TWI322200B - - Google Patents

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Publication number
TWI322200B
TWI322200B TW95124895A TW95124895A TWI322200B TW I322200 B TWI322200 B TW I322200B TW 95124895 A TW95124895 A TW 95124895A TW 95124895 A TW95124895 A TW 95124895A TW I322200 B TWI322200 B TW I322200B
Authority
TW
Taiwan
Prior art keywords
copper
layer
magnesium alloy
cyanide
aqueous solution
Prior art date
Application number
TW95124895A
Other languages
English (en)
Chinese (zh)
Other versions
TW200639279A (en
Original Assignee
Univ Chang Gung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Chang Gung filed Critical Univ Chang Gung
Priority to TW095124895A priority Critical patent/TW200639279A/zh
Publication of TW200639279A publication Critical patent/TW200639279A/zh
Application granted granted Critical
Publication of TWI322200B publication Critical patent/TWI322200B/zh

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  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • ing And Chemical Polishing (AREA)
TW095124895A 2006-07-07 2006-07-07 A composition and a method of aqueous solution for an electrodeposited copper layer of cyanide-free compound magnesium alloy surface TW200639279A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095124895A TW200639279A (en) 2006-07-07 2006-07-07 A composition and a method of aqueous solution for an electrodeposited copper layer of cyanide-free compound magnesium alloy surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095124895A TW200639279A (en) 2006-07-07 2006-07-07 A composition and a method of aqueous solution for an electrodeposited copper layer of cyanide-free compound magnesium alloy surface

Publications (2)

Publication Number Publication Date
TW200639279A TW200639279A (en) 2006-11-16
TWI322200B true TWI322200B (fr) 2010-03-21

Family

ID=45073921

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095124895A TW200639279A (en) 2006-07-07 2006-07-07 A composition and a method of aqueous solution for an electrodeposited copper layer of cyanide-free compound magnesium alloy surface

Country Status (1)

Country Link
TW (1) TW200639279A (fr)

Also Published As

Publication number Publication date
TW200639279A (en) 2006-11-16

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MM4A Annulment or lapse of patent due to non-payment of fees