過將銅合金導體的樣品溶解於6〇%硝酸中並使Sn〇沈 澱分離，且對澄清部分施以原子吸光分析（Atimic Absorption Spectrometry)，從而對所溶解的以進行測定 得到的。通過從合計錫重量中減去Sn單質的重量，可求 SnO中所含有的錫的重量。該Sn0主要是在鑄造時的凝固過 程中，通過與熔融銅中所含的氧的結合而生成。 形成本發明之銅合金導體中的氧濃度不超過〇〇8重量 %為佳。當氧濃度超過〇. 08重量％時，Sn〇的量增加，有時 會對所得到之導體的拉線加工性帶來障礙。更佳的氧濃度 為〇· 04重量％以下。氧濃度的測定可利用例如紅外線吸收" 分析（Infrared Spectrum Abs〇rbance)進行。 平均：：發明之銅合金導體中所含有的氧化錫的 千均士粒子直徑在10心以下為佳。#平均粒子直徑超過1〇 磁有。時-會/對將所得到的導體拉線至細徑時的加工性 鏡· 乳匕錫的平均粒子直徑可利用掃描型電子顯微 蜆· btM(Scanning El + r u· 、 g iectron Microscope)和能量分散型χSpectro-photometric Analysis). The weight of the Sn element is obtained by dissolving a sample of the copper alloy conductor in 6 % nitric acid and separating the Sn 〇 precipitate, and applying an Atomic Absorption Spectrometry to the clarified portion to thereby determine the dissolved amount. of. The weight of tin contained in SnO can be obtained by subtracting the weight of the Sn element from the total tin weight. This Sn0 is mainly produced by a combination with oxygen contained in molten copper during solidification at the time of casting. It is preferred that the oxygen concentration in the copper alloy conductor of the present invention is not more than 〇〇8 wt%. When the oxygen concentration exceeds 0.02% by weight, the amount of Sn 增加 increases, which may hinder the wire drawability of the obtained conductor. A more preferable oxygen concentration is 〇·04% by weight or less. The measurement of the oxygen concentration can be performed by, for example, Infrared Spectrum Abs〇rbance. Average: The diameter of the uniformity of the tin oxide contained in the copper alloy conductor of the invention is preferably 10 or less. #Average particle diameter exceeds 1〇 Magnetic. Time-meeting/processability mirror for drawing the obtained conductor to a small diameter. The average particle diameter of the chylomicron can be obtained by scanning electron microscopy 蚬·btM (Scanning El + ru·, g iectron Microscope) and Energy dispersive type
1291994 五、發明說明（4) 線分析裝置：EDX(Energy-dispersive1291994 V. Invention description (4) Line analysis device: EDX (Energy-dispersive
Spectroscopy)進行測定。更佳的氧化 在以下。 心化錫的平均粒子直徑 士述之銅合金導體適合利用以下的方法進行 二:：銅=導體的製造方法包括將含有〇.〇;〜。.80 重里1的錫、剩餘的部分由不可避免的雜質和鋼之原 料進打熔解鑄造的製程和將所得到的鑄塊進行軋製的製、 程，其特徵在於在前述鑄造製程中的、溶解原料的凝固時， 使冷卻速度不小於3 °c /秒。 通^§利用上述錫含有置的原料，並使熔解原料的凝固 時的冷卻速度不小於3 t：/秒，能夠得到氧化錫中的錫成分 重量/錫單質的重量不大於〇· 3之銅合金導體。當冷卻速度 小於3 °C /秒時，氧化錫的生成量增大，導致導電率的下 降。通常該冷卻速度的上限是5〇 °c /秒左右。 一般來說，銅合金導體可利用熔解〜鑄造—熱（冷）軋 的製程，到，再在後期製程中進行拉線並加工成&定7的線 徑。這裏，使凝固後的鑄塊經熱軋達到2 〇 〇 〇c時的冷卻速 度或在鑄造後進行冷軋前的冷卻速度不小於1 〇 t /秒為 佳。通過控制在這樣的冷卻速度，能夠使氧化錫的生成量 在一個適當的範圍，並保持較高的強度和導電率。當冷卻 速度小於1 0 °C /秒時，錫在銅中擴散使氧化錫的生成量增 大，並導致導電率的下降。 形成本發明之銅合金導體具有足夠的強度，特別是可 作為細徑的導體進行利用。例如能夠輕鬆地得到線徑不超Spectroscopy) was performed. Better oxidation is below. The average particle diameter of the tinned tin is described in the following method: 2: Copper = conductor manufacturing method including 〇.〇; .80 a process in which the tin of the 1st, the remaining part is subjected to melt casting by inevitable impurities and a raw material of steel, and a process of rolling the obtained ingot, characterized in that in the aforementioned casting process, When the solidified material is solidified, the cooling rate is not less than 3 ° C / sec. By using the raw material contained in the tin, and cooling rate at the time of solidification of the molten raw material is not less than 3 t: / sec, the weight of the tin component in the tin oxide / the weight of the tin element is not more than 〇 · 3 Alloy conductor. When the cooling rate is less than 3 °C / sec, the amount of tin oxide is increased, resulting in a decrease in electrical conductivity. Usually, the upper limit of the cooling rate is about 5 〇 ° c / sec. In general, copper alloy conductors can be processed by melting to casting-hot (cold) rolling, and then drawn in a later process and processed into a diameter of < Here, it is preferable that the cooling rate of the solidified ingot after hot rolling reaches 2 〇 〇 〇c or the cooling rate before cold rolling after casting is not less than 1 〇 t / sec. By controlling such a cooling rate, the amount of tin oxide generated can be made to an appropriate range, and high strength and electrical conductivity can be maintained. When the cooling rate is less than 10 °C / sec, the diffusion of tin in the copper increases the amount of tin oxide generated and causes a decrease in electrical conductivity. The copper alloy conductor forming the present invention has sufficient strength, and particularly can be utilized as a conductor of a small diameter. For example, it is easy to get the wire diameter is not exceeded.
12134pif.ptd 第8頁 129199412134pif.ptd Page 8 1291994
五、發明說明（5) 過1.2 mm，甚至不超過〇.5mm的導體。 以下對本發明的實施形態進行說明。 (實驗例1)準備含有〇· 075重量％的811、剩餘的部分由 Cu和不可避免的雜質構成之銅合金，並利用「熔解〜77禱造 —熱軋〜冷軋」的製程製作銅合金導體。在鑄造中^雔 皮帶式鑄造機。 又 由作業結果可知，凝固時的冷卻速度為5 · 7 7 °c /秒， 减固後至2 〇 〇 °c的冷卻速度（加工時的冷卻速度）為2 1/ 秒0 、，在製程進行的過程中，於軋製結束後取下樣品並利用 發光分光分析（乾式分析）求合金中的全Sn量。接著通過將 〔樣πα /谷解於6 Q %硝酸中，並使不溶物沈殿，且對澄清部 二進行原子吸光分析，從而求得溶解的Sn單質量。由全sn 里減去Sn單質量，為SnO中的Sn量。結果，SnO中的Sn/Sn $ $為〇· 07。而且，當利用掃描型電子顯微鏡（SEM)觀察 ，=的樣品斷面並求平均粒子直徑時，為4 # m。 ^採取另一樣品並利用紅外線吸收分析測定氧含量 時’為〇· 0230重量％。 种An拉f結束後的加工度為75%(斷面減小率），最終線 加:中#另外，當將本實驗例、比較例進行綜合，對 行綜二在r，中細線化時的加工難易度進 為 η:::;;:時並 當利用社知人 貝驗例1付到5的評價。 ^銅0金導體求拉伸強度和導電率時，拉伸強V. INSTRUCTIONS (5) Conductors of 1.2 mm or even no more than 〇5 mm. Embodiments of the present invention will be described below. (Experimental Example 1) A copper alloy containing 075 wt% of 811 and a remaining portion of Cu and unavoidable impurities was prepared, and a copper alloy was produced by a process of "melting ~ 77 prayer - hot rolling to cold rolling" conductor. In the casting, the belt casting machine. According to the results of the operation, the cooling rate at the time of solidification is 5 · 7 7 °c / sec, and the cooling rate (the cooling rate during processing) after the reduction to 2 〇〇 °c is 2 1 / sec 0 , in the process In the course of the process, the sample was taken after the end of rolling and the amount of total Sn in the alloy was determined by luminescence spectroscopic analysis (dry analysis). Next, the dissolved Sn single mass was determined by dissolving [like πα / gluten] in 6 Q% nitric acid, and insoluble matter, and performing atomic absorption analysis on the clarified portion 2. The Sn single mass is subtracted from the total sn, which is the amount of Sn in the SnO. As a result, Sn/Sn $ $ in SnO is 〇·07. Further, when the cross section of the sample was observed by a scanning electron microscope (SEM) and the average particle diameter was obtained, it was 4 # m. ^ When another sample was taken and the oxygen content was measured by infrared absorption analysis, it was 〇·2303% by weight. The processing degree after the end of the An pull f is 75% (the reduction rate of the section), and the final line is added: the middle # In addition, when the experimental example and the comparative example are integrated, when the line 2 is in the r, the middle line is thinned. The difficulty of processing is η:::;;: When using the evaluation of the company, the evaluation of the case 1 is paid to 5. ^Copper 0 gold conductor when tensile strength and electrical conductivity, strong tensile
1291994 五、發明說明（6) 度為552N/mm2，導電率為88. 3%IACS。 (實驗例2)除了利用Sn含有量為〇· 624重量％的銅合金 以外，由與實驗例1相同的製程製作銅合金導體。凝固時 的冷卻速度為3 · 2 °C /秒，加工時的冷卻速度為2 3。〇 /秒。 拉線結束後的加工度為9 9 · 7 5 % (斷面減小率），得到〇 4mm的最終線徑。 當與實驗例1同樣的，在製程進行中的軋製之後，採 取樣品並測定SnO中的Sn/Sn時，為〇· 28，SnO的平均粒子 直徑為12//m。而且，氧含量為0.0298重量％。 所得到的銅合金導體的拉伸強度為720N/mm2，導電率 為62· 5% I ACS。加工性的評價為2，其理由是因為Sn〇的粒 度變大。 而且’雖然該貫驗例2與實驗例5和實驗例6相比，含 有較多的Sn ’但是拉伸強度不會為一個高值。這也是因為 SnO的粒子直徑變大。 (實驗例3)除了利用Sn含有量為〇· 187重量％的銅合金 以外，由與實驗例1相同的製程製作銅合金導體。凝固時 的冷卻速度為3. 9 °C/秒，加工時的冷卻速度為18它/秒。 拉線結束後的加工度為99· 75%(斷面減小率），得到〇· 4mm的最終線徑。 當與實驗例1同樣的，在製程進行中的軋製之後，採 取樣品並測定SnO中的Sn/Sn時，為〇· 18，Sn〇的平均粒子 直徑為6//m。而且，氧含量為0.0820重量％。 所得到的銅合金導體的拉伸強度為595N/mm2，導電率。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。. (Experimental Example 2) A copper alloy conductor was produced in the same manner as in Experimental Example 1, except that a copper alloy having a Sn content of 624 wt% was used. The cooling rate during solidification is 3 · 2 ° C / sec, and the cooling rate during processing is 2 3 . 〇 / sec. The machining degree after the end of the wire is 9 9 · 7 5 % (the reduction rate of the section), and the final wire diameter of 〇 4 mm is obtained. In the same manner as in Experimental Example 1, after the rolling in the course of the process, when the sample was taken and Sn/Sn in SnO was measured, it was 〇·28, and the average particle diameter of SnO was 12/m. Moreover, the oxygen content was 0.029% by weight. The obtained copper alloy conductor had a tensile strength of 720 N/mm 2 and a conductivity of 62·5% I ACS. The evaluation of the workability was 2 because the particle size of Sn 变 became large. Further, although the test example 2 contained more Sn' than the experimental example 5 and the experimental example 6, the tensile strength was not a high value. This is also because the particle diameter of SnO becomes large. (Experimental Example 3) A copper alloy conductor was produced in the same manner as in Experimental Example 1, except that a copper alloy having a Sn content of 187 % by weight was used. The cooling rate at the time of solidification was 3.9 ° C / sec, and the cooling rate during processing was 18 sec / sec. The degree of processing after the end of the wire drawing was 99. 75% (the reduction rate of the section), and the final wire diameter of 〇·4 mm was obtained. In the same manner as in Experimental Example 1, after the rolling in the course of the process, when the sample was taken and Sn/Sn in SnO was measured, it was 〇·18, and the average particle diameter of Sn〇 was 6/m. Moreover, the oxygen content was 0.0820% by weight. The obtained copper alloy conductor has a tensile strength of 595 N/mm 2 and electrical conductivity.
1291994 五、發明說明（Ό 為82.6%IACS。加工性的評價為4。 實驗例3與下一實驗例4相比，含有較多的Sn，但是由 於氧含量較實驗例4多，所以SnO的存在量增加，且拉伸強 度的值也小於實施例4。 (實驗例4)除了利用Sn含有量為〇· 177重量％的銅合金 以外，由與實驗例1相同的製程製作銅合金導體。凝固時 的冷卻速度為5 · 4 7 °C /秒，加工時的冷卻速度為1 8 °C /秒。 拉線結束後的加工度為99·75%(斷面減小率），得到〇 4mm的最終線徑。 當與實驗例1同樣的，在製程進行中的軋製之後，採 取樣品並測定SnO中的Sn/Sn時，為〇· 〇7，SnO的平均粒子 直徑為6/zm。而且，氧含量為0.0350重量％。 所得到的銅合金導體的拉伸強度為61 0N/ mm2，導電率 為8 2 · 8 % IA C S。形成非常平衡的材料。而且，加工性非常 好，得到5的評價。 (實驗例5)除了利用Sn含有量為〇· 31 5重量％的銅合金 以外，由與實驗例1相同的製程製作銅合金導體。凝固時 的冷卻速度為5 · 4 7 °C /秒，加工時的冷卻速度為8 °c /秒。 拉線結束後的加工度為99· 75%(斷面減小率），得到〇 4mm的最終線徑。 當與實驗例1同樣的，在製程進行中的軋製之後，採 取樣品並測定SnO中的Sn/Sn時，為〇· u，Sn〇的平均粒子 直徑為。而且，氧含量為0.0410重量％。 所得到的銅合金導體的拉伸強度為70 0N/mm2，導電率1291994 V. Inventive Note (Ό is 82.6% IACS. The evaluation of workability is 4. Experimental Example 3 contains more Sn than the next Experimental Example 4, but since the oxygen content is more than Experimental Example 4, SnO The amount of presence was increased, and the value of the tensile strength was also smaller than that of Example 4. (Experimental Example 4) A copper alloy conductor was produced in the same manner as in Experimental Example 1, except that a copper alloy having a Sn content of 177 wt% was used. The cooling rate during solidification is 5 · 4 7 ° C / sec, and the cooling rate during processing is 18 ° C / sec. The degree of processing after the end of the wire is 99. 75% (sectional reduction rate), and 〇 is obtained. The final wire diameter of 4 mm. When the sample was taken and the Sn/Sn in SnO was measured after the rolling in the process as in Experimental Example 1, the average particle diameter of SnO was 6/zm. Further, the oxygen content was 0.0350% by weight. The obtained copper alloy conductor had a tensile strength of 61 0 N/mm 2 and a conductivity of 8 2 · 8 % IA CS. A very balanced material was formed, and the workability was very good. The evaluation of 5 was obtained. (Experimental Example 5) In addition to the use of a copper alloy having a Sn content of 〇·31 5% by weight A copper alloy conductor was produced by the same process as in Experimental Example 1. The cooling rate at the time of solidification was 5 · 4 7 ° C / sec, and the cooling rate at the time of processing was 8 ° C / sec. 99·75% (sectional reduction rate), a final wire diameter of 〇4 mm was obtained. When the sample was rolled and the Sn/Sn in SnO was measured, the same as in Experimental Example 1, 〇· u, Sn 〇 has an average particle diameter of 0.02 μg and an oxygen content of 0.0410% by weight. The obtained copper alloy conductor has a tensile strength of 70 0 N/mm 2 and electrical conductivity.
1291994 五、發明說明（8) 為76· 8% I ACS。加工性的評價為3。這是因為加工時的冷卻 速度。 而且’在該實驗例5中，儘管s n的含有量較下/實驗 =6猶小’但導電率並不比實施例6大。其理由是因為加工 時的冷卻速度不超過1(rc/秒，311在(：11中擴散形成SnO，從 而使導電率下降。 (實驗例6 )除了利用Sn含有量為〇. 3 38重量％的銅合金 以外，由與實驗例1相同的製程製作銅合金導體。凝固時 的冷卻速度為5· 47 °C/秒，加工時的冷卻速度為23 °C/秒。 拉線結束後的加工度為9 9. 75%(斷面減小率），得到〇· 4mm的最終線徑。 當與實驗例1同樣的，在製程進行中的軋製之後，採 取樣品並測定SnO中的Sn/Sn時，為〇. 〇7，SnO的平均粒子 直徑為4//m。而且，氧含量為0.0215重量％。 所得到的銅合金導體的拉伸強度為71 ON/mm2，導電率 為78· 0%I ACS。加工性的評價為4。 (比較例1)除了利用Sn含有量為〇. 〇30重量％的銅合金 以外，由與實驗例1相同的製程製作銅合金導體。凝固時 的冷卻速度為5 · 4 7 °C /秒，加工時的冷卻速度為1 8 °C /秒。 拉線結束後的加工度為9 9 · 7 5 % (斷面減小率），得到〇. 4mm的最終線徑。 當與實驗例1同樣的，在製程進行中的軋製之後，採 取樣品並測定SnO中的Sn/Sn時，為〇· 〇3，SnO的平均粒子 直徑為3//m。而且，氧含量為0.0240重量％。1291994 V. Description of invention (8) is 76.8% I ACS. The workability was evaluated as 3. This is because of the cooling rate during processing. Further, in this Experimental Example 5, although the content of s n was lower than that of the experiment = 6 is small, the conductivity was not larger than that of Example 6. The reason is that the cooling rate at the time of processing does not exceed 1 (rc/sec, and 311 is diffused to form SnO in (11), so that the electrical conductivity is lowered. (Experimental Example 6) The amount of Sn is 〇. 3 38% by weight. A copper alloy conductor was produced in the same manner as in Experimental Example 1 except for the copper alloy. The cooling rate during solidification was 5 · 47 ° C / sec, and the cooling rate during processing was 23 ° C / sec. The degree was 9 9.75% (sectional reduction rate), and the final wire diameter of 〇·4 mm was obtained. When the rolling was in progress during the course of the process as in Experimental Example 1, the sample was taken and Sn/ in SnO was measured. In the case of Sn, 〇7, SnO has an average particle diameter of 4/m, and the oxygen content is 0.0215% by weight. The obtained copper alloy conductor has a tensile strength of 71 ON/mm2 and a conductivity of 78·. 0% I ACS. The workability was evaluated as 4. (Comparative Example 1) A copper alloy conductor was produced in the same manner as in Experimental Example 1 except that a copper alloy having a Sn content of 30% by weight was used. The cooling rate is 5 · 4 7 ° C / sec, and the cooling rate during processing is 18 ° C / sec. The degree of processing after the end of the wire 9 9 · 7 5 % (sectional reduction rate), the final wire diameter of 〇. 4 mm was obtained. When the rolling was in progress during the course of the process as in Experimental Example 1, the sample was taken and the Sn/Sn in SnO was measured. In the case of 〇·〇3, the average particle diameter of SnO is 3/m, and the oxygen content is 0.0240% by weight.
12134pif.ptd 第12頁 129199412134pif.ptd Page 12 1291994
所得到的銅合金導體的拉伸強度為535N/mm2，導電 ;9=ACS。由於採用接近純銅的原料，導電率表現為 if的值:但是拉伸強度得不収夠的強纟。加工性沒有 問通’评價為5。 (比較例2)除了利用Sn含有量為〇. 68〇重量％的銅合金 m與實驗例1相同的製程製作銅合金導體。凝固時 的乂P連度為2.1 C/秒’加工時的冷卻速度為23口秒。 4_的最終線徑。 ‘，、、.75/°(斷面減小率），得到〇.The obtained copper alloy conductor had a tensile strength of 535 N/mm 2 and was electrically conductive; 9 = ACS. Due to the use of raw materials close to pure copper, the conductivity is expressed as the value of if: but the tensile strength is not strong enough. The processability is not evaluated. (Comparative Example 2) A copper alloy conductor was produced in the same manner as in Experimental Example 1 except that the copper alloy m having a Sn content of 〇.68 〇% by weight was used. The 乂P connection at the time of solidification was 2.1 C/sec. The cooling rate at the time of processing was 23 sec. The final wire diameter of 4_. ‘,,, .75/° (section reduction rate), get 〇.
=實驗例！同樣的’在製程進行中的札製之後，採 =樣二並測定Sn0中的Sn/以時，為〇 37，Sn〇的平均粒子 仫車乂=，達到20ym。而且，氧含量為〇〇85〇重量％。 + ^所付到的銅合金導體的拉伸強度為71〇N/mm2，但導電 :車二:’為= .5%IACS。該原料由於Sn含量高，所以拉伸 f t 但是導電率稍有不足。而且，加工性由於在後期 d 3 :線率增大，評價為1。考慮是由於Sn0粒子直徑 高拉：ΐίΠΞί比：：所：，任-實驗例都同時具備= Experimental example! The same 'after the process in progress, after taking the sample 2 and measuring Sn/ in Sn0, it is 〇 37, and the average particle S 乂 of Snn is 20 ym. Moreover, the oxygen content was 〇〇85〇% by weight. + ^ The tensile strength of the copper alloy conductor paid is 71〇N/mm2, but conductive: car 2:' = 1.5% IACS. Since this raw material has a high Sn content, it fends ft but the conductivity is slightly insufficient. Further, the workability was evaluated as 1 due to an increase in the linear rate at the later stage d 3 . The consideration is due to the diameter of the Sn0 particle. High: ΐίΠΞί ratio::::
身中的Sn含量不在一個較佳r =較例？斤示？广料本 1U早乂隹靶圍時，不管加工條件如何， …’ 伸強度和導電率並存。即使SnO中的Sn/Sn超過 〇·3，也同樣不能使拉伸強度和導電率並存。 錫的t 2述ί明^形成本發明之銅合金導體藉由減少氧化 、 曰大對拉伸強度的增加作出貢獻之有效錫量，The Sn content in the body is not a better r = comparative example? What is the indication? When the 1U is used for the target circumference, regardless of the processing conditions, ...' tensile strength and electrical conductivity coexist. Even if Sn/Sn in SnO exceeds 〇·3, the tensile strength and electrical conductivity do not coexist. The tin alloy of tin forms the effective amount of tin which contributes to the increase of the tensile strength by reducing the oxidation and the copper alloy conductor of the present invention.
1291994 五、發明說明（ίο) 並通過減少為得到所定的拉伸強度所需的總錫量而抑制導 電率的下降。所以，能夠實現使高強度和導電率並存的導 體。 而且，形成本發明之銅合金導體的製造方法是一種適 合用於製造本發明的銅合金導體之製造方法。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離本發明之精神 和範圍内，當可作些許之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。1291994 V. INSTRUCTIONS (ίο) and suppressing the decrease in conductivity by reducing the amount of total tin required to obtain a given tensile strength. Therefore, a conductor which coexists with high strength and electrical conductivity can be realized. Further, the method of producing the copper alloy conductor of the present invention is a method of producing a copper alloy conductor suitable for use in the production of the present invention. While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.
12134pif.ptd 第14頁 1291994 圖式簡單說明 無 12134pif.ptd 第15頁12134pif.ptd Page 14 1291994 Simple description of the diagram No 12134pif.ptd Page 15
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| CN100538917C (en) * | 2005-12-26 | 2009-09-09 | 云南铜业股份有限公司 | A kind of production method of copper-tin alloy wire |
| CN103421982A (en) * | 2013-07-15 | 2013-12-04 | 徐高磊 | Copper alloy band used on auto radiator |
| CN103602851B (en) * | 2013-11-08 | 2015-10-28 | 浙江八达铜业有限公司 | Copper alloy and manufacture method thereof |
| CN107723504B (en) * | 2017-10-09 | 2019-08-09 | 中国西电集团有限公司 | A kind of contact line of bronze in use for electrified railroad in and its method for continuous production |
| CN117505582A (en) * | 2023-11-24 | 2024-02-06 | 广西产研院新型功能材料研究所有限公司 | A kind of high-strength copper alloy micro wire and preparation method thereof |
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| US4822560A (en) * | 1985-10-10 | 1989-04-18 | The Furukawa Electric Co., Ltd. | Copper alloy and method of manufacturing the same |
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