TWI323194B - - Google Patents

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Publication number
TWI323194B
TWI323194B TW095134950A TW95134950A TWI323194B TW I323194 B TWI323194 B TW I323194B TW 095134950 A TW095134950 A TW 095134950A TW 95134950 A TW95134950 A TW 95134950A TW I323194 B TWI323194 B TW I323194B
Authority
TW
Taiwan
Prior art keywords
substrate
cleaning
thin
liquid
support portion
Prior art date
Application number
TW095134950A
Other languages
English (en)
Chinese (zh)
Other versions
TW200714378A (en
Inventor
Tatsuya Okumura
Koki Ishida
Kaichi Masunari
Shigenobu Sakamoto
Katsumi Okada
Original Assignee
Arakawa Chem Ind
Sansha Electric Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arakawa Chem Ind, Sansha Electric Mfg Co Ltd filed Critical Arakawa Chem Ind
Publication of TW200714378A publication Critical patent/TW200714378A/zh
Application granted granted Critical
Publication of TWI323194B publication Critical patent/TWI323194B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW095134950A 2005-09-29 2006-09-21 Method and device for washing thin substrate TW200714378A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005285521A JP4637705B2 (ja) 2005-09-29 2005-09-29 薄型基板の洗浄方法及び装置

Publications (2)

Publication Number Publication Date
TW200714378A TW200714378A (en) 2007-04-16
TWI323194B true TWI323194B (fr) 2010-04-11

Family

ID=37981442

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095134950A TW200714378A (en) 2005-09-29 2006-09-21 Method and device for washing thin substrate

Country Status (3)

Country Link
JP (1) JP4637705B2 (fr)
KR (1) KR100839876B1 (fr)
TW (1) TW200714378A (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117680425A (zh) * 2023-12-22 2024-03-12 淮安特创科技有限公司 一种用于印刷电路板表面处理水平线的节水方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS636769U (fr) * 1986-06-30 1988-01-18
JP2565625Y2 (ja) * 1992-09-07 1998-03-18 大日本スクリーン製造株式会社 基板処理装置
US5920797A (en) * 1996-12-03 1999-07-06 Applied Materials, Inc. Method for gaseous substrate support
JP3590711B2 (ja) * 1997-08-05 2004-11-17 シャープ株式会社 基板洗浄装置
KR100531681B1 (ko) * 1999-07-16 2005-11-29 삼성전자주식회사 반도체 칩 패키지의 세정 설비
JP2001213517A (ja) * 1999-11-24 2001-08-07 Daiichi Shisetsu Kogyo Kk 板状部材の搬送装置
JP2004152987A (ja) * 2002-10-30 2004-05-27 Kemitoron:Kk プリント配線基板のエッチング方法及びエッチング装置
JP2004148199A (ja) * 2002-10-30 2004-05-27 Kemitoron:Kk スプレー処理装置
JP2004152988A (ja) * 2002-10-30 2004-05-27 Kemitoron:Kk プリント配線基板のスプレー処理方法及びスプレー処理装置
JP2004352454A (ja) * 2003-05-29 2004-12-16 Seiko Epson Corp 搬送装置、洗浄装置、薬液処理装置および回路基板の製造方法

Also Published As

Publication number Publication date
KR100839876B1 (ko) 2008-06-19
JP4637705B2 (ja) 2011-02-23
TW200714378A (en) 2007-04-16
KR20070036735A (ko) 2007-04-03
JP2007096127A (ja) 2007-04-12

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees