1314207 九、發明說明： 【發明所屬之技術領域】 本發明係有關超導元件之製程，特別地指一種將金屬 粉末材料經由轉印技術或模具塑型技術在超導元件內植佈 骨料之製程。 【先前技術】 在電子產品走向高階化、輕薄化之趨勢發展下，使得 電子元件在更小體積具備更強大的功能，當電子元件尺寸 走向細微化、功能整合化之際，導致其單位面積的發熱密 度也愈來愈高，傳統以鰭片透過風扇散逸於空氣的散熱方 式，已不能滿足新一代電子元件的需求，因此散熱效率已 經成爲決定電子產品之壽命、可靠度及穩定性的重要因 素。熱管（Heat Pipe)，是藉由工作流體液氣相間的變化 (phase change)吸收熱量，並以氣體分子傳輸熱量的方式， 因而可得到極高的熱傳導係數，具有相當好的傳熱效果， 現今已被廣泛應用於電子熱傳導領域，如電腦內部中央處 理器之散熱等。惟，熟習此項技術者可以理解的是’由於 熱管其毛細結構必須貼附於整根熱管內部管壁’雖然其提 供了工作介質液體回流之毛細力，但在其毛細結構內部之 流動阻力也成爲流動壓降的主要來源，因此造成其性能在 某些操作情形下會有大幅度遞減的情形。 均溫板則是將熱管由點的熱傳導更進一步地變成面的 熱傳導，具有更高效率的熱傳導特性’未來可能被大量應 用的導熱元件之一，目前之所以未被廣泛使用乃因現階段 1314207 技術常因毛細組織骨料之植佈過程、熱處理中之 焊等而使得結構鬆軟，且構造複雜及未能有效節 本亦成爲另一項瓶頸。 已知有許多相關均溫板的文獻被提出，例如 專利公開第200609478號，揭示一種「微型均熱 製品製造方法」，其主要利用沖壓加工及鈾刻加 分別完成微型均熱板之外型中間製品及細微結構 步驟等，進而完成可相互貼合成微型均熱板的中 以解決微型均熱板中間製品的細微結構體不易利 工方式製作成型，以及將蝕刻加工應用在中間製 工成本過局之問題。 【發明內容】 本發明之主要目的在於提供一種在超導元件 料之製程’使構造簡單化、量產容易及降低成本 爲了達成上述目的及其他目的，根據本發明 程，其至少包括下列步驟： 沖製步驟：準備導熱性金屬板材料，將其沖 殼體和一上蓋體模型，及在該上蓋體頂部沖製有一 塑型步驟：以轉印技術或模具塑型技術，將 在該下殼體和上蓋體內側表面塑成一薄膜胚型， 間的若干定點上塑成若干凸柱胚型。 燒結步驟：加熱使該薄膜胚型和凸柱胚型燒 組織結構。 焊接步驟：自該上蓋體頂部之注料孔焊接一 燒結及回 省製造成 台灣發明 板的中間 工方式， 體的加工 間製品， 用沖壓加 品外型加 內植佈骨 〇 之植佈製 製出一下 -注料孔。 金屬粉末 及兩者之 結成毛細 注料管。 1314207 封合步驟：將該上蓋體覆設在下殼體上方，且沿兩者 啣接界面焊接封閉。 注料步驟：自該注料管抽真空後注入工作介質，並將 該注料管裁斷及焊接封口。 根據本發明植佈製程，該塑型步驟係以金屬粉末調和 溶劑後’以轉印技術直接/或藉由離型紙間接在該下殼體和 上蓋體內側表面轉印出一薄膜胚型，及在該下殼體或上蓋 體內側表面若干定點上轉印出若干凸柱胚型等·，利用轉印 技術’該金屬粉末之厚薄容易控制，及能精準地疊積成適 當高度的凸柱，且量產容易及生產成本低。 根據本發明植佈製程之另一種方式，該塑型步驟和燒 結步驟’可以金屬粉末調和溶劑後以模具分別塑成一對應 於下殼體和上蓋體內側表面的薄膜胚型及若干凸柱胚型， 經燒結後再黏貼於下殻體和上蓋體的內側表面上。利用模 塑技術，其塑型簡單化、量產容易及生產成本低。此爲本 發明另一目的。 根據本發明超導元件，該下殻體自底部周圍朝開口部 方向形成一個逐漸向外側擴大的傾斜側面；相對於此，該 上蓋體沿邊緣內側，朝下殻體開口部方向形成一個傾斜的 凹部，且外周邊緣對應於該下殼體之傾斜側面形成一個角 度一致的傾斜凸緣部，彼此吻合密接在一起。如此，該結 構容易組合定位，且彼此之間的接觸面積大，其穩定性及 可靠性可確保。此爲本發明又一目的。 根據本發明超導元件，該下殼體和上蓋體之截面積成 1314207 圓形之設計’且該凸柱成環狀排列於下殼體和上蓋體之 間；當蒸發端持續處於高溫狀態或表面溫度不平均，而導 致該超導元件腔體內壓力及溫度不平均時，其飽和蒸汽會 因壓力差產生氣流旋渦迅速分佈至整個較低溫之區域，使 該超導元件之均溫效率更高。此爲本發明再一目的。 【實施方式】 以下將配合實施例對本發明技術特點作進一步地說 明，該實施例僅爲較佳代表的範例並非用來限定本發明之 實施範圍，謹藉由參考附圖結合下列詳細說明而獲致最好 的理解。 首先，請參考第1圖並對照第2圖，根據本發明超導 元件1植佈骨料之製程，其至少包括下列步驟·· 沖製步驟：準備導熱性金屬板材料，例如銅板或鎳板 等，將其沖製出一個下殼體10和一個上蓋體20模型，兩 者之間能共同構成一腔室，及在該上蓋體20頂部沖製有— 注料孔2 5 (如第2圖之步驟一所示）。 塑型步驟：將例如銅或鎳等之金屬粉末調和溶劑後， 以轉印技術或模具塑型技術在該下殻體10和上蓋體20內 側表面塑成一薄膜胚型3 1、32 ’及在兩者之間的若干定點 上塑成若干凸柱胚型33(如第2圖之步驟二所示）。 燒結步驟：讓該下殼體10和上蓋體20進入—熱爐4〇 加熱，使該金屬粉薄膜胚型31、32和凸柱胚型33燒結成 多孔性的毛細組織結構（如第2圖之步騾三所示）。 焊接步驟：從該上蓋體20頂部之注料孔25焊接—注 1314207 料管26 (如第2圖之步驟四所示）。 封合步驟：將該上蓋體20覆設在下殼體1〇上方 沿兩者啣接界面焊接封閉，形成一個腔室內具有骨料 件（如第2圖之步驟五所示）。 注料步驟：從該注料管26將腔室內抽真空後，注 作介質例如水、氨水或乙醇等，同時將該注料管2 6载 焊接封口，形成一個超導元件丨（如第2圖之步驟六所 根據本發明，該塑型步驟中之轉印技術，係以金 末調和溶劑成糊狀後’將糊膏刮過絹網留白部分使其 的方式（由於此部分爲習知轉印技術故不進一步說明 直接在該下殻體10和上蓋體20內側表面轉印出一薄 型31、32’其印刷的厚度可以控制在最適當的厚度； 以相同的方式在該下殻體10內側表面若干定點上，重 印以疊積出適當高度的若干凸柱胚型33;或者，在該 體20內側表面若干定點上，重覆轉印以堆積出適當高 若干凸柱胚型33。上述之轉印技術，熟習此項技術者 理解的是，亦可以用間接轉印的方式，例如先在離型 分別轉印出對應於下殻體1 〇和上蓋體20內側表面的 胚型3 1、3 2及若干凸柱胚型3 3，再黏貼組合於該下 10和上蓋體20上；及，該凸柱胚型33可以一體地轉 下殼體10薄膜胚型31之若干定點上，或者’ 一體地 在上蓋體20薄膜胚型32之若干定點上。 根據本發明另一種方式’該塑型步驟和燒結步驟 以金屬粉末調和溶劑後以模具分別塑成一對應於下殼 ，且 的元 入工 斷及 示）。 屬粉 滲透 )， 膜胚 及， 覆轉 上蓋 度的 可以 紙上 薄膜 殼體 印在 轉印 ，可 體10 1314207 和上蓋體2 0內側表面的薄膜胚型3 1、3 2及若干凸柱胚型 3 3 ’經燒結成多孔性毛細組織薄膜3丨，、3 2 ’及若干多孔性 毛細組織凸柱33’後再黏貼於下殻體10和上蓋體20的內側 表面上。其中，該若干凸柱胚型33可以用模具一次在對應 於該下殻體10內側表面的薄膜胚型31之若干定點上一體 地塑成；或者，以模具一次在對應於該上蓋體20內側表面 的薄膜胚型32之若干定點上一體地塑成。 請再參考第3圖及第4圖所示，第3圖爲根據本發明 上述植佈製程製成的超導元件1之平面圖，第4圖爲其剖 面圖。根據本發明，該下殻體10和上蓋體20兩者之間構 成一密閉的真空腔室，在該下殻體10和上蓋體20內側表 面分別形成一多孔性的毛細組織薄膜3 Γ、3 2 ’，且於兩者 之間的若干定點上形成若干多孔性的毛細組織凸柱3 3 ’，及 視工作條件其內部注入之工作介質可選擇例如水、氨水或 乙醇等。 在理想的情況下，該下殻體10和上蓋體20之截面積 較佳爲圓形、方形或多角形之其中一種，較佳爲圓形，上 述毛細組織凸柱3 3 ’可爲圓柱形、方柱形、橢圓柱形或多角 柱形之其中一種，較佳爲圓柱形，且該若干凸柱3 3 ’成環狀 排列於下殼體1 〇和上蓋體20之間。此外，該下殻體1 0自 底部周圍朝開口部方向形成一個逐漸向外側擴大的傾斜側 面1 Oa ;相對於此，該上蓋體20沿邊緣內側，朝下殼體1 0 開口部方向形成一個傾斜的凹部20a，且外周邊緣對應於 該下殼體1 〇之傾斜側面1 〇a形成一個角度一致的傾斜凸緣 -10- 1314207 部20b，彼此吻合地密接在一起。如此，該結構簡單化， 在下殼體10和上蓋體20組合時定位容易，且彼此之間的 接觸面積大，其穩定性及可靠性可確保。 再如第4圖所示，上述超導元件1接觸熱源之一端爲 蒸發端1 a，另一相對端則爲冷凝端1 b，假設熱源5 0位於 該超導元件1之下方，蒸發端la的工作介質因吸熱而蒸發 成汽態，飽和蒸汽a往上升迅速擴散至整個冷凝端lb，經 由其他散熱裝置（圖中未示）例如鰭片或水套等吸收冷凝 1 端1 b熱能，使工作氣體冷凝液化成工作流體b，並沿毛細 組織薄膜3 2 ’和毛細組織凸柱3 3 ’等迴流至蒸發端1 a，形成 二相流循環。從另一方面而言，上述成圓盤形設計之超導 元件1，若熱源持續處於高溫狀態或表面溫度不平均，而 導致該超導元件1腔體內壓力及溫度不平均時，該飽和蒸 汽a即會因壓力差產生氣流旋渦迅速分佈至整個較低溫之 區域，進而使該超導元件1之均溫效率更高。 以上僅爲本發明代表說明的較佳實施例，並不侷限本 1 發明實施範圍，即不偏離本發明申請專利範圍所作之均等 變化與修飾’應仍屬本發明之涵蓋範圍。 【圖式簡單說明】 第1圖爲本發明超導元件植佈骨料之流程方塊圖。 第2圖係顯不本發明超導元件植佈骨料之製程示意 圖。 第3圖係顯示本發明超導元件之平面示意圖。 第4圖爲自第3圖之4-4方向剖面放大圖。 -11- 13142071314207 IX. Description of the Invention: [Technical Field] The present invention relates to a process for superconducting elements, in particular to a method in which a metal powder material is implanted into a superconducting element via a transfer technique or a mold molding technique. Process. [Prior Art] Under the trend of higher-order, lighter and thinner electronic products, electronic components have more powerful functions in smaller volumes. When the size of electronic components is finer and functionally integrated, the unit area is The heat density is also getting higher and higher. Traditionally, the fins are dissipated through the fan to dissipate the air. The heat dissipation efficiency has become an important factor in determining the life, reliability and stability of electronic products. . Heat Pipe absorbs heat by the phase change of the working fluid, and transfers heat by gas molecules, so that a very high heat transfer coefficient can be obtained, which has a fairly good heat transfer effect. It has been widely used in the field of electronic heat conduction, such as the heat dissipation of the central processing unit of the computer. However, those skilled in the art can understand that 'because the capillary structure of the heat pipe must be attached to the inner wall of the entire heat pipe', although it provides the capillary force of the liquid returning of the working medium, the flow resistance inside the capillary structure is also It becomes the main source of flow pressure drop, thus causing a situation in which its performance will be greatly reduced under certain operating conditions. The temperature equalization plate is to further change the heat conduction of the heat pipe from the point to the heat conduction of the surface, and has a higher efficiency of heat conduction characteristics. One of the heat conduction elements that may be widely used in the future, the reason why it is not widely used at present is due to the current stage 1314207 The technique is often caused by the planting process of the capillary structure aggregate, the welding in the heat treatment, etc., and the structure is complicated, and the complicated structure and the failure to effectively save the cost become another bottleneck. A number of related known temperature-regulating plates have been proposed, for example, Patent Publication No. 200609478, which discloses a "micro-smoothed product manufacturing method" which mainly utilizes stamping processing and uranium engraving to separately complete the micro-hydrothermal plate appearance. The intermediate product and the fine structure steps, etc., thereby completing the micro-soaking plate which can be mutually affixed to each other to solve the micro-hydrogen plate intermediate product, and the fine structure is difficult to manufacture, and the etching process is applied to the intermediate manufacturing cost. The problem of the bureau. SUMMARY OF THE INVENTION The main object of the present invention is to provide a process for superconducting component materials that simplifies the structure, facilitates mass production, and reduces costs. To achieve the above and other objects, the present invention includes at least the following steps: Stamping step: preparing a thermal conductive metal plate material, punching the casing and an upper cover body model, and punching a molding step on the top of the upper cover body: using a transfer technique or a mold molding technique, the lower case The inner surface of the body and the upper cover body is molded into a thin film embryo type, and a plurality of convex column embryo shapes are formed at a plurality of fixed points. Sintering step: heating causes the thin film embryo and the stud embryo to burn the structure. Welding step: welding a sintering hole from the injection hole at the top of the upper cover body and returning to the intermediate manufacturing method of manufacturing the invention board of Taiwan, the processing room product of the body, using the stamping and adding the outer shape and the planting of the implanted bones Make a look - the injection hole. The metal powder and the two form a capillary injection tube. 1314207 Sealing step: the upper cover body is overlaid on the lower casing, and is welded and sealed along the joint interfaces of the two. Injection step: the working medium is injected after vacuuming the injection tube, and the injection tube is cut and welded and sealed. According to the planting process of the present invention, the molding step is to transfer a solvent to the metal powder, and then transfer a film embryo directly or directly through the release paper on the inner surface of the lower casing and the upper cover by the transfer technique, and A plurality of stud embryos, etc. are transferred at a fixed point on the inner surface of the lower casing or the upper cover body, and the thickness of the metal powder is easily controlled by a transfer technique, and the studs can be accurately stacked to a proper height. And mass production is easy and production costs are low. According to another mode of the planting process of the present invention, the molding step and the sintering step can be performed by blending the solvent with the metal powder, and then molding the film into a film embryo type corresponding to the inner surface of the lower casing and the upper cover body and a plurality of convex column embryo types. After being sintered, it is adhered to the inner side surfaces of the lower case and the upper cover. With the molding technology, the molding is simple, the mass production is easy, and the production cost is low. This is another object of the invention. According to the superconducting element of the present invention, the lower casing forms an inclined side surface which gradually expands outward from the periphery of the bottom toward the opening; in contrast, the upper cover body forms an inclined direction toward the opening of the lower casing along the inner side of the edge. a recess, and the peripheral edge forms an angled inclined flange portion corresponding to the inclined side surface of the lower casing, and is in close contact with each other. Thus, the structure is easily combined and positioned, and the contact area between each other is large, and the stability and reliability can be ensured. This is another object of the invention. According to the superconducting element of the present invention, the cross-sectional area of the lower casing and the upper cover is 1314207 circular design 'and the stud is arranged in a ring shape between the lower casing and the upper cover; when the evaporation end is continuously at a high temperature or When the surface temperature is not uniform, and the pressure and temperature in the cavity of the superconducting element are not uniform, the saturated steam will rapidly distribute the vortex to the entire lower temperature region due to the pressure difference, so that the superconducting element has higher uniform temperature efficiency. . This is another object of the present invention. The embodiments of the present invention will be further described with reference to the embodiments, which are merely preferred examples and are not intended to limit the scope of the present invention. The best understanding. First, referring to FIG. 1 and referring to FIG. 2, the process of implanting aggregate material of the superconducting element 1 according to the present invention includes at least the following steps: a punching step: preparing a thermally conductive metal plate material, such as a copper plate or a nickel plate. And, it is punched out to form a lower casing 10 and an upper cover 20 model, which can form a chamber together, and a punching hole 2 5 is formed on the top of the upper cover 20 (such as the second Figure 1 shows the steps). a molding step: after a metal powder such as copper or nickel is conditioned, a film embryo type 3 1 , 32 ′ is molded on the inner surface of the lower casing 10 and the upper cover 20 by a transfer technique or a mold molding technique. A number of stud embryos 33 are formed at a number of points between the two (as shown in step 2 of Figure 2). Sintering step: heating the lower casing 10 and the upper cover 20 into the hot furnace 4 to sinter the metal powder thin film embryo type 31, 32 and the stud embryo 33 into a porous capillary structure (Fig. 2) The third step is shown). Welding step: welding from the injection hole 25 at the top of the upper cover body 20 - 1314207 material tube 26 (as shown in step 4 of Fig. 2). Sealing step: the upper cover body 20 is placed over the lower casing 1 焊接 and welded and sealed along the joint interface of the two, forming a cavity having an aggregate material (as shown in step 5 of Fig. 2). Filling step: vacuuming the chamber from the injection tube 26, and then injecting into a medium such as water, ammonia or ethanol, and simultaneously welding the injection tube to form a superconducting element (eg, second) According to the invention, the transfer technique in the molding step is a method in which the paste is scraped over the white portion of the net after the gold is mixed with the solvent to form a paste (since this part is a habit) The transfer technique is not further explained. A thin type 31, 32' is directly transferred on the inner surface of the lower casing 10 and the upper cover 20, and the thickness of the printing can be controlled at the most appropriate thickness; in the same manner in the lower shell At a plurality of fixed points on the inner surface of the body 10, a plurality of stud embryos 33 of a suitable height are reprinted; or, at a plurality of fixed points on the inner surface of the body 20, the transfer is repeated to accumulate a suitably high number of stud embryos 33 The transfer technique described above is understood by those skilled in the art that indirect transfer can also be used, for example, the embryo type corresponding to the inner surface of the lower casing 1 and the upper cover 20 is separately transferred in the release form. 3 1, 3 2 and a number of convex column embryos 3 3, and then The sticker is assembled on the lower 10 and the upper cover 20; and the raised stud 33 can be integrally turned down on a plurality of fixed points of the film blank 31 of the housing 10, or 'integrally in the upper cover 20, the thin film type 32 According to another aspect of the present invention, the molding step and the sintering step are prepared by blending a solvent with a metal powder, and then molding a mold corresponding to the lower shell, and the element is cut and shown. The embryo and the overlying cover can be printed on the paper film casing, and the thin film embryo type 3 1 , 3 2 and a plurality of stud embryo 3 3 ' on the inner surface of the upper cover 20 are sintered. The porous capillary structure film 3丨, 3 2 ' and a plurality of porous capillary structure studs 33' are then adhered to the inner side surfaces of the lower casing 10 and the upper cover body 20. Wherein, the plurality of stud embryos 33 may be integrally molded at a plurality of fixed points of the film blank 31 corresponding to the inner surface of the lower casing 10 by a mold; or, once in the mold, corresponding to the inner side of the upper cover 20 The surface of the film blank 32 is integrally molded at a plurality of points. Referring to Figures 3 and 4 again, Fig. 3 is a plan view of the superconducting element 1 produced by the above-described planting process according to the present invention, and Fig. 4 is a cross-sectional view thereof. According to the present invention, a closed vacuum chamber is formed between the lower casing 10 and the upper cover 20, and a porous capillary structure film 3 is formed on the inner surfaces of the lower casing 10 and the upper cover 20, respectively. 3 2 ', and a plurality of porous capillary studs 3 3 ' are formed at a plurality of fixed points between the two, and the working medium injected internally according to working conditions may be selected, for example, water, ammonia or ethanol. In an ideal case, the cross-sectional area of the lower casing 10 and the upper cover 20 is preferably one of a circular shape, a square shape or a polygonal shape, preferably a circular shape, and the above-mentioned capillary structure protrusion 3 3 ' may be cylindrical. One of a square cylindrical shape, an elliptical cylindrical shape or a polygonal cylindrical shape, preferably cylindrical, and the plurality of convex posts 3 3 ′ are arranged in a ring shape between the lower casing 1 〇 and the upper cover body 20 . Further, the lower casing 10 forms an inclined side surface 1 Oa which gradually expands outward from the periphery of the bottom portion; in contrast, the upper cover body 20 forms a direction toward the inner side of the edge toward the opening of the lower casing 10 The inclined recess 20a, and the peripheral edge corresponding to the inclined side surface 1 〇a of the lower casing 1 形成 forms an inclined flange -10- 1314207 portion 20b of uniform angle, which are closely joined to each other. Thus, the structure is simplified, and the positioning is easy when the lower casing 10 and the upper cover 20 are combined, and the contact area between them is large, and the stability and reliability can be ensured. As shown in FIG. 4, one end of the superconducting element 1 contacting the heat source is the evaporation end 1 a, and the other opposite end is the condensation end 1 b. It is assumed that the heat source 50 is located below the superconducting element 1 and the evaporation end la The working medium evaporates into a vapor state due to heat absorption, and the saturated steam a rapidly diffuses to the entire condensation end lb, and absorbs the heat of the condensation end 1 b by other heat sinks (not shown) such as fins or water jackets. The working gas is condensed into a working fluid b and returned to the evaporation end 1 a along the capillary structure film 3 2 ' and the capillary column 3 3 ', to form a two-phase flow cycle. On the other hand, the superconducting element 1 of the above-mentioned disc-shaped design, if the heat source continues to be in a high temperature state or the surface temperature is uneven, and the pressure and temperature in the cavity of the superconducting element 1 are not uniform, the saturated steam a will cause the airflow vortex to be rapidly distributed to the entire lower temperature region due to the pressure difference, thereby making the superconducting element 1 more uniform in temperature efficiency. The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and the equivalents and modifications of the present invention are not intended to be included in the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a flow block diagram of a superconducting element implanted aggregate of the present invention. Fig. 2 is a schematic view showing the process of fabricating aggregates of superconducting elements of the present invention. Figure 3 is a schematic plan view showing the superconducting element of the present invention. Fig. 4 is an enlarged cross-sectional view taken along line 4-4 of Fig. 3. -11- 1314207
【主要元件符號說明】 1 本發明超導元件 la 蒸發端 lb 冷凝端 10 下殼體 10a 傾斜側面 20 上蓋體 20a 凹部 20b 凸緣部 25 注料孔 26 注料管 3 1、32 薄膜胚型 3 1’、32 5 毛細組織薄膜 33 凸柱胚型 33 5 毛細組織凸柱 40 熱爐 50 熱原[Main component symbol description] 1 Superconducting element la of the present invention Evaporating end lb Condensing end 10 Lower case 10a Inclined side 20 Upper cover body 20a Recessed portion 20b Flange portion 25 Injection hole 26 Injection tube 3 1 and 32 Thin film embryo type 3 1', 32 5 capillary tissue film 33 convex column embryo type 33 5 capillary tissue column 40 hot furnace 50 pyrogen