TWI298184B - - Google Patents

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Publication number
TWI298184B
TWI298184B TW092128783A TW92128783A TWI298184B TW I298184 B TWI298184 B TW I298184B TW 092128783 A TW092128783 A TW 092128783A TW 92128783 A TW92128783 A TW 92128783A TW I298184 B TWI298184 B TW I298184B
Authority
TW
Taiwan
Prior art keywords
carrier tape
clamp
carrier
opening
jig
Prior art date
Application number
TW092128783A
Other languages
English (en)
Chinese (zh)
Other versions
TW200416907A (en
Inventor
Watanabe Hiroshi
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200416907A publication Critical patent/TW200416907A/zh
Application granted granted Critical
Publication of TWI298184B publication Critical patent/TWI298184B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames

Landscapes

  • Advancing Webs (AREA)
  • Wire Bonding (AREA)
TW092128783A 2002-12-09 2003-10-17 Carrying belt conveying apparatus TW200416907A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002356113A JP3768472B2 (ja) 2002-12-09 2002-12-09 テープ搬送装置

Publications (2)

Publication Number Publication Date
TW200416907A TW200416907A (en) 2004-09-01
TWI298184B true TWI298184B (2) 2008-06-21

Family

ID=32756535

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092128783A TW200416907A (en) 2002-12-09 2003-10-17 Carrying belt conveying apparatus

Country Status (3)

Country Link
JP (1) JP3768472B2 (2)
KR (1) KR100539214B1 (2)
TW (1) TW200416907A (2)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100700618B1 (ko) * 2005-12-02 2007-03-28 합명회사 서우테크 티씨피/씨오에프 외관검사기의 필름규격에 의한 폭조절구조
JP4648257B2 (ja) * 2006-06-28 2011-03-09 芝浦メカトロニクス株式会社 被搬送部材の搬送装置及び電子部品の実装装置
CN112147145A (zh) * 2020-10-10 2020-12-29 昆山晋基精密机械模具有限公司 一种基于视觉检测的料带检测设备
KR102731954B1 (ko) * 2022-11-21 2024-11-18 스테코 주식회사 Cof 패키지 용 필름 이송 장치

Also Published As

Publication number Publication date
KR20040050839A (ko) 2004-06-17
KR100539214B1 (ko) 2005-12-27
JP2004193182A (ja) 2004-07-08
JP3768472B2 (ja) 2006-04-19
TW200416907A (en) 2004-09-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees