1306149 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種光學感測裝置， 利用將-多頻混合之入射光束加以分光、盥J 應，而感測一待測位置物件之與光 二 對距離位置之光學制裝置。于❼4裝置間之& _ 【先前技術】 隨著時勢的發展與演進，許多產品在加工尺寸精 ，度方面之要求’亦隨之曰趨嚴謹，特別是對於光電 類或微機電類元件而言，其精準度往往必須達到奈= 等級之要求。然而，在光電類或微機電類元件之^個 加工過程中，往往不可避免地必須將待加工之工=輪 送至特定之加工位置來進行加工作業，甚至還可能合 ' 在工件尚處於運動狀態時，就進行特定之加工作業' 在此狀況下，從微觀的角度來看，即便這此谨勒非二 • 微小，也勢必會對加工品質造成重大之影^。動非吊 在此前提之下，往彳主必須藉助於適當之定位穿 來加以輔助定位，使加工位置不至於有太大之 1罝 抑或是利用一高精準度與高靈敏度之位置感 ’ 來提供精密之位置量測功能，並在位置偏移^ =置 定標準時，藉由與適當的補償機制來加以控制，於特 件之尺寸與加工位置能夠滿足既定之標準t ，使工 在眾多的位置感測裝置中’由於利用光學感 式之來感測位置之位置感測裝置具備較佳之方 準度，故而廣受所屬技術領域之工作者所青睞= 6 1306149 主流。在習知技術中，常用的光學位置感測系統有水 平掃瞄奈米量測系統與掃瞄曝光系統等。其中，水平 掃瞄奈米量測系統與掃瞄曝光系統係透過光學尺而 對在運動軸向之位移進行補償（compensation)與回饋 (feedback)控制。對於垂直方向之微量位移''則需 要透過一微位移感測器或位置感測器，實際感測俯仰 偏移擺動之偏移量，在經由微奈米制動器加以補償 回饋。 〇σ在習知技術中，微位移感測器通常有渦電流感測 器電谷感測器與單頻光干涉儀（如雷射干涉儀）。 其中，渦電流感測器與電容感測器係藉由量 電J而反推算位移之變異量。在實務運用層面上，$ Ϊί易受到環境溫度、濕度、材質、表面氧化等變里 之ΐΐιϊϊΐ若在開放空間中進行感測，則感測結i 要μ*疋度往往會大過奈米等級之量測精準度 一密閉3 電严感測器與電容感測器通常必須在 準度要^ ^進行感測才能滿足奈米等級之量測精 技術關!儀(以雷射干涉儀為例)之量測 請泉閱第—圖步結;^圖式，提出更詳盡之說明。 之元：酉己置二:C示-種習知基本型雷射干涉儀 距離亦量測—待測位置物件2之位置 1間之距離。位置物件2表面與雷射干涉儀 光源12、—聚田隹射#干/儀1包含有一殼體11、一雷射 反射鏡15盘=13、一平面分光鏡14、—參考 圖所示。^先學感應模組16，其配置方式如第一 在進行待測位置物件2之位置距離量測時，可使 7 1306149 雷射干涉儀1相對於待測 2), 性震動而使雷射干涉儀 f直方向fl〇會因機械 距離產生微小4異:表面間之 2表面上之一待測點p本八田 待測位置物件 p〇間相距-垂直㈣dQG/，雷射干涉儀1與待測點 鏡隹?吏射而t源乂2;所發出之光線會經過聚焦透 m後而沿-水平方向ffiQ而射出= 〇入射光束IL〇會射向平面分光鏡 八二 SP〇，並經過单而八止拉， 刀7^鏡Μ之一分光點1306149 IX. Description of the Invention: [Technical Field] The present invention relates to an optical sensing device that utilizes an incident beam of a multi-frequency mixing to split and illuminate, and senses an object to be measured and a light II Optical device for distance position. & _ [Prior Art] With the development and evolution of the current situation, many products in the processing of dimensional precision, the degree of requirements 'has become more stringent, especially for optoelectronic or micro-electromechanical components In other words, its accuracy often has to meet the requirements of Nai = Grade. However, in the processing of photoelectric or micro-electromechanical components, it is inevitable that the work to be processed must be sent to a specific processing position for processing operations, and even the workpiece is still in motion. In the state, specific processing operations are carried out. In this case, from a microscopic point of view, even if this is a small one, it will inevitably have a significant impact on the processing quality. Under this premise, the lord must use the appropriate positioning to assist in positioning, so that the processing position is not too much or the position of high precision and high sensitivity is used. Provide precise position measurement function, and when the position offset ^ = set standard, by controlling with the appropriate compensation mechanism, the size and processing position of the special parts can meet the established standard t, making the work numerous In the position sensing device, since the position sensing device that senses the position by using the optical sensing has a better degree of accuracy, it is widely favored by workers skilled in the art = 6 1306149 mainstream. In the prior art, commonly used optical position sensing systems include a horizontal scanning nanometer measuring system and a scanning exposure system. Among them, the horizontal scanning nanometer measuring system and the scanning exposure system perform compensation and feedback control on the displacement of the moving axis through the optical scale. For the micro-displacement in the vertical direction, it is necessary to actually sense the offset of the pitch-offset oscillation through a micro-displacement sensor or position sensor, and compensate the feedback through the micro-nano brake. 〇σ In the prior art, micro-displacement sensors typically have an eddy current sensor electric valley sensor and a single frequency optical interferometer (such as a laser interferometer). Among them, the eddy current sensor and the capacitive sensor inversely calculate the variation of the displacement by the electric quantity J. On the practical level of application, $ Ϊί is susceptible to changes in ambient temperature, humidity, materials, surface oxidation, etc. If it is sensed in an open space, the sense junction i should be larger than the nanometer level. The measurement accuracy is a closed 3 electric sturdy sensor and capacitive sensor usually must be in accordance with the accuracy of ^ ^ to be able to meet the nanometer level measurement technology technology! Instrument (with laser interferometer as an example The measurement of the spring please read the first - map step; ^ diagram, put forward a more detailed explanation. The yuan: 酉 置 set two: C shows a kind of conventional basic laser interferometer distance is also measured - the position of the object 2 to be measured position 1 distance. The surface of the position object 2 and the laser interferometer light source 12, - 聚田隹射# dry / instrument 1 comprises a housing 11, a laser mirror 15 disk = 13, a plane beam splitter 14, - as shown in the reference figure. ^ First learn the sensing module 16, the configuration is as follows: when the position distance measurement of the object 2 to be tested is performed, the 7 1306149 laser interferometer 1 can be made to be compared with the 2) to be tested. The interferometer f straight direction fl〇 will be slightly different due to the mechanical distance: one of the surfaces on the surface of the surface to be measured p. The position of the object to be tested is the distance between the objects p〇-vertical (four) dQG/, the laser interferometer 1 and The measuring point mirror 吏 吏 吏 而 t t t ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Single and eight pull, knife 7 ^ mirror one of the light points
、>丨# φ 千面刀先鏡1之分光後，而反射出一I 測先束RL〇與穿透射出一參考 =f 江〇射入平面分光鏡14 ^ ，光束 係相距一量測既雜 ^ :光點处〇與待測點P〇 距離t，H離& ’與參考反射鏡15相距一參考 〇並/、喊體11之底面相距一光軸距離％。 測點ΐ二再量測方向1ν。射向待 穿透Α τΐ : 測量光程Pr“等於2 Γ。)。 15，ϊί 會沿一參考方向、而射向參考反射鏡 之鄭考方向V°之相反方向反射回分光點SP〇 鄰近位置而行進一參考光程pt〇 (等於2砣）。 先，進測里光程ΡΓ〇之量測光束RL〇會在分 2點SPo之鄰近位置與行進參考光程ptQ之參考光束 L〇 ^生干涉，並依據測量光程PrQ與參考光程pt〇 + 光程差DPg (即Dg= Pr。—Pt。）而發出- α "束IFL〇。最後，干涉光束ifLq會沿一干涉輸 而射向光學感應模組16，光學感應模組16 可依據所感測到之干涉光束IFLg之干涉條紋數量與 干涉光束IFL〇之強度而計算出光程差dp〇，並藉由 1306149 D〇= Pr〇 — Pt〇而求得測量光程Pr〇與參考光程Pt〇間之 相對關係。 在實務運用層面上，由於光軸距離a〇與參考距離 t〇可藉由雷射干涉儀1在進行上述量測前之自我標準 化校正而得知其值，加以上述之光程差DP〇可藉由上 述量測方式而得知。因此，利用上述關係可求得待測 之垂直距離d。等於（l/2DPQ+tO-a〇)。 舉凡在所屬技術領域具有通常知識者皆能理 解，雷射干涉儀1亦可只用於量測待測位置物件2表 面與分光點SPG之距離即可，亦即以量測距離rG為量 測標的。故在進行上述量測前，只需執行參考距離t〇 之自我標準化校正即可，而不必進行光軸距離a〇之設 定或自我標準化校正。此時，所欲求得知量測距離r0 等於（l/2DP〇+t〇)。 同時，舉凡在所屬技術領域具有通常知識者皆能 理解，在實際進行待測位置物件2表面與雷射干涉儀 1間之距離量測時，會以快速掃描之方式感測待測位 置物件2表面上之多個點，亦即使雷射干涉儀1沿掃 瞄方向I 〇快速移動，利用上述方式快速地對待測位 置物件2表面上之多個待測點進行感測，然後再將多 個待測點所感測之距離位置予以平均而得到一平均 值與一最大變異值（或標準差），並利用該平均值與 該最大變異值（或標準差）來代表行待測位置物件2 之距離位置。 然而，為了提升掃瞄效率，通常會將掃瞄速率增 加至特定之程度，但如此一來，則極有可能會因此而 產生錯誤估算或漏算干涉條紋之情事，而導致量測結 果失真同時，若干涉條紋之非完全建設性干涉，甚至 9 1306149 是為相消性干涉時，則干涉條紋會變得比較不明顯而 不易解析。此外，在量測過程中亦容易產生光斑，且 部分之干涉條紋可能會落在感測範圍之外，並因而對 量測結果在認定上容易造成誤判。再者，由於利用雷 射干涉儀1所量測之光程差光程差DP〇在微觀的系統 中，通常相對地顯得很大’對於光波波長之影響也隨 之變得很大，因此必須藉助適當之穩頻裝置來&制頻 率（同時也控制波長），來將解析度提升至夺米等級, > 丨# φ Thousand-faced knives 1 after the splitting, and reflect a I measured first beam RL 〇 and through the transmission of a reference = f Jiang 〇 injection plane beam splitter 14 ^, the beam system is measured by a distance Both the intersection of the spot and the point to be measured P, t, H, & ' are spaced apart from the reference mirror 15 by a reference 〇 and /, the bottom surface of the body 11 is separated by an optical axis distance %. The measuring point 再 second measures the direction 1ν. The shot is to be penetrated Α τΐ : The measurement path Pr is “equal to 2 Γ.). 15, ϊί will be reflected back to the split point SP〇 in the opposite direction of the reference direction of the reference mirror V° in a reference direction. Position and travel a reference optical path pt 〇 (equal to 2 砣). First, the measuring beam RL 进 of the optical path 进 in the measurement will be in the vicinity of the 2 points of the Po and the reference beam L 行进 the reference optical path ptQ ^ Interference, and according to the measuring optical path PrQ and the reference optical path pt 〇 + optical path difference DPg (ie Dg = Pr. - Pt.) - - α " beam IFL 〇. Finally, the interference beam ifLq will follow an interference And the optical sensor module 16 can calculate the optical path difference dp〇 according to the intensity of the interference fringe IFLg and the intensity of the interference beam IFL〇, and the optical path difference dp〇 is calculated by 1306149 D〇= Pr〇—Pt〇 obtains the relative relationship between the measurement optical path Pr〇 and the reference optical path Pt〇. At the practical application level, since the optical axis distance a〇 and the reference distance t〇 can be obtained by the laser interferometer 1 Perform self-normalization correction before the above measurement to know the value, and add the above optical path DP〇 can be known by the above measurement method. Therefore, the above-mentioned relationship can be used to obtain the vertical distance d to be measured, which is equal to (l/2DPQ+tO-a〇). Those who have common knowledge in the technical field are all It can be understood that the laser interferometer 1 can also be used only for measuring the distance between the surface of the object 2 to be tested and the spectroscopic point SPG, that is, measuring the distance rG as a quantity, so before performing the above measurement, It is only necessary to perform self-normalization correction of the reference distance t〇 without setting the optical axis distance a〇 or self-normalization correction. At this time, the desired measurement distance r0 is equal to (l/2DP〇+t〇). At the same time, those who have common knowledge in the technical field can understand that when the distance between the surface of the object 2 to be tested and the laser interferometer 1 is actually measured, the object to be tested is sensed by rapid scanning. 2 a plurality of points on the surface, even if the laser interferometer 1 moves rapidly in the scanning direction I ,, the plurality of points to be measured on the surface of the object 2 to be measured are quickly sensed by the above method, and then more Distance sensed by the point to be measured The average is obtained to obtain an average value and a maximum variation value (or standard deviation), and the average value and the maximum variation value (or standard deviation) are used to represent the distance position of the object 2 to be tested. However, in order to improve Scanning efficiency usually increases the scanning rate to a certain extent, but as a result, it is highly probable that an erroneous estimation or missing interference fringe will result, and the measurement result will be distorted at the same time, if the interference fringe Non-constructive interference, even if 9 1306149 is for destructive interference, the interference fringes will become less obvious and not easy to resolve. In addition, the spot will be easily generated during the measurement process, and some of the interference fringes may be It falls outside the sensing range, and thus the measurement result is easily misjudged in the determination. Furthermore, since the optical path difference DP 量 measured by the laser interferometer 1 is relatively large in a microscopic system, the influence on the wavelength of the light wave becomes large, so it is necessary to Increase the resolution to the meter level with the appropriate frequency stabilization device & frequency (also control the wavelength)
【發明内容】 本發明所欲解決之技術問題與目的： —綜觀以上所述，吾人深體在習知技術中， =次，行量測前皆必須進行自我標準化校正子二二 :結果容以真，不易解析’容易造成誤判， 以及必須增加製作成本等問題。 、SUMMARY OF THE INVENTION The technical problems and objects to be solved by the present invention are as follows: - As far as the above is concerned, in the prior art, in the prior art, the self-standardization syndrome must be performed before the measurement. Really, it is not easy to analyze 'prone to misjudgment, and must increase production costs and other issues. ,
緣此，本發明之主要目的係提供一 位置感測裝置，其係利用多頻混人^ ^式巨離 於㈣> 、，使干涉光線產生明顯而易 於辨减之干涉波包，亚依據干涉波包之 待測位置物件之絕對距離位置。 求付一Accordingly, the main object of the present invention is to provide a position sensing device which utilizes a multi-frequency mixing method to generate an interference wave packet which is distinctly and easily discernible, and is based on interference. The absolute distance position of the object to be tested in the wave packet. Pay for one
本發明之次一目的係提一與 =J置，其係用以感測一待測位置物丁: :J 絕對距離位置。在該裝置中，係預先= iii而在感測裝置中對應建立—組對應之二維i 不I明之另一 Η叼你提供一種光學 感測裝置，其卿感測-待敎置=== 10 1306149 置間之一絕對距離位置。在 表ΐ之參考反射組件x取代習知技術中ίίί 反射鏡，#以增加光學感測之量測範圍。，考 本發明解決問題之技術手段： r係ί m習知技術之問題所採用之技術手 =測裝置係用以感測=置置:以 混合光源（特別是多頻混合多頻 元件…先成二仏ί =件其與中一 74光數束個與心 ίϊΐίΐ光程，並依據量測光程與上述=ϊί 成之複數個 相等者定ϊί=; J J J J先】呈中，與量測光程間 程之參考光束與行進量測光程^考光 光束時，會產生—干涉波包。最後 風：j 杈組感應干涉光束之干涉波包位》 位置而計算出上述之絕對轉位置。城據干涉波包 在本發明較佳實施例中，# M 依據上述之參考光程而在感測C中t組上係預$ 之二維轉換座標，在二維轉換座=立-組對應 二維轉換座標之其:干：波，所在位置落於 、甲 置野表不量測光程等於該 1306149 位置所對應之臨界參考光程，故可藉由干涉波包之所 在位置而求得該量測光程，並據以計算出上述之絕對 距離位置。此外，複數個反射表面可進一步以傾斜交 錯漸層併排之方式加以配置。 本發明對照先前技術之功效： 由以上所述可知，由於本發明係利用感測多頻混 ' 合光源（特別是多頻混合白光光源）所發出之光束在 干涉時可產生明顯而容易辨識之干涉波包的特性，進 • 而利用干涉光束之干涉波包位置來計算出一待測位 置物件之絕對距離位置，且干涉波包之位置遠較習知 技術中之每個單一干涉條紋更為明顯而易於觀察，也 無須計算干涉條紋之數量，因此可同時解決上述之量 測結果容易失真，不易解析，容易造成誤判，以及必 須增加製作成本等問題。 此外，由於本發明之二維轉換座標係依據上述之 , 參考光程而建立，具備有極高精準度與穩定性，因此 只需在初次使用時進行一次初始化校正，即可連續使 Φ 用很多次而仍舊能保持合乎奈米等級要求之高精準 度，而不必在每次進行量測之前都進行自我標準化校 正，藉以提升操作上之便利性。同時，由於上述之複 數個反射表面可進一步以傾斜交錯漸層併排之方式 加以配置，因此可有效增加光學感測之量測範圍。 本發明所採用的具體實施例，將藉由以下之實施 例及圖式作進一步之說明。 12 1306149 【實施方式】 =於本發明所提供之光學式距離位置感測裝置 可於多種光學測距裝置、設備與系統，其組 合實施方式更是不勝枚舉，故在此不再一一贅述，僅 列舉其中較佳之二實施例來加以具體說明。 . 你閱第二圖至第五圖’第二圖係顯示本發明第 . 配置示意圖與距離位置感測技術，第 三圖係顯1本發明第-實施财之參考反射组件配 置關係不意圖’第四圖係顯示本發明第一實施例中之 • 參考反射組件之立體外觀示意圖，第五圖係顯示本發 明第一實施例中之二維轉換座標之示意圖。如圖所 示，一光ί式距離位置感測裝置（以下簡稱感測裝置） 3亦^以量測上述待測位置物件2之絕對位置距離， 亦即3:測該待測位置物件2表面與感測裝置3間之距 離。 感測裝置3包含有一殼體31、一多頻混合光源 ' 32 (在本實施中特別指一多頻混合白光光源）、一透 . 鏡組件33、一光圈34、一分光元件（在本實施例中 13 1 係二平面分光鏡35 )、一參考反射組件36與一光學感 應杈組37。透鏡組件33包含有一第一聚焦透鏡33卜 一第二聚焦透鏡332、一第三聚焦透鏡333、一第四 攻焦透鏡334與一第五聚焦透鏡335。光圈34具備有 一穿孔341。 參考反射組件36具備—基準面與第一數量 (Μ )個長條狀反射鏡，各長條狀反射鏡分別具備有 —反射表面，故共有Μ個反射表面，同時，Μ個長 條狀反射鏡係以Μ個支撐元件。在本實施例中，Μ 等於4’亦即參考反射組件36包含四個傾斜交錯漸層 1306149 ^iiTimVe6^ 363 ^364 ^χ 四個傾叙六Λ36、362、363與364分別對應地具有 盥364父曰漸層併排之反射表面361a、362a、363a 盥364 i同時’四個長條狀反射鏡361、362、363 主、=，以四個支撐元件365、366、撕與篇予以 (C牙ha:;光學感應模組37包含-線電荷耦合器 元 372geC〇UPledDevice，CCD) 371 與一運算處理單 量測Ϊ進職置物件2所處之—_位置距離之 =感測裝置3相對於該待測位置物件2而 或待測1 1進行掃目苗移動（可移動感測裝置3 會因機赫3件2)’在掃描過程中，在—垂直方向I =動而使感測*置3與待測位置物件2表 置物件2 #產生微^之變異量。當其掃目肖至—待測位 測點面上之一待測，點Pl日夺，感測裝置3與待 剧點Pi間相距一垂直距離山。 -聚多頻混合光源32所發出之光線會經過第 透鏡^?豸】31之聚焦成平行光束，並經過第二聚焦 之聚焦而穿透光圈34之穿孔341，最後再經 =入二透鏡333而聚焦成沿一水平方向mi射出 之一八，束1Ll。入射光束1Ll會射向平面分光鏡35 射出點、SP1，並經過平面分光鏡35之分光後，反 入射朵i測光束RL1與穿透射出—參考光束孔1。在 、>m p ti1射入平面分光鏡35時，分光點奶與待 ，36 . 底面相距:光_= 離&，並與殼體31之 束叫會沿一量測方向^射向待測點 5再沿置測方向之相反方向反射回分光點sp] 14 1306149 之鄰近位置而行進一測量光程Pr!(等於2 q )。參考 光束TL!會沿一參考方向Vi而射向參考反射組件36 中之四個反射表面361a、362a、363a與364a，並沿 參考方向乂！之相反方向反射回分光點鄰近位 置而行進複數個不同之參考光程，並且與測量光程 Pqi間分別差距複數個不同之光程差。 在複數個不同之參考光程中，與測量光程卩^相 等者，定義為一臨界（critical)參考光程Pt!。同時， 在上述複數個不同之光程差中，臨界參考光程Ph與 測量光程Pr!間之差距為零者，可定義為一零光程 差。在參考光束Th行進臨界參考光程Ph時，分光 點SP!與參考光束TL!射入參考反射組件36處係相 距一臨界參考距離U，亦即臨界參考距離等於1/2 倍之臨界參考光程Ph。 在本實施例中，上述之基準面RS!係與該參考方 向V!相互垂直，參考反射組件36中第一個長條狀反 射鏡361之一端係以支撐元件365予以支撐固定，第 一個反射表面361a與基準面RS丨間之距離，係自其 一端與基準面RSi相切齊，而逐漸遞增至另一端與基 準面RS!相距一單位偏移距離Δ。 在上述四個長條狀反射鏡361中，第二數量（N， 在本實施例中N介於2與4之間，且包含2與4)個 長條狀反射鏡之兩端係分別以第N-1個與第N個支撐 元件予以支撐固定，使第N個反射表面與基準面RS1 間之距離，係自其一端與基準面RS!相距N-1倍單位 偏移距離A，而逐漸遞增至另一端與基準面RSi相距 N倍單位偏移距離A。 譬如，第四（即N等於4)個長條狀反射鏡364 15 1306149 之兩端係分別以第三個支撐元件367與第四個支撐元 =368予以支撐固定，使第四個反射表面364&與基 準面叫間之距離’係自其—端與基準面叫相距三 倍單位偏移距離△(即3Λ)，而逐漸遞增至另—端與 基準面RS丨相距四倍單位偏移距離△(即4Δ)。 • 由以上參考反射組件36中之四個反射表面 361a、362a、363a與364a間之相對位置可知，臨界 ' 參考距離丨1可介於與之間，亦即臨界參 考光程Pt〗可介於（2t1(r8A )與2ti〇之間。 ❿ 其中’當臨界參考光程Pt!介於（2t10-2A)與2t10 之間時，表示參考光束TLi係沿參考方向Vl而射向 參考反射組件36中之第一個反射表面361a。當臨界 參f光程Pq介於（2t1(r4A)與（2t10-2A)之間時， 表示參考光束TL1係沿參考方向v i而射向參考反射 組件36中之第二個反射表面362a。當臨界參考光程 Pti介於（2t1(r6A)與（2t10-4A)之間時，表示參考 光束TL1係沿參考方向V1而射向參考反射組件3 6中 之第三個反射表面363a。當臨界參考光程pti介於 φ (2ti〇-8A)與（2t1(r6A)之間時，表示參考光束tl! 係沿參考方向Vi而射向參考反射組件36中之第四個 反射表面364a。 接著，自待測位置物件2所反射之量測光束RL! 與自參考反射組件36所反射之參考光束TL!係在平 面分光鏡35之分光點SP〗之鄰近位置處開始產生干 涉’並依據量測光程Pr!與上述複數個參考光程間之 差距所分別形成之複數個不同之光程差，而沿一干涉 輸出方向VI〗射出至少一干涉光束IF、。 干涉光束IFLi會經過第四聚焦透鏡334與第五 16 1306149 聚焦透鏡335之聚焦後，被線CCD 371所感測。其 中，在行進臨界參考光程之參考光束TL!與行進 量測光程Pr!之量測光束RL!產生該干涉光束ifl! 時，會產生一干涉波包IFC (標示於第五圖），運算 處理單元372可依據線CCD 371所偵測感應干涉波 包IF C之所在位置而計算該待測位置物件2所處之絕 對距離位置。 以下’吾人在進一步揭露本發明如何依據線CCD 371所偵測感應該干涉波包IFC之所在位置而計算該 絕對距離位置。如第五圖所示，光學感應模組37係 依據與上述複數個不同之參考光程而建置有一組二 維轉換座標373，二維轉換座標373係由一 X方向模The second object of the present invention is to add a value of =J, which is used to sense a position to be measured: :J absolute distance position. In the device, the optical sensing device is provided in advance in the sensing device corresponding to the two-dimensional i, which is corresponding to the group-setting, and the sensing device is set to be set === 10 1306149 One of the absolute distance positions. In the reference frame, the reference reflection component x replaces the conventional technique ίίί mirror, # to increase the measurement range of optical sensing. The technical means for solving the problem in the invention: r system ί m technology used in the technical hand = measuring device is used for sensing = placement: mixed light source (especially multi-frequency hybrid multi-frequency components... first Two 仏ί = a piece of light with a medium and a light beam, and according to the measuring optical path and the above = ϊί into a plurality of equals ϊ = = JJJJ first] in the middle, with the measurement light When the reference beam of the inter-process path and the traveling optical path of the optical path are measured, the interference wave packet is generated. Finally, the absolute wave position is calculated by the position of the interference wave packet of the sensing group of the interference beam. According to the preferred embodiment of the present invention, #M is based on the reference optical path described above, and the two-dimensional conversion coordinates of the pre-$ are grouped in the sensing C, in the two-dimensional conversion block = the vertical-group correspondence The two-dimensional conversion coordinates are: dry: wave, where the position is located, and the field measurement range of the field is equal to the critical reference path of the 1306149 position, so it can be obtained by the position of the interference wave packet. The optical path is measured and the absolute distance position described above is calculated. The plurality of reflective surfaces can be further configured in a staggered alternating layer side by side. The present invention compares the effects of the prior art: As can be seen from the above, since the present invention utilizes a sensing multi-frequency mixing light source (especially multi-frequency The beam emitted by the hybrid white light source can produce a characteristic of the interference wave packet which is clearly and easily recognized when interfering, and the interference wave packet position of the interference beam is used to calculate the absolute distance position of the object to be measured, and the interference The position of the wave packet is far more obvious than that of the single interference fringe in the prior art, and it is easy to observe, and it is not necessary to calculate the number of interference fringes, so that the above measurement results can be easily solved at the same time, which is easy to be distorted, difficult to analyze, and easily cause misjudgment. In addition, since the two-dimensional conversion coordinate of the present invention is established according to the above-mentioned reference optical path, it has extremely high precision and stability, so that it is only necessary to perform an initialization correction when it is used for the first time. , can continuously make Φ many times and still maintain the high precision required by the nano level It is not necessary to perform self-normalization correction before each measurement, thereby improving the convenience of operation. At the same time, since the plurality of reflective surfaces described above can be further arranged in a diagonally staggered layer by side, the optical can be effectively increased. The measurement range of the sensing. The specific embodiments used in the present invention will be further illustrated by the following embodiments and drawings. 12 1306149 [Embodiment] = Optical distance position sensing provided by the present invention The device can be used in a variety of optical distance measuring devices, devices and systems, and the combined implementation thereof is also numerous, so it will not be repeated here, and only the preferred two embodiments are specifically described. Figure 5 to Figure 5, the second diagram shows the configuration diagram of the present invention and the distance position sensing technology, and the third diagram shows that the reference reflection component configuration relationship of the first implementation of the present invention is not intended to be shown in the fourth figure. A perspective view of a stereoscopic appearance of a reference reflection assembly in a first embodiment of the present invention, and a fifth diagram showing a two-dimensional conversion in the first embodiment of the present invention Schematic diagram of the coordinates. As shown in the figure, a light-illuminated distance position sensing device (hereinafter referred to as a sensing device) 3 also measures the absolute position distance of the object 2 to be tested, that is, 3: measures the surface of the object 2 to be tested. The distance from the sensing device 3. The sensing device 3 includes a housing 31, a multi-frequency hybrid light source '32 (in this embodiment, particularly a multi-frequency hybrid white light source), a lens assembly 33, an aperture 34, and a beam splitting component (in this embodiment) In the example, 13 1 is a two-plane beam splitter 35 ), a reference reflection component 36 and an optical sensing group 37 . The lens assembly 33 includes a first focus lens 33, a second focus lens 332, a third focus lens 333, a fourth focus lens 334 and a fifth focus lens 335. The aperture 34 is provided with a through hole 341. The reference reflection unit 36 has a reference plane and a first number of (Μ) strip mirrors, each of which has a reflective surface, so that there are a plurality of reflective surfaces, and at the same time, a long strip of reflection The mirror system has a support element. In the present embodiment, Μ is equal to 4', that is, the reference reflection component 36 includes four oblique staggered gradations 1306149 ^ iiTimVe6^ 363 ^ 364 ^ χ four narration six Λ 36, 362, 363 and 364 respectively have 盥 364 The father 曰 progressively side by side reflective surfaces 361a, 362a, 363a 盥 364 i at the same time 'four long strip mirrors 361, 362, 363 main, =, with four support elements 365, 366, tear and article (C teeth Ha:; optical sensing module 37 includes - line charge coupler element 372geC〇UPledDevice, CCD) 371 and an arithmetic processing unit for measuring the position of the workpiece 2 - position distance = sensing device 3 relative to The object 2 to be tested or the object to be tested is 1 1 to perform the moving of the eye-catching seed (the movable sensing device 3 will be 3 pieces of the machine 2) 2 during the scanning process, in the vertical direction I = moving to make the sensing * Set 3 and the object to be tested 2 to set the object 2 # to generate the variation of the micro ^. When it is swept away, one of the measuring points on the measuring point is to be tested, and the point P1 is taken away, and the sensing device 3 is separated from the to-be-pointed point Pi by a vertical distance. The light emitted by the poly-multi-frequency hybrid light source 32 is focused into a parallel beam by the lens 31, and passes through the second focus to penetrate the aperture 341 of the aperture 34, and finally passes through the second lens 333. And focusing to one of eight shots along a horizontal direction, the bundle 1Ll. The incident beam 1L1 is directed to the exit point of the plane beam splitter 35, SP1, and after being split by the plane beam splitter 35, the incident beam RL1 is reflected and transmitted through the reference beam aperture 1. When >mp ti1 is incident on the plane beam splitter 35, the splitting point milk is at a distance from the bottom surface: 36. The light is _= away from & and the bundle with the housing 31 is shot along a measuring direction. The measuring point 5 is then reflected back in the opposite direction of the measuring direction back to the vicinity of the splitting point sp] 14 1306149 and travels a measuring optical path Pr! (equal to 2 q ). The reference beam TL! will be directed toward the four reflective surfaces 361a, 362a, 363a and 364a of the reference reflection assembly 36 in a reference direction Vi and in the reference direction! The opposite direction is reflected back to the vicinity of the splitting point to travel a plurality of different reference optical paths, and is separated from the measuring optical path Pqi by a plurality of different optical path differences. In a plurality of different reference optical paths, the measurement optical path 等^ is defined as a critical reference optical path Pt!. Meanwhile, in the above plurality of different optical path differences, the difference between the critical reference optical path Ph and the measuring optical path Pr! is zero, which can be defined as a zero optical path difference. When the reference beam Th travels the critical reference optical path Ph, the splitting point SP! is spaced from the reference beam TL! into the reference reflection component 36 by a critical reference distance U, that is, the critical reference distance is equal to 1/2 times the critical reference light. Cheng Ph. In this embodiment, the reference plane RS! is perpendicular to the reference direction V!, and one end of the first elongated mirror 361 of the reference reflection assembly 36 is supported and fixed by the support member 365, the first one. The distance between the reflecting surface 361a and the reference plane RS丨 is tangent to the reference plane RSi from one end thereof, and gradually increases to the other end by a unit offset distance Δ from the reference plane RS!. In the above four strip mirrors 361, the second number (N, in the present embodiment, N between 2 and 4, and including 2 and 4) of the strip mirrors are respectively The N-1th and Nth support members are supported and fixed such that the distance between the Nth reflective surface and the reference plane RS1 is N-1 times the unit offset distance A from the reference plane RS! Gradually increasing to the other end from the reference plane RSi by N times the unit offset distance A. For example, the fourth (ie, N equal to 4) strip mirrors 364 15 1306149 are supported at both ends by a third support member 367 and a fourth support member = 368, respectively, such that the fourth reflective surface 364 & The distance from the reference surface is 'from its end to the reference surface three times the unit offset distance △ (ie 3Λ), and gradually increases to the other end and the reference plane RS丨 four times the unit offset distance △ (ie 4 Δ). • From the relative position between the four reflective surfaces 361a, 362a, 363a and 364a of the above reference reflective component 36, the critical 'reference distance 丨1 can be between and between, that is, the critical reference optical path Pt can be between (between 2t1(r8A) and 2ti〇. ❿ where 'when the critical reference optical path Pt! is between (2t10-2A) and 2t10, it means that the reference beam TLi is directed to the reference reflection component 36 along the reference direction V1. The first reflective surface 361a. When the critical reference optical path Pq is between (2t1(r4A) and (2t10-2A), the reference beam TL1 is directed to the reference reflection component 36 along the reference direction vi. The second reflective surface 362a. When the critical reference optical path Pti is between (2t1(r6A) and (2t10-4A), it indicates that the reference beam TL1 is incident on the reference reflection component 36 along the reference direction V1. The third reflective surface 363a. When the critical reference optical path pti is between φ (2ti 〇 -8A) and (2t1 (r6A), it indicates that the reference beam tl! is incident on the reference reflection component 36 along the reference direction Vi. The fourth reflecting surface 364a. Next, the measuring beam RL! and self-parameter reflected from the object 2 to be tested The reference beam TL! reflected by the reflection component 36 starts to generate interference at a position adjacent to the splitting point SP of the plane beam splitter 35, and is formed according to the difference between the measurement optical path Pr! and the plurality of reference optical paths. a plurality of different optical path differences, and at least one interference beam IF is emitted along an interference output direction VI. The interference beam IFLi passes through the focusing of the fourth focusing lens 334 and the fifth 16 1306149 focusing lens 335, and is then line CCD 371 sensed, wherein an interference wave packet IFC is generated when the interference beam ifl! is generated by the reference beam TL! of the traveling critical reference optical path and the measuring beam RL! of the traveling optical path Pr! 5)), the operation processing unit 372 can calculate the absolute distance position of the object 2 to be tested according to the position of the induced interference wave packet IF C detected by the line CCD 371. The following is a further disclosure of the present invention. The absolute distance position is calculated by detecting the position of the interference wave packet IFC detected by the line CCD 371. As shown in the fifth figure, the optical sensing module 37 is based on a plurality of different reference optical paths. Build a group of two-dimensional coordinate converter 373, converts the two-dimensional coordinate system 373 by an X direction die
擬橫座標xm與一 z方向模擬縱座標Zm<>x方向模揭 橫座標Xm上之一單位長度UXq係對應於上述四個屈 射表面361a、362a、363a與364a中，任音一者之寅 度。z方向模擬縱座標21〇上之一單位長度\Zq表示上 述=個反射表面361a、362a、363a與364a在第三匿 至第四圖中Z方向的單位解析等分。 在本實施例中，有四個反射表面361a、362a、363; 與364^’故分別對應地以四個模擬區間瓜❹〜^^來表 在Z方向之解析等分為五，故以分 = 。，表示。因此二維轉換= 雙=間，及解析區間”4分割為二十伯 二實；解割區間係分別代表不同之參考为 =擬區間叫中’表示 遞增至知。在‘ 1 丁衣不參考光私係自 逐漸線性遞減至(―。在;為擬 17 1306149 ^考光程係自縱座標為零處之（2ti(r6A)，逐漸線性 遞增至（2t10-4A)。在模擬區間爪3中，表示參考光程 f自縱座標A零處之（2t10-6A )，逐漸線性遞減至 (2tIG_8A)，其中，最大參考距離&與單位偏移距離 △皆在建構感測裝置3時已預先知其數值，故皆為 知之定值。 在第五圖中’干涉波包IFC係出現在模擬區間 * m2與解析區間113所對應之分割區間。表示臨界參考 光程 Pt〗介於 2ί1()-6Δ+ (3/5) (2Δ)與 2t1(r6A+ (4/5) • (2Δ)之間，也就是 Ptl 介於（2t10-4.8A)與（2t1(r4.4A) 之間。在實務運用時，可取中間值作為代表值，故在 本實施例中，臨界參考光程Ptl即等於（2〜_4 6δ)。 換以言之，測量光程Pri也就是等於（2ti()_4.6A)，亦 即量測距離r!等於（t10-2.3A)。 在實務運用層面上，由於光轴距離ai可藉由在組 裝感測裝置3時預先設定，或在進行上述量測前之利 * 用自我標準化校而得知其值，故可利用量測距離Γι 減去光軸距離a!而得知垂直距離山’藉以確認待測 _ 位置物件2之絕對距離位置。同時，上述之二維轉換 座標373通常係建置在371線CCD 371中，藉以直 接感測出干涉波包IFC所在之對應位置。 舉凡在所屬技術領域具有通常知識者皆能理 解，感測震置3亦可只用於量測待測位置物件2表面 與分光點SP〗之距離即可，亦即以量測距離η定義上 述之待測位置物件2所在之絕對距離位置。此時，可 直接以量測距離ri等於（tlG_2.3A)來表示待測位置 物件2所在之絕對距離位置而不必進行光軸距離心 之設定或自我標準化校正。 1 18 1306149 拽紘舉ίΐ所屬技術領域具有通常知識者亦可輕易 量測時，會以快速掃描之方式感= 立置3 上之多個點，亦即使感測裝置3沿丄ϊ 用上述方式快逮地對待測位置物 測點所感敎距齡置予以平均而得到 一最大變異值（或標準差），並利用兮 ；； 大變異值“戈則來代表行待 對距離位置。 直初忏2之絕 =以上敘述之後’舉凡在所屬技術領 通韦知識者更能輕易王里解，若將每—個反射表八 割為2048個解析區間（亦即個掃描解析 刀 刪”4個受到外界干擾較大之解析區：)， 3 母 射表面則可分割為2_個解析 ^乎::零::差:置精確至次像素，使解:度ϊ ^ ； ί ΐ6 〇 (： ；r^ f； 0：：；^ * ^ ^ ^ ^ ® 離之實際量測範圍達8 〇 _。 ，、即上述！測距 U = 亦=實=中所使用 照上述傾斜交錯漸層併排之方，士疋—千個，並且依 =範圍可分別大幅增加至。8=置如藉以將量 _)之大量測範圍來量測上述之絕甚置至疋 ，外^上述之待測位置物件 t才能獲得較佳之反射效果。因此， 19 1306149 之待測位置物件2係以採用具備光滑表面之一光學平 板為宜。 一每请參閱第六圖至第八圖，第六圖係顯示本發明第 二實施例^元件配置示意圖與距離位置感測技術，第 七圖，顯不本發明第二實施例中之參考反射組件配 置關係示意圖，第八圖係顯示本發明第二實施例中之 參考反射組件之立體外觀示意圖。如圖所示，一光學 ，距離位置感測裝置（以下簡稱感測裝置）4亦用以 量測上述待測位置物件2之絕對位置距離，亦即量測 該待測位置物件2表面與感測裝置4間之距離。 感測裝置4包含有一殼體41、一多頻混合光源 42 (在本實施中特別指一多頻混合白光光源）、一透 鏡組件43、一光圈44、一分光元件（在本實施例中 係一平面分光鏡45)、一參考反射組件46與一光學感 應模組47。透鏡組件43包含有一第六聚焦透鏡43卜 一第七聚焦透鏡432、一第八聚焦透鏡433、一第九 聚焦透鏡434與一第十聚焦透鏡435。光圈44具備有 一穿孔441。 八 參考反射組件46具備一基準面與第三數量 (P )個長條狀反射鏡，各長條狀反射鏡分別具備有 一反射表面，故共有P個反射表面，同時，p個長條 狀反射鏡係以P個支撐元件。在本實施例中，p等於 4,亦即參考反射組件46包含四個傾斜交錯漸層併排 之長條狀反射鏡461、462、463與464，且四個長條 狀反射鏡46卜462、463與464分別對應地具有四個 傾斜父錯漸層併排之反射表面461a、462a、463a與 464a。同時，四個長條狀反射鏡461、462、463與464 係以四個支撐元件465、466、467與468予以支撐固 定。光學感應模組47包含—線CCD471與一運算處 20 1306149 理單元472。 在、行苻測位置物件2所處之一絕 量測日ί，⑽測裝置4相對於該待測位置 沿-掃r田方向ι2進行掃晦移動 或待測位置物件2)，在掃描過程中，在一置4 會因機械性震動而使感測裝置4與待測位置物\ 2 面間之距離產生微小之變異量。當其掃目结至_待測^ 置物件2表面上之-待測點p2時’感測裝置4盘 測點P2間相距一垂直距離d2。 〃 τThe unitary length UXq of the pseudo-horizontal xm and the z-direction analog ordinate Zm<x-direction mode relief abscissa Xm corresponds to the above four refracting surfaces 361a, 362a, 363a and 364a, one of the sounds寅 degree. One unit length \Zq on the z-direction analog ordinate 21 表示 indicates that the above-mentioned one reflective surface 361a, 362a, 363a, and 364a is equally divided into units in the Z direction from the third to fourth figures. In this embodiment, there are four reflective surfaces 361a, 362a, and 363; corresponding to 364^', respectively, the four analog intervals are divided into five, and the analysis in the Z direction is equally divided into five, so = . , said. Therefore, the two-dimensional transformation = double = between, and the analytical interval "4 divided into twenty-two real; the cut-off interval represents different reference == the pseudo-interval is called 'increase to know.' The light private system gradually decreases linearly to (“. in; for the 17 1306149 ^ test optical path from the ordinate to zero (2ti (r6A), gradually linearly increasing to (2t10-4A). In the simulation interval claw 3 In the meantime, the reference optical path f from the ordinate A is zero (2t10-6A), and gradually decreases linearly to (2tIG_8A), wherein the maximum reference distance & and the unit offset distance Δ are all at the time of constructing the sensing device 3 In the fifth figure, the 'interference wave packet IFC system appears in the division interval corresponding to the simulation interval * m2 and the analysis interval 113. The critical reference optical path Pt is between 2 ί1 ( ) -6Δ+ (3/5) (2Δ) and 2t1 (r6A+ (4/5) • (2Δ), that is, Ptl is between (2t10-4.8A) and (2t1(r4.4A)). In practical practice, the intermediate value can be taken as the representative value, so in the present embodiment, the critical reference optical path Ptl is equal to (2~_4 6δ). The optical path Pri is also equal to (2ti()_4.6A), that is, the measuring distance r! is equal to (t10-2.3A). At the practical application level, since the optical axis distance ai can be assembled by the sensing device 3 When pre-setting, or before the above measurement, the value is known by self-standardization, so the distance aι can be subtracted from the optical axis distance a! and the vertical distance is determined by the mountain to confirm the test _ The absolute distance position of the position object 2. At the same time, the above-mentioned two-dimensional conversion coordinate 373 is usually built in the 371 line CCD 371, thereby directly sensing the corresponding position of the interference wave packet IFC. It can be understood that the sensing vibration 3 can also be used only for measuring the distance between the surface of the object 2 to be tested and the light-splitting point SP, that is, the measuring distance η defines the above-mentioned object 2 to be tested. Absolute distance position. At this time, the absolute distance position where the object 2 to be tested is located can be directly represented by the measurement distance ri equal to (tlG_2.3A) without setting the optical axis distance or self-normalization correction. 1 18 1306149 拽纮举ΐΐTechnical field If there is a general knowledge, it can be easily measured, and it will be sensed by a quick scan = a plurality of points on the stand 3, even if the sensing device 3 is in the above manner, the sense of the position measurement point is quickly grasped. The 敎 distance is averaged to obtain a maximum variability (or standard deviation), and 兮;; large variability value "Ge Zee to represent the distance to the distance. Straight 忏 2 = = after the above description Those who are familiar with the technology can easily solve the problem. If each reflection table is cut into 2048 resolution intervals (that is, one scan analysis knife is deleted), four resolution areas that are subject to external interference:), 3 The maternal surface can be divided into 2_ parsing ^::zero::difference: set to the nearest sub-pixel, so that the solution: degree ϊ ^ ; ί ΐ6 〇(: ; ;r^ f; 0::;^ * ^ ^ ^ ^ ® The actual measurement range is up to 8 〇 _. , that is, the above! Ranging U = also = real = used in the above-mentioned oblique staggered gradual side by side side, gentry - thousand, and depending on the range can be significantly increased to. 8=Setting a large amount of measurement range of the quantity _) to measure the above-mentioned ones to the top, and the above-mentioned object to be tested can obtain a better reflection effect. Therefore, the object 2 to be tested at 19 1306149 is preferably an optical plate having a smooth surface. Referring to FIG. 6 to FIG. 8 respectively, the sixth figure shows a second embodiment of the present invention, a component arrangement diagram and a distance position sensing technique, and a seventh diagram, which shows a reference reflection in the second embodiment of the present invention. FIG. 8 is a schematic diagram showing the stereoscopic appearance of the reference reflection component in the second embodiment of the present invention. As shown in the figure, an optical distance detecting device (hereinafter referred to as a sensing device) 4 is also used for measuring the absolute position distance of the object 2 to be tested, that is, measuring the surface and feeling of the object 2 to be tested. The distance between the devices 4. The sensing device 4 includes a housing 41, a multi-frequency hybrid light source 42 (specifically, a multi-frequency hybrid white light source in the present embodiment), a lens assembly 43, an aperture 44, and a beam splitting element (in this embodiment A planar beam splitter 45), a reference reflector assembly 46 and an optical sensing module 47. The lens assembly 43 includes a sixth focus lens 43, a seventh focus lens 432, an eighth focus lens 433, a ninth focus lens 434 and a tenth focus lens 435. The aperture 44 is provided with a through hole 441. The eight reference reflection assembly 46 is provided with a reference surface and a third number (P) of elongated mirrors, each of which has a reflective surface, so that there are P reflective surfaces, and at the same time, p long strips of reflection The mirror is made up of P support elements. In the present embodiment, p is equal to 4, that is, the reference reflection component 46 includes four obliquely-arranged side-by-side strip mirrors 461, 462, 463, and 464, and four strip mirrors 46, 462, 463 and 464 respectively have four inclined father-staggered side-by-side reflective surfaces 461a, 462a, 463a and 464a. At the same time, the four elongated mirrors 461, 462, 463 and 464 are supported and supported by four support members 465, 466, 467 and 468. The optical sensing module 47 includes a line CCD 471 and a computing unit 20 1306149. At the position where the object 2 is in the measurement position, the measuring device 4 is in the scanning process with respect to the position to be tested along the sweeping direction ι2 or the object to be tested 2) In the case of a set 4, a slight variation in the distance between the sensing device 4 and the surface of the object to be tested is caused by mechanical vibration. When it is swept to the point _ to be measured on the surface of the object 2 to be tested, the sensing device 4 is at a vertical distance d2 from the measuring point P2. 〃 τ
同時，多頻混合光源42所發出之光線會經過第 六聚焦透鏡431之聚焦成平行光束，並經過第七聚焦 透鏡432之聚焦而穿透光圈44之穿孔441，最後再經 過第八聚焦透鏡433而聚焦成沿一垂直方向皿2射出 一入射光束IL2。入射光束IL2會射向平面分光鏡45 之一分光點S?2 ’並經過平面分光鏡45之分光後，反 射出一參考光束RL2與穿透射出一量測光束Tl2。在 入射光束Ik射入平面分光45時，分光點sp2與待測 點P2係相距一量測距離k，與參考反射組件46之基 準面RS2相距一最大參考距離ο。，並與殼體4丨之底 面相距一光轴距離a2。 量測光束TL2會沿一量測方向V 2射向待測點 P2 ’再沿量測方向V 2之相反方向反射回分光點SP2 之鄰近位置而行進一測量光程Ptz (等於2 t2)。參考 光束RL2會沿—參考方向汉2射向參考反射組件46中 之四個反射表面461a、462a、463a與464a，並沿參 考方向IV2之相反方向反射回分光點SP2之鄰近位置 而行進複數個不同之參考光程，並且與測量光程pt2 之間分別差距複數個不同之光程差。 21 1306149 在複數個不同之參考光程中，與測量光程Pt2相 等者，定義為一臨界（critical)參考光程Pr2。同時， 在上述複數個不同之光程差中，臨界參考光程Pr2與 測量光程Pt2間之差距為零者，可定義為一零光程 差。在參考光束RL2行進臨界參考光程Pr2時，分光 點SP2與參考光束RL2射入參考反射組件46處係相 距一臨界參考距離r2，亦即臨界參考距離r2等於1/2 倍之臨界參考光程Pr2。 在本實施例中，上述之基準面RS2係與該參考方 向IV2相互垂直，參考反射組件46中第一個長條狀反 射鏡461之一端係以支撐元件465予以支撐固定，第 一個反射表面461 a與基準面RS2間之距離，係自其 一端與基準面RS2相切齊，而逐漸遞增至另一端與基 準面RS2相距上述之單位偏移距離A。 在上述四個長條狀反射鏡461中，第四數量（Q， 在本實施例中Q介於2與4之間，且包含2與4)個 長條狀反射鏡之兩端係分別以第Q-1個與第Q個支撐 元件予以支撐固定，使第Q個反射表面與基準面RS2 間之距離，係自其一端與基準面RS2相距Q-1倍單位 偏移距離A，而逐漸遞增至另一端與基準面RS2相距 Q倍單位偏移距離A。 譬如，第四（即Q等於4)個長條狀反射鏡464 之兩端係分別以第三個支撐元件467與第四個支撐元 件468予以支撐固定，使第四個反射表面464a與基 準面RS2間之距離，係自其一端與基準面RS2相距三 倍單位偏移距離A (即3A)，而逐漸遞增至另一端與 基準面RS2相距四倍單位偏移距離A (即4A)。 由以上參考反射組件46中之四個反射表面 22 1306149 461a、462a、463a與464a間之相對位置可知，臨界 參考距離Ο可介於（r2Q_4A)與r2G之間，亦即臨界參 考光程Pr2可介於（2r20-8A)與2r2〇之間。 其中，當臨界參考光程Pr2介於（2γ2〇-2Δ)與2r20 之間時，表示參考光束RL2係沿參考方向IV2而射向 參考反射組件46中之第一個反射表面461a。當臨界 參考光程Pr2介於（2γ2〇-4Δ)與（2γ20-2Δ)之間時， 表示參考光束RL2係沿參考方向IV2而射向參考反射 組件36中之第二個反射表面362a。當臨界參考光程 Pr2介於（2r20-6A)與（2r20-4A)之間時，表示參考 光束RL2係沿參考方向ιγ2而射向參考反射組件46中 之第三個反射表面463a。當臨界參考光程Pr2介於 (2r2(r8A)與（2ι·2〇-6Δ)之間時，表示參考光束RL2 係沿參考方向IV2而射向參考反射組件46中之第四個 反射表面464a。 接著，自待測位置物件2所反射之量測光束TL2 與自參考反射組件46所反射之參考光束RL2係在平 面分光鏡45之分光點SP2之鄰近位置處開始產生干 涉’並依據量測光程Pt2與上述複數個參考光程間之 差距所分別形成之複數個不同之光程差，而沿一干涉 輸出方向VI2射出至少一干涉光束IFL2。 干涉光束IFL2會經過第九聚焦透鏡434與第十 聚焦透鏡435之聚焦後，被線CCD 471所感測。其 中，在行進臨界參考光程Pr2之反射光束RL2與行進 量測光程Pt2之穿透光束TL2產生干涉光束ifl2時， 會產生類似於第五圖所示之一干涉波包，該運算處理 單元472可依據線CCD 471所偵測感應干涉波包之 所在位置而計算該待測位置物件2所處之絕對距離位 置。 23 1306149 同樣地，在本實施例中，亦可進一步利用第一實 施例中所揭露之二維轉換座標、模擬區間、解析區間 與分割區間等解析技術手段來判定上述干涉波包所 在之位置，據以計算出該絕對距離位置，在此不再予 以贅述。同時，所欲量測之絕對距離位置亦可利用上 述之垂直距離七或量測距離t：2來表示。此外，上述 之待測位置物件2應具備較佳之反射性，才能獲得較 佳之反射效果。因此，吾人建議上述之待測位置物件 2亦以採用具備光滑表面之一光學平板為宜。At the same time, the light emitted by the multi-frequency hybrid light source 42 is focused into a parallel beam by the sixth focus lens 431, and passes through the focus of the seventh focus lens 432 to penetrate the through hole 441 of the aperture 44, and finally passes through the eighth focus lens 433. The focus is directed to emit an incident beam IL2 along a vertical direction dish 2. The incident beam IL2 is directed to a splitting point S?2' of the plane beam splitter 45 and split by the plane beam splitter 45, and a reference beam RL2 is reflected and transmitted through a measuring beam Tl2. When the incident beam Ik is incident on the plane beam splitting 45, the beam splitting point sp2 is spaced apart from the point P2 to be measured by a measuring distance k, and is spaced apart from the reference plane RS2 of the reference reflecting component 46 by a maximum reference distance ο. And is spaced from the bottom surface of the casing 4 by an optical axis distance a2. The measuring beam TL2 travels along a measuring direction V 2 toward the point P2 to be measured and then returns to the vicinity of the beam splitting point SP2 in the opposite direction of the measuring direction V 2 to travel a measuring optical path Ptz (equal to 2 t2). The reference beam RL2 will be directed to the four reflective surfaces 461a, 462a, 463a and 464a of the reference reflective component 46 along the reference direction Han 2 and will be reflected back in the opposite direction of the reference direction IV2 back to the vicinity of the splitting point SP2 to travel a plurality of Different reference optical paths, and the measurement optical path pt2 are separated by a plurality of different optical path differences. 21 1306149 In a plurality of different reference optical paths, the same as the measuring optical path Pt2, defined as a critical reference optical path Pr2. Meanwhile, in the above plurality of different optical path differences, the difference between the critical reference optical path Pr2 and the measuring optical path Pt2 is zero, which can be defined as a zero optical path difference. When the reference beam RL2 travels the critical reference optical path Pr2, the splitting point SP2 and the reference beam RL2 are incident on the reference reflection component 46 by a critical reference distance r2, that is, the critical reference path r2 is equal to 1/2 times the critical reference path length. Pr2. In this embodiment, the reference plane RS2 is perpendicular to the reference direction IV2, and one end of the first strip mirror 461 of the reference reflection assembly 46 is supported and fixed by the support member 465. The first reflective surface The distance between the 461 a and the reference plane RS2 is tangent to the reference plane RS2 from one end thereof, and gradually increases to the other end from the reference plane RS2 by the unit offset distance A described above. In the above four strip mirrors 461, the fourth number (Q, in the present embodiment, Q between 2 and 4, and including 2 and 4) of the strip mirrors are respectively The Q-1th and the Qth supporting elements are supported and fixed, so that the distance between the Qth reflecting surface and the reference plane RS2 is 0-1 times the unit offset distance A from the reference plane RS2, and gradually The distance from the other end to the reference plane RS2 is Q times the unit offset distance A. For example, the fourth (ie, Q equals 4) strip mirrors 464 are supported and fixed by the third support member 467 and the fourth support member 468, respectively, so that the fourth reflective surface 464a and the reference surface The distance between RS2 is three times the unit offset distance A (ie, 3A) from one end of the reference plane RS2, and gradually increases to the other end by four times the unit offset distance A (ie, 4A) from the reference plane RS2. From the relative positions between the four reflective surfaces 22 1306149 461a, 462a, 463a and 464a of the above reference reflective component 46, the critical reference distance Ο can be between (r2Q_4A) and r2G, that is, the critical reference optical path Pr2 can be Between (2r20-8A) and 2r2〇. Wherein, when the critical reference optical path Pr2 is between (2γ2〇-2Δ) and 2r20, it indicates that the reference beam RL2 is directed to the first reflective surface 461a of the reference reflective component 46 along the reference direction IV2. When the critical reference optical path Pr2 is between (2γ2〇-4Δ) and (2γ20-2Δ), it is indicated that the reference beam RL2 is directed toward the second reflective surface 362a of the reference reflective component 36 along the reference direction IV2. When the critical reference optical path Pr2 is between (2r20-6A) and (2r20-4A), it means that the reference beam RL2 is directed toward the third reflecting surface 463a of the reference reflection assembly 46 along the reference direction ι γ2. When the critical reference optical path Pr2 is between (2r2 (r8A) and (2ι·2〇-6Δ), it means that the reference beam RL2 is directed to the fourth reflective surface 464a of the reference reflection component 46 along the reference direction IV2. Then, the measurement beam TL2 reflected from the object 2 to be measured and the reference beam RL2 reflected from the reference reflection component 46 are adjacent to the spot SP2 of the plane beam splitter 45 to generate interference> and according to the measurement The optical path Pt2 and the plurality of reference optical paths respectively form a plurality of different optical path differences, and at least one interference beam IFL2 is emitted along an interference output direction VI2. The interference beam IFL2 passes through the ninth focusing lens 434. After focusing of the tenth focus lens 435, it is sensed by the line CCD 471. When the reflected beam RL2 of the traveling critical reference optical path Pr2 and the transmitted beam TL2 of the traveling optical path Pt2 generate the interference beam ifl2, a similarity occurs. In the interference wave packet shown in FIG. 5, the operation processing unit 472 can calculate the absolute distance position of the object 2 to be tested according to the position of the induced interference wave packet detected by the line CCD 471. 1306149 Similarly, in this embodiment, the two-dimensional conversion coordinates, the simulation interval, the analysis interval, and the segmentation interval disclosed in the first embodiment may be further utilized to determine the location of the interference wave packet. The absolute distance position is calculated and will not be described here. At the same time, the absolute distance position to be measured can also be represented by the above vertical distance seven or the measured distance t: 2. In addition, the above-mentioned position to be tested The object 2 should have better reflectivity in order to obtain a better reflection effect. Therefore, it is recommended that the object 2 to be tested described above also adopt an optical plate having a smooth surface.
、綜合以上所述，本發明所提供之光學式距離位置 感測裝置3與4，係利用感測多頻混合光源32與42 (特別是多頻混合白光光源）所發出之光束在干涉時 可產生明顯而容易辨識之干涉波包IFC的特性，進而 利用干涉波包IF C之位置來計算出待測位置物件2之 f邑對距離位置。由於干涉波包IFC之位置遠較習知技 每個單一干涉條紋更為明顯而易於觀察，也無 ^计算干涉條紋之數量，因此可同時解決上述之^ 解析，容易造成誤判’以及必須 $外，由於本發明之二維轉換座標3乃係依據上 因考光程而建立，具備有極高精準度與穩定性， =只需在初次使用時進行一次初始化校正， 用彳艮多次而仍舊能保持合乎奈米等級要求之高 而不必在每次進行量測之前都進行習知技i = >考距離tG之自我標準化校正，藉以提升操作 牛=利性。同時，由於上述之複數個反射表面可進一 =利用上述之傾斜交錯漸層併排之方式來加以配 ’因此可有效增加光學感測之量測範圍大幅提升 .，甚至是8mm，因此可大幅提升光學式距離位 24 1306149 置感測裝置3與4之應用領域。 藉由上述之本發明實施例可知，本發明確具產 上之利用價值。惟以上之實施例說明，僅為本^明乂 較佳實施例說明，舉凡所屬技術領域中具有通备知 者當可依據本發明之上述實施例說明而作其它 之改良及變化。然而這些依據本發明實施例所作 種改良及變化，當仍屬於本發明之發明精神 專利範圍内。 1 【圖式簡單說明】 第—圖係顯示習知基本型雷射干涉儀之元件配 意圖與距離位置感測技術； ’、 第二圖=顯示本發明第一實施例之元件配置 與距離位置感測技術； 第三圖本發明第一實施例中之參考反射組件 配置關係示意圖； 第四圖==發明第一實施例中之參考反 之立體外觀示意圖； 第五圖t顯ίΐ發明第一實施例中之二維轉換座標 <不思圖； 弟六圖係顯示本發明第二實 卜與距離位置感測技術；（件配置不思圖 第七圖係顯示本發明第二實施例 ^配置關係示意圖；以及 -考反射組件 第八圖，顯示本發明第二實施 之立體外觀示意圖。 号反射、、且件 25 1306149In summary, the optical distance position sensing devices 3 and 4 provided by the present invention can utilize the light beams emitted by the sensing multi-frequency mixing light sources 32 and 42 (especially the multi-frequency hybrid white light source). The characteristic of the interference wave packet IFC which is obviously and easily recognized is generated, and the position of the interference wave packet IF C is used to calculate the position of the distance of the object 2 to be measured. Since the position of the interference wave packet IFC is much more obvious than that of the conventional interference fringe of the conventional technique, and the number of interference fringes is not calculated, the above-mentioned resolution can be solved at the same time, which is easy to cause misjudgment and must be externally Since the two-dimensional conversion coordinate 3 of the present invention is established according to the optical path of the upper test, it has extremely high precision and stability, and it is only necessary to perform an initial correction when it is used for the first time, and it is used for many times. It can maintain the high level of nanometer requirements without having to perform the conventional technique before each measurement. i = > Self-standardization correction of the distance tG, so as to improve the operation of the cattle = profit. At the same time, since the above-mentioned plurality of reflective surfaces can be further integrated with the above-mentioned oblique staggered gradual layer side by side, the measurement range of optical sensing can be effectively increased, and even 8 mm, the optical can be greatly improved. Distance position 24 1306149 The application area of the sensing devices 3 and 4. It will be apparent from the above-described embodiments of the present invention that the present invention has a utility value in production. The above embodiments are merely illustrative of the preferred embodiments, and other modifications and changes can be made by those skilled in the art. However, these improvements and variations in accordance with the embodiments of the present invention are still within the scope of the inventive spirit of the present invention. 1 [Simple description of the drawings] The first figure shows the component fitting intention and distance position sensing technology of the conventional basic laser interferometer; ', the second figure= shows the component arrangement and distance position of the first embodiment of the present invention FIG. 3 is a schematic diagram showing a configuration of a reference reflection component in a first embodiment of the present invention; FIG. 4 is a schematic view showing a third embodiment of the invention in a first embodiment; The two-dimensional conversion coordinate in the example <not thinking; the six-figure system shows the second real and distance position sensing technology of the present invention; (the configuration of the seventh embodiment shows the second embodiment of the present invention) A schematic diagram of the relationship; and an eighth embodiment of the test reflection assembly, showing a stereoscopic appearance of the second embodiment of the present invention. No. reflection, and the piece 25 1306149
【主要元件符號說明】 1 雷射干涉儀 11 殼體 12 雷射光源 13 聚焦透鏡 14 平面分光鏡 15 參考反射鏡 16 光學感應模組 2 待測位置物件 3、4 光學式距離位置感測裝置 31、41 殼體 32、42 多頻混合光源 33、43 透鏡組件 331 第一聚焦透鏡 332 第二聚焦透鏡 333 第三聚焦透鏡 334 第四聚焦透鏡 335 第五聚焦透鏡 431 第六聚焦透鏡 432 第七聚焦透鏡 433 第八聚焦透鏡 26 1306149 434 第九聚焦透鏡 435 第十聚焦透鏡 34、44 光圈 341 、 441 穿孔 35 ' 45 平面分光鏡 36、46 參考反射組件 361〜364 、 461〜464 長條狀反射鏡 g 361a〜364a、461a〜464a 反射表面 365〜368 、 465〜468 支撐元件 37、47 光學感應模組 371 、 471 線電荷耦合器 372 、 472 運算處理單元 373 二維轉換座標 ' IL〇、IL、IL2 入射光束 φ RL〇、RLi、TL2 量測光束 TL〇、TL!、RL2 參考光束 IFL〇、IFLi、IFL2 干涉光束 IFC 干涉波包 P〇、Pi、P2 待測點 SP〇、SP!、SP2 分光點 RS!、RS2 基準面 I 〇 ' I 1 ' I 2 掃目苗方向 27 1306149[Description of main component symbols] 1 Laser interferometer 11 Housing 12 Laser light source 13 Focusing lens 14 Plane beam splitter 15 Reference mirror 16 Optical sensor module 2 Objects to be tested 3, 4 Optical distance position sensing device 31 41 housing 32, 42 multi-frequency hybrid light source 33, 43 lens assembly 331 first focus lens 332 second focus lens 333 third focus lens 334 fourth focus lens 335 fifth focus lens 431 sixth focus lens 432 seventh focus Lens 433 eighth focusing lens 26 1306149 434 ninth focusing lens 435 tenth focusing lens 34, 44 aperture 341, 441 perforation 35 '45 plane beam splitter 36, 46 reference reflection assembly 361~364, 461~464 long strip mirror g 361a~364a, 461a~464a Reflecting surfaces 365~368, 465~468 Supporting elements 37, 47 Optical sensing module 371, 471 Line charge couplers 372, 472 Operation processing unit 373 Two-dimensional conversion coordinates 'IL〇, IL, IL2 incident beam φ RL〇, RLi, TL2 measuring beam TL〇, TL!, RL2 reference beam IFL〇, IFLi, IFL2 interference light IFC P〇 interference wave packet, Pi, P2 SP〇 test point, SP!, SP2 spectral point RS!, RS2 square plane I 'I 1' I 2 mesh seedlings sweep direction 271,306,149
Π〇、Π]、Π2、瓜2 垂直方向 瓜〇、瓜1 水平方向 rv〇' iv!' v2 量測方向 V〇 ' Vl ' iv2 參考方向 VI〇 ' VI1 ' VI2 干涉輸出方向 d〇 ' di ' d2 垂直距離 r〇 、 ri 、 t2 量測距離 to 、 ti 、 Γ2 參考距離 a〇 、 x a〗 光軸距離 Pr〇、Pr】、Pt2 測量光程 Pt〇 > Pti ' Pr2 參考光程 DP〇 光程差 Xm X方向模擬橫座標 zm Z方向模擬縱座標 UX〇 ' UZ〇 單位長度 m〇~m3 模擬區間 n〇 〜n4 解析區間 28Π〇,Π],Π2, melon 2 Vertical direction melon, melon 1 Horizontal direction rv〇' iv!' v2 Measurement direction V〇' Vl ' iv2 Reference direction VI〇' VI1 ' VI2 Interference output direction d〇' di ' d2 Vertical distance r〇, ri, t2 Measuring distance to, ti, Γ2 Reference distance a〇, xa Optical axis distance Pr〇, Pr】, Pt2 Measuring optical path Pt〇> Pti ' Pr2 Reference optical path DP〇 Optical path difference Xm X direction simulation abscissa zm Z direction simulation ordinate UX〇' UZ〇 unit length m〇~m3 Simulation interval n〇~n4 Analysis interval 28