TWI296558B - - Google Patents

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Publication number
TWI296558B
TWI296558B TW95118879A TW95118879A TWI296558B TW I296558 B TWI296558 B TW I296558B TW 95118879 A TW95118879 A TW 95118879A TW 95118879 A TW95118879 A TW 95118879A TW I296558 B TWI296558 B TW I296558B
Authority
TW
Taiwan
Prior art keywords
ultraviolet
adhesive
dresser
substrate
abrasive
Prior art date
Application number
TW95118879A
Other languages
English (en)
Chinese (zh)
Other versions
TW200743551A (en
Inventor
Wey Hwang
Cheng Hsiang Chou
Chih Chung Chou
Original Assignee
Kinik Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kinik Co filed Critical Kinik Co
Priority to TW095118879A priority Critical patent/TW200743551A/zh
Publication of TW200743551A publication Critical patent/TW200743551A/zh
Application granted granted Critical
Publication of TWI296558B publication Critical patent/TWI296558B/zh

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  • Polishing Bodies And Polishing Tools (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW095118879A 2006-05-26 2006-05-26 Method for making conditioners by means of ultraviolet curing process TW200743551A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095118879A TW200743551A (en) 2006-05-26 2006-05-26 Method for making conditioners by means of ultraviolet curing process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095118879A TW200743551A (en) 2006-05-26 2006-05-26 Method for making conditioners by means of ultraviolet curing process

Publications (2)

Publication Number Publication Date
TW200743551A TW200743551A (en) 2007-12-01
TWI296558B true TWI296558B (de) 2008-05-11

Family

ID=45068813

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095118879A TW200743551A (en) 2006-05-26 2006-05-26 Method for making conditioners by means of ultraviolet curing process

Country Status (1)

Country Link
TW (1) TW200743551A (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9254548B2 (en) 2012-04-25 2016-02-09 Taiwan Semiconductor Manufacturing Co., Ltd. Method of forming diamond conditioners for CMP process
TWI755069B (zh) * 2020-09-21 2022-02-11 合晶科技股份有限公司 修整拋光墊的方法

Also Published As

Publication number Publication date
TW200743551A (en) 2007-12-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees